Camera module and method of manufacturing the same

Light emitting device with excellent heat resistance and light resistance

Increased light output light emitting device using multiple phosphors

Light emitting device provided with a wavelength conversion unit incorporating plural kinds of phosphors

Light emitting device with silicone resin layer formed by screen printing

Method of forming metal interconnect layers for flip chip device

Semiconductor chip capable of implementing wire bonding over active circuits

Semiconductor package substrate having contact pad protective layer formed thereon

Ball grid array package stack

Semiconductor device and fabrication method thereof

Chip package

Method of fabricating a substrate with a concave surface

Multilayer circuit board and method of manufacturing the same

Semiconductor multipackage module including tape substrate land grid array package stacked over ball grid array package

Reinforced bond pad for a semiconductor device

Structure and assembly method of integrated circuit package

Semiconductor device

Power semiconductor module

Semiconductor device, method for manufacturing the semiconductor device and semiconductor substrate

Semiconductor device and method of manufacturing semiconductor device

Area mount type semiconductor device, and die bonding resin composition and encapsulating resin composition used for the same

Semiconductor Package Having Integrated Metal Parts for Thermal Enhancement

Method of manufacturing stack-type semiconductor device and method of manufacturing stack-type electronic component

Elimination of low frequency oscillations in semiconductor circuitry

Power semiconductor device and method therefor

Power semiconductor device and method therefor

Light-emitting diode

Compact light emitting device package with enhanced heat dissipation and method for making the package

Strobe light control circuit and IGBT device

Method of assembling soldered packages utilizing selective solder deposition by self-assembly of nano-sized solder particles

Electronic device substrate and its fabrication method, and electronic device and its fabrication method

Multi-wire board, its manufacturing method, and electronic apparatus having the multi-wire board

Transferring die(s) from an intermediate surface to a substrate

Method of fabricating semiconductor chip assemblies

SOCKETS FOR "SPRINGED" SEMICONDUCTOR DEVICES

Manufacturing managing method of semiconductor devices and a semiconductor substrate

Copper interconnect post for connecting a semiconductor chip to a substrate and method of fabricating the same

Fabricating process of an electrically conductive structure on a circuit board

Method of forming a low temperature-grown buffer layer, a light emitting element and method of making same, and light emitting device

Semiconductor wafer coat layers and methods therefor

Integrated circuit edge protection method and apparatus

Leadless semiconductor package and manufacturing method thereof

Method of manufacturing enhanced thermal dissipation integrated circuit package

Method of manufacturing flexible circuit substrate

Packing method for electronic components

SEMICONDUCTOR PACKAGE SUBSTRATE HAVING CONTACT PAD PROTECTIVE LAYER FORMED THEREON AND METHOD FOR FABRICATING THE SAME

Ball grid array package and process for manufacturing same

Molding method for foldover package

Organic substrates with integral thin-film capacitors, methods of making same, and systems containing same

Method of production of circuit board utilizing electroplating

Sensor module structure and method for fabricating the same

Semiconductor device and manufacturing method thereof

Optical device cavity structure, optical device, and method for manufacturing an optical device cavity structure

Optical semiconductor device, manufacturing method therefor, and optical semiconductor apparatus

Light source module, backlight unit, and liquid crystal display device

Phosphor blend for wavelength conversion and white light emitting device using the same

Multi-wire board, its manufacturing method, and electronic apparatus having the multi-wire board

Heat sink for multiple semiconductor modules

Optical device module, optical path fixing device, and method for manufacturing optical device module

Semiconductor device and an image sensing device

Mounting structure and mounting method of a semiconductor device, and liquid crystal display device

Semiconductor device to be applied to various types of semiconductor package

Stacked die package

Semiconductor device having stress relaxation sections

Semiconductor chip package and manufacturing method thereof

Chip package with dam bar restricting flow of underfill

Method for mounting semiconductor chips on a substrate and corresponding assembly

Multi-chip package and method for manufacturing the same

Method of mounting an integrated circuit package in an encapsulant cavity

Semiconductor device

Flip chip package and the fabrication thereof

Reducing cracking of high-lead or lead-free bumps by matching sizes of contact pads and bump pads

ELECTRONIC DEVICE PACKAGE

Packaged semiconductor device and method of manufacture using shaped die

Wire bonded wafer level cavity package

Semiconductor device module and manufacturing method of semiconductor device module

Semiconductor device having bonding pad of the first chip thicker than bonding pad of the second chip

High density integrated circuit having multiple chips and employing a ball grid array (BGA) and method for making same

Integrated heat spreader with intermetallic layer and method for making

Semiconductor packages and methods of manufacturing thereof

Thermally enhanced three-dimensional package and method for manufacturing the same

Semiconductor device and a manufacturing method of the same

Electronic device and method for fabricating the same

Circuit device and manufacturing method thereof

Semiconductor chips having redistributed power/ground lines directly connected to power/ground lines of internal circuits and methods of fabricating the same

Semiconductor device and manufacturing method thereof

Stacked package for electronic elements

Method for manufacturing semiconductor apparatus, and semiconductor apparatus and electric appliance

Semiconductor assembly including chip scale package and second substrate with exposed surfaces on upper and lower sides

Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sides

Stacked-type semiconductor device and method of manufacturing the same

Stacked semiconductor package

Vertically integrated system-in-a-package

Electronic component mounting package and package assembled substrate

Memory card with connecting portions for connection to an adapter

Memory card with connecting portions for connection to an adapter

IC card and method of manufacturing the same

Low cost hermetically sealed package

Semiconductor integrated circuit (IC) packaging with carbon nanotubes (CNT) to reduce IC/package stress

Method of forming self-passivating interconnects and resulting devices

Semiconductor device and method of manufacturing the same, metal component and method of manufacturing the same

Structure and method to control underfill

Lead frame for a magnetic sensor

Electronic package with a stepped-pitch leadframe

Lead frame and semiconductor device

Semiconductor module and method of manufacturing the same

Package structure having mixed circuit and composite substrate

Semiconductor device

Semiconductor device with extraction electrode

Semiconductor device and method of manufacturing the same

Organic substrates with embedded thin-film capacitors, methods of making same, and systems containing same

Wafer level package including a device wafer integrated with a passive component

IC package with prefabricated film capacitor

Isolation structure configurations for modifying stresses in semiconductor devices

Chip scale surface mounted device and process of manufacture

Semiconductor device suitable for a ferroelectric memory and manufacturing method of the same

Light emitting diode systems

Semiconductor light emitting device

LED lamp apparatus and manufacturing method thereof

System and method for surface mountable display

Semiconductor light-emitting device mounting member, light-emitting diode constituting member using same, and light-emitting diode using same

Semiconductor light emitting device and semiconductor light emitting unit

Phosphor and manufacturing method of the same, and light emitting device using the phosphor

LED

Receiving optical subassembly with an improved high frequency performance

LED package using Si substrate and fabricating method thereof

A1InGaP LED having reduced temperature dependence

Lighting device with flipped side-structure of LEDs

Infrared imaging sensor and vacuum packaging method thereof

Distortion and shock resistant optical device module for image capture

Image sensor module with optical path delimiter and accurate alignment

COMPACT CAMERA MODULE WITH REDUCED THICKNESS

Bonding wire cleaning unit and method of wire bonding using same

Laser bonding tool with improved bonding accuracy

CURRENT SENSOR

Circuit device

Multilayer wiring board and its manufacturing method

Semiconductor integrated device and apparatus for designing the same

Liquid epoxy resin composition and semiconductor device

Device for controlling a vehicle

Method for manufacturing semiconductor device, and method and structure for implementing semicondutor device

Package structure and fabrication thereof

Method of manufacturing a semiconductor device

Universal interconnect die

Stacked die-in-die BGA package with die having a recess

Method of manufacturing semiconductor device

Microelectronics devices, having vias, and packaged microelectronic devices having vias

Flip chip interconnection having narrow interconnection sites on the substrate

Package structure of semiconductor and wafer-level formation thereof

Vertically stacked semiconductor device

Wafer-level package for integrated circuits

Schottky diode device with aluminum pickup of backside cathode

Microelectronic imaging units and methods of manufacturing microelectronic imaging units

White light emitting device and method of making same

Integrated circuit for communications modules

Integrated circuit carrier

Embedded capacitor structure

Flexible circuit substrate and method of manufacturing the same

ESD foam ground clip

Vertical cavity surface-emitting laser in non-hermetic transistor outline package

Light-emitting device and image reading apparatus

Semiconductor structure with RF element

Secure system for tracking elements using tags

Lighting device, image pickup apparatus and portable terminal unit

Method for fabricating flip-attached and underfilled semiconductor devices

Die attach methods and apparatus

Capillary underfill and mold encapsulation method and apparatus

Aluminum cap with electroless nickel/immersion gold

Flip-chip semiconductor package and method for fabricating the same

Semiconductor chip and method manufacturing the same

Manufacturing method for semiconductor device, semiconductor device, and electronic apparatus

Electronic assembly including multiple substrates

Wiring board, electronic circuit board, electronic apparatus and manufacturing method of electronic circuit board

Semiconductor device and semiconductor-device manufacturing method

Semiconductor device having a functional surface

Wafer level chip scale package having a gap and method for manufacturing the same

C4 joint reliability

Semiconductor device with interlocking clip

Semiconductor device having a frame portion and an opening portion with mountable semiconductor chips therein

Semiconductor composite apparatus, print head, and image forming apparatus

Integrated circuit thermal management method and apparatus

Semiconductor packaging mold and method of manufacturing semiconductor package using the same

Semiconductor device including an arrangement for detection of tampering

Semiconductor device including substrate and upper plate having reduced warpage

Semiconductor device

Semiconductor device and manufacturing method thereof

LED package structure and method for making the same

Leadframe for semiconductor device

Device and applications for passive RF components in leadframes

Methods and apparatuses for microelectronic assembly having a material with a variable viscosity around a MEMS device

Power semiconductor devices and methods of manufacture

Power semiconductor devices and methods of manufacture

Light emitting diode package with protective function against electrostatic discharge

Semiconductor light source for illuminating a physical space including a 3-dimensional lead frame

Light emitting diode package and fabrication method thereof

Metal silicate-silica-based polymorphous phosphors and lighting devices

Epoxy resin molding material for sealing use and semiconductor device

Microchannel structure and manufacturing method therefor, light source device, and projector

System for tracking elements using tags

Method for producing a wire connection

Pressure sensor device and pressure sensor cell thereof

Method and apparatus for improving thermal energy dissipation in a direct-chip-attach coupling configuration of an integrated circuit and a circuit board

Signal transmission arrangement and method

Method of forming an interconnection element

ELECTRICAL CONTACT

Method for Manufacturing Gold Bumps

Manufacturing method for physical quantity sensor using lead frame and bonding device therefor

Heatsink apparatus and thermally-conductive intermediate material for dissipating heat in semiconductor packages

Flip-chip adaptor package for bare die

Package of image sensor device and formation thereof

System and method to increase die stand-off height

Underfill on substrate process and ultra-fine pitch, low standoff chip-to-package interconnections produced thereby

Semiconductor device and manufacturing method of the same

Semiconductor integrated circuit arrangement device and method

Semiconductor device and its manufacture method, and measurement fixture for the semiconductor device

Electronic function part mounted body and method of manufacturing the electronic function part mounted body

Semiconductor device

Electronic assembly with integral thermal transient suppression

Semiconductor device and manufacturing method therefor

Heat sink for surface-mounted semiconductor devices and mounting method

Power amplifier circuitry having inductive networks

Apparatus and methods for packaging electronic devices for optical testing

Microelectronic component assemblies with recessed wire bonds and methods of making same

Flip-chip-on-film package structure

LED device with flip chip structure

Three-dimensional package

Top via pattern for bond pad structure

Double density method for wirebond interconnect

Stacked package integrated circuit

Integrated device and electronic system

Wiring board and method of manufacturing the same

Strain silicon wafer with a crystal orientation (100) in flip chip BGA package

Semiconductor device and manufacturing method for the same

Stacked semiconductor package

Semiconductor device package

Semiconductor chip and semiconductor device including the same

Miniature optical element for wireless bonding in an electronic instrument

Acceleration sensor and method of manufacturing acceleration sensor

Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device

Light source apparatus

Light emitting device

Light emitting device and illumination apparatus

Powdered fluorescent material and method for manufacturing the same, light-emitting device, and illumination apparatus

Solid-state image sensing device

RFID tag, module component, and RFID tag fabrication method

Contact securing element for bonding a contact wire and for establishing an electrical connection

Method, device and system for bonding a semiconductor element

Heating element movement bonding method for semiconductor components

Bonding pads having slotted metal pad and meshed via pattern

Sensor and guide wire assembly

METHOD FOR LAMINATING CHIPS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME

Semiconductor device and a method for manufacturing the same

Temperature dependent semiconductor module connectors

Preparation of semiconductor device

Forming a barrier layer in interconnect joints and structures formed thereby

Low capacitance solder bump interface structure

Stray field shielding structure for semiconductors

Methods of forming self-healing metal-insulator-metal (MIM) structures and related devices

Front-end processing of nickel plated bond pads

Method for manufacturing a semiconductor package with a laminated chip cavity

Chip heat dissipation structure and manufacturing method

Solder masks used in encapsulation, assemblies including the solar mask, and methods

Methods for packing microfeature devices and microfeature devices formed by such methods

Semiconductor package fabrication

Method for producing chip stacks and chip stacks formed by integrated devices

Liquid epoxy resin composition and semiconductor device

Wafer-processing tape

Circuit device

Optical semiconductor device, electronic device, and method for producing optical semiconductor device

Jacketed LED assemblies and light strings containing same

Electronic package with integrated capacitor

Current regulator having a transistor and a measuring resistor

Blister package with integrated electronic tag and method of manufacture

Material for forming insulating film with low dielectric constant, low dielectric insulating film, method for forming low dielectric insulating film and semiconductor device

Semiconductor device

Semiconductor device with via hole for electric connection

Semiconductor device having a package base with at least one through electrode

Copper interconnection with conductive polymer layer and method of forming the same

Printed wiring board and method for manufacturing the same

Tape ball grid array package with electromagnetic interference protection and method for fabricating the package

METHOD OF FORMING REDISTRIBUTION BUMP AND SEMICONDUCTOR CHIP AND MOUNT STRUCTURE FABRICATED USING THE SAME

Package of a semiconductor device with a flexible wiring substrate and method for the same

Semiconductor chip packaging apparatus and method of manufacturing semiconductor chip package

Conductive bump structure of circuit board and method for fabricating the same

Chip package and fabricating method thereof

Semiconductor device, semiconductor body and method of manufacturing thereof

Heat spreader and package structure utilizing the same

Method and structure to provide balanced mechanical loading of devices in compressively loaded environments

Semiconductor power module

Interposer, and multilayer printed wiring board

Impedance matching external component connections with uncompensated leads

Assemblies and multi-chip modules including stacked semiconductor dice having centrally located, wire bonded bond pads

Imaging module and method for forming the same

Method for MCP packaging for balanced performance

Semiconductor component having stiffener, circuit decal and terminal contacts

Microelectronic devices having conductive complementary structures and methods of manufacturing microelectronic devices have conductive complementary structures

Semiconductor package and method for manufacturing the same

High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package

Radio-frequency module for communication

Encapsulated light receiving and processing semiconductor module with enhanced shielding and grounding properties