Electronic-component-housing package and electronic device

Power semiconductor devices having integrated inductor

Semiconductor device stack with bonding layer and wire retaining member

SEMICONDUCTOR DEVICE

LEADFRAME FOR SEMICONDUCTOR PACKAGES

Semiconductor device and manufacturing method therefor

SEMICONDUCTOR DEVICE, LEADFRAME AND METHOD OF ENCAPSULATING

Package for an optical device

Method of manufacturing semiconductor device

Power device and a method for controlling a power device

SEMICONDUCTOR DEVICE

Semiconductor device and method of manufacturing the same

Method for manufacturing a semiconductor component and structure therefor

Method for producing a metal-ceramic substrate for electric circuits on modules

Semiconductor device

Semiconductor device and manufacturing method of the same

Semiconductor device having lead free solders between semiconductor chip and frame and fabrication method thereof

Multi-chip semiconductor package

Lead frames with improved adhesion to plastic encapsulant

Semiconductor device which exposes die pad without covered by interposer and its manufacturing method

SEMICONDUCTOR DEVICE

Method for forming a patterned thick metallization atop a power semiconductor chip

Method of teaching eyepoints for wire bonding and related semiconductor processing operations

Leadless semiconductor package with electroplated layer embedded in encapsulant and the method for manufacturing the same

Semiconductor circuit and switching power supply apparatus

Electronic device

Method and apparatus for stacked die package with insulated wire bonds

Semiconductor device including wires connecting electrodes to an inner lead

Semiconductor device with lead terminals having portions thereof extending obliquely

Integrated circuit package-on-package stacking system

Metal schemes of trench MOSFET for copper bonding

Semiconductor device with circuit for reduced parasitic inductance

Methods for making microelectronic die systems

PACKAGED POWER SWITCHING DEVICE

SEMICONDUCTOR DEVICE

Three-dimensional package

CHIP ON LEAD WITH SMALL POWER PAD DESIGN

Semiconductor device with output circuit arrangement

Thin film light emitting diode

Condenser for power module and power module

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Method of making a semiconductor chip assembly with an aluminum post/base heat spreader and a silver/copper conductive trace

Semiconductor package and plasma display device including the same

Low profile discrete electronic components and applications of same

Illumination system

Silicon substrate and chip package structure with silicon base having stepped recess for accommodating chip

Manufacturing method for semiconductor devices and semiconductor device

Semiconductor chip assembly with aluminum post/base heat spreader and silver/copper conductive trace

Light emitting diode

Electric power converter

Grid array packages

Stackable semiconductor device assemblies

Integrated circuit packaging system substrates and method of manufacture thereof

Light emitting diode and method for manufacturing the same

Semiconductor integrated circuit

Wiring board

Semiconductor element and electrical apparatus

Intermediate structure of semiconductor device and method of manufacturing the same

Step cavity for enhanced drop test performance in ball grid array package

Grid array packages and assemblies including the same

Method of packaging integrated circuit devices using preformed carrier

Semiconductor device and method for manufacturing the same

Semiconductor Package Having Support Chip And Fabrication Method Thereof

Semiconductor devices including semiconductor dice in laterally offset stacked arrangement

Leadless package housing having a symmetrical construction with deformation compensation

Thermally enhanced electronic package

Semiconductor device having a mounting substrate with a capacitor interposed therebetween

Semiconductor device

Semiconductor element and electrical apparatus

Semiconductor device

Die assemblies

Semiconductor device including DC-DC converter

Integrated circuit packaging system with a protrusion on an inner stacking module and method of manufacture thereof

Integrated circuit packaging system with exposed terminal interconnects and method of manufacturing thereof

SEMICONDUCTOR POWER MODULE PACKAGE HAVING EXTERNAL BONDING AREA

Semiconductor device and method of forming bond wires and stud bumps in recessed region of peripheral area around the device for electrical interconnection to other devices

Semiconductor device and method of forming an IPD beneath a semiconductor die with direct connection to external devices

Semiconductor package with semiconductor core structure and method of forming same

Leadless integrated circuit packaging system and method of manufacture thereof

Wire-on-lead package system having leadfingers positioned between paddle extensions and method of manufacture thereof

Integrated circuit packaging system with stacked paddle and method of manufacture thereof

High frequency semiconductor device

Semiconductor device

Package for Semiconductor Devices

Electronic device and method for manufacturing the same

Semiconductor integrated circuit device

Power semiconductor module and manufacturing method thereof

Semiconductor chip stacked body and method of manufacturing the same

Flash memory card

Power semiconductor module

Semiconductor assemblies and methods of manufacturing such assemblies including trenches in a molding material between semiconductor die

Integrated sensor including sensing and processing die mounted on opposite sides of package substrate

Wire bonding apparatus, record medium storing bonding control program , and bonding method

Method of manufacturing a semiconductor package with a bump using a carrier

Electronic package structure and method

Thin film light emitting diode

Semiconductor device including a DC-DC converter having a metal plate

Interconnect System without Through-Holes

Semiconductor device and connection checking method for semiconductor device

Integrated circuit devices having printed circuit boards therein with staggered bond fingers that support improved electrical isolation

Package structure

Power semiconductor module with segmented base plate

Chip package and manufacturing method thereof

Semiconductor package having isolated inner lead

Encapsulant interposer system with integrated passive devices and manufacturing method therefor

Semiconductor device and method of forming WLCSP using wafer sections containing multiple die

Trench MOSFET with trench source contact having copper wire bonding

Semiconductor module including a switch and non-central diode

Thin film light emitting diode

High temperature, stable SiC device interconnects and packages having low thermal resistance

Method of manufacturing a semiconductor package using a carrier

ELECTRONIC PACKAGE STRUCTURE AND METHOD

Electronic package structure having conductive strip and method

Integrated circuit packaging system with multi level contact and method of manufacture thereof

INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING BUMPED LEAD AND METHOD OF MANUFACTURE THEREOF

Integrated circuit packaging system with plated pad and method of manufacture thereof

Integrated circuit packaging system with increased connectivity and method of manufacture thereof

Semiconductor package

Method for forming an isolated inner lead from a leadframe

Method of manufacturing semiconductor device

Method and article of manufacture for wire bonding with staggered differential wire bond pairs

Spread spectrum isolator

System including a plurality of encapsulated semiconductor chips

Package circuit board with a reduced number of pins and package including a package circuit board with a reduced number of pins and methods of manufacturing the same

Semiconductor device and manufacturing method therefor

Method and apparatus for stacked die package with insulated wire bonds

Semiconductor device and a manufacturing method of the same

Semiconductor package including multiple chips and separate groups of leads

Chip package structure

Image forming apparatus, chip, and chip package

Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices

Integrated circuit package

Semiconductor device

LIGHT EMITTING DIODE AND LIGHT SOURCE MODULE HAVING SAME

Electrical microfilament to circuit interface

Semiconductor device and a manufacturing method of the same

Semiconductor module including circuit component and dielectric film, manufacturing method thereof, and application thereof

Inner-connecting structure of lead frame and its connecting method

Semiconductor body and method for voltage regulation

Semiconductor device in which a semiconductor chip is sealed

SEMICONDUCTOR DEVICE

Semiconductor device

Semiconductor packing having offset stack structure

Semiconductor memory device and semiconductor memory card

Flexible semiconductor package apparatus having a responsive bendable conductive wire member and a manufacturing the same

Semiconductor device including semiconductor chip mounted on lead frame

Pre-molded, clip-bonded multi-die semiconductor package

SEMICONDUCTOR DEVICE HAVING INTEGRATED CIRCUIT WITH PADS COUPLED BY EXTERNAL CONNECTING COMPONENT AND METHOD FOR MODIFYING INTEGRATED CIRCUIT

Semiconductor device and manufacturing method thereof

Closed loop wire bonding methods and bonding force calibration

SEMICONDUCTOR DEVICE

MICROELECRONIC ASSEMBLY AND METHOD FOR FORMING THE SAME

Semiconductor device

Electronic circuit for controlling a power field effect transistor

Semiconductor package system with cavity substrate and manufacturing method therefor

SHRINK PACKAGE ON BOARD

SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, AND WIRING BOARD

Integrated circuit packages incorporating an inductor and methods

Electronic control device

Electric power semiconductor device

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND OPTICAL PICKUP MODULE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, OPTICAL PICKUP MODULE AND SEMICONDUCTOR DEVICE

PACKAGE, AND FABRICATION METHOD FOR THE PACKAGE

Semiconductor package with a mold material encapsulating a chip and a portion of a lead frame

Semiconductor device, manufacturing method thereof, and manufacturing method of semiconductor module

Semiconductor die package including multiple dies and a common node structure

Semiconductor device and method of manufacturing the same

Semiconductor device

Module having a stacked passive element and method of forming the same

Method of making a semiconductor chip assembly with a copper/aluminum post/base heat spreader

Semiconductor device and method of bonding wires between semiconductor chip and wiring substrate

Semiconductor package

Dual or multiple row package

Module having a stacked passive element and method of forming the same

MEMORY MODULE

Chip package structure and fabricating method thereof

CHIP PACKAGE STRUCTURE AND FABRICATING METHOD THREROF

Semiconductor device

Semiconductor device assemblies, electronic devices including the same and assembly methods

Semiconductor package system with through silicon via interposer

Semiconductor structure with an electric field stop layer for improved edge termination capability

Circuit device

Method of forming assymetrical encapsulant bead

METHOD OF REDUCING VOIDS IN ENCAPSULANT

Method of forming semiconductor package

METHOD OF FORMING ASSYMETRICAL ENCAPSULANT BEAD

Method of controlling satellite drops from an encapsulant jetter

Integrated circuit package system with adhesive segment spacer

Semiconductor package with a controlled impedance bus and method of forming same

Semiconductor device for battery power voltage control

Integrated circuit packaging system having planar interconnect

Semiconductor package and method for manufacturing the same

Semiconductor package system with die support pad

SEMICONDUCTOR CHIP ASSEMBLY WITH COPPER/ALUMINUM POST/BASE HEAT SPREADER

Connecting terminal, semiconductor package using connecting terminal and method for manufacturing semiconductor package

Method of manufacturing a semiconductor device

Semiconductor device and a method of manufacturing the same

Semiconductor package and method using isolated Vplane to accommodate high speed circuitry ground isolation

Power semiconductor module including a multilayer substrate

Resin sheet, circuit device and method of manufacturing the same

Integrated circuit devices with stacked package interposers

Method of manufacturing a semiconductor device

Method of fabicating a microelectronic die having a curved surface

Semiconductor device

Ball grid array package stacking system

Integrated capacitors in package-level structures, processes of making same, and systems containing same

VERTICAL CURRENT TRANSPORT IN A POWER CONVERTER CIRCUIT

Semiconductor chip assembly with post/base heat spreader and substrate

Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages

Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages

Method of making a semiconductor chip assembly with a post/base heat spreader and a substrate

Inverter power module with distributed support for direct substrate cooling

Isolator with complementary configurable memory

Ball grid array package having one or more stiffeners

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

QFN package

Package structure utilizing high and low side drivers on separate dice

Semiconductor package

Semiconductor package which includes an insulating layer located between package substrates which may prevent an electrical short caused by a bonding wire

Resin sealing type semiconductor device and method of manufacturing the same, and lead frame

Resin sealing type semiconductor device and method of manufacturing the same, and resin sealing type electronic device

WIRE BODNING PACKAGE STRUCTURE

Semiconductor system-in-a-package containing micro-layered lead frame

Semiconductor device having a suspended isolating interconnect

Micro-layered lead frame semiconductor packages

Package device having crack arrest feature and method of forming

Stacked-chip device

Wire bonding device and wire bonding process using same

Package, method of manufacturing a package and frame

Integrated circuit apparatus, systems, and methods

Circuit for detecting bonding defect in multi-bonding wire

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

Semiconductor device

ADVANCED QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Stacked integrated circuit package-in-package system and method of manufacture thereof

Lead frame, resin package, semiconductor device and resin package manufacturing method

Advanced quad flat non-leaded package structure and manufacturing method thereof

Sensor device including two sensors embedded in a mold material

Method of manufacturing a single chip semiconductor integrated circuit device including a mask ROM in a short time

Semiconductor structure with communication element

Metal leadframe package with secure feature

Leadless package with internally extended package leads

Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages

Method of manufacturing stacked semiconductor device

Method for fabricating package structure of stacked chips

Semiconductor device

Semiconductor assembly with component pads attached on die back side

Flange package for a semiconductor device

IC Package Method Capable of Decreasing IR Drop and Associated IC Apparatus

Stacked Memory Module

Compact co-packaged semiconductor dies with elevation-adaptive interconnection plates

Lead frame package

Semiconductor device packages with electromagnetic interference shielding

Assembling of Electronic Members on IC Chip

Semiconductor device and radio communication device

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Stackable optoelectronics chip-to-chip interconnects and method of manufacturing

Stackable optoelectronics chip-to-chip interconnects and method of manufacturing

Stackable optoelectronics chip-to-chip interconnects and method of manufacturing

SHIELDED WIREBOND

Copper on organic solderability preservative (OSP) interconnect and enhanced wire bonding process

Optical semiconductor apparatus

Integrated circuit package stacking system

Method for forming an etched recess package on package system

Method and System for Secure Heat Sink Attachment on Semiconductor Devices with Macroscopic Uneven Surface Features

Method of manufacturing a stacked semiconductor apparatus

Method of manufacturing a wafer including providing electrical conductors isolated from circuitry

STACKED DIE PACKAGE HAVING REDUCED HEIGHT AND METHOD OF MAKING SAME

Semiconductor device including a transformer on chip

High frequency ceramic package and fabrication method for the same

UNIVERSAL SUBSTRATE FOR SEMICONDUCTOR PACKAGES AND THE PACKAGES

Method of forming a molded array package device having an exposed tab and structure

Semiconductor device and manufacturing method thereof

Power semiconductor device

Power semiconductor device

High density stacked die assemblies, structures incorporated therein and methods of fabricating the assemblies

Stress Mitigation in Packaged Microchips

OPTICAL SEMICONDUCTOR DEVICE

Metal core circuit element mounting board

Radio frequency unit analog level detector and feedback control system

Lens support and wirebond protector

Semiconductor device having a semiconductor chip and resin sealing portion

Semiconductor device and heat sink with 3-dimensional thermal conductivity

Semiconductor device

Semiconductor device

Chip-Stacked Package Structure with Leadframe Having Multi-Piece Bus Bar

Carrier for bonding a semiconductor chip onto and a method of contracting a semiconductor chip to a carrier

Resin-encapsulated semiconductor device and its manufacturing method

Integrated circuit package system with chip on lead

Fine-pitch routing in a lead frame based system-in-package (SIP) device

Non-pull back pad package with an additional solder standoff

Wiring substrate and method of manufacturing the same

Method of fabricating a circuit apparatus

Method of making a semiconductor chip assembly with a post/base heat spreader and vertical signal routing

Method of making a semiconductor chip assembly with a post/base heat spreader and horizontal signal routing

System-in-package module and mobile terminal having the same

Semiconductor device

Semiconductor device with fuse portion

Semiconductor chip assembly with post/base heat spreader and vertical signal routing

Semiconductor device