Surface mount package

Advanced leadframe having predefined bases for attaching passive components

Method of manufacturing a passive integrated matching network for power amplifiers

Cavity ball grid array apparatus having improved inductance characteristics

Method and System for Applying an Adhesive Substance on an Electronic Device

Trenched MOSFET termination with tungsten plug structures

METHOD OF FABRICATING A HIGH-DENSITY LEAD ARRANGEMENT PACKAGE STRUCTURE

Semiconductor device with improved signal transmission characteristics

Semiconductor device

Adhesive layer forming a capacitor dielectric between semiconductor chips

BUMP FOR OVERHANG DEVICE

Package for electronic device and method for manufacturing electronic device

Arrangement for electrically connecting semiconductor circuit arrangements to an external contact device and method for producing the same

Semiconductor die package and method for making the same

Semiconductor device and package, and method of manufacturer therefor

Multi-part lead frame with dissimilar materials

Semiconductor device

Die package with asymmetric leadframe connection

Assembly method for semiconductor die and lead frame

Method of manufacturing a semiconductor device

Method for fabricating board on chip (BOC) semiconductor package with circuit side polymer layer

Semiconductor half-bridge module with low inductance

Radio frequency receiver chip with improved electrostatic discharge level

Semiconductor device

Intrinsic thermal enhancement for FBGA package

Packaging logic and memory integrated circuits

Alignment using fiducial features

Reliable integrated circuit and package

Contact Structures Comprising A Core Structure And An Overcoat

Signal isolation in a package substrate

Substrate structure and the fabrication method thereof

Module having stacked chip scale semiconductor packages

Electronic component comprising a cooling surface

Power semiconductor module

Probe card assembly and kit

Semiconductor device, stacked semiconductor device, and manufacturing method for semiconductor device

Leadless semiconductor package

Physical quantity sensor, lead frame, and manufacturing method therefor

Nickel bonding cap over copper metalized bondpads

Semiconductor device for use as multimedia memory card, has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of substrate is covered by encapsulant

Assembly structure and method for chip scale package

Semiconductor device

Lead frame with attached components

Gate contact and runners for high density trench MOSFET

Trenched MOSFET device with contact trenches filled with tungsten plugs

Structure for avalanche improvement of ultra high density trench MOSFET

High density hybrid MOSFET device

High density trench MOSFET with low gate resistance and reduced source contact space

Source contact and metal scheme for high density trench MOSFET

Method for modified bus bar with Kapton™ tape or insulative material on LOC packaged part

Method of making semiconductor BGA package having a segmented voltage plane

Method for producing a protective assembly for protecting an electronic component from electrostatic discharge, and correspondingly configured electronic component

Semiconductor element and manufacturing method thereof

Method for mounting an electronic part on a substrate using a liquid containing metal particles

Semiconductor device having capacitive insulation means and communication terminal using the device

Circuit device and method of manufacturing the same

Power module package structure

Encapsulated power semiconductor assembly

Semiconductor BGA package having a segmented voltage plane

System for assembling electronic components of an electronic system

Semiconductor device

Methods of making integrated circuits

Integrated circuit with substantially perpendicular wire bonds

Semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor device packages with substrates for redistributing semiconductor device electrodes

SIP type package containing analog semiconductor chip and digital semiconductor chip stacked in order, and method for manufacturing the same

Low cost power semiconductor module without substrate

Semiconductor device

Stacked chip package with redistribution lines

LED package structure and method making of the same

Adherence of a solid-state image-sensing device to a substrate

Offset integrated circuit package-on-package stacking system

Integrated circuit package including miniature antenna

Lead frame and resin-encapsulated semiconductor device

Semiconductor device with sealed semiconductor chip

Semiconductor component in a housing with mechanically inforcing flat conductor webs

Semiconductor device and method for the fabrication thereof including grinding a major portion of the frame

Semiconductor device and fabrication method thereof

Wirebonded device packages for semiconductor devices having elongated electrodes

Bondwire utilized for coulomb counting and safety circuits

Methods of forming wire bonds for semiconductor constructions

Multi-chip module and method of manufacture

Three dimensional packaging optimized for high frequency circuitry

Semiconductor power module package

Methods for providing bias to a monolithic microwave integrated circuit

Power switching control device for electric systems

Memory packages having stair step interconnection layers

Multi-chip semiconductor package

Semiconductor device with a rewiring level and method for producing the same

Semiconductor device having a flexible board for connection to a semiconductor chip mounted on an insulating substrate

Semiconductor device and method of manufacturing the same

Method of manufacturing a semiconductor device

Circuit device

Semiconductor device and electronic device

Semiconductor device with electrically isolated ground structures

Device packages having a III-nitride based power semiconductor device

Lead frame for semiconductor package and method of manufacturing the same

Multilayer printed wiring board

Electric circuit module with improved heat dissipation characteristics using a fixing tool for fixing an electric apparatus to a heat sink

Semiconductor device and manufacturing method thereof

Bonding pad for a packaged integrated circuit

Thin multiple semiconductor die package

Semiconductor device having resin-sealed area on circuit board thereof

Semiconductor light-emitting device, method for manufacturing the same, and light-emitting apparatus including the same

Reinforced bond pad for a semiconductor device

Structure and assembly method of integrated circuit package

Semiconductor device

Power semiconductor module

Semiconductor device, method for manufacturing the semiconductor device and semiconductor substrate

Strobe light control circuit and IGBT device

Electronic device substrate and its fabrication method, and electronic device and its fabrication method

Leadless semiconductor package and manufacturing method thereof

Semiconductor device and an image sensing device

Stacked die package

High density integrated circuit having multiple chips and employing a ball grid array (BGA) and method for making same

Semiconductor device and a manufacturing method of the same

Circuit device and manufacturing method thereof

Semiconductor assembly including chip scale package and second substrate with exposed surfaces on upper and lower sides

Vertically integrated system-in-a-package

Lead frame for a magnetic sensor

Electronic package with a stepped-pitch leadframe

Lead frame and semiconductor device

Package structure having mixed circuit and composite substrate

Method of manufacturing a semiconductor device

Universal interconnect die

Method of manufacturing semiconductor device

Schottky diode device with aluminum pickup of backside cathode

Integrated circuit for communications modules

Semiconductor structure with RF element

Secure system for tracking elements using tags

LED package structure and method for making the same

System for tracking elements using tags

Signal transmission arrangement and method

ELECTRICAL CONTACT

Heatsink apparatus and thermally-conductive intermediate material for dissipating heat in semiconductor packages

Flip-chip adaptor package for bare die

Double density method for wirebond interconnect

Semiconductor device and manufacturing method for the same

Semiconductor chip and semiconductor device including the same

Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device

Method, device and system for bonding a semiconductor element

Preparation of semiconductor device

Electronic package with integrated capacitor

Printed wiring board and method for manufacturing the same

Tape ball grid array package with electromagnetic interference protection and method for fabricating the package

Semiconductor device, semiconductor body and method of manufacturing thereof

High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package

Semiconductor device

Method of manufacture of ceramic composite wiring structures for semiconductor devices

Ultra thin dual chip image sensor package structure and method for fabrication

Semiconductor device and a manufacturing method of the same

Semiconductor device including a semiconductor chip with signal contact areas and supply contact areas, and method for producing the semiconductor device

Semiconductor device, method for designing the same and recording medium that can be read by computer in which program for designing semiconductor device is recorded

Chip-packaging with bonding options having a plurality of package substrates

Integrated circuit package system with die and package combination

Semiconductor package with passive device integration

Integrated circuit package with lead fingers extending into a slot of a die paddle

Methods for assembling semiconductor devices and interposers

Package for high frequency usages and its manufacturing method

Integrated circuit with staggered differential wire bond pairs

Ultra thin dual chip image sensor package structure and method for fabrication

Semiconductor package having double layer leadframe

Integrated circuit package and method of manufacture thereof

Semiconductor device package, method of manufacturing the same, and semiconductor device

Electrical contact

Method of making reinforced semiconductor package

Encapsulation of circuit components to reduce thermal cycling stress

Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment

Method of manufacturing semiconductor device

High frequency semiconductor device

Semiconductor package, ID generating system thereof, ID recognizing system thereof, ID recognition method thereof, semiconductor integrated circuit chip, ID generating system thereof, ID recognizing system thereof, and ID recognition method thereof

Semiconductor device with chip-on-board structure

Semiconductor device with a number of bonding leads and method for producing the same

Semiconductor device

Semiconductor device and its writing method

Module card structure

Semiconductor package having improved adhesiveness and ground bonding

Dual row leadframe and fabrication method

Package stacking lead frame system

Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device

Semiconductor device and manufacturing process therefor

Semiconductor device with micro connecting elements and method for producing the same

Semiconductor device

Semiconductor device

Substrate for an FBGA semiconductor component

Semiconductor device and method of manufacturing the same

Method of manufacturing non-leaded integrated circuit package system having etched differential height lead structures

Semiconductor package with low and high-speed signal paths

Minimized wire bonds in transient blocking unit packaging

Semiconductor apparatus

Semiconductor device and method of making the same

Molded package and semiconductor device using molded package

Semiconductor device including capsule type semiconductor package and semiconductor chip in stacking manner

High performance IC package and method

Microelectronic imaging units and methods of manufacturing microelectronic imaging units

Smart card, smart card module, and a method for production of a smart card module

Wire bonding method

Methods and apparatus for integrated circuit ball bonding with substantially perpendicular wire bond profiles

Device packages

Chip-stacked semiconductor package and method for fabricating the same

Device package

Semiconductor device and method of manufacturing the same

Chip packaging structure adapted to reduce electromagnetic interference

Method and apparatus for packaging an electronic chip

Integrated circuit device having encapsulant dam with chamfered edge

Semiconductor device

Molding tool and a method of forming an electronic device package

Method of making a semiconductor chip assembly using multiple etch steps to form a pillar after forming a routing line

Manufacturing method of semiconductor device

Integrated circuit die connection methods and apparatus

Semiconductor device

Semiconductor package with crossing conductor assembly and method of manufacture

Semiconductor device

Chip on board leadframe for semiconductor components having area array

Chip-type noise filter, manufacturing method thereof, and semiconductor package

Semiconductor device with sense structure

Method for making memory cards and similar devices using isotropic thermoset materials with high quality exterior surfaces

Method for designing integrated circuit package and method for manufacturing same

System-in-package wireless communication device comprising prepackaged power amplifier

Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit

Semiconductor module including circuit component and dielectric film, manufacturing method thereof, and application thereof

Semiconductor device including multiple rows of peripheral circuit units

Multi-surface IC packaging structures and methods for their manufacture

Multimedia card and transfer molding method

Semiconductor device and method of fabricating same

Semiconductor package using flexible film and method of manufacturing the same

Die paddle clamping method for wire bond enhancement

Thin array plastic package without die attach pad and process for fabricating the same

Assembly having wafer with image sensor chips, a photo-sensitive adhesive pattern and plate thereof and method of manufacturing the same

Semiconductor device

Semiconductor apparatus and manufacturing method

High temperature, stable SiC device interconnects and packages having low thermal resistance

Package for gallium nitride semiconductor devices

Semiconductor chip stack package having dummy chip

Lead frame routed chip pads for semiconductor packages

Support device for monolithically integrated circuits

Semiconductor device having signal line and reference potential planes separated by a vertical gap

Semiconductor device with improved arrangement of a through-hole in a wiring substrate

Mounting pad structure for wire-bonding type lead frame packages

Multi-chip package mounted memory card

Circuit device and portable device with symmetrical arrangement

DFN semiconductor package having reduced electrical resistance

Semiconductor package device having reduced mounting height and method for manufacturing the same

Dual flat non-leaded semiconductor package

Semiconductor device

Electrical contact

Interconnection device and system

Electrical contact and connector and method of manufacture

Semiconductor device

Packaging for electronic modules

Stacked electronic component and manufacturing method thereof

Intelligent high-power amplifier module

Semiconductor device having improved adhesion between bonding and ball portions of electrical connectors

Chip support of a leadframe for an integrated circuit package

Semiconductor device having exposed heat dissipating metal plate

Integrated circuit packaging device and method for matching impedance

High power light emitting diode device

Semiconductor device package

Stacked-type semiconductor device

Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication

Semiconductor integrated circuit device and method of manufacturing the same

Semiconductor device and method of fabricating the same

INTEGRATED CIRCUIT PACKAGE WITH INNER GROUND LAYER

Semiconductor device and radio communication device

Semiconductor device and manufacturing method therefor

Method of marking a low profile packaged semiconductor device

Package that integrates passive and active devices with or without a lead frame

Semiconductor package with a controlled impedance bus

Module

PACKAGED CHIP CAPABLE OF LOWERING CHARACTERISTIC IMPEDANCE

Semiconductor chip having coolant path, semiconductor package and package cooling system using the same

System for implementing a configurable integrated circuit

Semiconductor device with a substrate having a spiral shaped coil

Methods of making and using a floating lead finger on a lead frame

Packages for encapsulated semiconductor devices and method of making same

Use of a down-bond as a controlled inductor in integrated circuit applications

Semiconductor device and manufacturing method thereof

BOND POSITIONING METHOD FOR WIRE-BONDING PROCESS AND SUBSTRATE FOR THE BOND POSITIONING METHOD

Housing for power semiconductor modules

Transceiver using low temperature co-fired ceramic method

High density package interconnect wire bond strip line and method therefor

Integrated circuit with stacked-die configuration utilizing substrate conduction

Multi-part lead frame with dissimilar materials

Semiconductor device and a method of manufacturing the same

Electrical-interference-isolated transistor structure

Carrier-free semiconductor package and fabrication method thereof

Printed circuit board having a bond wire shield structure for a signal transmission line

Semiconductor device, its manufacturing method, and radio communication device

Semiconductor package and fabrication method thereof

Mold assembly, method and a package stack via bottom-leaded plastic (BLP) packaging

Memory module having interconnected and stacked integrated circuits

Lead frame assemblies and decoupling capacitors

Power semiconductor device

Bond pad for ball grid array package

Multi-chip module

Wire bond interconnection

Semiconductor device

connection arrangement for micro lead frame plastic packages

Microelectronic assemblies incorporating inductors