212004 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Package base, package, electronic device, electronic apparatus, and moving object
#2402Semiconductor laser structure
#2403Multi-band active antenna
#2404Circuit device, electronic apparatus and moving object
#2405Semiconductor device and manufacturing method for the same
#2406Functional spacer for SIP and methods for forming the same
#2407Copper-containing layer on under-bump metallization layer
#2408Package-on-package structure and methods for forming the same
#2409Semiconductor devices with recessed interconnects
#2410Methods of fabricating QFN semiconductor package and metal plate
#2411Bumps bonds formed as metal line interconnects in a semiconductor device
#2412Stacked semiconductor device
#2413Capacitive micromachined ultrasonic transducer probe using wire-bonding
#2414Power semiconductor device and power conversion device
#2415Semiconductor module with ultrasonically welded terminals
#2416Chip capacitors
#2417Semiconductor device
#2418Electronic device and mounting structure of the same
#2419Circuit substrate and method for manufacturing the same
#2420Integrated system and method of making the integrated system
#2421Multi-die semiconductor structure with intermediate vertical side chip and semiconductor package for same
#2422Semiconductor device with face-to-face chips on interposer and method of manufacturing the same
#2423Method of forming semiconductor device having a conductive via structure
#2424Optoelectronic lighting module, optoelectronic lighting apparatus and vehicle headlamp
#2425Power semiconductor module
#2426Method of forming a component having wire bonds and a stiffening layer
#2427Semiconductor device including a protective film
#2428Method of forming an integrated circuit device including a pillar capped by barrier layer
#2429Lead finger locking structure
#2430Resin sealing type semiconductor device and method of manufacturing the same, and lead frame
#2431Conductor structure for three-dimensional semiconductor device
#2432Methods of packaging semiconductor devices and packaged semiconductor devices
#2433Semiconductor device
#2434Wire-pull test location identification on a wire of a microelectronic package
#2435Semiconductor device having a device fixed on a substrate with an adhesive
#2436Bonded structures for package and substrate
#2437Semiconductor device, semiconductor device design method, semiconductor device design apparatus, and program
#2438Millimeter wave integrated circuit with ball grid array package including transmit and receive channels
#2439Semiconductor device and a method of manufacturing the same
#24403D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approach
#2441Pad design for reliability enhancement in packages
#2442Methods of packaging semiconductor devices and structures thereof
#2443Power module semiconductor device
#2444Package and method for fabricating package
#2445Radio frequency and microwave devices and methods of use
#2446Method of forming package-on-package (PoP) structure having a chip package with a plurality of dies attaching to first side of an interposer with a die formed thereon
#2447Semiconductor device
#2448Semiconductor device and manufacturing method therefor
#2449Semiconductor device
#2450Hybrid bonding mechanisms for semiconductor wafers
#2451Methods, circuits and systems for a package structure having wireless lateral connections
#2452Semiconductor device
#2453Packaging structure for thin die and method for manufacturing the same
#2454Packaged semiconductor devices and packaging devices and methods
#2455Through via structure
#2456Three-dimensional semiconductor architecture
#2457Sensor device and sensor arrangement
#2458Method for producing an electronic assembly
#2459Die seal ring for integrated circuit system with stacked device wafers
#2460Package on-package with cavity in interposer
#2461Semiconductor device
#2462Enhanced flash chip and method for packaging chip
#2463Package in package (PiP) electronic device and manufacturing method thereof
#2464Ring structures in device die
#2465Alignment mark design for packages
#2466Method for making semiconductor device with lead frame made from top and bottom components and related devices
#2467Semiconductor device with encapsulated lead frame contact area and related methods
#2468Low CTE component with wire bond interconnects
#2469Semiconductor device with a semiconductor chip connected in a flip chip manner
#2470Adjusting sizes of connectors of package components
#2471Circuit board
#2472Package on package structure
#2473Integrated circuit package assembly
#2474Microelectronic packages having cavities for receiving microelectronic elements
#2475Methods of fabricating semiconductor chip solder structures
#2476Semiconductor device
#2477Printed wiring board, semiconductor package, and method for manufacturing printed wiring board
#2478Molded chip package and method of manufacturing the same
#2479Smart card module, smart card, and method for producing a smart card module
#2480Methods of manufacturing and operating die-to-die inductive communication devices
#2481Detecting and driving load using MOS transistor
#2482Structures and methods for shielding magnetically sensitive components
#2483Schottky diode
#2484Electrostatic discharge diodes and methods of forming electrostatic discharge diodes
#2485Off-chip vias in stacked chips
#2486Bonding pad arrangment design for multi-die semiconductor package structure
#2487Semiconductor module bonding wire connection method
#2488Pick-and-place tool for packaging process
#2489Semiconductor device with mechanical lock features between a semiconductor die and a substrate
#2490Semiconductor device and production method therefor
#2491Semiconductor devices and methods of fabricating the same
#2492Memory device comprising programmable command-and-address and/or data interfaces
#2493Apparatus and method for reducing volume of resource allocation information message in a broadband wireless communication system
#2494Systems and methods for high-speed, low-profile memory packages and pinout designs
#2495Devices and methods for processing singulated radio-frequency units
#2496Method of forming post-passivation interconnect structure
#2497Semiconductor packages and methods of packaging semiconductor devices
#2498Semiconductor device and method of manufacturing semiconductor device
#2499Semiconductor device with notched main lead
#2500Semiconductor device with step portion having shear surfaces
#2501Components with multiple energization elements for biomedical devices
#2502Devices and systems comprising drivers for power conversion circuits
#2503Bump structure having a side recess and semiconductor structure including the same
#2504Semiconductor package and method of manufacturing the same
#2505DC-DC converter having terminals of semiconductor chips directly attachable to circuit board
#2506Fabrication method of semiconductor device, evaluation method of semiconductor device, and semiconductor device
#2507Stacked semiconductor die assemblies with support members and associated systems and methods
#2508Wafer, package structure and method of manufacturing the same
#2509Stacked chip package including substrate with recess adjoining side edge of substrate and method for forming the same
#2510Electronic component and electronic device
#2511Semiconductor device
#2512Semiconductor package and system with an isolation structure to reduce electromagnetic coupling
#2513Assembly structure for connecting multiple dies into a system-in-package chip and the method thereof
#2514Nonvolatile memory device having authentication, and methods of operation and manufacture thereof
#2515Multiple energization elements in stacked integrated component devices
#2516Integrated circuit package including miniature antenna
#2517Integrated electronic device including an interposer structure and a method for fabricating the same
#2518Wire bonding apparatus
#2519Connector structures of integrated circuits
#2520Chip-scale packaging with protective heat spreader
#2521Semiconductor device and method of manufacturing the semiconductor device
#2522Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods
#2523Method of fabricating a packaging substrate including a carrier having two carrying portions
#2524Biocompatible packaging
#2525Encapsulated molded package with embedded antenna for high data rate communication using a dielectric waveguide
#2526Semiconductor device having semiconductor element bonded to base body by adhesive member
#2527Semiconductor device for reducing propagation time of gate input signals
#2528Semiconductor device for reducing gate wiring length
#2529Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP
#2530Multiple die layout for facilitating the combining of an individual die into a single die
#2531Semiconductor device and method for manufacturing semiconductor device
#2532Integrated electronic device with transceiving antenna and magnetic interconnection
#2533Semiconductor devices and methods of making semiconductor devices
#2534Combined QFN and QFP semiconductor package
#2535Semiconductor device
#2536Interconnection structure having a via structure and fabrication thereof
#2537Circuits incorporating integrated passive devices having inductances in 3D configurations and stacked with corresponding dies
#2538Method for making a sensor device using a graphene layer
#2539Semiconductor device with output circuit and pad arrangements
#2540Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP
#2541Packages with metal line crack prevention design
#2542Integrated circuit chip and fabrication method
#2543Integrated circuit device
#2544Semiconductor sensor device and method of producing a semiconductor sensor device
#2545Scalable semiconductor interposer integration
#2546Power semiconductor device
#2547Method of manufacturing resin-encapsulated semiconductor device, and lead frame
#2548Conductive pads and methods of formation thereof
#2549Power module semiconductor device and inverter equipment, and fabrication method of the power module semiconductor device, and metallic mold
#2550Optical device including three-coupled quantum well structure
#2551Method for forming chip package
#2552Flexible electronic system with wire bonds
#2553Solid state lighting apparatuses, systems, and related methods
#2554Power semiconductor package with a common conductive clip
#2555Wire bonding method employing two scrub settings
#2556Structure for aluminum pad metal under ball bond
#2557Chip package and method for forming the same
#2558Method and materials for warpage thermal and interconnect solutions
#2559Manufacture of coated copper pillars
#2560Semiconductor socket with direct selective metalization
#2561Semiconductor device having lead frame with notched inner leads
#2562Semiconductor package
#2563Method for manufacturing electrical connections in a semiconductor device and the semiconductor device
#2564Semiconductor packages and methods of forming the same
#2565Semiconductor chip and semiconductor package having the same
#2566Semiconductor device, fabrication method for a semiconductor device and electronic apparatus
#2567Stacked die integrated circuit
#2568Power semiconductor device
#2569Semiconductor module package and method of manufacturing the same
#2570Lead frame with mold lock structure
#2571Discrete three-dimensional vertical memory comprising off-die address/data-translator
#2572Semiconductor device
#2573Semiconductor chip and semiconductor package
#2574Semiconductor device and method of manufacturing the same
#2575Electronic device including soldered surface-mount component
#2576Semiconductor package with lead mounted power bar
#2577Positional relationship among components of semiconductor device
#2578Packages with through-vias having tapered ends
#2579Packaging mechanisms for dies with different sizes of connectors
#2580Semiconductor device having fan-in and fan-out redistribution layers
#2581Method of manufacturing circuit board and semiconductor package
#2582Semiconductor packages and data storage devices including the same
#2583Semiconductor device including stacked semiconductor chips
#25843-D inductor and transformer
#2585Methods for making semiconductor device with sealing resin
#2586Semiconductor device, method of manufacturing a semiconductor device, and positioning jig
#2587Exposed die power semiconductor device
#2588Semiconductor interposer integration
#2589Semiconductor device packaging having plurality of wires bonding to a leadframe
#2590Ultra-thin embedded semiconductor device package and method of manufacturing thereof
#2591Mounting member, electronic component, and method for manufacturing module
#2592Semiconductor device with lead terminals having portions thereof extending obliquely
#2593Semiconductor device having plated outer leads exposed from encapsulating resin
#2594Semiconductor device and method of manufacturing same
#2595Method for producing a multiplicity of optoelectronic semiconductor components
#2596Composite sensor for detecting angular velocity and acceleration
#2597High voltage monolithic LED chip with improved reliability
#2598Method of manufacturing light-emitting device and wiring substrate for light-emitting element
#2599Semiconductor element, semiconductor element manufacturing method, semiconductor module, semiconductor module manufacturing method, and semiconductor package
#2600Enhanced flip chip structure using copper column interconnect
#2601Method of packaging a semiconductor chip using a 3D printing process and semiconductor package having angled surfaces
#2602Semiconductor device manufacturing method
#2603Forming a carbon nano-tube dispersion
#2604Method and apparatus for incorporating passive devices in an integrated passive device separate from a die
#2605Semiconductor device
#2606Multiple die in a face down package
#2607Microelectronic packages with nanoparticle joining
#2608Semiconductor device grid array package
#2609Package structure and method of forming the same
#2610Method for manufacturing semiconductor device
#2611Semiconductor chip and semiconductor chip package each having signal paths that balance clock skews
#2612Method for manufacturing semiconductor devices having a metallisation layer
#2613Semiconductor package and fabrication method thereof
#2614Integrated circuit package
#2615Methods for forming a sensor array package
#2616Cap for a chip device having a groove, device provided with said cap, assembly consisting of the device and a wire element, and manufacturing method thereof
#2617Optoelectronic component with a pre-oriented molecule configuration and method for producing an optoelectronic component with a pre-oriented molecule configuration
#2618Protection circuit including vertical gallium nitride schottky diode and PN junction diode
#2619Pad structure exposed in an opening through multiple dielectric layers in BSI image sensor chips
#2620Integrated circuit package fabrication
#2621Semiconductor device
#2622Semiconductor device
#2623Bonded processed semiconductor structures and carriers
#2624Semiconductor device wiring pattern and connections
#2625Packaged semiconductor device having a shielding against electromagnetic interference and manufacturing process thereof
#2626Electric storage device and method for producing electric storage device
#2627Semiconductor light emitting device, manufacturing method thereof, and semiconductor light emitting device package using the same
#2628Semiconductor device and method of manufacturing the same
#2629Semiconductor device including independent film layer for embedding and/or spacing semiconductor die
#2630Semiconductor device and connection checking method for semiconductor device
#2631Pad-less interconnect for electrical coreless substrate
#2632Flip-chip hybridisation of two microelectronic components using a UV anneal
#2633Semiconductor device
#2634Impedance controlled electrical interconnection employing meta-materials
#2635Device and method of manufacturing the same
#2636Magnetically coupled galvanically isolated communication using lead frame
#2637Semiconductor device and manufacturing method thereof
#2638Selective planishing method for making a semiconductor device
#2639Semiconductor device and method of manufacture thereof
#2640Multi-dimensional integrated circuit structures and methods of forming the same
#2641Amplifier
#2642Light-emitting module
#2643Semiconductor device including embedded controller die and method of making same
#2644Structure and formation method of chip package structure
#2645Probing chips during package formation
#2646Semiconductor device having multiple contact clips
#2647Flexibly-wrapped integrated circuit die
#2648Leadframe area array packaging technology
#2649Methods for forming a semiconductor device package
#2650Semiconductor module
#2651System and method for 3D integrated circuit stacking
#2652Bonding pad structure with dense via array
#2653Semiconductor devices comprising getter layers and methods of making and using the same
#2654Passive component structure and manufacturing method thereof
#2655Leadless package type power semiconductor module
#2656Power semiconductor module
#2657Assembly bonding
#2658Contact bump connection and contact bump and method for producing a contact bump connection
#2659Test structure and method of testing electrical characteristics of through vias
#2660Power conversion device
#2661Apparatus and method for harvesting energy in an electronic device
#2662Semiconductor integrated circuit
#2663Integrated circuit package and methods of forming same
#2664Method of making the light source structure in flexible substrate
#2665System-in-package module and manufacture method for a system-in-package module
#2666Semiconductor device with through silicon via and alignment mark
#2667Chip package and method of manufacturing the same
#2668Substrate composite, method and device for bonding of substrates
#2669Package for an implantable neural stimulation device
#2670Integrated circuit module having a first die with a power amplifier stacked with a second die and method of making the same
#2671Stackable microelectronic package structures
#2672Semiconductor package and fabrication method thereof
#2673Semiconductor device having mirror-symmetric terminals and methods of forming the same
#2674Semiconductor assemblies, stacked semiconductor devices, and methods of manufacturing semiconductor assemblies and stacked semiconductor devices
#2675Semiconductor package
#2676Package with terminal pins with lateral reversal point and laterally exposed free end
#2677Semiconductor package with conductive clips
#2678Preparation method of a thin power device
#2679Package on package structure and fabrication method thereof
#2680Stackable microelectronic package structures
#2681Apparatus, system, and method for wireless connection in integrated circuit packages
#2682Semiconductor device
#2683Interface for communication between voltage domains
#2684Semiconductor component with chip for the high-frequency range
#2685LED package with multiple element light source and encapsulant having curved and/or planar surfaces
#2686LED module
#2687Method of making stacked multi-chip packaging structure
#2688Grid array connection device and method
#2689Semiconductor device for transmitting electrical signals between two circuits
#2690Methods and apparatus for package with interposers
#2691Semiconductor device
#2692Pre-molded integrated circuit packages
#2693Molding method for COB-EUSB devices and metal housing package
#2694Linearity performance for radio-frequency switches
#2695Devices and methods related to radio-frequency switches having improved on-resistance performance
#2696Radio-frequency switching devices having improved voltage handling capability
#2697Insulated gate semiconductor device and method
#2698Method and apparatus for multi-chip structure semiconductor package
#2699Bonding device
#2700Self-adhesive die