212006 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier Not covered by any one of groups , and
Light emitting device and light emitting device package including the same
#12902Nitridosilicate phosphor tunable light-emitting diodes by using UV and blue chips
#12903Ohmic electrode for use in a semiconductor diamond device
#12904Sensor array microchip
#12905Compact proximity sensor suppressing internal reflection
#12906Heat sink fin including angular dimples
#12907HEAT-DISSIPATING DEVICE
#12908LOOP HEAT PIPE AND STARTUP METHOD FOR THE SAME
#12909Heat Sink
#12910Fin fabrication process for entrainment heat sink
#12911Structure, structure and method for providing an on-chip variable delay transmission line with fixed characteristic impedance
#12912Apparatus and method for target thickness and surface profile uniformity control of multi-head chemical mechanical polishing process
#12913Electronic gaming machine interface system
#12914METHOD FOR FABRICATING VIA HOLE AND THROUGH-SILICON VIA
#12915Antifuse structure for in line circuit modification
#12916Method of manufacturing a semiconductor device having a contact plug
#12917Multiple layer barrier metal for device component formed in contact trench
#12918Method of programming electrical antifuse
#12919Method of forming E-fuse in replacement metal gate manufacturing process
#12920Method of manufacturing light emitting device
#12921Methods for monitoring thickness of a conductive layer
#12922PHASE CHANGE ENERGY STORAGE IN CERAMIC NANOTUBE COMPOSITES
#12923Housing having separate getter chamber for device operating under vacuum
#12924Semiconductor device having data bus
#12925Multi-wafer 3D CAM cell
#12926Insulation circuit board, and power semiconductor device or inverter module using the same
#12927Device mounting systems and methods
#12928Power module
#12929Heat sink assembly for a pluggable module
#12930Electronic device having fan duct
#12931HEATING SPREADING ELEMENT WITH ALN FILM AND METHOD FOR MANUFACTURING THE SAME
#12932Space-saving high-density modular data pod systems and energy-efficient cooling systems
#12933Space-saving high-density modular data pod systems and energy-efficient cooling systems
#12934Electronic apparatus with improved heat dissipation
#12935Transformer device and method for manufacturing a transformer device
#12936Termination circuit for on-die termination
#12937Multi-chip stacked system and chip select apparatus thereof
#12938Structures and methods for RF de-embedding
#12939Lighting device
#12940PLANAR LIGHT EMITTING DEVICE
#12941Pellet loader with pellet separator for molding IC devices
#12942Curable composition for semiconductor encapsulation
#12943Apparatus and methods for 3-D stacking of thinned die
#12944Semiconductor chip including a chip via plug penetrating a substrate, a semiconductor stack, a semiconductor device package and an electronic apparatus including the semiconductor chip
#12945Semiconductor device having plural wiring layers
#12946Semiconductor device and semiconductor package having the same
#12947Filling cavities in semiconductor structures having adhesion promoting layer in the cavities
#12948Semiconductor Device and Manufacturing Method Thereof
#12949Integrated circuit device and method of forming the same
#12950Contact Array for Substrate Contacting
#12951Seed layers for metallic interconnects and products
#12952Integrated circuit manufacturing method and integrated circuit
#12953Solder interconnect pads with current spreading layers
#12954Integrated circuit package and physical layer interface arrangement
#12955Semiconductor device includes a ceramic substrate and heat sink
#12956Semiconductor device and method of forming passive devices
#12957Antifuse structure for in line circuit modification
#12958Antifuse structure for in line circuit modification
#12959Anti-fuse element without defective opens
#12960Mitigation of detrimental breakdown of a high dielectric constant metal-insulator-metal capacitor in a capacitor bank
#12961Structure of metal e-fuse
#12962Semiconductor device having active region and dummy wirings
#12963Structure to reduce etching residue
#12964Tone inversion with partial underlayer etch for semiconductor device formation
#12965Self aligned silicided contacts
#12966Vertical power semiconductor carrier having laterally isolated circuit areas
#12967Vertical NPNP structure in a triple well CMOS process
#12968SEALANT FOR OPTICAL SEMICONDUCTORS AND OPTICAL SEMICONDUCTOR DEVICE
#12969System for flash-free overmolding of led array substrates
#12970Semiconductor light emitting device
#12971Display device, organic light emitting diode display, and manufacturing method of sealing substrate
#12972LED lamp with improved die arrangement
#12973Semiconductor device
#12974Self-powered integrated circuit with multi-junction photovoltaic cell
#12975Semiconductor apparatus and fabrication method of the same
#12976Material structure in scribe line and method of separating chips
#12977Interconnection structure and display device including interconnection structure
#12978SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND ELECTRIC DEVICE
#12979Radiation detection apparatus and radiation detection system
#12980Radiation detection apparatus and radiation detection system
#12981Processing detector array signals using stacked readout integrated circuits
#12982Charged particle beam apparatus and method for stably obtaining charged particle beam image
#12983Mounting apparatus for heat dissipating member
#12984Laser processing method
#12985Cu-Al ALLOY POWDER, ALLOY PASTE UTILIZING SAME, AND ELECTRONIC COMPONENT
#12986Copper conductor film and manufacturing method thereof, conductive substrate and manufacturing method thereof, copper conductor wiring and manufacturing method thereof, and treatment solution
#12987Heat radiating fin
#12988HEAT SINK
#12989HEAT DISSIPATION PLATE FOR PROJECTION-TYPE IC PACKAGE
#12990Separable liquid-cooling heat-dissipation module
#12991Heat sinking element and method of treating a heat sinking element
#12992COLD/HEAT DISCHARGE WITH INNER FLUID TO ACTUATE THE EXTERNAL FLUID PUMP
#12993Heat storage by phase-change material
#12994COOLING DEVICE
#12995HEAT DISSIPATING DEVICE
#12996HEAT DISSIPATION DEVICE
#12997Use of ionomeric silicone thermoplastic elastomers in electronic devices
#12998FASTENING OF PANEL-TYPE ELEMENTS
#12999Space-saving high-density modular data pod systems and energy-efficient cooling systems
#13000Semiconductor structure and method of designing semiconductor structure to avoid high voltage initiated latch-up in low voltage sectors
#13001Free cooling solution for a containerized data center
#13002(METH)ACRYLATE POLYMER, A RESIN COMPOSITION AND A SHAPED ARTICLE
#13003Antifuse structure for in line circuit modification
#13004Array of alpha particle sensors
#13005Method for inspecting substrate, substrate inspection apparatus, exposure system, and method for producing semiconductor device
#13006Method of manufacturing semiconductor device
#13007Method for segregating the alloying elements and reducing the residue resistivity of copper alloy layers
#13008ELECTRONIC SYSTEM WITH VENTILATION PATH THROUGH INLET-POSITIONED EHD AIR MOVER, OVER OZONE REDUCING SURFACES, AND OUT THROUGH OUTLET-POSITIONED HEAT EXCHANGER
#13009Method of creating template for matching, as well as device for creating template
#13010Methods for reading a feature pattern from a packaged die
#13011Semiconductor device including fuse array and method of operation the same
#13012Light diode with cooling body
#13013LEAD PIN FOR PACKAGE SUBSTRATE AND PACKAGE SUBSTRATE USING THE SAME
#13014PRINTED CIRCUIT BOARD WITH HEAT SINK
#13015Printed circuit board with heat sink
#13016Heat dissipation device
#13017Apparatus and method for cooling a semiconductor device
#13018Unitary housing for electronic device
#13019Semiconductor device and method of fabricating the same
#13020Solid-state imaging device and electronic apparatus with antireflection structure
#13021Wiring substrate and manufacturing method for wiring substrate
#13022Perforated contact electrode on vertical nanowire array
#13023LIGHT EMITTING DEVICE
#13024Method for fabricating a semiconductor chip and semiconductor chip
#13025SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#13026Semiconductor device with vertical current flow and low substrate resistance and manufacturing process thereof
#13027Semiconductor device with vertical current flow and low substrate resistance and manufacturing process thereof
#13028Semiconductor memory device
#13029Electromigration resistant via-to-line interconnect
#13030Heat Sink Module
#13031Insulation sheet made from silicon nitride, and semiconductor module structure using the same
#13032Shielded semiconductor device structure
#13033Semiconductor device and manufacturing method of the same
#13034Laser machining method and chip
#13035Product chips and die with a feature pattern that contains information relating to the product chip
#13036CAPACITOR AND SEMICONDUCTOR DEVICE
#13037Semiconductor device and method of manufacturing the same
#13038Trench Silicide Contact With Low Interface Resistance
#13039Semiconductor-on-insulator apparatus, device and system with buried decoupling capacitors
#13040METHOD FOR PRODUCING ELECTRONIC DEVICE, ELECTRONIC DEVICE, SEMICONDUCTOR DEVICE, AND TRANSISTOR
#13041Optoelectronic semiconductor component
#13042Organic light-emitting display device and foldable display device including the same
#13043Pixelated LED
#13044Method for producing an optoelectronic semiconductor component and optoelectronic semiconductor component
#13045LED device having a tilted peak emission and an LED display including such devices
#13046Composite substrate and method for manufacturing composite substrate
#13047Semiconductor light emitting devices including flexible unitary film on aluminum nitride substrate
#13048Semiconductor Device, Method of Manufacturing A Semiconductor Device, and Display Device
#13049Thin film transistors and methods for manufacturing the same
#13050SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURING THE SAME
#13051SEMICONDUCTOR APPARATUS AND FABRICATING METHOD THEREOF
#13052VOLTAGE SWITCHABLE DIELECTRIC MATERIALS WITH LOW BAND GAP POLYMER BINDER OR COMPOSITE
#13053ELECTROCONDUCTIVE THICK FILM COMPOSITION(S), ELECTRODE(S), AND SEMICONDUCTOR DEVICE(S) FORMED THEREFROM
#13054Coated fullerenes, compositions and dielectrics made therefrom
#13055Method for edge sealing barrier films
#13056Methods for linewidth modification and apparatus implementing the same
#13057CONNECTION TERMINAL AND CIRCUIT COMPONENT
#13058Lead pin for printed circuit board and printed circuit board using the same
#13059Back-end-of-line planar resistor
#13060Printed circuit board and method for manufacturing the same
#13061Heat transfer systems including heat conducting composite materials
#13062HEAT TRANSFER SYSTEMS AND METHODS
#13063Flattened heat pipe and manufacturing method thereof
#13064RADIAL HEAT SINK WITH HEAT PIPE SET THEREIN
#13065Stacking apparatus and method for stacking integrated circuit elements
#13066Method of manufacturing a plurality of miniaturized spring contacts
#13067CHEMICAL-MECHANICAL POLISHING WAFER AND METHOD OF USE
#13068Method of fabricating metal-insulator-semiconductor tunneling contacts using conformal deposition and thermal growth processes
#13069Method of manufacturing via hole in a semiconductor device
#13070METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE HAVING A REFRACTORY METAL CONTAINING FILM
#13071Semiconductor device having decreased contact resistance and method for manufacturing the same
#13072Metal capacitor and method of making the same including dielectric layer of different mechanical strength and dielectric constant regions
#13073Methods of forming nonvolatile memory devices having electromagnetically shielding source plates
#13074Semiconductor apparatus
#13075Thermal conduction device and method for fabricating the same
#13076Method for forming barrier film on wiring line
#13077Fan holder and heat dissipation device using the same
#13078Equalization in proximity communication
#13079Luminescent ceramic converter and LED containing same
#13080Systems and methods for improved chip device performance
#13081Heat spreader for IC package, and IC package clamper having the heat spreader
#13082Base for power module
#13083Heat sink for an electronic or electrical component
#13084Flow rectifying cooling apparatus and a method for rectifying flow in a cooling apparatus
#13085Dual CPU and heat dissipating structure thereof
#13086Cold plate having blades that interleave with memory modules
#13087ELECTROSTATIC DISCHARGE PREVENTION FOR LARGE AREA SUBSTRATE PROCESSING SYSTEM
#13088IMAGE CAPTURE DEVICE WITH FOUR PROCESSING UNITS
#13089CHOKE MODULE HAVING IMPROVED ARRANGEMENT OF MAGNETIC UNIT
#13090Semiconductor device and method of controlling the same
#13091Method to match SOI transistors using a local heater element
#13092Transistor structure having an electrical contact structure with multiple metal interconnect levels staggering one another
#13093Contactor, contact structure, probe card, and test apparatus
#13094Method of making a finger sensor package
#13095Lighting device with multiple emitters and remote lumiphor
#13096Semiconductor device including a pair of shield lines
#13097TEMPLATE, METHOD OF FORMING TEMPLATE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#13098Power Electronic Module
#13099WIRING STRUCTURE OF SEMICONDUCTOR DEVICE
#13100Semiconductor device and method of manufacturing the same
#13101Stack-type semiconductor device and method for manufacturing the same
#13102Semiconductor device
#13103HIGH BANDWIDTH SEMICONDUCTOR BALL GRID ARRAY PACKAGE
#13104SEMICONDUCTOR DEVICE
#13105Optoelectronic component, and method for the production of an optoelectronic component
#13106Packaging structure of a micro-device including a getter material
#13107SEMICONDUCTOR DEVICE
#13108Through-wafer interconnection
#13109Method and system for manufacturing copper-based capacitor
#13110Anti-fuse element without defective opens
#13111Integrated circuit chip customization using backside access
#13112Electrical Fuses Using Junction Breakdown and Semiconductor Integrated Circuits Including the Same
#13113Semiconductor inductor with a serpentine shaped conductive wire interlaced with a serpentine shaped ferromagnetic core
#13114Contacts for FET devices
#13115Electronic device including a well region
#13116Method for manufacturing vertical transistor having buried junction
#13117Manufacturing method power semiconductor device
#13118Semiconductor device having a gate insulating film with a thicker portion covering a surface of an epitaxial protrusion and manufacturing method thereof
#13119Integrated circuit with protection from copper extrusion
#13120Semiconductor image pickup device
#13121SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
#13122Accessing or interconnecting integrated circuits
#13123Light-emitting diode comprising a carrier body, a mirror layer, and two contact layers
#13124Silicone resin, sealing material, and optical semiconductor device
#13125Interconnects for stacked non-volatile memory device and method
#13126Defect review apparatus and defect review method
#13127Systems and Methodologies for Achieving Acoustic Cancellation in Synthetic Jet Ejectors
#13128Method for fabricating air gap interconnect structures
#13129METHOD OF MANUFACTURING CIRCUIT BOARD
#13130Multilayer wiring substrate
#13131Printed circuit board
#13132HEAT-RADIATING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
#13133ELECTRONIC CIRCUIT COMPRISING A TRANSFER FACE ON WHICH CONTACT PADS ARE LAID OUT
#13134Heat spreading device and method with sectioning forming multiple chambers
#13135EBULLIENT COOLING DEVICE
#13136PLATE TYPE HEAT PIPE AND HEAT SINK USING THE SAME
#13137HEAT DISSIPATION STRUCTURE
#13138Less-secure processors, integrated circuits, wireless communications apparatus, methods and processes of making
#13139Methods of fabricating photomasks for improving damascene wire uniformity without reducing performance
#13140Semiconductor device having silicon-diffused metal wiring layer and its manufacturing method
#13141MANUFACTURING PROCESS OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
#13142Method for radiation hardening a semiconductor device
#13143Method for manufacturing semiconductor device
#13144Method for manufacturing light emitting device having an active layer formed over a Ga-face
#13145Metal-ceramic substrate and method for manufacturing such a substrate
#13146ELECTRICAL COMPONENT AND METHOD FOR MANUFACTURING ELECTRICAL COMPONENTS
#13147Bonding material, method, and structure
#13148Semiconductor package molding system and molding method thereof
#13149Heat sink for a pulsed high-power laser diode
#13150Switching module including a snubber circuit connected in parallel to a series-connected unit of flowing restriction elements
#13151THERMAL PIPE CAP
#13152Transmission line for electronic circuits
#13153Thin fastener of heat sink
#13154Heat pipe and circuit board with a heat pipe function
#13155Liquid cooling system for an electronic system
#13156Mounting assembly for heat dissipating device
#13157Heat sink integrated power delivery and distribution for integrated circuits
#13158Thin film transistor array panel, liquid crystal display, method for repairing the same, color filter array panel and method for manufacturing the same
#13159Camera module including an image sensor and a laterally adjacent surface mount device coupled at a lower surface of a dielectric material layer
#13160PHOTOGRAPHIC MODULES AND METHODS OF FORMING THE SAME
#13161Solid-state imaging device, semiconductor device, manufacturing methods thereof, and electronic apparatus
#13162Modular MMW power source
#13163Package inductance compensating tunable capacitor circuit
#13164Optimized semiconductor packaging in a three-dimensional stack
#13165SILICON-ON-INSULATOR (SOI) BODY-CONTACT PASS GATE STRUCTURE
#13166Semiconductor package having test pads on top and bottom substrate surfaces and method of testing same
#13167Light-emitting device
#13168Semiconductor device
#13169Semiconductor chips having redistributed power/ground lines directly connected to power/ground lines of internal circuits and methods of fabricating the same
#13170Through level vias and methods of formation thereof
#13171Sublithographic patterning employing image transfer of a controllably damaged dielectric sidewall
#13172Buffered fuse for integrated circuit reconfiguration by laser
#13173Semiconductor device and method for manufacturing the same
#13174Interconnect structure with enhanced reliability
#13175Structure, semiconductor structure and method of manufacturing a semiconductor structure and packaging thereof
#13176Interconnect structure for high frequency signal transmissions
#13177Slot-shielded coplanar strip-line compatible with CMOS processes
#13178Integrated circuits and fabrication methods thereof
#13179Semiconductor device and method for manufacturing the same
#13180Semiconductor Device Having Island Type Support Patterns
#13181Capacitors in integrated circuits and methods of fabrication thereof
#13182Structure and design structure for high-Q value inductor and method of manufacturing the same
#13183Anti-fuse element
#13184SEMICONDUCTOR DEVICE
#13185HIGH-SPEED MEMORY SOCKETS AND INTERPOSERS
#13186Seal ring structure with polyimide layer adhesion
#13187Semiconductor structure and method for manufacturing the same
#13188Contact structure for reducing gate resistance and method of making the same
#13189Method for fabricating contact electrode and semiconductor device
#13190Light emitting device package including a substrate having at least two recessed surfaces
#13191Refractive index tuning of wafer level package LEDs
#13192Semiconductor device
#13193Miniature packaging for discrete circuit components
#13194Four-terminal metal-over-metal capacitor design kit
#13195Method of fabricating optical devices using laser treatment of contact regions of gallium and nitrogen containing material
#13196Phosphor and manufacturing method therefore, and light emission device using the phosphor
#13197ELECTROLYTIC COPPER PLATING SOLUTION FOR FILLING FOR FORMING MICROWIRING OF COPPER FOR ULSI
#13198LEAD FRAME HAVING METAL CUP WITH ENLARGED HEAT-DISSPIATION AREA
#13199Through wiring substrate and manufacturing method thereof
#13200THROUGH WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF