Wiring board and semiconductor device

Substrate slot design for die stack packaging

PACKAGE FOR MIXED SIGNAL MCU WITH MINIMAL PIN COUNT

Power semiconductor arrangement

Pin Array No Lead Package and Assembly Method Thereof

INTERDIGITATED LEADFINGERS

Process of forming an electronic device including an inductor

Fingerprint Sensor and Interconnect

Lead frame routed chip pads for semiconductor packages

Electronic controller

Semiconductor device and method of manufacturing the same

Circuit substrate for preventing warpage and package using the same

Integrated circuit package system with stacked die

Lead frame having a die stage smaller than a semiconductor device and a semiconductor device using the same

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device package

Memory card

Semiconductor assembly with component attached on die back side

Semiconductor device and method for fabricating the same

Semiconductor device package with groove

Stack semiconductor package including an interposer chip having an imposed diode or capacitor

Semiconductor device, lead-frame product used for the same and method for manufacturing the same

SEMICONDUCTOR DEVICE

Microelectronic component assemblies and microelectronic component lead frame structures

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Packaged microelectronic components with terminals exposed through encapsulant

Printed circuit board for package and manufacturing method thereof

System and method for increasing the strength of a bond made by a small diameter wire in ball bonding

Methods using die attach paddle for mounting integrated circuit die

GNSS receiver package

Stacked chip package structure with leadframe having bus bar

Mounting structure for IC tag and IC chip for mounting

Die attach paddle for mounting integrated circuit die

Method of producing a semiconductor package

Chip-stacked package structure having leadframe with multi-piece bus bar

Chip-stacked package structure for lead frame having bus bars with transfer pads

Electronic device having wiring substrate and lead frame

Stacked dual MOSFET package

Systems and methods for supporting a subset of multiple interface types in a semiconductor device

Compact impedance transformation circuit

Semiconductor memory device and semiconductor device

Semiconductor device, relay chip, and method for producing relay chip

Wire bonding method, wire bonding apparatus and semiconductor device

High density stacked die assemblies, structures incorporated therein and methods of fabricating the assemblies

Semiconductor device and manufacturing method thereof

Semiconductor device

CHIP CARRIER WITH SIGNAL COLLECTION TAPE AND FABRICATION METHOD THEREOF

POWER MODULE WITH LAMINAR INTERCONNECT

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Method of manufacturing a single chip semiconductor integrated circuit device including a mask ROM in a short time

Methods for a multiple die integrated circuit package

Electric power converter

Semiconductor device

HIGH PERFORMANCE IC PACKAGE AND METHOD

Stacked structure of chips and water structure for making the same

Pre-encapsulated lead frames for microelectronic device packages, and associated methods

Manufacturing method for resin sealed semiconductor device

Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof

High frequency line-to-waveguide converter and high frequency package

CHIP SCALE MODULE PACKAGE IN BGA SEMICONDUCTOR PACKAGE

Microelectronic package

Stacked semiconductor components with through wire interconnects (TWI)

Integrated circuit including clip

Power semiconductor component

Semiconductor light-emitting device and light-emitting display therewith

Highly Heat-Resistant Synthetic Polymer Compound and High Withstand Voltage Semiconductor Device

Semiconductor element and manufacturing method thereof

Interconnect for improved die to substrate electrical coupling

Physical quantity sensor, lead frame, and manufacturing method therefor

Method of manufacturing semiconductor device

Light emitting device

CIRCUIT BOARD AND CIRCUIT STRUCTURE

CONFIGURABLE UNIVERSAL INTERCONNECT DEVICE

Package structure with leadframe on offset chip-stacked structure

Package with solder-filled via holes in molding layers

PACKAGE-BASE STRUCTURE OF POWER SEMICONDUCTOR DEVICE AND MANUFACTURING PROCESS OF THE SAME

Method for manufacturing a passive integrated matching network for power amplifiers

Lead frame with included passive devices

Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacers

Method for fabricating chip-stacked semiconductor package

Multiplexed RF isolator

Power semiconductor devices having integrated inductor

Semiconductor switching module and method

Integrated circuit package-in-package system

Integrated circuit package system with molding vents

Interposer and semiconductor package with reduced contact area

Integrated circuit package system including die stacking

SEMICONDUCTOR DEVICE WITH INTERNAL HEAT SINK

Integrated circuit package-on-package stacking system

On-chip magnetic components

Method for identifying semiconductor integrated circuit device, method for manufacturing semiconductor integrated circuit device, semiconductor integrated circuit device and semiconductor chip

Multiplexed RF isolator circuit

Multi-die DC-DC buck power converter with efficient packaging

Methods for providing and using grid array packages

Semiconductor device and its wiring method

Semiconductor device and its wiring method

Semiconductor device

Semiconductor device and manufacturing method for the same

BOND FINGER ON VIA SUBSTRATE, PROCESS OF MAKING SAME, PACKAGE MADE THEREBY, AND METHOD OF ASSEMBLING SAME

Dual side cooling integrated power device package and module with a clip attached to a leadframe in the package and the module and methods of manufacture

Semiconductor device

Nonvolatile memory apparatus

Method of designing semiconductor integrated circuit, designing apparatus, semiconductor integrated circuit system, semiconductor integrated circuit mounting substrate, package and semiconductor integrated circuit

Semiconductor device and method for manufacturing same

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE

Chip having two groups of chip contacts

Integrated circuit package system with laminate base

Chip package structure

Interconnect structure for semiconductor package

Semiconductor module with a power semiconductor chip and a passive component and method for producing the same

Semiconductor device and an information management system therefor

Method of fabricating a semiconductor chip package

System and method of attenuating electromagnetic interference with a grounded top film

CIRCULAR WIRE-BOND PAD, PACKAGE MADE THEREWITH, AND METHOD OF ASSEMBLING SAME

Transformer coils for providing voltage isolation

Chip structure with redistribution traces

Method of manufacturing semiconductor device

Microelectronic packages with leadframes, including leadframes configured for stacked die packages, and associated systems and methods

Semiconductor device, electronic card and pad rearrangement substrate

Semiconductor device

CHIP PACKAGE STRUCTURE AND FABRICATING METHOD THREROF

Electronic assembly and manufacturing method having a reduced need for wire bonds

Semiconductor device and method of manufacturing the same

Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device

Semiconductor device including semiconductor element surrounded by an insulating member wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof

Flip chip package including a non-planar heat spreader and method of making the same

SEMICONDUCTOR PACKAGE

Integrated circuit package system with stiffener

Electronic module with switching functions and method for producing the same

Multi-chip semiconductor connector assemblies

Chip package structure and fabricating method thereof

Method of Manufacturing a Semiconductor Device

Bond and method for bonding two contact surfaces

CHIP-PACKAGING WITH BONDING OPTIONS CONNECTED TO A PACKAGE SUBSTRATE

Integrated circuit incorporating wire bond inductance

Stack package having pattern die redistribution

Multiple-dies semiconductor device with redistributed layer pads

Semiconductor package having optimal interval between bond fingers for reduced substrate size

Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages

Exposed top side copper leadframe manufacturing

Method of fabricating an integrated circuit with etched ring and die paddle

Solid state image pickup device, method for manufacturing the same, semiconductor device and method for manufacturing the same

Manufacturing method for a leadless multi-chip electronic module

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Integrated circuit package system with offset stack

RF power transistor having an encapsulated chip package

Semiconductor package having functional and auxiliary leads, and process for fabricating it

Semiconductor apparatus with decoupling capacitor

Semiconductor device, and life prediction circuit and life prediction method for semiconductor device

Micro universal serial bus (USB) memory package

IC packages with internal heat dissipation structures

Structure and method for producing multiple size interconnections

Semiconductor device having semiconductor element with back electrode on insulating substrate

DIE STACK CAPACITORS, ASSEMBLIES AND METHODS

Multi-chip stacked package with reduced thickness

Socket for making with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component

Method of making thermally enhanced substrate-base package

Mounting integrated circuit dies for high frequency signal isolation

Semiconductor device

Electronic Part And Method Of Producing The Same

Semiconductor device with improved high current performance

Semiconductor device

Interconnections resistant to wicking

Device clamp for reducing oxidation in wire bonding

Method of forming semiconductor packaged device

Backages with buried electrical feedthroughs

Semiconductor device

Semiconductor module featuring solder balls having lower melting point than that of solder electrode terminals of passive element device

Semiconductor package substrate and semiconductor package having the same

Semiconductor integrated circuit device

Semiconductor device having a bonding wire and method for manufacturing the same

Stacked package electronic device

Lead frame and method of manufacturing the same and semiconductor device

Leadframe IC packages having top and bottom integrated heat spreaders

Method and structure for improving the reliability of leadframe integrated circuit packages

Multilayer structures for magnetic shielding

Semiconductor device with reduced parasitic inductance

Method for producing a chip-substrate connection

Semiconductor integrated circuit device with power lines improved

Wire bonding structure and method that eliminates special wire bondable finish and reduces bonding pitch on substrates

Multilayer dielectric substrate and semiconductor package

Electronic device substrate, electronic device and methods for making same

Multi-channel optical receiver module

Stub-tuned wirebond package

SEMICONDUCTOR PACKAGE

Integrated circuit package and multi-layer lead frame utilized

Dual MOSFET package

Method and apparatus for cooling semiconductor device hot blocks and large scale integrated circuit (IC) using integrated interposer for IC packages

Semiconductor device and method of manufacturing the same

No-lead IC packages having integrated heat spreader for electromagnetic interference (EMI) shielding and thermal enhancement

Integrated circuit package system with different mold locking features

Integrated circuit chip packaging

Method and apparatus for manufacture and inspection of semiconductor device

Semiconductor device

Manufacturing method of resin-molding type semiconductor device, and wiring board therefor

Electronic device with integrated heat distributor

Integrated circuit device with semiconductor device components embedded in plastic housing composition

Semiconductor device having shifted stacked chips

Lead frame and semiconductor device using the same

Package structure

Semiconductor chip capable of being laminated and a semiconductor device including the lamination of a plurality of semiconductor chips

Wafer level stack structure for system-in-package and method thereof

Semiconductor device and method for manufacturing same

System and method for routing signals between side-by-side die in lead frame type system in a package (SIP) devices

Method of forming stackable package

Power semiconductor module as H-bridge circuit and method for producing the same

Molded SiP package with reinforced solder columns

Circuit apparatus and method of fabricating the apparatus

Leadframe structures for semiconductor packages

System and method for providing a power bus in a wirebond leadframe package

Method for fabricating semiconductor package free of substrate

Carrierless chip package for integrated circuit devices, and methods of making same

Semiconductor die package including multiple dies and a common node structure

Semiconductor element mounting board and optical transmission module

Surface mounting electronic component and manufacturing method thereof

Filter device substrate and filter device

Integrated circuit devices with stacked package interposers

Semiconductor power module including epoxy resin coating

Leadframe enhancement and method of producing a multi-row semiconductor package

Memory circuit system having semiconductor devices and a memory

MOSFET power package

Tail wire cutting method and bonding apparatus

POP Semiconductor Device Manufacturing Method

Semiconductor package, array arranged substrate structure for the semiconductor package and fabrication method of the semiconductor package

Chip package

Electronic component package

Semiconductor light emitting device with first and second leads

Hybrid stacking package system

Chip with power and signal pads connected to power and signal lines on substrate

Common Assembly Substrate and Applications Thereof

Integrated circuit package system with wire bond pattern

Hybrid flip-chip and wire-bond connection package system

Power semiconductor module with flush terminal elements

Methods and apparatus for a reduced inductance wirebond array

Integrated circuit package system with ground ring

Chip package structure

Semiconductor package and method using isolated Vplane to accommodate high speed circuitry ground isolation

Electrical arrangement comprising a wire connection arrangement and method for the production of such an electrical arrangement

Multichip package system

Semiconductor device and manufacturing method thereof

Methods of Packaging Using Fluid Resin

Tape wiring substrate and tape package using the same

Semiconductor device with lead frames

Semiconductor device including a DC-DC converter

Connecting device for electronic components

Method of packaging integrated circuit devices using preformed carrier

On-die bond wires system and method for enhancing routability of a redistribution layer

Semiconductor devices and electrical parts manufacturing using metal coated wires

Leadless semiconductor package with electroplated layer embedded in encapsulant and the method for manufacturing the same

Semiconductor device

Physical quantity sensor and lead frame used for same

Power transistor and power semiconductor device

Carrierless chip package for integrated circuit devices, and methods of making same

METHOD FOR MOUNTING AN ELECTRONIC PART ON A SUBSTRATE USING A LIQUID CONTAINING METAL PARTICLES

Multichip module with improved system carrier

Semiconductor device

Semiconductor device

Connecting a plurality of bond pads and/or inner leads with a single bond wire

Chip Package Structure

Method for making QFN package with power and ground rings

Semiconductor chip assembly

Wire bonding method for preventing polymer cracking

Method for fabricating a semiconductor package

Multi-chip package

Integrated circuit package system having interconnect stack and external interconnect

Semiconductor package system with substrate having different bondable heights at lead finger tips

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Semiconductor package and method for fabricating the same

Electronic assembly and method for forming the same

Thermally-enhanced ball grid array package structure and method

Semiconductor device and semiconductor module therewith

Power semiconductor device and method for producing it

INTEGRATED CIRCUIT CHIP AND PACKAGE

Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in integrated circuit (IC) packages

No lead package with heat spreader

Integrated circuit package system including die stacking

Transmission line substrate and semiconductor package

CENTER PAD TYPE IC CHIP WITH JUMPERS, METHOD OF PROCESSING THE SAME AND MULTI CHIP PACKAGE

Semiconductor device and manufacturing the same

DC/DC converter

Integrated circuit package system with bonding lands

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Electronic circuit, a semiconductor device and a mounting substrate

Semiconductor apparatus containing multi-chip package structures

Semiconductor device assemblies including face-to-face semiconductor dice and systems including such assemblies

RF module including control IC without the aid of a relay pad

Hermetically sealed ceramic package

Power composite integrated semiconductor device and manufacturing method thereof

Semiconductor device

System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices

Customizable power and ground pins

Multi-chip module for battery power control

COL-TSOP with nonconductive material for reducing package capacitance

Wire bonding apparatus, record medium storing bonding control program, and bonding method

Wire bonding apparatus, record medium storing bonding control program, and bonding method

Method for manufacturing physical quantity sensor

Method and structure for coupling two microcircuits

Semiconductor device

Stacked semiconductor structure and fabrication method thereof

Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices