Manufacturing method of solid-state image sensing device

Solid image-pickup device and method for manufacturing the solid image pickup device

Low thermal resistance LED package

Package-integrated thin film LED

Illuminating apparatus, method for fabricating the using the same and display apparatus using the same

Opto-electronic device having a light-emitting diode and a light sensor

Method of mounting electronic component

Semiconductor device and method for manufacture thereof, circuit board, and electronic instrument

Thermally conductive channel between a semiconductor chip and an external thermal interface

Method for fabricating connection terminal of circuit board

Bumping process and structure thereof

Integrated inductor and method of fabrication

Method for fabricating semiconductor package with short-prevented lead frame

Chip package, chip packaging, chip carrier and process thereof

Method for flip chip bonding by utilizing an interposer with embedded bumps

Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel

Transient thermoelectric cooling of optoelectronic devices

Multi-wavelength optical transceiver module, and multiplexer/demultiplexer using thin film filter

Anti-tamper module

Modular mounting arrangement and method for light emitting diodes

Integrated structure with CPU and north bridge chip

Electronic component embedded within a plastic compound and including copper columns within the plastic compound extending between upper and lower rewiring layers, and system carrier and panel for producing an electronic component

Semiconductor device having semiconductor chip on base through solder layer and method for manufacturing the same

Semiconductor device and manufacturing method of the same

UBM STRUCTURE FOR IMPROVING RELIABILITY AND PERFORMANCE

Packaged device and method of forming same

Substrate structure with embedded chip of semiconductor package and method for fabricating the same

Bumping process and structure thereof

Molded high density electronic packaging structure for high performance applications

Compliant interconnects for semiconductors and micromachines

Array capacitor with resistive structure

Semiconductor device and method of producing the same

Audio amplifier assembly

Multilayer semiconductor device

Semiconductor device and method for producing the same

Image sensor package

IC (integrated circuit) card

Thermally enhanced molded package for semiconductors

System to control effective series resistance of power delivery circuit

IC substrate and manufacturing method thereof and semiconductor element package thereby

Cavity-down multiple-chip package

Physical quantity sensor and manufacturing method therefor

Power converter

Securing a transistor outline can within an optical component

Method and apparatus for mixing light emitted by a plurality of solid-state light emitters

Package structure for optical-electrical semiconductor

Light emitting module

Package structure of multi-chips light-emitting module

Solderable top metal for SiC device

Package structure of image sensor device

Rfid tag

Method and apparatus for placing conductive balls

Method of forming folded-stack packaged device using vertical progression folding tool

Semiconductor device having element portion and control circuit portion

Iridium oxide nanowires and method for forming same

Vacuum sealed surface acoustic wave pressure sensor

Acceleration sensor chip package

Thermoelectric cooling and/or moderation of transient thermal load using phase change material

Device for bonding a metal on a surface of a substrate

Circuit carrier and production thereof

Semiconductor device and method of manufacturing the same

Method for making electronic packages

Plating method, semiconductor device fabrication method and circuit board fabrication method

Methods of making microelectronic packages with conductive elastomeric posts

Method for fabricating quad flat non-leaded package

Processing method during a package process

Packaging method for an electronic element

Multilayer core board and manufacturing method thereof

Optic device

Backlight device for liquid crystal display including a plurality of light emitting diodes within their own concaves aligned in a straight line within a larger concave

Light emitting source and a light emitting source array

Device and method for producing output light having a wavelength spectrum in the infrared wavelength range and the visble wavelength range

Electronic flash, imaging device and method for producing a flash of light having a wavelength spectrum in the visible range and the infrared range using a fluorescent material

Camera module and method of fabricating the same

Electronic circuitry

Structure and method for contact pads having a recessed bondable metal plug over of copper-metallized integrated circuits

Liquid crystal display

Semiconductor device having aluminum electrode and metallic electrode

Soldered material, semiconductor device, method of soldering, and method of manufacturing semiconductor device

Structure of polymer-matrix conductive film and method for fabricating the same

WAFER LEVEL MICROELECTRONIC PACKAGING WITH DOUBLE ISOLATION

Method of forming a bond pad on an I/C chip and resulting structure

Integrated circuit package employing a heat-spreader member

Heat dissipating package structure and method for fabricating the same

Ceramic multilayer substrate

Integrated circuit package having inductance loop formed from same-pin-to-same-bonding-pad structure

Memory card module with an inlay design

Package structure module of bump posited type lead frame

Multichip leadframe package

Semiconductor HBT MMIC device and semiconductor module

Multiple light-emitting diode arrangement

Flip-chip electrode light-emitting element formed by multilayer coatings

Optical semiconductor apparatus

Device and method for emitting output light using quantum dots and non-quantum fluorescent material

Package structure of light-emitting device

Fluorescent substance and light-emitting device using the same

Contactless data storage medium and method for operating contactless data storage medium

Method and process of contact to a heat softened solder ball array

Acceleration sensor chip package

Method of manufacturing of thin based substrate

Laser processing unit, laser processing method, and method for manufacturing semiconductor device

Flexible circuit board processing method

Manufacturing method of a semiconductor device

Semiconductor device and its manufacturing method

Method of manufacturing electric device

Polymer encapsulated dicing lane (PEDL) technology for Cu/low/ultra-low k devices

Semiconductor device and manufacturing method for the same

Method for manufacturing wafer level chip scale package using redistribution substrate

Method for producing an optical or electronic module provided with a plastic package

Method of manufacturing an LED

Method for temporarily engaging electronic component for test

Inspection method of bonded status of ball in wire bonding

Coated fluorescent substance, light emitting device comprising said substance and a method for producing said substance

Structure and method for mounting LSI package onto photoelectric wiring board, information processing apparatus, optical interface, and photoelectric wiring board

Transparent member, optical device using transparent member and method of manufacturing optical device

Semiconductor laser unit and optical pickup device including the semiconductor laser unit

Integrated semiconductor laser device and method of fabricating the same

Memory card structure and manufacturing method thereof

Folded substrate with interposer package for integrated circuit devices

Bonding structure, actuator device and liquid-jet head

LED illumination apparatus

Oxynitride phosphor and production process thereof, and light-emitting device using oxynitride phosphor

Semiconductor package with flash-absorbing mechanism and fabrication method thereof

Semiconductor device package with concavity-containing encapsulation body to prevent device delamination and increase thermal-transferring efficiency

Semiconductor package using flip-chip mounting technique

Chip bond layout for chip carrier for flip chip applications

Stacked die module

Thick metal layer integrated process flow to improve power delivery and mechanical buffering

Multi-chip integrated circuit module for high-frequency operation

Power amplifier module

Semiconductor chip mounting wiring board, manufacturing method for same, and semiconductor module

Semiconductor component with plastic housing, and process for producing the same

Micro-electro-mechanical system (MEMS) package having hydrophobic layer

3D interconnect with protruding contacts

Memory card structure

Attachment of integrated circuit structures and other substrates to substrates with vias

Power transistor including a leadframe and a semiconductor chip arranged on the leadframe

Semiconductor package structure with microstrip antennan

Die attach paddle for mounting integrated circuit die

Electro-optical device and electronic apparatus

Integrated circuit package employing a flexible substrate

Lead frame and physical amount sensor

Electronic device and method for fabricating the same

Semiconductor device, mounting structure, electro-optical device, method of manufacturing electro-optical device, and electronic apparatus

Semiconductor device

Structure of chip carrier for semiconductor optical device, optical module, and optical transmitter and receiver

Semiconductor light-emitting element assembly with a composite substrate

SMD(surface mount device)-type light emitting diode with high heat dissipation efficiency and high power

Method and apparatus for a photodetector responsive over a selectable wavelength range

Flip chip bonding tool

Wire bonder

Method and apparatus for mounting and removing an electronic component

Electronic flame-off electrode with ball-shaped tip

Contour structures to highlight inspection regions

Pressure sensor with processing circuit covered by sensor chip

Encapsulant of epoxy resin, curing agent, and secondary aminosilane coupling agent or phosphate

Method of forming bump that may reduce possibility of losing contact pad material

Method of manufacturing a substrate with through electrodes

Redistribution layer of wafer and the fabricating method thereof

Method for forming an electrode

Semiconductor device and method of manufacturing thereof

Electronic parts packaging structure and method of manufacturing the same

Semiconductor electrical connection structure and method of fabricating the same

Method for manufacturing semiconductor device and semiconductor device

Three dimensional package type stacking for thinner package application

Die handling system

Method for manufacturing semiconductor light emitting device

Die-attach films for chip-scale packaging, packages made therewith, and methods of assembling same

Curable organopolysiloxane composition and a semiconductor device made with the use of this composition

Underfill of resin and sulfonic acid-releasing thermally cleavable compound

Optical system using LED coupled with phosphor-doped reflective materials

Power semiconductor module

Inverter and vehicle drive unit using the same

Reducing the coupling between LC-oscillator-based phase-locked loops in flip-chip ASICs

CPU power delivery system

Power management integrated circuit

Semiconductor light emitting device having mixed light emission

Mold compound interlocking feature to improve semiconductor package strength

Increasing the adhesion of an adhesive connection in housings

Semiconductor device and fabrication method thereof

Semiconductor device and manufacturing method thereof

Copper interposer for reducing warping of integrated circuit packages and method of making IC packages

Array capacitor apparatuses to filter input/output signal

Methods to deposit metal alloy barrier layers

Underfill material to reduce ball limiting metallurgy delamination and cracking potential in semiconductor devices

Copper interconnect

Semiconductor device using multi-layer unleaded metal plating, and method of manufacturing the same

Carbon nanotube structure, a semiconductor device, a semiconductor package and a manufacturing method of a semiconductor device

Face-to-face bonded I/O circuit die and functional logic circuit die system

Semiconductor package

Construction to improve thermal performance and reduce die backside warpage

Semiconductor device and electronic apparatus

Resin molded semiconductor device and mold

Semiconductor device

Methods for manufacturing semiconductor device, semiconductor device and metal mold

Multi-chip package and method for manufacturing the same

Method of forming a stacked semiconductor package

Cavity-down stacked multi-chip package

Memory card

Semiconducting device that includes wirebonds

Surface-mounted microwave package and corresponding mounting with a multilayer circuit

Semiconductor lead frame, semiconductor package having the same, and method of plating the same

Semiconductor device

Apparatus of antenna with heat slug and its fabricating process

Lead frame and semiconductor package therefor

Active device bases, leadframes utilizing the same, and leadframe fabrication methods

ELECTRICAL PACKAGE STRUCTURE INCLUDING CHIP WITH POLYMER THEREON

Film substrate of a semiconductor package and a manufacturing method

Lead frame and light receiving module comprising it

Semiconductor device having power semiconductor elements

Sustaining circuit with bi-directional device

Integrated circuit with at least one bump

Circuit arrangement comprising a power component and a drive circuit integrated in two semiconductor bodies

Integrated diode in a silicon chip scale package

Led lamp for light source

Semiconductor package including light emitter and IC

Module assembly for multiple die back-illuminated diode

Semiconductor device and method for producing same

Process for manufacture of novel, inexpensive radio frequency identification devices

Wire bonder and method of operating the same

Method forming split thin film capacitors with multiple voltages

Semiconductor substrate thinning method for manufacturing thinned die

Method of forming electrode for semiconductor device

Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same

Semiconductor device manufacturing method

Integrated circuit package

Semiconductor device with improved heat dissipation, and a method of making semiconductor device

Method of fabricating microelectronic package using no-flow underfill technology and microelectronic package formed according to the method

Method for manufacturing a GaN based LED of a black hole structure

Nano-sized metals and alloys, and methods of assembling packages containing same

Low melting-point solders, articles made thereby, and processes of making same

Photoelectric composite interconnection assembly and electronics device using same

Cooling device for radiation sources provided during production of a printing form

Radio frequency module and manufacturing method thereof

Thermally conductive composite and uses for microelectronic packaging

Decoupling capacitor for an integrated circuit and method of manufacturing thereof

Array capacitor with IC contacts and applications

Interconnecting a port of a microwave circuit package and a microwave component mounted in the microwave circuit package

Method and structures for testing a semiconductor wafer prior to performing a flip chip bumping process

Production method of anisotropic conductive sheet

Lens forming systems and methods

Package stress management

Semiconductor package with wire bond arrangement to reduce cross talk for high speed circuits

Semiconductor device

Semiconductor element including a wet prevention film

Reliable printed wiring board assembly employing packages with solder joints

Method for manufacturing wafer level chip scale package structure

Input/output routing on an electronic device

Die down ball grid array package

Reinforced bond pad for a semiconductor device

Apparatus for singulating and bonding semiconductor chips, and method for the same

Semiconductor package with crossing conductor assembly and method of manufacture

Semiconductor device comprising light-emitting element and light-receiving element, and manufacturing method therefor

Electronic device

Control circuitry in stacked silicon

Chip package

Three dimensional package and packaging method for integrated circuits

Light emitting diode device

COF flexible printed wiring board and method of producing the wiring board

White light emitting device and manufacturing method thereof

Method for manufacturing and semiconductor light emitting device

Migration-proof light-emitting semiconductor device and method of fabrication

Liquid crystal display

Packaging structure for imaging detectors

Bonding tool for ultrasonic bonding and method of ultrasonic bonding

Wire feed system for a wire bonding apparatus

Self-reflowing printed circuit board and application methods

Circuit device and manufacturing method thereof

Electronic assemblies and methods of making the same

Bonding apparatus

Capacitance type physical quantity sensor having sensor chip and circuit chip

Top layers of metal for integrated circuits

Circuit-connecting material and circuit terminal connected structure and connecting method

Aluminum cap for reducing scratch and wire-bond bridging of bond pads

Singulation method used in image sensor packaging process and support for use therein

Semiconductor device and method for manufacturing the same

Wafer scale integration packaging and method of making and using the same

Semiconductor package having a heat slug and manufacturing method thereof

PROCESS OF FABRICATING FLIP-CHIP PACKAGES

Packaging method, packaging structure and package substrate for electronic parts

Structural design for flip-chip assembly

Method for producing a packaged integrated circuit

High power allngan based multi-chip light emitting diode

Methods of assembly for a semiconductor light emitting device package

Stacked die module and techniques for forming a stacked die module

Thin-film battery having ultra-thin electrolyte

Semiconductor laser module, spatial optical transmission system and electronic appliance

Stacked light source

Solder foil, semiconductor device and electronic device

Semiconductor device

Semiconductor device

Plasma display device

Devices and systems for electrostatic discharge suppression

Phosphor and an incandescent lamp color light emitting diode lamp using the same

Phosphor blends for wavelength conversion and white light emitting device using the same

High performance amine based no-flow underfill materials for flip chip applications

Semiconductor device packaged into chip size and manufacturing method thereof

Electronic component-mounted structure, method for mounting electronic component, electro-optical device, and electronic apparatus

Production methods for a leadframe and electronic devices

IC PACKAGE HAVING GROUND IC CHIP AND METHOD OF MANUFACTURING SAME