207827 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Wire connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
Package for light emitting apparatus and light emitting apparatus including the same
#1802BONDING PAD ARRANGMENT DESIGN FOR SEMICONDUCTOR PACKAGE
#1803Semiconductor packages including interconnection members
#1804High-frequency device including high-frequency switching circuit
#1805Support terminal integral with die pad in semiconductor package
#1806High voltage polymer dielectric capacitor isolation device
#1807Wiring substrate and method for manufacturing wiring substrate
#1808Semiconductor device
#1809Semiconductor package
#1810Semiconductor device
#1811Switching device and electronic circuit
#1812Chip on package structure and method
#1813Stacked package configurations and methods of making the same
#1814ELECTRONIC CONNECTION STRUCTURE FOR COUPLING PINS OF CHIP WITH WIRING CIRCUIT AND PANEL USING SAME
#1815Methods for forming semiconductor device packages
#1816Metal top stacking package structure and method for manufacturing the same
#1817Semiconductor device packages
#1818Semiconductor package with integrated output inductor using conductive clips
#1819Semiconductor substrate structure, semiconductor package and method of manufacturing the same
#1820Semiconductor chip, flip chip package and wafer level package including the same
#1821Semiconductor device and manufacturing method
#1822Current sensor isolation
#1823Integrated circuit package having wirebonded multi-die stack
#1824Semiconductor device
#1825Lead frames with wettable flanks
#1826Wiring module including wiring substrate having border portion separating two side metallic foils and manufacturing method of wiring module
#1827Adjustable losses of bond wire arrangement
#1828Semiconductor device having a sealing layer covering a semiconductor memory unit and a memory controller
#1829High-frequency amplifier
#1830SEMICONDUCTOR MODULE
#1831Embedded circuit package
#1832Systems and Methods for Main Distribution on an Integrated Circuit
#1833Source down semiconductor devices and methods of formation thereof
#1834Method for package-on-package assembly with wire bonds to encapsulation surface
#1835Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask
#1836Power semiconductor module and composite module
#1837Method of manufacturing semiconductor device and semiconductor device
#1838Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
#1839Integrated circuit underfill scheme
#1840Method of manufacturing semiconductor device and semiconductor device
#1841Semiconductor device
#1842Switch circuit of cascode type having high speed switching performance
#1843Wire bonding method
#1844Compensation of bondwires in the microwave regime
#1845Leadless electronic packages for GaN devices
#1846Electrostatic discharge protection for a balun
#1847Multichip stacking package structure and method for manufacturing the same
#1848Power package lid
#1849Semiconductor device with an isolation structure coupled to a cover of the semiconductor device
#1850Semiconductor device
#1851Semiconductor modules and methods of forming the same
#1852Singulation method for semiconductor package with plating on side of connectors
#1853Chip rotated at an angle mounted on die pad region
#1854Amplifier
#1855Magnetically coupled galvanically isolated communication using lead frame
#1856Semiconductor device with power transistors coupled to diodes
#1857Semiconductor device module with solder layer
#1858Multi-die wirebond packages with elongated windows
#1859Semiconductor device and manufacturing method thereof
#1860Semiconductor chip package having contact pins at short side edges
#1861Power semiconductor module
#1862Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereof
#1863SEMICONDUCTOR PACKAGE
#1864Semiconductor device
#1865Repackaged integrated circuit and assembly method
#1866Module and method for manufacturing the module
#1867High-frequency semiconductor amplifier
#1868Optoelectronic light-emitting component and leadframe assemblage
#1869Offset interposers for large-bottom packages and large-die package-on-package structures
#1870Semiconductor device
#1871DC-DC converter having terminals of semiconductor chips directly attachable to circuit board
#1872Semiconductor device and method for manufacturing semiconductor device
#1873Power module and fabrication method for the same
#1874Package-on-package assembly with wire bonds to encapsulation surface
#1875Semiconductor packages having wire bond wall to reduce coupling
#1876Method of producing a semiconductor package
#1877Connection pads for a fingerprint sensing device
#1878High current, low switching loss SiC power module
#1879Semiconductor device and method of manufacturing the same
#1880Semiconductor package and method of manufacturing the same
#1881Packaged semiconductor device having leadframe features preventing delamination
#1882Semiconductor device
#1883Integrated circuit (IC) package with thick die pad functioning as a heat sink
#1884Method of manufacturing a semiconductor device including through silicon plugs
#1885Isolator with reduced susceptibility to parasitic coupling
#1886Cascode transistor device and manufacturing method thereof
#1887Light emitting device
#1888Semiconductor packages and related methods
#1889High frequency integrated circuit and packaging for same
#1890Semiconductor device
#1891Stacked chip-on-board module with edge connector
#1892Method of making an electronic device including two-step encapsulation and related devices
#1893METHOD AND STRUCTURE FOR FAN-OUT WAFER LEVEL PACKAGING
#1894Detecting and driving load using transistor
#1895Semiconductor photomultiplier
#1896Environmental hardened packaged integrated circuit
#1897Multi-chips in system level and wafer level package structure
#1898Semiconductor package including a plurality of stacked chips
#1899Semiconductor devices with impedance matching-circuits
#1900Integrated circuit device with plating on lead interconnection point and method of forming the device
#1901Integrated circuit (IC) package with a solder receiving area and associated methods
#1902Integrated circuit device with shaped leads and method of forming the device
#1903DC-DC converter with a switching transistor arranged in an area where an inductor overlaps a substrate
#1904INTEGRATED CIRCUIT PACKAGE WITH POWER PLATES
#1905Radio frequency isolation structure with racetrack
#1906Semiconductor device
#1907Substrate-less stackable package with wire-bond interconnect
#1908Chip carrier with dual-sided chip access and a method for testing a chip using the chip carrier
#1909Semiconductor device
#1910Semiconductor device
#1911Semiconductor die and package jigsaw submount
#1912Racetrack layout for radio frequency shielding
#1913Flow sensor package
#1914High-frequency module
#1915Nitride semiconductor element and nitride semiconductor package
#1916Switching element with a series-connected junction FET (JFET) and MOSFET achieving both improved withstand voltage and reduced on-resistance
#1917Method of manufacturing semiconductor device and semiconductor device
#1918Semiconductor device and measurement device
#1919Resin-encapsulated semiconductor device and its manufacturing method
#1920Memory devices with controllers under memory packages and associated systems and methods
#1921Semiconductor device and manufacturing method thereof
#1922SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#1923Integrated matching circuit for a high frequency amplifier
#1924Semiconductor device
#1925Thin film light emitting diode
#1926Semiconductor device
#1927SEMICONDUCTOR POWER MODULE USING DISCRETE SEMICONDUCTOR COMPONENTS
#1928SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
#1929Method of forming a bondpad and bondpad
#1930Low-noise arrangement for very-large-scale integration differential input/output structures
#1931Semiconductor package
#1932Semiconductor device
#1933OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-ON-PACKAGE STRUCTURES
#1934Method for manufacturing semiconductor device, and semiconductor device
#1935Semiconductor die arrangement
#1936Non-planar inductive electrical elements in semiconductor package lead frame
#1937Broadband radio frequency power amplifiers, and methods of manufacture thereof
#1938Semiconductor chip and a semiconductor package having a package on package (POP) structure including the semiconductor chip
#1939Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method
#1940Semiconductor device comprising a conductive film joining a diode and switching element
#1941Semiconductor device and measurement device
#1942Interconnect crack arrestor structure and methods
#1943PACKAGED SEMICONDUCTOR DEVICES AND RELATED METHODS
#1944Electronic device with first and second contact pads and related methods
#1945Semiconductor module, semiconductor device, and vehicle
#1946Method for producing a printed circuit, printed circuit obtained by this method and electronic module comprising such a printed circuit
#1947Robust and Reliable Power Semiconductor Package
#1948Power overlay structure having wirebonds and method of manufacturing same
#1949Semiconductor device having a plurality of circuits arranged on a side of a semiconductor chip
#1950IC module, dual IC card, and method for manufacturing IC module
#1951Discrete flexible interconnects for modules of integrated circuits
#1952High isolation wideband switch
#1953ALUMINUM ALLOY LEAD FRAME FOR A SEMICONDUCTOR DEVICE AND CORRESPONDING MANUFACTURING PROCESS
#1954Chip package and method for forming the same
#1955Semiconductor packages and modules with integrated ferrite material
#1956Optoelectronic packages having through-channels for routing and vacuum
#1957SEMICONDUCTOR DEVICE
#1958Semiconductor device
#1959Power module with a plurality of patterns with convex and concave side
#1960Flexible circuit leads in packaging for radio frequency devices
#1961Input/output termination for ripple prevention
#1962Optoelectronic packages having magnetic field cancelation
#1963Packaged device with additive substrate surface modification
#1964QUAD-FLAT NON-LEAD PACKAGE STRUCTURE AND METHOD OF PACKAGING THE SAME
#1965Semiconductor device and method of manufacturing the same
#1966Stackable molded microelectronic packages with area array unit connectors
#1967Semiconductor package having cascaded chip stack
#1968PACKAGE SUBSTRATE
#1969Semiconductor device
#1970Lighting system
#1971Semiconductor package assemblies with system-on-chip (SOC) packages
#1972SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#1973Multichip modules and methods of fabrication
#1974Integrated circuit with electromagnetic communication
#1975SEMICONDUCTOR PACKAGE
#1976Semiconductor device including semiconductor chips stacked over substrate
#1977Semiconductor device and its manufacturing method
#1978Intramodule radio frequency isolation
#1979Semiconductor module
#1980Low-inductance circuit arrangement comprising load current collecting conductor track
#1981SEMICONDUCTOR PACKAGE
#1982Method of manufacturing semiconductor device
#1983Semiconductor package having overhang portion
#1984SEMICONDUCTOR DEVICE EMPLOYING ALUMINUM ALLOY LEAD-FRAME WITH ANODIZED ALUMINUM
#1985Semiconductor device
#1986Wire bonds for electronics
#1987Radio frequency module including segmented conductive ground plane
#1988Thin plastic leadless package with exposed metal die paddle
#1989Chip-on-film package having bending part
#1990Floating mold tool for semicondcutor packaging
#1991Radio frequency module including segmented conductive top layer
#1992Semiconductor package
#1993Power converter package using driver IC
#1994Dual power converter package
#1995Semiconductor device and DC-to-DC converter
#1996Stack packages and methods of manufacturing the same
#1997Semiconductor device and method of fabricating same
#1998Semiconductor device and method of manufacturing the same
#1999Semiconductor package having etched foil capacitor integrated into leadframe
#2000Electronic component with a leadframe
#2001SEMICONDUCTOR DEVICE
#2002Semiconductor device with coils in different wiring layers
#2003Stacked synchronous buck converter having chip embedded in outside recess of leadframe
#2004Semiconductor device and lead frame used for the same
#2005Wafer level flat no-lead semiconductor packages and methods of manufacture
#2006Circuit device, electronic apparatus and moving object
#2007Semiconductor device
#2008RADIO FREQUENCY SHIELDING CAVITY PACKAGE
#2009Electronic device
#2010Semiconductor module with ultrasonically welded terminals
#2011Electronic device and mounting structure of the same
#2012Semiconductor device including Schottky barrier diode and power MOSFETs and a manufacturing method of the same
#2013Cascode power transistors
#2014Semiconductor package and method of fabricating the same
#2015Radio frequency power device
#2016EXPOSED DIE QUAD FLAT NO-LEADS (QFN) PACKAGE
#2017Integrated passive device assemblies for RF amplifiers, and methods of manufacture thereof
#2018Semiconductor device and manufacturing method
#2019Semiconductor device having low on resistance
#2020Multiple bond via arrays of different wire heights on a same substrate
#2021Surface finish for wirebonding
#2022Resin sealing type semiconductor device and method of manufacturing the same, and lead frame
#2023Semiconductor device and manufacturing method of semiconductor device
#2024Wire-pull test location identification on a wire of a microelectronic package
#2025Semiconductor device
#2026Semiconductor device and semiconductor package
#2027SEMICONDUCTOR DEVICE
#2028Microelectronic package with consolidated chip structures
#2029Method of manufacturing semiconductor device
#2030Semiconductor device, semiconductor device design method, semiconductor device design apparatus, and program
#2031Semiconductor device
#2032Semiconductor device with a heat-dissipating plate
#2033Microfluidic delivery member with filter and method of forming same
#2034High-voltage energy storage module and method for producing the high-voltage energy storage module
#2035Stack of integrated-circuit chips and electronic device
#2036Semiconductor device having power distribution using bond wires
#2037Silicon shield for package stress sensitive devices
#2038Power module semiconductor device
#2039Semiconductor device
#2040Methods, circuits and systems for a package structure having wireless lateral connections
#2041Semiconductor device
#2042Integrated electronic package and method of fabrication
#2043Semiconductor device and method of manufacturing the same
#2044Semiconductor device
#2045Method for making semiconductor device with lead frame made from top and bottom components and related devices
#2046Semiconductor device and method for manufacturing the same
#2047Semiconductor device with encapsulated lead frame contact area and related methods
#2048Electronic component device
#2049Semiconductor device
#2050CONDUCTOR DESIGN FOR INTEGRATED MAGNETIC DEVICES
#2051Microelectronic packages having cavities for receiving microelectronic elements
#2052STACKED DIE PACKAGE WITH REDISTRIBUTION LAYER
#2053Smart card module, smart card, and method for producing a smart card module
#2054Methods of manufacturing and operating die-to-die inductive communication devices
#2055Detecting and driving load using MOS transistor
#2056Structures and methods for shielding magnetically sensitive components
#2057SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
#2058Bonding pad arrangment design for multi-die semiconductor package structure
#2059Semiconductor device including filling material provided in space defined by three semiconductor chips
#2060Semiconductor device with mechanical lock features between a semiconductor die and a substrate
#2061Semiconductor package with shielding member and method of manufacturing the same
#2062Printed circuit board having traces and ball grid array package including the same
#2063Semiconductor package
#2064Chip rotated at an angle mounted on die pad region
#2065Semiconductor chip covered with sealing resin having a filler material
#2066Metal base substrate, power module, and method for manufacturing metal base substrate
#2067Memory device comprising programmable command-and-address and/or data interfaces
#2068Power amplifier modules with bifet and harmonic termination and related systems, devices, and methods
#2069Power amplifier modules including bipolar transistor with grading and related systems, devices, and methods
#2070Power amplifier modules including wire bond pad and related systems, devices, and methods
#2071High-frequency device including high-frequency switching circuit
#2072Systems and methods for high-speed, low-profile memory packages and pinout designs
#2073Semiconductor device including sense insulated-gate bipolar transistor
#2074Chip package and method for forming the same
#2075CHIP PACKAGE AND METHOD FOR FORMING THE SAME
#2076Semiconductor device and a manufacturing method thereof
#2077Semiconductor device with notched main lead
#2078Devices and systems comprising drivers for power conversion circuits
#2079Semiconductor device
#2080DC-DC converter having terminals of semiconductor chips directly attachable to circuit board
#2081Enhanced flash chip and method for packaging chip
#2082Semiconductor device and method of fabricating semiconductor device
#2083Fabrication method of semiconductor device, evaluation method of semiconductor device, and semiconductor device
#2084Stacked semiconductor die assemblies with die support members and associated systems and methods
#2085Stacked semiconductor die assemblies with support members and associated systems and methods
#2086Stacked chip package including substrate with recess adjoining side edge of substrate and method for forming the same
#2087Binding wire and semiconductor package structure using the same
#2088Structures for reducing corrosion in wire bonds
#2089Semiconductor package and system with an isolation structure to reduce electromagnetic coupling
#2090Nonvolatile memory device having authentication, and methods of operation and manufacture thereof
#2091Integrated circuit package including miniature antenna
#2092SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR MODULE INCLUDING THE SAME
#2093Multi-use substrate for integrated circuit
#2094Semiconductor device and method of manufacturing the semiconductor device
#2095Semiconductor apparatus including a heat dissipating member
#2096Semiconductor stacked package
#2097Encapsulated molded package with embedded antenna for high data rate communication using a dielectric waveguide
#2098Semiconductor device for reducing propagation time of gate input signals
#2099Semiconductor device for reducing gate wiring length
#2100Multiple die layout for facilitating the combining of an individual die into a single die