212004 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Formation of connectors without UBM
#2702Conductive shield for semiconductor package
#2703Method of manufacturing semiconductor device and semiconductor device
#2704Surface mounted piezoelectric vibrator
#2705Fabricating a proximity sensor having light-blocking structure in leadframe
#2706Interposer-chip-arrangement for dense packaging of chips
#2707Methods of forming semiconductor die assemblies
#2708Method for handling very thin device wafers
#2709Electronic device
#2710Electronic package, package carrier, and method of manufacturing package carrier
#2711Switch mode power converters using magnetically coupled galvanically isolated lead frame communication
#2712Package structure and methods of forming same
#2713Computer modules with small thicknesses and associated methods of manufacturing
#2714Device including two power semiconductor chips and manufacturing thereof
#2715Semiconductor package
#2716Semiconductor device and semiconductor device mounting structure
#2717Semiconductor device and method for manufacturing the same
#2718Method for fabricating EMI shielding package structure
#2719Carrier-less silicon interposer using photo patterned polymer as substrate
#2720Semiconductor device with sealed semiconductor chip
#2721Semiconductor device packages and methods of manufacturing the same
#2722Electronic device with first and second contact pads and related methods
#2723TSV substrate structure and the stacked assembly thereof
#2724Electronic apparatus, method of optimizing de-coupling capacitor and computer-readable recording medium
#2725Redistribution structures for microfeature workpieces
#2726Embedded semiconductive chips in reconstituted wafers, and systems containing same
#2727Substrates having ball lands, semiconductor packages including the same, and methods of fabricating semiconductor packages including the same
#2728Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor die
#2729Semiconductor package
#2730Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics
#2731Optical communication device, reception apparatus, transmission apparatus, and transmission and reception system
#2732Discrete semiconductor device package and manufacturing method
#2733Semiconductor device assembly with package interconnect extending into overlying spacer material, and associated systems, devices, and methods
#2734Stacked microelectronic devices
#2735Semiconductor device and semiconductor package having a plurality of differential signal balls
#2736Through silicon via structure
#2737Adhesive composition and semiconductor device using same
#2738Semiconductor device, method of manufacturing the same, in-millimeter-wave dielectric transmission device, method of manufacturing the same, and in-millimeter-wave dielectric transmission system
#2739Semiconductor sensor chips
#2740High speed circuit assembly with integral terminal and mating bias loading electrical connector assembly
#2741Method of fabricating packaging substrate having embedded through-via interposer
#2742Package on-Package (PoP) structure including stud bulbs and method
#2743Methods of forming wire interconnect structures
#2744Substrate for semiconductor package and semiconductor package having the same
#2745Camera module and electronic device
#2746Nanoelectromechanical antifuse and related systems
#2747Defense against counterfeiting using antifuses
#2748Semiconductor device and semiconductor package
#2749Semiconductor device and method of manufacturing semiconductor device
#2750Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#2751Semiconductor device having a junction portion contacting a schottky metal
#2752EMI shielding in semiconductor packages
#2753Thermal dissipation through seal rings in 3DIC structure
#2754Wire clamp with piezoelectric actuator and method and apparatus for applying a preload force to the piezoelectric actuator
#2755Apparatus and method of attaching solder ball and method of fabricating semiconductor package including solder ball
#2756Method for singulating packaged integrated circuits and resulting structures
#2757Method of forming interconnection structure of package structure
#2758Die-to-die gap control for semiconductor structure and method
#2759Electronic device and method of fabricating an electronic device
#2760Test circuit and method of semiconductor integrated circuit
#2761Microelectronic package and method of manufacture thereof
#2762Semiconductor package and method for manufacturing the same
#2763Methods and apparatus of packaging semiconductor devices
#2764Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die
#2765No-flow underfill for package with interposer frame
#2766Transformer input matched transistor
#2767Semiconductor device and method for producing semiconductor device
#2768Semiconductor device and method for producing the same
#2769Vertically integrated systems
#2770Semiconductor device and method for manufacturing the same
#2771Method for manufacturing semiconductor device
#2772Electronic device and method of manufacturing electronic device
#2773Light emitting device and system providing white light with various color temperatures
#2774Semiconductor die laminating device with independent drives
#2775Flip-chip, face-up and face-down centerbond memory wirebond assemblies
#2776Chip on package structure and method
#2777Method and apparatus for high temperature semiconductor device packages and structures using a low temperature process
#2778Semiconductor structure and manufacturing method thereof
#2779Stacked semiconductor package including a smaller-area semiconductor chip
#2780Methods for manufacturing a chip arrangement, methods for manufacturing a chip package, a chip package and chip arrangements
#2781Semiconductor device and method of forming a shielding layer between stacked semiconductor die
#2782Semiconductor device
#2783Transistor arrangement
#2784Semiconductor device package
#2785System-in-package module with memory
#2786Contactless communication unit connector assemblies with signal directing structures
#2787Processes and structures for IC fabrication
#2788Semiconductor chips having through silicon vias and related fabrication methods and semiconductor packages
#2789Integrated circuit combination of a target integrated circuit and a plurality of thin film photovoltaic cells connected thereto using a conductive path
#2790Circuit module having a substrate, semiconductor chip, and molding material formed by dicing
#2791Semiconductor package and method of fabricating the same
#2792Stacked die package with aligned active and passive through-silicon vias
#2793UV-curable anisotropic conductive adhesive
#2794Lead, wiring member, package part, metal part provided with resin and resin-sealed semiconductor device, and methods for producing same
#2795Power module package
#2796Unpacked structure for power device of radio frequency power amplification module and assembly method therefor
#2797Semiconductor device having stacked memory elements and method of stacking memory elements on a semiconductor device
#2798Stress buffer structures in a mounting structure of a semiconductor device
#2799Method for producing photosensitive infrared detectors
#2800Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereof
#2801Electrical connections for chip scale packaging
#2802Chip packages, chip arrangements, a circuit board, and methods for manufacturing chip packages
#2803Semiconductor devices having through-vias and methods for fabricating the same
#2804Microelectronic devices with through-substrate interconnects and associated methods of manufacturing
#2805Systems and methods for single-molecule nucleic-acid assay platforms
#2806Transistor arrangement with semiconductor chips between two substrates
#2807Contact pad structure, an electronic component, and a method for manufacturing a contact pad structure
#2808Semiconductor device
#2809Semiconductor device and electronic unit provided with the same
#2810Semiconductor chip and stacked semiconductor package having the same
#2811Light emitting device having wire including stack structure
#2812Package carrier and manufacturing method thereof
#2813Gas sensor package
#2814Formation of through-silicon via (TSV) in silicon substrate
#2815Semiconductor package and method of fabricating the same
#2816Semiconductor device
#2817Semiconductor device having stacked chips
#2818Stiffening electronic packages by disposing a stiffener ring between substrate center area and conductive pad
#2819Integrated semiconductor device and wafer level method of fabricating the same
#2820Optical module
#2821Semiconductor module and method for manufacturing the same
#2822Power semiconductor device
#2823Printed wiring board and method for manufacturing the same
#2824Via network structures and method therefor
#2825Method for removing electroplated metal facets and reusing a barrier layer without chemical mechanical polishing
#2826Ablation method and recipe for wafer level underfill material patterning and removal
#2827Methods and apparatus for package on package devices with reversed stud bump through via interconnections
#2828Circuit module and method of producing the same
#2829Substrate-less stackable package with wire-bond interconnect
#2830Semiconductor-on-insulator with back side strain topology
#2831Substrate for mounting multiple power transistors thereon and power semiconductor module
#2832Monolithic bidirectional silicon carbide switching devices
#2833Interconnecting structure for electrically connecting a first electronic device with a second electronic device
#2834Multichip power semiconductor device
#2835Image sensor integrated circuit package with reduced thickness
#2836Optical coupling module
#2837Semiconductor device
#2838Semiconductor device and method of manufacturing the semiconductor device
#2839Semiconductor device
#2840ESD protection device
#2841Semiconductor package with multi-level die block
#2842Apparatus and methods for reducing impact of high RF loss plating
#2843Substrate, method of fabricating the same, and application the same
#28443D semiconductor device and structure
#2845Electronic device packages having bumps and methods of manufacturing the same
#2846Substrateless power device packages
#2847Interconnection structure with confinement layer
#2848Semiconductor device and method of forming pad layout for flipchip semiconductor die
#2849Lead frame having a perimeter recess within periphery of component terminal
#2850Stack of semiconductor structures and corresponding manufacturing method
#2851Semiconductor package with embedded die and its methods of fabrication
#2852Conductor pad for flexible circuits and flexible circuit incorporating the same
#2853Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another
#2854Semiconductor package
#2855Compensating for warpage of a flip chip package by varying heights of a redistribution layer on an integrated circuit chip
#2856Methods to fabricate a radio frequency integrated circuit
#2857Method for fabricating multi-chip stack structure
#2858Semiconductor device sealed in a resin section and method for manufacturing the same
#2859Image forming apparatus, chip, and chip package to reduce cross-talk between signals
#2860Electronic circuit device
#2861Strength of micro-bump joints
#2862Through-substrate via shielding
#2863Segmented bond pads and methods of fabrication thereof
#2864Pad configurations for an electronic package assembly
#2865Vertical semiconductor MOSFET device with double substrate-side multiple electrode connections and encapsulation
#2866Bump pad structure
#2867Multi-chip package and method of manufacturing the same
#2868Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure
#2869Semiconductor devices with ball strength improvement
#2870Semiconductor devices with close-packed via structures having in-plane routing and method of making same
#2871Technique for wafer-level processing of QFN packages
#2872Non-leaded type semiconductor package and method of assembling same
#2873Semiconductor device and method for manufacturing the same
#2874Method for fabricating wire bonding structure
#2875On-chip RF shields with backside redistribution lines
#2876Method for assembling a microelectronic chip element on a wire element, and installation enabling assembly to be performed
#2877Semiconductor device, method of manufacturing the semiconductor device, and electronic device
#2878Stacked package structure and method of forming a package-on-package device including an electromagnetic shielding layer
#2879Semiconductor structures and methods of manufacture
#2880Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#2881Mechanisms for forming bonding structures
#2882Light-emitting device
#2883LED module having a highly reflective carrier
#2884Current sensor device
#2885Dam structure for enhancing joint yield in bonding processes
#2886Packaging for high power integrated circuits and infrared emitter arrays
#2887Conductive structure and method for forming the same
#2888Capping coating for 3D integration applications
#2889Semiconductor device and method of assembling same
#2890Method and apparatus for measuring a free air ball size during wire bonding
#2891Semiconductor chips having improved solidity, semiconductor packages including the same and methods of fabricating the same
#2892Methods of forming conductive jumper traces
#2893LED package and method of the same
#2894Semiconductor device, transmission system, method for manufacturing semiconductor device, and method for manufacturing transmission system
#2895Semiconductor package having wire bond wall to reduce coupling
#2896Semiconductor device comprising an output driver circuitry, a packaged semiconductor device and associated methods
#2897Wire tail connector for a semiconductor device
#2898Semiconductor device and method of manufacturing same
#2899Packaged semiconductor device
#2900Wafer level chip scale package with exposed thick bottom metal
#2901Bonded structures for package and substrate
#2902Method of forming a reliable microelectronic assembly
#2903Ball height control in bonding process
#2904Device having reduced pad peeling during tensile stress testing and a method of forming thereof
#2905Metal to metal bonding for stacked (3D) integrated circuits
#2906Semiconductor device and method for manufacturing the same
#2907Semiconductor device
#2908Semiconductor device having an inductor
#2909Electronic circuit arrangement and method of manufacturing the same
#2910Method for producing a semiconductor module
#2911Copper post solder bumps on substrates
#2912Memory module and memory system
#2913Power converters having capacitive energy transfer elements and arrangements of energy storage elements for power converters
#2914Semiconductor package structure and semiconductor process
#2915Method of making a semiconductor device package
#2916Through silicon vias for semiconductor devices and manufacturing method thereof
#2917Semiconductor device with overlapped lead terminals
#2918Semiconductor device and radio communication device
#2919Method of fabricating semiconductor apparatus with through-silicon via and method of fabricating stack package including the semiconductor chip
#2920Semiconductor package and fabrication method thereof
#2921Transparent light emitting diodes
#2922Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices
#2923Forming of an electric connection of the via type
#2924Surface mountable electronic component
#2925Hybrid semiconductor package
#2926Error correction in multiple semiconductor memory units
#2927Thermal dissipation through seal rings in 3DIC structure
#2928Semiconductor package
#2929Semiconductor device with through-substrate via covered by a solder ball and related method of production
#2930Interconnect structure for wafer level package
#2931Printing circuit board with traces in an insulator
#2932Method of making a conductive pillar bump with non-metal sidewall protection structure
#2933Bonding structure and method
#2934Methods of fabricating semiconductor stack packages
#2935Illumination device
#2936Circuit device
#2937Methods of forming 3-D circuits with integrated passive devices
#2938Chip package and method for forming the same
#2939Chip package
#2940Semiconductor package and manufacturing method thereof
#2941Semiconductor package comprising stacked integrated circuit chips having connection terminals and through electrodes symmetrically arranged
#2942Chip package and method for forming the same
#2943Flux residue cleaning system and method
#2944Packaging process tools and packaging methods for semiconductor devices
#2945Method of making a stacked device assembly
#2946Electronic devices and components for high efficiency power circuits
#2947Bonding wire and method for manufacturing same
#2948Power module with integrated current sensor
#2949Semiconductor device and method of forming duplex plated bump-on-lead pad over substrate for finer pitch between adjacent traces
#2950Semiconductor package structure and fabrication method thereof
#2951Power transistor with heat dissipation and method therefore
#2952Semiconductor device and method of forming inductor over insulating material filled trench in substrate
#2953Electrostatic discharge diode
#2954Wide bandgap semiconductor device
#2955Microelectronic devices and microelectronic support devices, and associated assemblies and methods
#2956Semiconductor integrated circuit and drive apparatus including the same
#2957Wafer backside interconnect structure connected to TSVs
#2958Semiconductor device and method for fabricating the same
#2959Directly cooled substrates for semiconductor modules and corresponding manufacturing methods
#2960Reliable packaging and interconnect structures
#29613D packages and methods for forming the same
#2962Semiconductor device and method of forming high routing density interconnect sites on substrate
#2963Contact pads with sidewall spacers and method of making contact pads with sidewall spacers
#2964Semiconductor device and method of forming bump structure with insulating buffer layer to reduce stress on semiconductor wafer
#2965Semiconductor package
#2966Fabrication method of packaging substrate, and fabrication method of semiconductor package
#2967Semiconductor device fabricating method
#2968Fabrication method of semiconductor package without chip carrier
#2969Wafer process for molded chip scale package (MCSP) with thick backside metallization
#2970Semiconductor device, substrate and semiconductor device manufacturing method
#2971Wafer backside interconnect structure connected to TSVs
#2972Chip package and manufacturing method thereof
#2973Lead and lead frame for power package
#2974Antioxidant gas supply unit
#2975Pad over interconnect pad structure design
#2976Adjusting sizes of connectors of package components
#2977Detection of defective electrical connections
#2978Detection of current change in an integrated circuit
#2979Bonding apparatus
#2980Semiconductor device and method of forming conductive vias using backside via reveal and selective passivation
#2981Arrangement for energy conditioning
#2982Electronic apparatus having a resin filled through electrode configured to go through first and second semiconductor components
#2983Method for manufacturing electronic devices
#2984Multi-level semiconductor package
#2985Scheme for connector site spacing and resulting structures
#2986Semiconductor device and method of forming shielding layer over active surface of semiconductor die
#2987Semiconductor packages having an electric device with a recess
#2988Compact LED package with reflectivity layer
#2989Light emitting diode device
#2990Method for plating a semiconductor package lead
#2991System and method of sensing current in a power semiconductor device
#2992Method for manufacturing semiconductor devices having a metallisation layer
#2993Power converter
#2994Microelectronic devices and methods for filling vias in microelectronic devices
#2995Semiconductor device and method of forming PIP with inner known good die interconnected with conductive bumps
#2996Semiconductor device and method for manufacturing the same
#2997Semiconductor device, method for manufacturing the same, and electronic device
#2998Semiconductor component with moisture barrier for sealing semiconductor body
#2999Methods for bonding a hermetic module to an electrode array
#3000Method for fabricating stack die package