212004 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
AUXILIARY BOARD JOINING STRUCTURE
#9302Rigid power module suited for high-voltage applications
#9303Configuration context switcher with a latch
#9304Semiconductor memory device
#9305Package-on-package system with through vias and method of manufacture thereof
#9306Stack package having flexible conductors
#9307Integrated Circuit Package Having Under-Bump Metallization
#9308Semiconductor package and method of forming Z-direction conductive posts embedded in structurally protective encapsulant
#9309Semiconductor device and method of wafer level package integration
#9310Wafer level die integration and method therefor
#9311Routing layer for mitigating stress in a semiconductor die
#9312Die structure and die connecting method
#9313CHIP STRUCTURE, CHIP BONDING STRUCTURE USING THE SAME, AND MANUFACTURING METHOD THEREOF
#9314Semiconductor device having multiple semiconductor elements
#9315Semiconductor component having adhesive squeeze-out prevention configuration and method of manufacturing the same
#9316Semiconductor equipment and method of manufacturing the same
#9317Semiconductor device and method of forming electrical interconnection between semiconductor die and substrate with continuous body of solder tape
#9318Stacked semiconductor package
#9319Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#9320Chip package structure and method of making the same
#9321Ultra high speed signal transmission/reception
#9322PACKAGED ACOUSTIC TRANSDUCER DEVICE WITH SHIELDING FROM ELECTROMAGNETIC INTERFERENCE
#9323Finger sensor including capacitive lens and associated methods
#9324Semiconductor device
#9325SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
#9326Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device
#9327Light emitting diode package and light emitting diode system having at least two heat sinks
#9328Light-emitting device
#9329LIGHT EMITTING DIODE PACKAGE, LIGHTING APPARATUS HAVING THE SAME, AND METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE
#9330LED housing with fluoropolymer surface coating layer and LED structure having the same
#9331Light emitting device, method of manufacturing the same, light emitting device package, and lighting system
#9332Light emitting device, light emitting device package, and illumination system
#9333LIQUID REFLECTOR
#9334Surface mounted LED package
#9335Luminaire and light-emitting apparatus with light-emitting device
#9336High performance sub-system design and assembly
#9337Manufacturing method for electronic devices
#9338Semiconductor device capable of switching operation modes
#9339Method of forming a micro pin hybrid interconnect array
#9340Apparatus with a multi-layer coating and method of forming the same
#9341Method of manufacturing multi-layer printed circuit board
#9342Method for fitting contact wires to a surface of a photovoltaic cell, photovoltaic cell, photovoltaic module, arrangement for fitting contact wires to a surface of a photovoltaic cell
#9343Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel
#9344Method of manufacturing multi-layer printed circuit board
#9345Microelectronic devices and microelectronic support devices, and associated assemblies and methods
#9346Curable organopolysiloxane composition and semiconductor device
#9347Inverse chip connector
#9348STACKED AND SHIELDED PACKAGES WITH INTERCONNECTS
#9349Thru silicon enabled die stacking scheme
#9350Methods for forming anti-reflection structures for CMOS image sensors
#9351Method of manufacturing light-emitting device
#9352Positive-type photosensitive resin composition, method for production of resist pattern, semiconductor device, and electronic device
#9353Electrode-connecting structure, conductive adhesive used for the same, and electronic apparatus
#9354OPTO ELECTRICAL CONVERTING MODULE AND COMPONENT USED FOR THE SAME
#9355Light source unit and backlight assembly having the same
#9356Light emitting device having a multilayer re-emission layer and light emitting device package including the same
#9357Light emitting device package, backlight unit, display device and lighting device
#9358Light emitting device using filter element
#9359Power semiconductor module
#9360HEAT DISSIPATION SYSTEM FOR ELECTRICAL COMPONENTS
#9361METHOD AND APPARATUS FOR FABRICATING INTEGRATED CIRCUIT DEVICE USING SELF-ORGANIZING FUNCTION
#9362LIGHTING APPARATUS WITH ENCODED INFORMATION
#9363RF power amplifier
#9364Magnetic field current sensors
#9365Light emitting device
#9366Light emitting diode and light source module incorporating the same
#9367Integrated circuit package in package system
#9368Stack packages using reconstituted wafers
#9369Process for making a semiconductor system
#9370Method of manufacturing semiconductor device
#9371Semiconductor device and method of manufacturing the same
#9372Semiconductor device and method of forming high routing density BOL BONL and BONP interconnect sites on substrate
#9373Wafer-level chip-scale package device having bump assemblies configured to mitigate failures due to stress
#9374Semiconductor device having stacked components
#9375Semiconductor device
#9376Leadframe package for high-speed data rate applications
#9377Lead frame for semiconductor device
#9378Ball-Grid Array Device Having Chip Assembled on Half-Etched metal Leadframe
#9379Electrostatic discharge (ESD) protection circuit
#9380Wafer level package of MEMS microphone and manufacturing method thereof
#9381Method for transferring a uniform phosphor layer on an article and light-emitting structure fabricated by the method
#9382Light emitting device
#9383Light emitting device and light emitting device package
#9384Light emitting device, method for fabricating the light emitting device, and light emitting device package
#9385Light emitting device, light emitting device package and lighting system
#9386LIGHT EMITTING DIODE PACKAGE AND METHOD OF FABRICATING THE SAME
#9387Light emitting device
#9388Surface mount device thin package
#9389Light emitting diode package, lighting device and light emitting diode package substrate
#9390Circuit connecting material, film-form circuit connecting material using the same, circuit member connecting structure and method of manufacturing the same
#9391CIRCUIT CONNECTION MATERIAL, FILM-FORM CIRCUIT CONNECTING MATERIAL USING THE SAME, CIRCUIT MEMBER CONNECTING STRUCTURE, AND METHOD OF MANUFACTURING THE SAME
#9392Process for the wafer-scale fabrication of electronic modules for surface mounting
#9393Method of manufacturing a multilayered printed wiring board
#9394FORMING CHANNELS FOR AN ANTENNA WIRE OF A TRANSPONDER
#9395Multimode signaling on decoupled input/output and power channels
#9396Liquid crystal display and fabricating method thereof
#9397Structure and method of forming pillar bumps with controllable shape and size
#9398MANUFACTURING METHOD OF SEMICONDUCTOR CHIP-EMBEDDED WIRING SUBSTRATE
#9399Method for manufacture of inline integrated circuit system
#9400SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING THE SAME
#9401PACKAGE ASSEMBLY FOR SEMICONDUCTOR DEVICES
#9402Packaging process to create wettable lead flank during board assembly
#9403Method of manufacturing semiconductor device
#9404METHOD OF MANUFACTURING SOLID-STATE IMAGING DEVICE
#9405Light emitting device, light emitting system having the same, and fabricating method of the light emitting device and the light emitting system
#9406Chip-type LED and method for manufacturing the same
#9407THREE-DIMENSIONAL STRUCTURES AND METHODS OF FABRICATING THE SAME USING A PRINTING PLATE
#9408OPTO-ELECTRONIC TRANSCEIVER MODULE SYSTEM
#9409ELECTRONIC DEVICE AND SEMICONDUCTOR DEVICE
#9410Light emitting device and light unit having the same
#9411Lighting device and lighting system having the same
#9412HIGHLY REFLECTIVE WHITE MATERIAL AND LED PACKAGE
#9413Solid state lighting with selective matching of index of refraction
#9414SUBSTRATE FOR AN ELECTRICAL DEVICE
#9415SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
#9416Semiconductor device and method of forming RF balun having reduced capacitive coupling and high CMRR
#9417Optical display systems and methods
#9418Image display device and light emission device
#9419LED source with hollow collection lens
#9420EPOXY RESIN COMPOSITION FOR SEALING PACKING OF SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF
#9421LIQUID RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
#9422Wire bonding structure of semiconductor device and wire bonding method
#9423Integrated circuit package system with wire-in-film isolation barrier and method for manufacturing thereof
#9424Semiconductor package and multichip arrangement having a polymer layer and an encapsulant
#9425Semiconductor device with improved resin configuration
#9426Multi-layer interconnect structure for stacked dies
#9427Semiconductor device
#9428Embedded semiconductive chips in reconstituted wafers, and systems containing same
#9429Microelectronic package containing silicon connecting region for high density interconnects, and method of manufacturing same
#9430SEMICONDUCTOR DEVICE
#9431Semiconductor device including coupling ball with layers of aluminum and copper alloys
#9432Dummy metal design for packaging structures
#9433System in package with heat sink
#9434Power semiconductor module
#9435Stacked Semiconductor Device Package Assemblies with Reduced Wire Sweep and Manufacturing Methods Thereof
#9436Semiconductor device packages including connecting elements
#9437SEMICONDUCTOR LAMINATION PACKAGE AND METHOD OF PRODUCING SEMICONDUCTOR LAMINATION PACKAGE
#9438Semiconductor package
#9439Granular epoxy resin composition for encapsulating semiconductor, semiconductor device using the same and method for producing semiconductor device
#9440LEAD FRAME WITH RECESSED DIE BOND AREA
#9441Integrated circuit devices having selectively strengthened composite interlayer insulation layers and methods of fabricating the same
#9442Stacked chip package with redistribution lines
#9443Method for manufacturing a semiconductor device, method for detecting a semiconductor substrate and semiconductor chip package
#9444SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#9445Monolithic semiconductor switches and method for manufacturing
#9446Semiconductor device and communication method
#9447Semiconductor device and method of forming high-attenuation balanced band-pass filter
#9448Semiconductor device and semiconductor device assembly
#9449Semiconductor light emitting device, method of manufacturing the same, and semiconductor light emitting device package using the same
#9450Heat dissipation by through silicon plugs
#9451LED DIE STRUCTURE AND METHOD FOR MANUFACTURING THE BOTTOM TERMINAL THEREOF
#9452Optical semiconductor element mounting package, and optical semiconductor device using the same
#9453LED package having an array of light emitting cells coupled in series
#9454SUBSTRATE FOR MOUNTING LIGHT-EMITTING ELEMENT AND LIGHT-EMITTING DEVICE EMPLOYING THE SUBSTRATE
#9455Resin composition, reflector for light-emitting semiconductor device, and light-emitting semiconductor unit
#9456SUBSTRATE FOR LIGHT-EMITTING ELEMENT AND LIGHT-EMITTING DEVICE EMPLOYING IT
#9457Light emitting diode thermally enhanced cavity package and method of manufacture
#9458Semiconductor package with through silicon vias
#9459Pre-molded support mount of lead frame-type for LED light module
#9460Light emitting device, method of manufacturing the light emitting device, light emitting device package, and lighting system
#9461LED package structure for increasing light-emitting efficiency and controlling light-projecting angle and method for manufacturing the same
#9462Light-emitting device
#9463Light emitting device having multiple cavities and light unit having the same
#9464LIGHT-EMITTING DIODE CHIP AND PACKAGE STRUCTURE THEREOF
#9465Lighting device and method of manufacturing the same
#9466Light emitting diode having a wavelength shift layer and method of manufacture
#9467Multichip light emitting diode (LED) and method of manufacture
#9468Light emitting device, light emitting device package, and lighting system
#9469Solar sensor for the detection of the direction of incidence and the intensity of solar radiation
#9470Semiconductor device, method for manufacturing semiconductor device, apparatus for manufacturing semiconductor device, and method for evaluating semiconductor device
#9471Method for manufacturing wafer scale heat slug system
#9472Thermo-compression bonded electrical interconnect structure and method
#9473In system reflow of low temperature eutectic bond balls
#9474ARRANGEMENT RELATED TO A GAS SENSOR
#9475SOLDERING FLUX AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME
#9476METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#9477Semiconductor device and manufacturing method of the same
#9478Die level integrated interconnect decal manufacturing method and apparatus
#9479Method of manufacturing semiconductor device
#9480PHOSPHOR, METHOD OF COATING THE SAME, AND METHOD OF MANUFACTURING LIGHT EMITTING APPARATUS
#9481Chipstack package and manufacturing method thereof
#9482SEMICONDUCTOR CHIP USED FOR EVALUATION, EVALUATION SYSTEM, AND REPAIRING METHOD THEREOF
#9483ALUMINUM FOR ULTRASONIC BONDING
#9484Semiconductor device
#9485Optical waveguide, opto-electric hybrid board, and optical module
#9486Light emitting device and light unit having the same
#9487Illumination device for display device, and display device
#9488Light-emitting device and illumination device
#9489SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#9490Semiconductor device and method for manufacturing the same
#9491Methods and systems for material bonding
#9492Semiconductor device
#9493Semiconductor structure and manufacturing method of semiconductor structure
#9494SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#9495Backside dummy plugs for 3D integration
#9496Electronic device package and fabrication method thereof
#9497Through-wafer interconnects for photoimager and memory wafers
#9498Semiconductor chip with coil element over passivation layer
#9499Manufacturing process and structure of through silicon via
#9500SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE USING THE SAME
#9501Semiconductor packages having warpage compensation
#9502Semiconductor device provided with tin diffusion inhibiting layer, and manufacturing method of the same
#9503Semiconductor device
#9504Semiconductor device and semiconductor device manufacturing method
#9505Semiconductor device and method of forming a dual UBM structure for lead free bump connections
#9506Semiconductor device and method of manufacturing the same
#9507Semiconductor device package having a buffer structure and method of fabricating the same
#9508Integrated circuit system with stress redistribution layer and method of manufacture thereof
#9509Wafer level integrated interconnect decal and manufacturing method thereof
#9510Semiconductor device
#9511SEMICONDUCTOR DEVICE
#9512Semiconductor device
#9513WAFER LEVEL PACKAGING WITH HEAT DISSIPATION
#9514Semiconductor housing package, semiconductor package structure including the semiconductor housing package, and processor-based system including the semiconductor package structure
#9515Integrated circuit packaging system with leads and method of manufacture thereof
#9516Integrated circuit packaging system with an intermediate pad and method of manufacture thereof
#9517Semiconductor device package having a jumper chip and method of fabricating the same
#9518Integrated circuit packaging system with interconnect and method of manufacture thereof
#9519Dual-leadframe multi-chip package and method of manufacture
#9520Integrated circuit packages
#9521Integrated circuit protruding pad package system and method for manufacturing thereof
#9522Integrated circuit packaging system with leadframe and method of manufacture thereof
#9523Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#9524Semiconductor device and lead frame
#9525Integrated circuit packaging system with encapsulation and method of manufacture thereof
#9526Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitors
#9527Heterogeneous Technology Integration
#9528Manufacturing method of electronic device package, electronic device package, and oscillator
#9529Microphone unit and voice input device using same
#9530Method for fabrication of a semiconductor device and structure
#9531Integrated circuit having a semiconductor substrate with barrier layer
#9532Method for fabrication of a semiconductor device and structure
#9533Light emitting device, light emitting device package and lighting system
#9534SUBSTRATE FOR LIGHT-EMITTING ELEMENT AND LIGHT-EMITTING DEVICE
#9535LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD THEREOF
#9536Semiconductor light emitting element
#9537Light-emitting diode package including a cavity with a plurality of side-walls with different inclinations
#9538Light emitting device and light emitting device package
#9539Light-emitting device, light-emitting device package and lighting system
#9540HIGH-POWER LED PACKAGE
#9541Leadframe-based packages for solid state light emitting devices and methods of forming leadframe-based packages for solid state light emitting devices
#9542Light emitting device and method for manufacturing the same
#9543Single phosphor layer photonic device for generating white light or color lights
#9544Light emitting device having a pluralilty of light emitting cells and package mounting the same
#9545Light emitting device package and lighting system having the same
#9546Hybrid combination of substrate and carrier mounted light emitting devices
#9547Light-emitting device, light-emitting device package and lighting system
#9548Semiconductor chip having double bump structure and smart card including the same
#9549Light emitting device, method of manufacturing the same, light emitting device package and lighting system
#9550Light emitting device, light emitting device package and lighting system
#9551System and Method To Track And Authenticate Semiconductor Chips, Multi-Chip Package Modules, And Their Derivative System Products
#9552Micro-fluidic injection molded solder (IMS)
#9553METHOD FOR MANUFACTURING OPTICAL MODULE
#9554Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel
#9555Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the same
#9556CONTACT STRUCTURE HAVING A COMPLIANT BUMP AND A TESTING AREA AND MANUFACTURING METHOD FOR THE SAME
#9557Tape residue-free bump area after wafer back grinding
#9558Semiconductor device, manufacturing method of semiconductor device, and RFID tag
#9559Method of fabricating stacked packages with bridging traces
#9560Semiconductor fabrication method and system
#9561Method of fabricating a light emitting diode chip having phosphor coating layer
#9562Semiconductor chip package structure for achieving flip-chip type electrical connection without using wire-bonding process and method for making the same
#9563Electronic circuit module component and method of manufacturing electronic circuit module component
#9564Microfluidic system for purposes of analysis and diagnosis and corresponding method for producing a microfluidic system
#9565Semiconductor light-emitting apparatus integrated with heat-conducting/dissipating module
#9566LED lamp
#9567Molded power-supply module with bridge inductor over other components
#9568Integrated circuit card
#9569Electric power conversion apparatus
#9570System-in-package using embedded-die coreless substrates, and processes of forming same
#9571Surface emitting laser module, optical scanner, and image forming apparatus
#9572White LED light source module
#9573Light emitting diode package and lamp with the same
#9574Co-doped 1-1-2 nitrides
#9575MULTI-FUNCTION CARD DEVICE
#9576Packaged electronic device having metal comprising self-healing die attach material
#9577FILLING COMPOSITION, SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND METHOD OF FABRICATING THE SEMICONDUCTOR DEVICE
#9578MULTI-CHIP STACK STRUCTURE HAVING THROUGH SILICON VIA
#9579Enhanced WLP for superior temp cycling, drop test and high current applications
#9580Silicon substrate for package
#9581Under-Bump Metallization Structure for Semiconductor Devices
#9582ELECTRONIC DEVICE, PACKAGE INCLUDING THE SAME AND METHOD OF FABRICATING THE PACKAGE
#9583Integrated circuit packaging system with bump contact on package leads and method of manufacture thereof
#9584Chip package and method for forming the same
#9585Integrated circuit package system with package stacking and method of manufacture thereof
#9586Structure for multi-row lead frame and semiconductor package capable of minimizing an under-cut
#9587Stacked dual chip package and method of fabrication
#9588Integrated circuit packaging system with lead frame and method of manufacture thereof
#9589Multi-layer lead frame package and method of fabrication
#9590PHOTOELECTRIC CONVERSION FILM-STACKED SOLID-STATE IMAGING DEVICE WITHOUT MICROLENSES, ITS MANUFACTURING METHOD, AND IMAGING APPARATUS
#9591Stacked die package for MEMS resonator system
#9592Semiconductor device
#9593Power MOS transistor device and switch apparatus comprising the same
#9594Light emitting diode and method of fabricating the same
#9595Semiconductor chip assembly with post/base heat spreader with thermal via
#9596Semiconductor light emitting device
#9597Light Emitting Diode Package Structure and Manufacturing Method Thereof
#9598Semiconductor device and manufacturing method thereof, and camera module including the same
#9599Light emitting device, electrode structure, light emitting device package, and lighting system
#9600Light emitting device and light emitting device package