207827 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Wire connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
Package-on-package device with supplemental underfill and method for manufacturing the same
#1502Semiconductor device with inductively coupled coils
#1503Power module package having patterned insulation metal substrate
#1504Power module package having patterned insulation metal substrate
#1505Semiconductor device and method for manufacturing the same
#1506Chip on package structure and method
#1507Semiconductor device
#1508Interposer and method for manufacturing interposer
#1509Semiconductor device including a first internal circuit, a second internal circuit and a switch circuit unit
#1510METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
#1511Interfaces and die packages, and appartuses including the same
#1512Thin film light emitting diode
#1513Semiconductor device and electronic device
#1514Printed wiring board
#1515LEADFRAME SUBSTRATE WITH ISOLATOR INCORPORATED THEREIN AND SEMICONDUCTOR ASSEMBLY AND MANUFACTURING METHOD THEREOF
#1516Semiconductor device that includes a molecular bonding layer for bonding of elements
#1517Semiconductor device having improved heat dissipation efficiency
#1518Semiconductor packages including chip enablement pads
#1519Robust low inductance power module package
#1520Leads frames with crossing leads
#1521Flat No-Leads Package With Improved Contact Pins
#1522Pressure-sensing integrated circuit device with diaphragm
#1523Pre-encapsulated lead frames for microelectronic device packages, and associated methods
#1524Substrate for system in package (SIP) devices
#1525Method of manufacturing semiconductor device
#1526Systems and methods for electromagnetic interference shielding
#1527Package-on-package assembly with wire bonds to encapsulation surface
#1528Electro-optic device, electro-optic unit, and electronic apparatus
#1529Module with external shield and back-spill barrier for protecting contact pads
#1530Semiconductor package
#1531Die stack assembly using an edge separation structure for connectivity through a die of the stack
#1532Electronic package with antenna structure
#1533Semiconductor device
#1534Dual lead frame semiconductor package and method of manufacture
#1535Semiconductor device and semiconductor device mounting structure having conductor plates
#1536COATED BOND WIRES FOR DIE PACKAGES AND METHODS OF MANUFACTURING SAID COATED BOND WIRES
#1537Sensor chip package assembly and electronic device having sensor chip package assembly
#1538Semiconductor device and manufacturing method thereof
#1539Leadframe leads having fully plated end faces
#1540Electronic device
#1541Semiconductor device with metal patterns having convex and concave sides
#1542Semiconductor device having conductive wire with increased attachment angle and method
#1543WIRING BOARD WITH ELECTRICAL ISOLATOR AND BASE BOARD INCORPORATED THEREIN AND SEMICONDUCTOR ASSEMBLY AND MANUFACTURING METHOD THEREOF
#1544Stacked chip-on-board module with edge connector
#1545Power electronics assemblies having a semiconductor cooling chip and an integrated fluid channel system
#1546Power electronics assemblies having a wide bandgap semiconductor device and an integrated fluid channel system
#1547Semiconductor module
#1548Electronic component package having electronic component within a frame on a redistribution layer
#1549Resin-encapsulated semiconductor device
#1550Power amplifier modules with bonding pads and related systems, devices, and methods
#1551Methods of making semiconductor device packages and related semiconductor device packages
#1552Semiconductor device
#1553Multi-access memory system and a method to manufacture the system
#1554SEMICONDUCTOR DEVICE
#1555Semiconductor package having multi-phase power inverter with internal temperature sensor
#1556Semiconductor device
#1557SEMICONDUCTOR PACKAGE
#1558Integrated circuit chip packaging
#1559Integrated circuit chip packaging including a heat sink topped cavity
#1560Fingerprint identification module and manufacturing method thereof
#1561Semiconductor photomultiplier
#1562Semiconductor device and manufacturing method
#1563Semiconductor package with lid having lid conductive structure
#1564Multichip modules and methods of fabrication
#1565Integrated circuit device
#1566Method of fabricating semiconductor package including cutting encapsulating body and carrier to form packages
#1567Power converter monolithically integrating transistors, carrier, and components
#1568Inter-chip alignment
#1569Power quad flat no-lead (PQFN) package in a single shunt inverter circuit
#1570Method of manufacturing semiconductor device having semiconductor chip mounted on lead frame
#1571Hall-effect sensor isolator
#1572Low switching loss high performance power module
#1573Semiconductor device
#1574Chip package and method for forming the same
#1575Semiconductor device and manufacturing method thereof
#1576Light emitting apparatus
#1577Multi-chip package system and methods of forming the same
#1578Semiconductor device and method for manufacturing semiconductor device to prevent separation of terminals
#1579Structure and method of reinforcing a conductor soldering point of semiconductor device
#1580Method for fabricating glass substrate package
#1581HYBRID SYSTEM INTEGRATING PACKAGE-ON-PACKAGE SOC AND EMBEDDED MULTI-CHIP PACKAGE ON ONE MAIN CIRCUIT BOARD
#1582Production method for a detection apparatus and detection apparatuses
#1583Optical module
#1584Wire bonded electronic devices to round wire
#1585Power overlay structure and reconstituted semiconductor wafer having wirebonds
#1586Power module
#1587Directional backlights with light emitting element packages
#1588Photonic integrated circuit package
#1589Photonic integrated circuit package
#1590Fan-out multi-chip package with plurality of chips stacked in staggered stack arrangement
#1591Radio frequency power component and radio frequency signal transceiving device
#1592Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces
#1593Leadless electronic packages for GAN devices
#1594Power semiconductor device
#1595Semiconductor device and method of manufacturing the same
#1596Microelectronic package with horizontal and vertical interconnections
#1597Semiconductor module
#1598Semiconductor package structure based on cascade circuits
#1599Electronic package having electromagnetic interference shielding and associated method
#1600Electronic element mounting substrate and electronic device
#1601Method of making a current sensor and current sensor
#1602Flipped die stacks with multiple rows of leadframe interconnects
#1603Semiconductor device
#1604Semiconductor devices with improved thermal and electrical performance
#1605Semiconductor device
#1606METHOD FOR PRODUCING ELECTRONIC DEVICES
#1607Semiconductor device and electric power control apparatus
#1608Power transistor module
#1609Memory devices with controllers under memory packages and associated systems and methods
#1610High power and high frequency plastic pre-molded cavity package
#1611Semiconductor package system and related methods
#1612Automotive electronic device having a cover with fins to reduce gel vibration
#1613PACKAGED SEMICONDUCTOR DEVICES AND RELATED METHODS
#1614Method of manufacturing a semiconductor device
#1615Method of manufacturing semiconductor device
#1616Semiconductor device
#1617SEMICONDUCTOR PACKAGES INCLUDING SIDE SHIELDING PARTS
#1618IC carrier of semiconductor package and manufacturing method thereof
#1619Semiconductor device, package, and vehicle
#1620Semiconductor device and method for manufacturing semiconductor device
#1621Semiconductor device
#1622Semiconductor device with frame having arms and related methods
#1623Semiconductor device with lead frame
#1624Electronic device component with an integral diamond heat spreader
#1625Method for fabricating stack die package
#1626Memory package including buffer, expansion memory module, and multi-module memory system
#1627Half-bridge power semiconductor module and manufacturing method therefor
#1628Heterojunction semiconductor device for reducing parasitic capacitance
#1629Semiconductor package including a device and lead frame used for the same
#1630Broadband radio frequency power amplifiers, and methods of manufacture thereof
#1631Power electronic switching device comprising a plurality of potential surfaces
#1632Display apparatus
#1633Fingerprint recognition chip packaging structure and packaging method
#1634METHOD FOR MANUFACTURING ELECTRO-OPTICAL DEVICE, ELECTRO-OPTICAL DEVICE, AND ELECTRONIC APPARATUS
#1635Microelectronic package with stacked microelectronic units and method for manufacture thereof
#1636Distribution of electronic circuit power supply potentials
#1637Stiffened wires for offset BVA
#1638Wiring with external terminal
#1639SEMICONDUCTOR ASSEMBLY WITH THREE DIMENSIONAL INTEGRATION AND METHOD OF MAKING THE SAME
#1640SEMICONDUCTOR DEVICE WITH A RESIN LAYER AND METHOD OF MANUFACTURING THE SAME
#1641Integrated circuit device
#1642Semiconductor device and method of controlling warpage in reconstituted wafer
#1643Package structure and fabricating method thereof
#1644Semiconductor device
#1645PACKAGING SUBSTRATE FOR SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE AND METHOD
#1646Recessed lead leadframe packages
#1647Solenoid inductor
#1648Low-profile microdisplay module
#1649Circuits and methods for increasing output frequency of an LC oscillator
#1650Semiconductor device and method of manufacturing the same
#1651Semiconductor package
#1652Semiconductor package including stepwise stacked chips
#1653Semiconductor package
#1654Coated bond wires for die packages and methods of manufacturing said coated bond wires
#1655Semiconductor package with coated bonding wires and fabrication method thereof
#1656High-frequency modules
#1657Semiconductor device and semiconductor package
#1658Semiconductor device and method for producing the same
#1659Anchoring structure of fine pitch bva
#1660Output impedance matching circuit for RF amplifier devices, and methods of manufacture thereof
#1661Wire bond wires for interference shielding
#1662Sensor including a printed circuit board with semiconductor parts having a first and second resin
#1663Embedded wire bond wires
#1664Bonding pad arrangement design for multi-die semiconductor package structure
#1665Die attachment for packaged semiconductor device
#1666Semiconductor memory device
#1667Dual-interface IC card module
#1668Semiconductor package assemblies with system-on-chip (SOC) packages
#1669Multi-chip package, system and test method thereof
#1670FLEXIBLY-WRAPPED INTEGRATED CIRCUIT DIE
#1671Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies
#1672METHOD FOR MAKING IC WITH STEPPED SIDEWALL AND RELATED IC DEVICES
#1673Semiconductor device and electronic device
#1674Semiconductor storage device and manufacturing method thereof
#1675Semiconductor device, semiconductor chip, and method of manufacturing semiconductor device
#1676Monolithic microwave integrated circuits
#1677Semiconductor device with separated main terminals
#1678Semiconductor device having terminals directly attachable to circuit board
#1679Semiconductor device
#1680Light emitting diodes, components and related methods
#1681Semiconductor devices and packages and methods of forming semiconductor device packages
#1682Wafer-level packaging using wire bond wires in place of a redistribution layer
#1683Semiconductor device
#1684Radio frequency integrated circuit module
#1685Microelectronic package having stub minimization using symmetrically-positioned duplicate sets of terminals for wirebond assemblies without windows
#1686Power package module of multiple power chips and method of manufacturing power chip unit
#1687SEMICONDUCTOR DEVICE
#1688Semiconductor device and method of manufacturing the semiconductor device
#1689Universal BGA substrate
#1690INTEGRATED CIRCUIT WITH ON-DIE POWER DISTRIBUTION BARS
#1691Semi-hermetic semiconductor package
#1692Method of manufacturing semiconductor device and semiconductor device
#1693Display apparatus with a data driving chip and a gate driving chip disposed on a same side of a display panel
#1694Unpacked structure for power device of radio frequency power amplification module and assembly method therefor
#1695Back-to-back stacked dies
#1696Wire bonding methods and systems incorporating metal nanoparticles
#1697Semiconductor apparatus, method for manufacturing the same, electronic device, and moving body
#1698Packaged device with additive substrate surface modification
#1699Packaged semiconductor device having leadframe features preventing delamination
#1700Electrically conductive barriers for integrated circuits
#1701Method of Manufacturing a Multi-Chip Semiconductor Power Device
#1702High-frequency package
#1703Semiconductor packages having EMI shielding parts and methods of fabricating the same
#1704High-frequency package
#1705Apparatus and methods related to conformal coating implemented with surface mount devices
#1706Method of assembly semiconductor device with through-package interconnect
#1707Semiconductor package including planar stacked semiconductor chips
#1708Semiconductor device having a protective material with a first pH formed around cooper wire bonds and aluminum pads for neutralizes a second pH of an outer encapsulant material
#1709Multi-chip package having encapsulation body to replace substrate core
#1710Semiconductor device and its manufacturing method
#1711Resin-encapsulated semiconductor device and its manufacturing method
#1712Semiconductor device and method for manufacturing the same
#1713Semiconductor device
#1714Semiconductor package
#1715WAFER CIRCUIT
#1716Shielded module having compression overmold
#1717Via pattern to reduce crosstalk between differential signal pairs
#1718Semiconductor component and method of manufacture
#1719Heatsink very-thin quad flat no-leads (HVQFN) package
#1720Semiconductor component and method of manufacture
#1721Resin-encapsulatd semiconductor device and method of manufacturing the same
#1722Semiconductor device manufacturing method
#1723Method for determining a bonding connection in a component arrangement and test apparatus
#1724Semiconductor device and electric power control apparatus
#1725Circuit board having bypass pad
#1726Interposer and circuit substrate
#1727THERMAL ENHANCEMENT FOR QUAD FLAT NO LEAD (QFN) PACKAGES
#1728Methods of making semiconductor device packages and related semiconductor device packages
#1729Power module with the integration of control circuit
#1730Integrated fan-out structure with openings in buffer layer
#1731Lead-free soldering method and soldered article
#1732Semiconductor device with lead terminals having portions thereof extending obliquely
#1733SEMICONDUCTOR PACKAGE
#1734Nitride semiconductor element and nitride semiconductor package
#1735Semiconductor device package having an oscillator and an apparatus having the same
#1736Semiconductor package having an isolation wall to reduce electromagnetic coupling
#1737Semiconductor device including Schottky barrier diode and power MOSFETs and a manufacturing method of the same
#1738Semiconductor integrated circuit device
#1739Packaging structure, packaging method and template used in packaging method
#1740METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#1741Power amplifier modules including tantalum nitride terminated through wafer via and related systems, devices, and methods
#1742Power amplifier modules with harmonic termination circuit and related systems, devices, and methods
#1743Die package with low electromagnetic interference interconnection
#1744Die packaging with fully or partially fused dielectric leads
#1745Power amplifier modules with power amplifier and transmission line and related systems, devices, and methods
#1746Power semiconductor package device having locking mechanism, and preparation method thereof
#1747Method for making semiconductor device with sidewall recess and related devices
#1748Heat isolation structures for high bandwidth interconnects
#1749Low profile integrated circuit (IC) package comprising a plurality of dies
#1750DISPLAY DEVICE
#1751Substrate less die package having wires with dielectric and metal coatings and the method of manufacturing the same
#1752Package substrate and semiconductor package including the same
#1753Electronic device with periphery contact pads surrounding central contact pads
#1754Mixed impedance leads for die packages and method of making the same
#1755Semiconductor package including substrates spaced by at least one electrical connecting element
#1756SEMICONDUCITIVE CATECHOL GROUP ENCAPSULANT ADHESION PROMOTER FOR A PACKAGED ELECTRONIC DEVICE
#1757Semiconductor device that transfers an electric signal with a set of inductors
#1758Semiconductor device
#1759Radio frequency shielding within a semiconductor package
#1760Apparatus for stacked semiconductor packages and methods of fabricating the same
#1761Semiconductor package
#1762Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
#1763Reversible top/bottom MEMS package
#1764Package assembly
#1765Printed circuit board, method, and semiconductor package
#1766Method of manufacturing semiconductor device and wire bonding apparatus
#1767Shielded electronic component package
#1768Impedance matching configuration
#1769Semiconductor device
#1770Power semiconductor module
#1771Semiconductor device and manufacturing method of the same
#1772SEMICONDUCTOR DEVICE PACKAGE
#1773Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated by the same
#1774RF amplifier output circuit device with integrated current path, and methods of manufacture thereof
#1775Stacked semiconductor die assemblies with support members and associated systems and methods
#1776Semiconductor device
#1777Power semiconductor device and method of manufacturing the same
#1778Power semiconductor module
#1779Semiconductor device
#1780SILICON-ON-INSULATOR DEVICES HAVING CONTACT LAYER
#1781Stacked semiconductor die assemblies with die support members and associated systems and methods
#1782Semiconductor device with bond pad wiring lead-out arrangement avoiding bond pad probe mark area
#1783Circuit packages including modules that include at least one integrated circuit
#1784SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#1785Package-on-package type semiconductor device which is realized through applying not a TSV technology but a fan-out wafer level package technology
#1786Semiconductor integrated circuit layout structure
#1787Methods for connecting inter-layer conductors and components in 3D structures
#1788IMPROVED MATCHING TECHNIQUES FOR WIDE-BANDGAP POWER TRANSISTORS
#1789Magneto-resistive chip package including shielding structure
#1790SEMICONDUCTOR DEVICE AND OPTICAL COUPLING DEVICE
#1791Wafer-level packaging using wire bond wires in place of a redistribution layer
#1792Coupling of side surface contacts to a circuit platform
#1793Semiconductor device and method for manufacturing the same
#1794Semiconductor device, and alternator and power conversion device which use same
#1795Semiconductor device
#1796Optical coupling device having a drive circuit on a ground frame to drive a light emitting element on a power frame
#1797Transistor arrangement
#1798Method of fabricating a lead frame by additive process
#1799Semiconductor device
#1800Power semiconductor device