Highly reliable, cost effective and thermally enhanced AuSn die-attach technology

Semiconductor device, electronic device, and manufacturing method of the same

Interdigitated conductive lead frame or laminate lead frame for GaN die

Electronic module with stacked semiconductors

Method for setting capillary contact position data and wire bonding apparatus using the same

Ground shields for semiconductors

Fabrication of an integrated circuit package

Method of manufacturing semiconductor device

Probe For Semiconductor Devices

Power semiconductor component having chip stack

Thin integrated circuit device packages for improved radio frequency performance

Circuit board, semiconductor package having the same, and method of manufacturing the circuit board

Functional device-mounted module and a process for producing the same

Multi-chips module package and manufacturing method thereof

Warpage-reducing packaging design

Semiconductor device and manufacturing method of them

Semiconductor device sealed with electrical insulation sealing member

Multilayer integrated circuit for RF communication and method for assembly thereof

Semiconductor device, electronic apparatus comprising the same, and method for fabrication of substrate for semiconductor device used therein

Wafer level stack structure for system-in-package and method thereof

Semiconductor device, interposer chip and manufacturing method of semiconductor device

Low profile semiconductor system having a partial-cavity substrate

In-line apparatus and method for manufacturing double-sided stacked multi-chip packages

Semiconductor memory card

CHIP CARD MODULE

Apparatus and methods for packaging integrated circuit chips with antennas formed from package lead wires

Methods and systems for fabricating semiconductor components with through wire interconnects (TWI)

Circuit board and package structure thereof

Methods for fabricating chip-scale packages having carrier bonds

Electronic component and method for its assembly

Power configuration method for structured ASICs

Integrated circuit having second substrate to facilitate core power and ground distribution

Managed memory component

Semiconductor package structure and fabrication method thereof

Semiconductor package with integrated heatsink and electromagnetic shield

DOUBLE ENCAPSULATED SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Leadless lead-frame

Semiconductor package

Semiconductor package structure and fabrication method thereof

Semiconductor package and process for making the same

CHIP PACKAGE WITH BUILT-IN CAPACITOR STRUCTURE

Semiconductor device package and method for manufacturing same

SEMICONDUCTOR DEVICE AND MANUFACTURING PROCESS THEREOF

Arrangement and method impedance matching

Semiconductor component and apparatus for production of a semiconductor component

Power semiconductor module

Semiconductor-element mounting substrate, semiconductor device, and electronic equipment

Pad layout

Circuit module

Connecting module having passive components

Integrated capacitors in package-level structures, processes of making same, and systems containing same

Electronic circuit package

Methods for packaging and encapsulating semiconductor device assemblies that include tape substrates

Circuit board and electronic assembly

Semiconductor device

SEMICONDUCTOR DEVICE

Semiconductor device

ARRAY CIRCUIT SUBSTRATE AND WIRE BONDING PROCESS USING THE SAME

Electrical ground method for ball stack package

Multichip leadframe package

Electronic circuit device and manufacturing method thereof

Semiconductor package having improved thermal performance

System to wirebond power signals to flip-chip core

Vertical power semiconductor component, semiconductor device and methods for the production thereof

Semiconductor device having a metal plate conductor

Multi-chip package sharing temperature-compensated self-refresh signal and method thereof

Power Semiconductor Circuit And Method Of Manufacturing A Power Semiconductor Circuit

Semiconductor device

Semiconductor chip and semiconductor device

Hermetically sealed integrated circuits and method

Semiconductor device having semiconductor element, insulation substrate and metal electrode

Ribbon bonding in an electronic package

Schottky Diode Device with Aluminum Pickup of Backside Cathode

Apparatus and method for increasing the quantity of discrete electronic components in an integrated circuit package

Semiconductor device and manufacturing method of the same

Semiconductor package structure and method of manufacture

Combination quad flat no-lead and thin small outline package

Space-efficient package for laterally conducting device

Semiconductor device and mold for resin-molding semiconductor device

FINE-SIZED CHIP PACKAGE STRUCTURE

Semiconductor device having a molded package

Electrical microfilament to circuit interface

Relay board provided in semiconductor device, semiconductor device, and manufacturing method of semiconductor device

Thermal enhanced upper and dual heat sink exposed molded leadless package

Microelectronic devices having a curved surface and methods for manufacturing the same

Semiconductor chip mounted interposer, semiconductor device, semiconductor chip interposer fabrication method, bare chip mounted interposer, and interposer sheet

Power semiconductor component with semiconductor chip stack in a bridge circuit and method for producing the same

Chip package structure

System and method for implementing transformer on package substrate

Metal-base circuit board and its manufacturing method

Microelectronic component assemblies having lead frames adapted to reduce package bow

Sensor system having a substrate and a housing, and method for manufacturing a sensor system

Semiconductor module and manufacturing method thereof

Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another

Semiconductor components having through wire interconnects (TWI)

High-temperature solder, high-temperature solder paste and power semiconductor using same

Individualized low parasitic power distribution lines deposited over active integrated circuits

Protection for an integrated circuit chip containing confidential data

Radio-frequency system in package including antenna

Semiconductor device

Interposer and stacked chip package

Semiconductor integrated circuit

Method and apparatus that provides differential connections with improved ESD protection and routing

Power module

METAL LAYER FORMATION METHOD FOR DIODE CHIPS/WAFERS

Interconnecting a port of a microwave circuit package and a microwave component mounted in the microwave circuit package

Output amplifier structure with bias compensation

Semiconductor package structure and method of manufacture

SEMICONDUCTOR DEVICE

Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrate

Semiconductor device having a heat spreader exposed from a seal resin

Method of forming a leaded molded array package

INTEGRATED CIRCUIT PACKAGE SYSTEM

Semiconductor chip having bond pads

Semiconductor chip having bond pads

Integrated circuit package system including ribbon bond interconnect

Semiconductor device

Low voltage drop and high thermal performance ball grid array package

Method for fabricating semiconductor package

Integrated circuit package system including shield

Method for fabricating semiconductor package with stacked chips

Semiconductor device and method of manufacturing the same

Semiconductor device

Semiconductor chip having bond pads

Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package

BRACE FOR WIRE LOOP

Microelectronic devices and microelectronic support devices, and associated assemblies and methods

Packaging methods

Mm-wave antenna using conventional IC packaging

Semiconductor device, method of manufacturing a semiconductor device and substrate to be used to manufacture a semiconductor device

Single chip and stack-type chip semiconductor package and method of manufacturing the same

Multi-stack chip package with wired bonded chips

IC card with bonding wire connections of different lengths

IC card

Lead arrangement and chip package using the same

Low profile semiconductor package

IC card

Power module having at least two substrates

Manufacturing method for magnetic sensor and lead frame therefor

Method of making stacked die package

METHOD FOR REDUCING OR ELIMINATING SEMICONDUCTOR DEVICE WIRE SWEEP IN A MULTI-TIER BONDING DEVICE AND A DEVICE PRODUCED BY THE METHOD

Electronic assembly having graded wire bonding

Semiconductor device and manufacturing method thereof

Semiconductor chip with post-passivation scheme formed over passivation layer

Semiconductor device

Package device with electromagnetic interference shield

Methods for a multiple die integrated circuit package

Integrated circuit package system including high-density small footprint system-in-package

Packaging for high speed integrated circuits

LEADFRAME FOR SEMICONDUCTOR PACKAGES

Integrated circuit packaging

Multiple die integrated circuit package

High frequency chip packages with connecting elements

Method and apparatus for attaching a workpiece to a workpiece support

Semiconductor heat-transfer method

Integrated circuit mounting for thermal stress relief useable in a multi-chip module

Circuit device and method of manufacturing the same

Semiconductor structure and method of assembly

Semiconductor structure and method of manufacture

Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages

Housed DRAM chip for high-speed applications

Electronic module and method of assembling the same

Thin package system with external terminals

Semiconductor component and method for contracting said semiconductor component

Method of improving power distribution in wirebond semiconductor packages

Semiconductor device with multiple designation marks

Decoupling capacitor closely coupled with integrated circuit

Apparatus and method for providing bypass capacitance and power routing in QFP package

Package for high frequency waves containing high frequency electronic circuit

Semiconductor module having a coupling substrate, and methods for its production

Integrated circuit package system

Lead frame package structure with high density of lead pins arrangement

Microelectronic package having multiple conductive paths through an opening in a support substrate

Semiconductor device and a manufacturing method of the same

Method of forming a magnetic device having a conductive clip

Contact carriers (tiles) for populating larger substrates with spring contacts

Relay board and semiconductor device having the relay board

Semiconductor chip and semiconductor device

Semiconductor device having metallic lead and electronic device having lead frame

Semiconductor device and a manufacturing method of the same

Method of forming a molded array package device having an exposed tab and structure

Integrated circuit package system with multi-surface die attach pad

Method of forming a power module with a magnetic device having a conductive clip

Semiconductor constructions comprising multi-level patterns of radiation-imageable material

Flash memory card

Flash memory card

Molded semiconductor package

Insulated gate semiconductor device having a clamping element to clamp gate-emitter voltage and method of manufacturing thereof

Semiconductor device with a resin-sealed optical semiconductor element

LSI design support apparatus and LSI design support method

Electronic plug unit

Method of forming an electrical contact

Method of forming a semiconductor device

Decoupling capacitor closely coupled with integrated circuit

Substrate sheet material for a semiconductor device and a manufacturing method thereof, a molding method using a substrate sheet material, a manufacturing method of semiconductor devices

Wire sweep resistant semiconductor package and manufacturing method therefor

Complete power management system implemented in a single surface mount package

Complete power management system implemented in a single surface mount package

QFN/SON compatible package with SMT land pads

Semiconductor package with internal shunt resistor

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications

INDUCTIVE STRUCTURE

Manufacturing method of a semiconductor device to suppress generation of whiskers

Method of forming an electrical contact

Semiconductor chip having bond pads

Semiconductor device having metallic plate with groove

Semiconductor chip having bond pads and multi-chip package

Integrated circuit package and method of manufacture thereof

System in package (SIP) structure

Multi-part lead frame with dissimilar materials

Multi-part lead frame with dissimilar materials

Semiconductor component and method of assembling the same

Method and apparatus for decoupling conductive portions of a microelectronic device package

Multi-chip stacking package structure

MATRIX PACKAGE SUBSTRATE STRUCTURE, CHIP PACKAGE STRUCTURE AND MOLDING PROCESS THEREOF

Low height vertical sensor packaging

Partially patterned lead frames and methods of making and using the same in semiconductor packaging

Semiconductor device and method of manufacturing the same

Semiconductor device, lead frame used in the semiconductor device and electronic equipment using the semiconductor device

Die pad for semiconductor packages and methods of making and using same

Multi-chip package type semiconductor device

Mounting Spring Elements on Semiconductor Devices, and Wafer-Level Testing Methodology

Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts

Semiconductor device including a plurality of semiconductor chips stacked three-dimensionally, and method of manufacturing the same

Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices

Semiconductor device package

Semiconductor multi-chip package including two semiconductor memory chips having different memory densities

Methods of making a die-up ball grid array package with printed circuit board attachable heat spreader

Quad flat pack (QFP) package and flexible power distribution method therefor

Test carrier for semiconductor components having conductors defined by grooves

Microelectronic devices and microelectronic support devices, and associated assemblies and methods

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

Method for producing semiconductor device and semiconductor device

Method for producing an electronic component or module and a corresponding component or module

High frequency package, transmitting and receiving module and wireless equipment

Two layer substrate ball grid array design

Multi-chip package for reducing parasitic load of pin

Method and system for secure heat sink attachment on semiconductor devices with macroscopic uneven surface features

Semiconductor power component with a vertical current path through a semiconductor power chip

Method for connecting a die assembly to a substrate in an integrated circuit and a semiconductor device comprising a die assembly

Leadframe package with dual lead configurations

Bi-directional switch, and use of said switch

Semiconductor connection component

Semiconductor device and capacitance regulation circuit

Semiconductor device and capacitance regulation circuit

Semiconductor device, laminated semiconductor device, and wiring substrate

Semiconductor component and method of manufacture

Mount for a programmable electronic processing device

Multi-chip semiconductor device package

Semiconductor module

Semiconductor device and a manufacturing method of the same

Semiconductor assembly and packaging for high current and low inductance

Semiconductor device

Insulated gate semiconductor device and manufacturing method thereof

Use of an internal on-chip inductor for electrostatic discharge protection of circuits which use bond wire inductance as their load

Packaged integrated circuit having a heat spreader and method therefor

Solder composition for electronic devices

Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same

Multilayered circuit substrate and semiconductor package structure using the same

Power plane design and jumper wire bond for voltage drop minimization

Radio frequency over-molded leadframe package

High frequency semiconductor integrated circuit device, wireless electric unit and wireless communication system

Electrical interconnect structures for integrated circuits and methods of manufacturing the same

Output match transistor

Semiconductor power device and RF signal amplifier

Integrated circuit chip and integrated device

Semiconductor device, power amplifier device and PC card

Packaged integrated circuit with enhanced thermal dissipation

Low profile, chip-scale package and method of fabrication

Packaging method for segregating die paddles of a leadframe

Relay board with bonding pads connected by wirings

Connection element for a semiconductor component and method for producing the same

Reduced inductance in ball grid array packages

Semiconductor chip package

Packaging for high speed integrated circuits

Semiconductor device and method of manufacturing the same

Stacked semiconductor package having adhesive/spacer structure and insulation

Packaging for high speed integrated circuits

Packaging for high speed integrated circuits

Packaging for high speed integrated circuits

Semiconductor package without chip carrier and fabrication method thereof

Packaging for high speed integrated circuits

Packaging for high speed integrated circuits

Electronic device and carrier substrate for same

High-frequency device including high-frequency switching circuit

Electrically connecting substrate with electrical device

Integrated circuit device and electronic instrument

Stacked Semiconductor Package having Adhesive/Spacer Structure and Insulation

Semiconductor power module with SiC power diodes and method for its production

MEMS packaging method for enhanced EMI immunity using flexible substrates

MEMS package using flexible substrates, and method thereof

Integrated circuit for driving semiconductor device and power converter

Wire-bonding method and semiconductor package using the same

Structure and method for producing multiple size interconnections

Ball grid array package enhanced with a thermal and electrical connector

SEMICONDUCTOR MULTI-CHIP PACKAGE