Conducting layer in chip package module

Phosphor composition and method for producing the same, and light-emitting device using the same

BOND PAD FOR SEMICONDUCTOR DEVICE

PACKAGING STRUCTURE FOR THE HORIZONTAL CAVITY SURFACE EMITTING LASER DIODE WITH MONITOR PHOTODIODE

Lighting device package

Light emitting device

LED lampshade injection-molded or pressure cast with an IMD film

Circuit module and circuit device including circuit module

ELECTRONIC PACKAGE STRUCTURE

Semiconductor module, module substrate structure, and method of fabricating the same

PACKAGE STRUCTURE WITH EMBEDDED CAPACITOR, FABRICATING PROCESS THEREOF AND APPLICATIONS OF THE SAME

Structure and method for self protection of power device

Ink jet recording head and method for manufacturing the same

Driving circuit for a liquid crystal display device, method of manufacturing the same and display device having the same

Coil transducer with reduced arcing and improved high voltage breakdown performance characteristics

Ignition coil

Configurable IC with interconnect circuits that also perform storage operations

Probe card assembly and kit

FLUORESCENT SUBSTANCE CONTAINING GLASS SHEET, METHOD FOR MANUFACTURING THE GLASS SHEET AND LIGHT-EMITTING DEVICE

LED heat sink

Galvanic isolators and coil transducers

SEMICONDUCTOR PACKAGE HAVING EVAPORATED SYMBOLIZATION

Stacked integrated circuit assembly

Stacked semiconductor device and method of manufacturing the same

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICE MANUFACTURED THEREBY

Localized alloying for improved bond reliability

PACKAGE SUBSTRATE, METHOD OF FABRICATING THE SAME AND CHIP PACKAGE

FLIP CHIP PACKAGE WITH ANTI-FLOATING STRUCTURE

Wiring board and semiconductor device

Semiconductor device

System in package device

STACKED PACKAGE, METHOD OF MANUFACTURING THE SAME, AND MEMORY CARD HAVING THE STACKED PACKAGE

Semiconductor multi-package module including tape substrate land grid array package stacked over ball grid array package

Wafer level CSP packaging concept

Integrated circuit package system with an encapsulant cavity and method of fabrication thereof

Multi-chip semiconductor package and method for fabricating the same

Package structure with circuits directly connected to semiconductor chip

SEMICONDUCTOR DEVICE INCLUDING A PLURAL CHIPS WITH PROTRUDING EDGES LAMINATED ON A DIE PAD SECTION THAT HAS A THROUGH SECTION

ELECTRONIC PACKAGE STRUCTURE

STACKING OF TRANSFER CARRIERS WITH APERTURE ARRAYS AS INTERCONNECTION JOINTS

Lead frame for chip packages with wire-bonding at single-side pads

Semiconductor package with electromagnetic shielding capabilities

SUBSTRATE AND SEMICONDUCTOR DEVICE USING THE SAME

Semiconductor device including switching element and two diodes

Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA type

Light emitting semi-conductor diode (with high light output)

Light emitting diode package

CERAMIC LED PACKAGE

Semiconductor light-emitting device

LED package

Light-emitting diode package and manufacturing method thereof

LED chip package structure with a plurality of thick guiding pins and a method for manufacturing the same

Light-emitting material, scintillator containing the light-emitting material, x-ray detector equipped with the scintillator, image display device using the light-emitting material, and light source using the light-emitting material

Optical device and a method of manufacturing an optical device having a photoelectric conversion element and an optical adjustment element

METHODS AND APPARATUSES TO PRODUCE INLAYS WITH TRANSPONDERS

Radiation-emitting semiconductor component and method for producing the semiconductor component

Method for fabrication of a conductive bump structure of a circuit board

DEVICES FOR COOLING AND POWER

Semiconductor pressure sensor, manufacturing method thereof, and die for molding semiconductor pressure sensor

Modular board device, high frequency module, and method of manufacturing the same

Bumping electronic components using transfer substrates

Stress free package and laminate-based isolator package

Fabrication method of multichip stacking structure

Semiconductor Light Emitting Element and Method for Manufacturing the Same

Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part

Method and apparatus providing fine alignment of a structure relative to a support

Techniques for forming interconnects

PHOTOELECTRONIC WIRED FLEXIBLE PRINTED CIRCUIT BOARD USING OPTICAL FIBER

Microphone System with Silicon Microphone Secured to Package Lid

Circuit module and process for producing the same

PRE-MOLDED LEAD FRAME AND PROCESS FOR MANUFACTURING THE SAME

Electronic component built-in substrate and method of manufacturing electronic component built-in substrate

Electronic component contained substrate

Flexible wiring substrate and method for producing the same

Organic substrates with embedded thin-film capacitors, methods of making same, and systems containing same

Device for releasing heat generated in the amplifier unit of a solid-state image sensing element

Soft touch clamp actuation mechanism

IC package reducing wiring layers on substrate and its chip carrier

Multichip stacking structure

Semiconductor chip structure, method of manufacturing the semiconductor chip structure, semiconductor chip package, and method of manufacturing the semiconductor chip package

Chip having side pad, method of fabricating the same and package using the same

Electronic device having metal pad structure and method of fabricating the same

SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor device manufacturing method, semiconductor device, and wiring board

Structure of Memory Card and the Method of the Same

Heat sink with preattached thermal interface material and method of making same

Semiconductor device and method of manufacturing the same

Package, electronic device, substrate having a separation region and a wiring layers, and method for manufacturing

Semiconductor device using wiring substrate having a wiring structure reducing wiring disconnection

Semiconductor device having a high frequency electrode positioned with a via hole

Zigzag-stacked package structure

STACK PACKAGE AND METHOD OF MANUFACTURING THE SAME

Chip arrangement and method for producing a chip arrangement

Method of manufacturing an RFID tag

Memory card and manufacturing method of the same

Semiconductor device including isolation layer

Pre-molded clip structure

Thermally enhanced single inline package (SIP)

Semiconductor device with parylene coating

Semiconductor device

SEMICONDUCTOR DEVICE, MAGNETIC SENSOR, AND MAGNETIC SENSOR UNIT

ESD protection scheme for semiconductor devices having dummy pads

LED with light diverging arrangement

Multidirectional light-emitting diode

Light-emitting diode chip package body and packaging method thereof

High performance LED package

LED chip package structure using a ceramic material as a substrate and a method for manufacturing the same

Diode housing

SYSTEM AND METHOD FOR SOLDER BONDING

Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same

Embedded waveguide and embedded electromagnetic shielding

Low temperature bonding material comprising metal particles and bonding method

Method of manufacturing a printed wiring board lead frame package

Manufacturing method of semiconductor device with smoothing

Integrated circuit package system with leads having multiple sides exposed

Method of fabricating a semiconductor multi package module having an inverted package stacked over ball grid array (BGA) package

Electrically conductive interconnect system and method

Optical element, package substrate and device for optical communication

ACOUSTIC SUBSTRATE

Electronic control apparatus and method of manufacturing the same

Microminiature power converter

MULTICHIP PACKAGE HAVING A PLURALITY OF SEMICONDUCTOR CHIPS SHARING TEMPERATURE INFORMATION

Signal isolators using micro-transformers

Wafer level assemble chip multi-site testing solution

Device for regulating the intensity of an electric current

Light emitting device

Combination assembly of LED and Liquid-vapor thermally dissipating device

Direct Die Attachment

Circuit substrate and the semiconductor package having the same

Bonding pad of semiconductor integrated circuit, method for manufacturing the bonding pad, semiconductor integrated circuit, and electronic device

Semiconductor package and method of manufacturing the same

Semiconductor device having conductive bumps and deviated solder pad

Semiconductor device and manufacturing method thereof

Redistribution circuit structure

System-in-package packaging for minimizing bond wire contamination and yield loss

Plastic semiconductor packages having improved metal land-locking features

Semiconductor device and programming method

IC chip package with near substrate scale chip attachment

Stacked integrated circuit package system and method of manufacture therefor

Semiconductor package having a semiconductor chip in a substrate and method of fabricating the same

SEMICONDUCTOR MODULES WITH ENHANCED JOINT RELIABILITY

Stack type semiconductor chip package having different type of chips and fabrication method thereof

Semiconductor device and method of fabricating the same

Enhanced durability multimedia card

Under bump metallurgy structure of a package and method of making same

Semiconductor Device

MOSFET package

Optical semiconductor package having an optical module with a progressively varying refractive index

Optoelectronic device package and packaging method thereof

Photocoupler

Package structure for optoelectronic device and fabrication method thereof

Semiconductor device and electronic device having the same

Printed circuit board

Bonding pad structure for back illuminated optoelectronic device and fabricating method thereof

Aromatic Polyamide Composition and Article Manufactured Therefrom

Semiconductor device and manufacturing method thereof, liquid crystal television system, and EL television system

Power MOSFET wafer level chip-scale package

Method of bonding a solder ball and a base plate and method of manufacturing packaging structure of using the same

METAL-GRAPHITE FOAM COMPOSITE AND A COOLING APPARATUS FOR USING THE SAME

Packaging structure and method of a MEMS microphone

Illumination System Comprising Ceramic Luminescence Converter

Microelectronic assembly with multi-layer support structure

Flip chip mounting process and bump-forming process using electrically-conductive particles as nuclei

Electronic component built-in substrate and method for manufacturing the same

Electric Device Comprising a Housing and a Cooling Body

DISPLAY DEVICE

Electro optical device and electronic apparatus

Semiconductor device

Probe structure having a plurality of discrete insulated probe tips projecting from a support surface, apparatus for use thereof and methods of fabrication thereof

Electric power semiconductor device

MULTI-CHIP PACKAGE AND METHOD OF FABRICATING THE SAME

Semiconductor chip package and method of manufacturing the same

Semiconductor package with flow controller

Substrate improving immobilization of ball pads for BGA packages

INJECTION MOLDED SOLDER BALL METHOD

Semiconductor device and method for producing the same

MULTI-CHIP PACKAGE

Heat dissipating semiconductor package

Method and apparatus for providing thermal management on high-power integrated circuit devices

Chip package structure

Ball grid array structures having tape-based circuitry

Semiconductor package, manufacturing method thereof and IC chip

STACKABLE SEMICONDUCTOR PACKAGE AND THE METHOD FOR MAKING THE SAME

Cap package for micro electro-mechanical system

Microelectronic component assemblies with recessed wire bonds and methods of making same

Semiconductor power device

Power device package comprising metal tab die attach paddle (DAP) and method of fabricating the package

High power semiconductor package

Molding compound flow controller

Thin semiconductor package having stackable lead frame and method of manufacturing the same

Method for reduction of soft error rates in integrated circuits

CHIP PACKAGE CAPABLE OF MINIMIZING ELECTRO-MAGNETIC INTERFERENCE

Method for manufacturing a three-dimensional semiconductor device and a wafer used therein

INTEGRATED CIRCUITS WITH CONDUCTIVE FEATURES IN THROUGH HOLES PASSING THROUGH OTHER CONDUCTIVE FEATURES AND THROUGH A SEMICONDUCTOR SUBSTRATE

Electronic assembly for image sensor device and fabrication method thereof

MEMS microphone package and method thereof

Package, in particular for MEMS devices and method of making same

High-density power MOSFET with planarized metalization

Light emitting device and method of fabricating light emitting device

Light emitting device having a plurality of light emitting cells connected in series and method of fabricating the same

Light emitting apparatus

Light-Emitting Device and Method for Manufacturing Same

Semiconductor light emitting element

Control aperture for an IR sensor

Infrared Sensor

Method of making circuitized substrate with solder balls having roughened surfaces, method of making electrical assembly including said circuitized substrate, and method of making multiple circuitized substrate assembly

Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece

Ceramic electronic component and method for manufacturing the same

Component mounting apparatus

Moveable access control list (ACL) mechanisms for hypervisors and virtual machines and virtual port firewalls

APPARATUS FOR INTEGRATED INPUT/OUTPUT CIRCUIT AND VERIFICATION METHOD THEREOF

Integrated circuit/printed circuit board substrate structure and communications

Mesh network within a device

Pin with shape memory alloy

METHOD FOR CHIP TO PACKAGE INTERCONNECT

MICROELECTRONIC DIE INCLUDING SOLDER CAPS ON BUMPING SITES THEREOF AND METHOD OF MAKING SAME

SEMICONDUCTOR DEVICE HAVING FUSE CIRCUIT ON CELL REGION AND METHOD OF FABRICATING THE SAME

Manufacture including shield structure

Method for fabricating semiconductor package

Method of forming component package

Microelectronic package with thermal access

Method of making a semiconductor device having multiple die redistribution layer

Photo-detector and related methods

SOLDER PASTE COMPOSITION, SOLDER PRECOATING METHOD AND MOUNTED SUBSTRATE

Copper-elastomer hybrid thermal interface material to cool under-substrate silicon

Silicone composition for sealing light emitting element, and light emittying device

B-stageable die attach adhesives

CONDUCTIVE SINTERED LAYER FORMING COMPOSITION AND CONDUCTIVE COATING FILM FORMING METHOD AND BONDING METHOD USING THE SAME

Heat transfer device in a rotating structure

Three-dimensional memory-based three-dimensional memory module

MULTI-CHANNEL OPTICAL COUPLING DEVICE, ELECTRONIC EQUIPMENT, LEAD FRAME MEMBER, AND FABRICATION METHOD FOR MULTI-CHANNEL OPTICAL COUPLING DEVICE

Local wireless communications within a device

Structurally robust power switching assembly

Compact High-Intensity LED Based Light Source

Light-emitting device with a long lifespan

Chip mount, methods of making same and methods for mounting chips thereon

Stacked type chip package structure

STRESS AND COLLAPSE RESISTANT INTERCONNECT FOR MOUNTING AN INTEGRATED CIRCUIT PACKAGE TO A SUBSTRATE

IC card and semiconductor integrated circuit device package

Electric circuit device and the manufacturing method

Sub-assembly

HEAT TRANSFER APPARATUS CONTAINING A COMPLIANT FLUID FILM INTERFACE AND METHOD THEREFOR

Universal energy conditioning interposer with circuit architecture

Liquid crystal display and fabricating method thereof

Semiconductor module and mobile apparatus

Package level integration of antenna and RF front-end module

Sensitivity capacitive sensor

Illumination system comprising a radiation source and a fluorescent material

CHIP STACK WITH PRECISION ALIGNMENT, HIGH YIELD ASSEMBLY AND THERMAL CONDUCTIVITY

Dual molded multi-chip package system

Integrated circuit package with top pad

Semiconductor device package having pseudo chips

Interconnections for flip-chip using lead-free solders and having improved reaction barrier layers

Semiconductor packages, stacked semiconductor packages, and methods of manufacturing the semiconductor packages and the stacked semiconductor packages

Semiconductor device

METHODS OF FORMING STEPPED BUMPS AND STRUCTURES FORMED THEREBY

DIRECT TERMINATION OF A WIRING METAL IN A SEMICONDUCTOR DEVICE

Metal Line of Semiconductor Device and Manufacturing Method Thereof

Method to reduce UBM undercut

Semiconductor components having through interconnects

Conductive systems and devices including wires coupled to anisotropic conductive film, and methods of forming the same

Crack-resistant solder joint, electronic component such as circuit substrate having the solder joint, semiconductor device, and manufacturing method of electronic component

Wafer level package with die receiving through-hole and method of the same

STACK PACKAGE HAVING REDUCED ELECTRICAL CONNECTION LENGTH SUITABLE FOR HIGH SPEED OPERATIONS AND METHOD OF MANUFACTURING THE SAME

Methods of forming stepped bumps and structures formed thereby

Semiconductor device having multiple die redistribution layer

Control of Standoff Height Between Packages with a Solder-Embedded Tape

Package on package design to improve functionality and efficiency

Method for fabricating heat-dissipating package and heat-dissipating structure applicable thereto

CURVED HEAT SPREADER DESIGN FOR ELECTRONIC ASSEMBLIES

Heat dissipation semiconductor pakage

Ceramic interposer with silicon voltage regulator and array capacitor combination for integrated circuit packages

Strip patterned transmission line

Memory module for improving impact resistance

Manufacturing method of chip package

Semiconductor device and method of manufacturing the same

Semiconductor device with chip mounted on a substrate

Multiple electronic component containing substrate

Method of making a multi-layered semiconductor device

Integrated circuit package with molded cavity

Stacked packages with bridging traces

Stackable integrated circuit package system with recess

Laterally Interconnected IC Packages and Methods

Mountable integrated circuit package-in-package system with adhesive spacing structures

Bridge stack integrated circuit package-on-package system

Multi-chips package and method of forming the same

Package structures

Array capacitor for decoupling multiple voltages

Semiconductor package having leadframe with exposed anchor pads

Power device package

Lead frame and method of manufacturing the same, and semiconductor device

Multi-die semiconductor package structure and method for manufacturing the same

Lead Frame

CHIP PACKAGE STRUCTURE

CHIP PACKAGE STRUCTURE

Structure of super thin chip scale package and method of the same

Stacked-package quad flat null lead package

Leadframe package for MEMS microphone assembly

Microelectronic Assembly Using Chip-On-Lead (COL) and Cantilever Leads

Stress mitigation in packaged microchips