207827 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Wire connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
Semiconductor device and method for manufacturing semiconductor device
#2102SEMICONDUCTOR DIE PACKAGE AND METHOD OF ASSEMBLING SAME
#2103Module comprising a semiconductor chip
#2104Quad flat no-lead package and manufacturing method thereof
#2105Combined QFN and QFP semiconductor package
#2106Method for making a sensor device using a graphene layer
#2107Semiconductor device with output circuit and pad arrangements
#2108Integrated circuit device
#2109Power semiconductor device
#2110Power module semiconductor device and inverter equipment, and fabrication method of the power module semiconductor device, and metallic mold
#2111Heat management in electronics packaging
#2112Chip to dielectric waveguide interface for sub-millimeter wave communications link
#2113Power semiconductor package with a common conductive clip
#2114EMBEDDED CHIPS
#2115Wire bonding method employing two scrub settings
#2116Structure for aluminum pad metal under ball bond
#2117Chip package and method for forming the same
#2118Semiconductor device having lead frame with notched inner leads
#2119Method for manufacturing electrical connections in a semiconductor device and the semiconductor device
#2120Dual-interface IC card components and method for manufacturing the dual-interface IC card components
#2121Semiconductor device and method of manufacturing the same
#2122POWER SEMICONDUCTOR DEVICE
#2123Semiconductor chip and semiconductor package having the same
#2124Semiconductor device
#2125Power semiconductor device
#2126Lead frame with mold lock structure
#2127WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE USING THE SAME
#2128Semiconductor device
#2129SEMICONDUCTOR MEMORY DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR MEMORY DEVICE
#2130Semiconductor device and manufacturing method thereof
#2131Integrated circuit (“IC”) assembly includes an IC die with a top metallization layer and a conductive epoxy layer applied to the top metallization layer
#2132Semiconductor chip and semiconductor package
#2133Semiconductor device and method of manufacturing the same
#2134SEMICONDUCTOR DEVICE EMPLOYING ALUMINUM ALLOY LEAD-FRAME WITH ANODIZED ALUMINUM
#2135Semiconductor package with lead mounted power bar
#2136Manufacturing method of semiconductor device and semiconductor device
#2137STRUCTURE AND METHOD OF PACKAGED SEMICONDUCTOR DEVICES WITH BENT-LEAD QFN LEADFRAMES
#2138Packaging mechanisms for dies with different sizes of connectors
#2139Semiconductor packages and data storage devices including the same
#2140Semiconductor device, method of manufacturing a semiconductor device, and positioning jig
#2141Exposed die power semiconductor device
#2142Semiconductor device packaging having plurality of wires bonding to a leadframe
#2143Package-on-package assembly with wire bond vias
#2144Semiconductor device with lead terminals having portions thereof extending obliquely
#2145Semiconductor device having plated outer leads exposed from encapsulating resin
#2146Semiconductor device
#2147Method of manufacturing light-emitting device and wiring substrate for light-emitting element
#2148CHIP PACKAGE STRUCTURE
#2149Semiconductor device manufacturing method
#2150Method and apparatus for incorporating passive devices in an integrated passive device separate from a die
#2151Semiconductor device
#2152Multiple die in a face down package
#2153Semiconductor device grid array package
#2154Semiconductor chip and semiconductor chip package each having signal paths that balance clock skews
#2155Semiconductor package and fabrication method thereof
#2156Multi-chip module with stacked face-down connected dies
#2157Semiconductor package with a bridge interposer
#2158Integrated circuit package
#2159STACKED SEMICONDUCTOR PACKAGES, METHODS FOR FABRICATING THE SAME, AND /OR SYSTEMS EMPLOYING THE SAME
#2160Semiconductor device including alternating stepped semiconductor die stacks
#2161Semiconductor package including a power stage and integrated output inductor
#2162Semiconductor device
#2163Semiconductor device
#2164Semiconductor device
#2165Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor device
#2166Methods of making a monolithic microwave integrated circuit
#2167Semiconductor device having semiconductor chip with large and small irregularities on upper and lower side surface portions thereof
#2168Packaged semiconductor device having a shielding against electromagnetic interference and manufacturing process thereof
#2169Electric power semiconductor device
#2170Power Semiconductor Module
#2171Semiconductor device including independent film layer for embedding and/or spacing semiconductor die
#2172DC-DC converter having terminals of semiconductor chips directly attachable to circuit board
#2173Semiconductor device and connection checking method for semiconductor device
#2174Semiconductor device
#2175Impedance controlled electrical interconnection employing meta-materials
#2176SEMICONDUCTOR DEVICE WITH PACKAGE-LEVEL DECOUPLING CAPACITORS FORMED WITH BOND WIRES
#2177Device and method of manufacturing the same
#2178Semiconductor device with reduced thickness
#2179Stacked synchronous buck converter having chip embedded in outside recess of leadframe
#2180Magnetically coupled galvanically isolated communication using lead frame
#2181Semiconductor device and method of manufacture thereof
#2182Amplifier
#2183Light-emitting module
#2184STACKED ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
#2185Flexibly-wrapped integrated circuit die
#2186Microelectronic unit and package with positional reversal
#2187SEMICONDUCTOR DIE WITH VARIABLE LENGTH BOND PAD
#2188SEMICONDUCTOR STRUCTURE
#2189Integrated package assembly for switching regulator
#2190Leadless package type power semiconductor module
#2191SEMICONDUCTOR DEVICE HAVING LEADFRAME WITH PRESSURE-ABSORBING PAD STRAPS
#2192Power semiconductor module
#2193Power conversion device
#2194Apparatus and method for harvesting energy in an electronic device
#2195Method of manufacturing semiconductor device
#2196System-in-package module and manufacture method for a system-in-package module
#2197Stackable microelectronic package structures
#2198Semiconductor device
#2199Semiconductor device having mirror-symmetric terminals and methods of forming the same
#2200Package with terminal pins with lateral reversal point and laterally exposed free end
#2201Semiconductor package with conductive clips
#2202Reversible top/bottom MEMS package
#2203Preparation method of a thin power device
#2204Optoelectronic system
#2205Wafer level package structure and method of forming same
#2206Stackable microelectronic package structures
#2207Wire Stitch Bond Having Strengthened Heel
#2208EMICONDUCTOR DEVICE WITH DIE TOP POWER CONNECTIONS
#2209SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
#2210Method For Treating A Leadframe Surface And Device Having A Treated Leadframe Surface
#2211Semiconductor device
#2212Semiconductor package including a connecting member
#2213Semiconductor device
#2214Semiconductor device and a manufacturing method thereof
#2215LED package with multiple element light source and encapsulant having curved and/or planar surfaces
#2216Method of making stacked multi-chip packaging structure
#2217Semiconductor device
#2218Pre-molded integrated circuit packages
#2219Molding method for COB-EUSB devices and metal housing package
#2220Die-to-die inductive communication devices and methods
#2221Stacked packaged integrated circuit devices, and methods of making same
#2222Method and apparatus for multi-chip structure semiconductor package
#2223Method for manufacturing semiconductor apparatus
#2224Package structure integrating a start-up component, a controller, and a power switch
#2225Semiconductor device and method of manufacturing the same
#2226Semiconductor package for III-nitride transistor stacked with diode
#2227Power converter package with an integrated output inductor
#2228Electronic package, package carrier, and method of manufacturing package carrier
#2229Switch mode power converters using magnetically coupled galvanically isolated lead frame communication
#2230SEMICONDUCTOR DIE PACKAGE WITH INSULATED WIRES FOR ROUTING POWER SIGNALS
#2231Stacked die sensor package
#2232Power semiconductor device to reduce voltage variation between terminals
#2233Semiconductor device including a MOSFET and having a super-junction structure
#2234Semiconductor device and semiconductor device mounting structure
#2235Semiconductor device with sealed semiconductor chip
#2236Electronic device with first and second contact pads and related methods
#2237Low profile wire bonded USB device
#2238Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics
#2239Electronic component having a corrosion-protected bonding connection and method for producing the component
#2240Semiconductor device assembly with package interconnect extending into overlying spacer material, and associated systems, devices, and methods
#2241ENHANCED DIE-UP BALL GRID ARRAY AND METHOD FOR MAKING THE SAME
#2242Semiconductor device, method of manufacturing the same, in-millimeter-wave dielectric transmission device, method of manufacturing the same, and in-millimeter-wave dielectric transmission system
#2243Multi-die sensor device
#2244Semiconductor sensor chips
#2245Substrate for semiconductor package and semiconductor package having the same
#2246Camera module and electronic device
#2247Nanoelectromechanical antifuse and related systems
#2248Defense against counterfeiting using antifuses
#2249Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#2250Electronic device and method of fabricating an electronic device
#2251Microelectronic package and method of manufacture thereof
#2252Semiconductor package and method of fabricating the same
#2253Ball grid array semiconductor package and method of manufacturing the same
#2254Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die
#2255Transformer input matched transistor
#2256Semiconductor device and method for producing semiconductor device
#2257Semiconductor integrated circuit device
#2258Semiconductor die laminating device with independent drives
#2259Semiconductor module
#2260Flip-chip, face-up and face-down centerbond memory wirebond assemblies
#2261Stacked semiconductor package including a smaller-area semiconductor chip
#2262Semiconductor module for electric power
#2263Semiconductor device
#2264Transistor arrangement
#2265Semiconductor device package
#2266Power semiconductor module having pattern laminated region
#2267Semiconductor Device and Method for Manufacturing Semiconductor Device
#2268Processes and structures for IC fabrication
#2269Semiconductor device
#2270Semiconductor package and method of fabricating the same
#2271Stacked die package with aligned active and passive through-silicon vias
#2272Semiconductor device and manufacturing method thereof
#2273Submount, encapsulated semiconductor element, and methods of manufacturing the same
#2274SEMICONDUCTOR MODULE CARRYING THE SAME
#2275Semiconductor devices with output circuit and pad
#2276Unpacked structure for power device of radio frequency power amplification module and assembly method therefor
#2277Semiconductor device for battery power voltage control
#2278Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereof
#2279Multi-die wirebond packages with elongated windows
#2280Semiconductor device
#2281Package-on-package assembly with wire bonds to encapsulation surface
#2282Semiconductor device including heat dissipating structure
#2283Semiconductor device
#2284Semiconductor device
#2285Semiconductor device and measurement device having an oscillator
#2286Optical module
#2287Semiconductor module and method for manufacturing the same
#2288Power semiconductor device
#2289SEMICONDUCTOR DEVICE AND METHOD OF INSPECTING THE SAME
#2290Substrate-less stackable package with wire-bond interconnect
#2291Semiconductor device and method for manufacturing the same
#2292Multi-die power semiconductor device packaged on a lead frame unit with multiple carrier pins and a metal clip
#2293Substrate for mounting multiple power transistors thereon and power semiconductor module
#2294Monolithic bidirectional silicon carbide switching devices
#2295Interconnecting structure for electrically connecting a first electronic device with a second electronic device
#2296Multichip power semiconductor device
#2297Semiconductor device
#2298Semiconductor device and method of manufacturing the semiconductor device
#2299Dense-pitch small-pad copper wire bonded double IC chip stack packaging piece and preparation method therefor
#2300Apparatus and methods for reducing impact of high RF loss plating
#2301Power semiconductor package with gate and field electrode leads
#2302Semiconductor packages having multiple lead frames and methods of formation thereof
#2303Stack packages having token ring loops
#2304SEMICONDUCTOR DEVICE
#2305Semiconductor package including multiple chips and separate groups of leads
#2306Adhesive sheet and method for manufacturing semiconductor device
#2307Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another
#2308Semiconductor package
#2309Semiconductor package having a baseplate with a die attach region and a peripheral region
#2310Methods to fabricate a radio frequency integrated circuit
#2311Semiconductor device sealed in a resin section and method for manufacturing the same
#2312Image forming apparatus, chip, and chip package to reduce cross-talk between signals
#2313Molded semiconductor package with backside die metallization
#2314Electronic circuit device
#2315Semiconductor device and method of manufacturing the same
#2316Segmented bond pads and methods of fabrication thereof
#2317Pad configurations for an electronic package assembly
#2318Fine Pitch stud POP Structure and Method
#2319Method for manufacturing semiconductor device and semiconductor device
#2320Method for assembling a microelectronic chip element on a wire element, and installation enabling assembly to be performed
#2321Semiconductor device, method of manufacturing the semiconductor device, and electronic device
#2322Method for package-on-package assembly with wire bonds to encapsulation surface
#2323IMAGE FORMING APPARATUS, CHIP, AND CHIP PACKAGE
#2324Semiconductor device and method of assembling same
#2325Manufacturing method of semiconductor device and semiconductor device
#2326III-nitride device and FET in a package
#2327Methods of forming conductive jumper traces
#2328Semiconductor device, transmission system, method for manufacturing semiconductor device, and method for manufacturing transmission system
#2329Semiconductor packages having wire bond wall to reduce coupling
#2330Semiconductor package having wire bond wall to reduce coupling
#2331Semiconductor device comprising an output driver circuitry, a packaged semiconductor device and associated methods
#2332Wire tail connector for a semiconductor device
#2333Semiconductor packages and electronic systems including the same
#2334Semiconductor device and method of using substrate with conductive posts and protective layers to form embedded sensor die package
#2335Packaged semiconductor device
#2336Semiconductor device and a method of manufacturing the same
#2337Leadless semiconductor package and method of manufacture
#2338Semiconductor package
#2339Semiconductor device and method for manufacturing the same
#2340Semiconductor device
#2341Semiconductor device with integrated antenna
#2342Method for producing a semiconductor module
#2343Dual lead frame semiconductor package and method of manufacture
#2344SEMICONDUCTOR DEVICE AND MICROPHONE
#2345Semiconductor substrate and semiconductor chip
#2346Semiconductor device and method for manufacturing the same
#2347Semiconductor device and radio communication device
#2348Semiconductor device
#2349Delta modulated low-power EHF communication link
#2350Semiconductor device and manufacturing method of semiconductor device
#2351Semiconductor package with integrated interference shielding and method of manufacture thereof
#2352Semiconductor device
#2353Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices
#2354Semiconductor device
#2355Hybrid semiconductor package
#2356Semiconductor device, electronic apparatus, and method of manufacturing semiconductor device
#2357Module and assembly with dual DC-links for three-level NPC applications
#2358Semiconductor device having a plurality of circuits arranged on a side of a semiconductor chip
#2359Elimination of Die-Top Delamination
#2360Illumination device
#2361Stacked chip package and method for forming the same
#2362Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof
#2363Resin-encapsulated semiconductor device and its manufacturing method
#2364Dual lead frame semiconductor package and method of manufacture
#2365Semiconductor device including DC-DC converter
#2366Semiconductor device
#2367Microelectronic devices and microelectronic support devices, and associated assemblies and methods
#2368Manufacturing method of wafer level package
#2369Integrated circuit package including embedded thin-film battery
#2370Semiconductor device, substrate and semiconductor device manufacturing method
#2371Semiconductor device including a DC-DC converter
#2372Chip package and manufacturing method thereof
#2373No-exposed-pad ball grid array (BGA) packaging structures and method for manufacturing the same
#2374SEMICONDUCTOR PACKAGE WITH WIRE BONDING
#2375Semiconductor device manufacturing method and semiconductor device
#2376Semiconductor device
#2377Apparatus and methods related to ground paths implemented with surface mount devices
#2378Detection of defective electrical connections
#2379Semiconductor package
#2380Semiconductor device and electronic apparatus
#2381Wafer scale technique for interconnecting vertically stacked dies
#2382Resin-sealed semiconductor device and associated wiring and support structure
#2383Semiconductor device having an inductor mounted on a back face of a lead frame
#2384Impedance controlled packages with metal sheet or 2-layer rdl
#2385Stacked semiconductor package
#2386Chip package and method of manufacturing the same
#2387Semiconductor device and method of forming shielding layer over active surface of semiconductor die
#2388System and method of sensing current in a power semiconductor device
#2389Power converter
#2390Semiconductor device
#2391Semiconductor device and method for manufacturing the same
#2392Semiconductor device and method for manufacturing the same
#2393Semiconductor device that attenuates high-frequency oscillation
#2394Method of manufacturing semiconductor device
#2395Method for fabricating stack die package
#2396Formulation for packaging an electronic device and assemblies made therefrom
#2397Method for connecting inter-layer conductors and components in 3D structures
#2398Semiconductor package and printed circuit board
#2399Semiconductor package assembly with decoupling capacitor
#2400Semiconductor device