Semiconductor device

Semiconductor device

Submount for use in flipchip-structured light emitting device including transistor

Increased light extraction from a nitride LED

Semiconductor light emitting device and semiconductor light emitting apparatus

Semiconductor light emitting device, semiconductor light emitting apparatus, and method of manufacturing a semiconductor light emitting device

LED mounting having increased heat dissipation

Case for accommodating solid-state imaging device and solid-state imaging apparatus

Image pickup device for minimizing image degradation from stray light flux entering its structure

Wavelength-converted semiconductor light emitting device

Integrated circuit card and a method for manufacturing the same

FINE PAD PITCH ORGANIC CIRCUIT BOARD WITH PLATING SOLDER AND METHOD FOR FABRICATING THE SAME

System and method for increasing yield from semiconductor wafer electroplating

Low profile small outline leadless semiconductor device package

Optoelectronic package with wire-protection lid

Electrical device allowing for increased device densities

Stacked microfeature devices

Methods of refining lead-containing materials

Method of manufacture of ceramic composite wiring structures for semiconductor devices

Primer composition for semiconductor-encapsulating epoxy resin molding compound and semiconductor device

LOCAL MULTILAYERED METALLIZATION

Method for manufacturing flip-chip type semiconductor device featuring nickel electrode pads, and plating apparatus used in such method

Microelectronic devices and methods for forming interconnects in microelectronic devices

Semiconductor integrated circuit and semiconductor device

Process for manufacturing sawing type leadless semiconductor packages

Ultra thin dual chip image sensor package structure and method for fabrication

CHIP STRUCTURE AND MANUFACTURING PROCESS THEREOF

Carrier for substrate film

Semiconductor device and a manufacturing method of the same

Solder bump and related intermediate structure having primary and secondary portions and method of manufacturing same

Method for reducing assembly-induced stress in a semiconductor die

Method for fabricating light-emitting devices utilizing a photo-curable epoxy

Method of making light emitting device with silicon-containing encapsulant

Hybrid module and production method for same, and hybrid circuit device

Nano memory, light, energy, antenna and strand-based systems and methods

Light emitting element mounting member, and semiconductor device using the same

LED and LED lamp

Method and apparatus for producing untainted white light using off-white emitting diodes

FLEXIBLE TYPE UNIT, FLEXIBLE TYPE REEL, AND METHOD OF MANUFACTURING FLEXIBLE TYPE REEL

Bi-curvature lens for light emitting diodes and photo detectors

Optical modulator module package using flip-chip mounting technology

Solid-state imaging device

Signal transmission circuit, IC package, and mounting board

Light emitting apparatus

Phosphor mixture and light emitting device

Composition of aromatic or cycloaliphatic amine-derived polyepoxide and polyamine

Semiconductor device including a semiconductor chip with signal contact areas and supply contact areas, and method for producing the semiconductor device

Die attach material for TBGA or flexible circuitry

Semiconductor device

System for different bond pads in an integrated circuit package

Integrated circuit having memory and router disposed thereon and method of making thereof

Semiconductor device having a plastic housing and external connections and method for producing the same

HEAT SINK AND PACKAGE STRUCTURE

HIP PACKAGE STRUCTURE

Magnetic self-assembly for integrated circuit packages

Semiconductor device, method for designing the same and recording medium that can be read by computer in which program for designing semiconductor device is recorded

Semiconductor device and method of stacking semiconductor chips

Stack semiconductor package formed by multiple molding and method of manufacturing the same

Stacked integrated circuits package system with dense routability and high thermal conductivity

Chip-packaging with bonding options having a plurality of package substrates

Integrated circuit package system with die and package combination

Stacked device package for peripheral and center device pad layout device

Semiconductor device

Die structure of package and method of manufacturing the same

PHOTO DETECTOR PACKAGE

MOSFET package

Semiconductor package with passive device integration

Surface acoustic wave device and manufacruring method thereof

MOSFET package

Integrated circuit package with lead fingers extending into a slot of a die paddle

Apparatus for use in semiconductor wafer processing for laterally displacing individual semiconductor devices away from one another

Capacitor parts

High frequency integrated circuits

Semiconductor device, stacked structure, and manufacturing method

Semiconductor device, magnetic sensor, and magnetic sensor unit

Surface-mountable light-emitting diode structural element

Semiconductor composite apparatus, LED, LED printhead, and image forming apparatus

Light source module of light emitting diode

Semiconductor light emitting device

Semiconductor light emitting device, semiconductor light emitting apparatus, and method of manufacturing semiconductor light emitting device

Low stress conductive adhesive

Solid-state image pickup device, electronic apparatus using such solid-state image pickup device and method of manufacturing solid-state image pickup device

METALLIC PLATING FOR SOCKET APPLICATION IN BALL GRID ARRAY PACKAGES

METHOD AND APPARATUS FOR MOUNTING AND REMOVING AN ELECTRONIC COMPONENT

Apparatus and method for bonding anisotropic conductive film using laser beam

Casting mold for producing an optical semiconductor module

Acceleration sensor

Adapter for a memory card and a memory card

Anisotropic conductive adhesive, electrode connection structure and method using the adhesive

Microfeature devices and methods for manufacturing microfeature devices

Application of impressed-current cathodic protection to prevent metal corrosion and oxidation

Methods for assembling semiconductor devices and interposers

Mold cleaning sheet and manufacturing method of a semiconductor device using the same

Radio frequency module and fabrication method thereof

Carrier for substrate film

Semiconductor device production method and semiconductor device

MULTI-CHIP BALL GRID ARRAY PACKAGE

Sensor including lead frame and method of forming sensor including lead frame

MEMS packaging using a non-silicon substrate for encapsulation and interconnection

Underfill encapsulant for wafer packaging and method for its application

METHOD FOR PECVD DEPOSITION OF SELECTED MATERIAL FILMS

Light-emitting diode device and method of manufacturing thereof

Package for high frequency usages and its manufacturing method

Inductor formed in an integrated circuit

Semiconductor device, manufacturing method and mounting method of the semiconductor device, circuit board, and electronic apparatus

Integrated circuit with staggered differential wire bond pairs

Semiconductor device with a recessed bond pad

Chip scale package having flip chip interconnect on die paddle

Electronic device, standoff member, and method of manufacturing electronic device

Semiconductor chip package and method of manufacture

Si power device mounted on a substrate including arrangements to prevent damage to connection layers due to heat treatment

Connection technology for power semiconductors comprising a layer of electrically insulating material that follows the surface contours

Integrated connection arrangements

Interconnecting substrate and semiconductor device

Ultra thin dual chip image sensor package structure and method for fabrication

Chip stack employing a flex circuit

Integrated circuit and wireless IC tag

Encapsulation method for semiconductor device having center pad

Semiconductor package having double layer leadframe

Integrated circuit package and method of manufacture thereof

Semiconductor device, electrode member and electrode member fabrication method

Image sensor packages and frame structure thereof

Light emitting device having a layer of photonic crystals with embedded photoluminescent material and method for fabricating the device

Semiconductor light emitting device

LIGHT EMITTING DEVICE

Flip-chip type nitride semiconductor light emitting diode

Electronic device contact structures

Oxynitride fluorescent material and light-emitting device

Light source utilizing an infrared sensor to maintain brightness and color of an LED device

Light emitting diode package including monitoring photodiode

Method and resistive bridge circuit for the detection of solder-joint failures in a digital electronic package

Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board

Sealed capacitive sensor

Patch substrate for external connection

Semiconductor device package, method of manufacturing the same, and semiconductor device

Electrical contact

Semiconductor device having a through contact through a housing composition and method for producing the same

Thin silicon based substrate

Method of making reinforced semiconductor package

Encapsulation of circuit components to reduce thermal cycling stress

Microfeature devices and methods for manufacturing microfeature devices

Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment

Dual metal stud bumping for flip chip applications

Method of manufacturing semiconductor device and semiconductor device

Method of cutting integrated circuit chips from wafer by ablating with laser and cutting with saw blade

Method for integrating an electronic component or similar into a substrate

Semiconductor component and method of manufacture

Low cost method to produce high volume lead frames

Microfeature systems including adhered microfeature workpieces and support members

Placement of absorbing material in a semiconductor device

Integrated circuit package-in-package system

Method of manufacturing semiconductor device

Method of making LED encapsulant with undulating surface

Methods for fabricating semiconductor devices so as to stabilize the same when contact-bearing surfaces thereof face over test substrates

Thermally conductive resin sheet and power module using the same

Lens composition of light emission diode device, LED device, backlight unit and liquid crystal display comprising the same

High frequency semiconductor device

Semiconductor package, ID generating system thereof, ID recognizing system thereof, ID recognition method thereof, semiconductor integrated circuit chip, ID generating system thereof, ID recognizing system thereof, and ID recognition method thereof

Method of manufacturing an ink-jet assembly

Input and output circuit of an integrated circuit chip

Printed conductive connectors

Bonding apparatus

Surface-acoustic-wave-device mount substrate, high-frequency module using the same, and communication apparatus

Resin sealing method for electronic part and mold used for the method

Semiconductor device with chip-on-board structure

Semiconductor device with a number of bonding leads and method for producing the same

Semiconductor device

High reflectivity p-contacts for group lll-nitride light emitting diodes

Flip chip package with advanced electrical and thermal properties for high current designs

Semiconductor device and manufacturing method thereof

Semiconductor chip capable of implementing wire bonding over active circuits

Copper bonding wire for semiconductor packaging

Semiconductor device and manufacturing method thereof

Method and system for bonding a semiconductor chip onto a carrier using micro-pins

Land grid array package

Chip scale package with heat spreader

High frequency arrangement

Lead frame, sensor including lead frame and method of forming sensor including lead frame

Semiconductor device

Semiconductor device and its writing method

Electronic component with stacked semiconductor chips and method for producing the same

Semiconductor device

CHIP-TYPE MICRO-CONNECTOR AND METHOD OF PACKAGING THE SAME

Molded part and electronic device using the same

Semiconductor packages and methods for making and using same

Semiconductor device and unit equipped with the same

Module card structure

Semiconductor package having improved adhesiveness and ground bonding

Semiconductor device with semiconductor chip mounted in package

Dual row leadframe and fabrication method

Package stacking lead frame system

Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device

Light emitting device provided with lens for controlling light distribution characteristic

Semiconductor light emitting device

Light emitting device with enhanced encapsulant adhesion using siloxane material and method for fabricating the device

Side-view type light emitting device

LED lamp

Method of making optical light engines with elevated LEDs and resulting product

Semiconductor device such as semiconductor laser device and manufacturing method therefor, and optical transmission module and optical disk unit employing the semiconductor laser device

Semiconductor device and manufacturing process therefor

Oxynitride phosphor and semiconductor light-emitting device

Methods for packaging microelectronic imagers

Accurate relative alignment and epoxy-free attachment of optical elements

Apparatus and method for bonding wires

Wire bonding method

Heat sink, an electronic component package, and a method of manufacturing a heat sink

Semiconductor device with micro connecting elements and method for producing the same

Thermally coupled surfaces having controlled minimum clearance

Component mounting method

Substrate for forming thin film, thin film substrate, optical wave guide, luminescent element and substrate for carrying luminescent element

Semiconductor component sealed on five sides by polymer sealing layer

Semiconductor package and method for manufacturing the same

METHOD OF FORMING CHIP-TYPE LOW-K DIELECTRIC LAYER

Method for producing an electronic component with shielding

Tools and methods for forming conductive bumps on microelectronic elements

Method of forming a wear-resistant dielectric layer

Optical guide and surface light emitting apparatus using the same

LED assembly with LED position template and method of making an LED assembly using LED position template

Heat sink having directive heat elements

System for testing semiconductor components having interconnect with variable flexure contacts

Current sensor

Bond pad structure for integrated circuit chip

Forming a cap above a metal layer

Flip chip ball grid array package with constraint plate

Semiconductor device

Semiconductor device

Substrate, semiconductor die, multichip module, and system including a via structure comprising a plurality of conductive elements

Semiconductor device, method of manufacturing the same, capacitor structure, and method of manufacturing the same

Semiconductor device

Semiconductor device and manufacturing method of the same

Component arrangement for series terminal for high-voltage applications

Semiconductor package with plated connection

Substrate for an FBGA semiconductor component

Semiconductor chip having solder bumps and dummy bumps

Contact structure and method for manufacturing the same

Heat spreader clamping mechanism for semiconductor modules

LED housing and fabrication method thereof

Apparatus and methods for cooling semiconductor integrated circuit chip packages

Method for producing an FBGA component and substrate for carrying out the method

Fine pitch low cost flip chip substrate

Semiconductor device and method of manufacturing the same

Ground arch for wirebond ball grid arrays

Stacked die package system

Input stage of semiconductor device with multiple pads of common function, and multi-chip package having the same

Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectonic devices

Chip package and producing method thereof

Method of manufacturing non-leaded integrated circuit package system having etched differential height lead structures

Semiconductor device and process for fabrication thereof

Semiconductor package with low and high-speed signal paths

Sensor system

Semiconductor storage device, semiconductor device, and manufacturing method therefor

Semiconductor device and production method thereof

Magnetic shielding for magnetically sensitive semiconductor devices

Light source apparatus and fabrication method thereof

LED light set

IC chip coating material and vacuum fluorescent display device using same

High power LED housing and fabrication method thereof

Optical semiconductor device package and optical semiconductor device

Semiconductor light emitting device, light emitting module and lighting apparatus

Method and system for transferring dies between surfaces

Perimeter matrix ball grid array circuit package with a populated center

Multilayer printed wiring board and process for producing the same

Multilayer substrate and method for producing same

Multilayer printed wiring board and method of manufacturing the same

Microchannel structure and its manufacturing method, light source device, and projector

Multistage heat pumps and method of manufacture

Methods of adhering microfeature workpieces, including a chip, to a support member

Manufacturing method of semiconductor device

Package or pre-applied foamable underfill for lead-free process

Semiconductor module for making electrical contact with a connection device via a rewiring device

System for controlling exterior vehicle lights

Optical module

Minimized wire bonds in transient blocking unit packaging

Semiconductor apparatus

Semiconductor device and method of making the same

Molded package and semiconductor device using molded package

Semiconductor device including capsule type semiconductor package and semiconductor chip in stacking manner

High performance IC package and method

Structure and method for bonding an IC chip

Consolidated flip chip BGA assembly process and apparatus

Integrated circuits and interconnect structure for integrated circuits

Ball grid array package

Semiconductor device and method of manufacturing the same

Interposers with flexible solder pad elements

Semiconductor device

Semiconductor device having semiconductor chips stacked and mounted thereon and manufacturing method thereof

Nested integrated circuit package on package system

Integrated circuit package system using interposer

Systems, methods, and apparatus for generating ball-out matrix configuration output for a flex circuit

Semiconductor device with gold coatings, and process for producing it

Interposer configured to reduce the profiles of semiconductor device assemblies, packages including the same, and methods

Multi-leadframe semiconductor package and method of manufacture

STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM

Semiconductor device and fabrication method thereof

Power supply, multi chip module, system in package and non-isolated DC-DC converter

Method of joining a thermoplastic material to a thermoset material, and thermoplastic-thermoset composite

Microelectronic imaging units and methods of manufacturing microelectronic imaging units

Smart card, smart card module, and a method for production of a smart card module

Wire bonding method

Capillary holder