212012 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Boron [B]
Semiconductor device using wiring substrate having a wiring structure reducing wiring disconnection
#6002Zigzag-stacked package structure
#6003STACK PACKAGE AND METHOD OF MANUFACTURING THE SAME
#6004Method of manufacturing an RFID tag
#6005Memory card and manufacturing method of the same
#6006Pre-molded clip structure
#6007Semiconductor device including ground and power-supply planes and a dielectric layer between the ground and power-supply planes
#6008Semiconductor integrated circuit device including wiring lines and interconnections
#6009SEMICONDUCTOR DEVICE, MAGNETIC SENSOR, AND MAGNETIC SENSOR UNIT
#6010Low temperature bonding material comprising metal particles and bonding method
#6011Method and apparatus for manufacturing electronic device
#6012METHOD FOR MANUFACTURING WIRING BOARD AND METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD
#6013ADHESIVE SHEET, DICING TAPE INTEGRATED TYPE ADHESIVE SHEET, AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE
#6014Electrically conductive interconnect system and method
#6015Method of manufacturing a component-embedded PCB
#6016Bonding pad of semiconductor integrated circuit, method for manufacturing the bonding pad, semiconductor integrated circuit, and electronic device
#6017Press-Fit Diode Having a Silver-Plated Wire Termination
#6018Semiconductor package and method of manufacturing the same
#6019Semiconductor device and manufacturing method thereof
#6020Semiconductor device and package including the same
#6021System-in-package packaging for minimizing bond wire contamination and yield loss
#6022Semiconductor device and programming method
#6023Methods of stacking semiconductor devices and methods of fabricating semiconductor device packages using the same
#6024Semiconductor device and method of fabricating the same
#6025Semiconductor Device
#6026MOSFET package
#6027Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
#6028Printed circuit board
#6029Semiconductor package including connected upper and lower interconnections, and manufacturing method thereof
#6030HIGHLY CONDUCTIVE COMPOSITION FOR WAFER COATING
#6031THREE-DIMENSIONAL ARCHITECTURE FOR SELF-CHECKING AND SELF-REPAIRING INTEGRATED CIRCUITS
#6032Flip chip mounting process and bump-forming process using electrically-conductive particles as nuclei
#6033Electric power semiconductor device
#6034Highly conductive composition for wafer coating
#6035INJECTION MOLDED SOLDER BALL METHOD
#6036Semiconductor device and method for producing the same
#6037Ball grid array structures having tape-based circuitry
#6038Plate structure having chip embedded therein and the manufacturing method of the same
#6039STACKABLE SEMICONDUCTOR PACKAGE AND THE METHOD FOR MAKING THE SAME
#6040Method of packaging semiconductor devices
#6041Microelectronic component assemblies with recessed wire bonds and methods of making same
#6042Method for reduction of soft error rates in integrated circuits
#6043Method for manufacturing a three-dimensional semiconductor device and a wafer used therein
#6044INTEGRATED CIRCUITS WITH CONDUCTIVE FEATURES IN THROUGH HOLES PASSING THROUGH OTHER CONDUCTIVE FEATURES AND THROUGH A SEMICONDUCTOR SUBSTRATE
#6045Electronic components produced by a method of separating two layers of material from one another
#6046Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece
#6047SEMICONDUCTOR DEVICE HAVING FUSE CIRCUIT ON CELL REGION AND METHOD OF FABRICATING THE SAME
#6048Method for fabricating semiconductor package
#6049Method of making a semiconductor device having multiple die redistribution layer
#6050B-stageable die attach adhesives
#6051Composition for pressure sensitive adhesive film, pressure sensitive adhesive film, and dicing die bonding film including the same
#6052CONDUCTIVE SINTERED LAYER FORMING COMPOSITION AND CONDUCTIVE COATING FILM FORMING METHOD AND BONDING METHOD USING THE SAME
#6053Printed circuit board
#6054Printed circuit board
#6055Semiconductor device package having pseudo chips
#6056Wafer level package with die receiving through-hole and method of the same
#6057Interconnections for flip-chip using lead-free solders and having improved reaction barrier layers
#6058Semiconductor packages, stacked semiconductor packages, and methods of manufacturing the semiconductor packages and the stacked semiconductor packages
#6059Semiconductor device
#6060Metal Line of Semiconductor Device and Manufacturing Method Thereof
#6061Conductive systems and devices including wires coupled to anisotropic conductive film, and methods of forming the same
#6062CURVED HEAT SPREADER DESIGN FOR ELECTRONIC ASSEMBLIES
#6063RF module package for releasing stress
#6064RF module package
#6065Packing board for electronic device, packing board manufacturing method, semiconductor module, semiconductor module manufacturing method, and mobile device
#6066Wafer level package with die receiving through-hole and method of the same
#6067Manufacturing method of chip package
#6068Semiconductor device with chip mounted on a substrate
#6069Stacked die package with die interconnects
#6070Multi-chips package and method of forming the same
#6071Semiconductor package having leadframe with exposed anchor pads
#6072Power device package
#6073Lead frame and method of manufacturing the same, and semiconductor device
#6074Structure of super thin chip scale package and method of the same
#6075Integrated circuits and interconnect structure for integrated circuits
#6076Adhesive of epoxy acrylate, non-unsaturated resin and bis(methacryloylethyl) hydrogen phosphate
#6077Bonding method and bonding material using metal particle
#6078Methods of connecting an antenna to a transponder chip
#6079Semiconductor chip and method of manufacturing semiconductor chip
#6080ELECTRONIC ASSEMBLY HAVING AN INDIUM WETTING LAYER ON A THERMALLY CONDUCTIVE BODY
#6081Thinned die integrated circuit package
#6082SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING THE SAME
#6083SEMICONDUCTOR DICE HAVING BACK SIDE REDISTRIBUTION LAYER ACCESSED USING THROUGH-SILICON VIAS, METHODS
#6084SEMICONDUCTOR DEVICE MANUFACTURING METHOD
#6085Flip chip mounting method by no-flow underfill
#6086Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
#6087Multilayer printed circuit board
#6088Multilayer printed circuit board
#6089Multilayer printed circuit board
#6090Printed-wiring board, method of manufacturing printed-wiring board, and electronic equipment
#6091Voltage regulator integrated with semiconductor chip
#6092Capillary-flow underfill compositions, packages containing same, and systems containing same
#6093Mounting structure for semiconductor element
#6094Semiconductor device and manufacturing method of the same
#6095METHOD FOR FABRICATING A CIRCUIT
#6096Single mask via method and device
#6097Mounting method for semiconductor parts on circuit substrate
#6098Semiconductor device
#6099Semiconductor chip assembly and fabrication method therefor
#6100Stacked semiconductor chips having double adhesive insulating layer interposed therebetween
#6101Method of Manufacturing a Semiconductor Packages and Packages Made
#6102Memory device
#6103SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME
#6104FLIP CHIP IN PACKAGE USING FLEXIBLE AND REMOVABLE LEADFRAME
#6105Inverted lead frame in substrate
#6106Semiconductor device with lead frame including conductor plates arranged three-dimensionally
#6107Process for making contact with and housing integrated circuits
#6108Image sensor and method for manufacturing the same
#6109Semiconductor device
#6110Semiconductor device, method and apparatus for testing same, and method for manufacturing semiconductor device
#6111Wiring structure of printed wiring board and method for manufacturing the same
#6112Printed wiring board
#6113Semiconductor Sensor Component Comprising Protected Feeders, and Method for the Production Thereof
#6114Method of manufacturing multi-layer printed circuit board
#6115Systems and methods to laminate passives onto substrate
#6116Integrated circuit device mounting with folded substrate and interposer
#6117Semiconductor device and electronic device
#6118Electric component having microtips and ductile conducting bumps
#6119Top layers of metal for high performance IC's
#6120Chip structure and process for forming the same
#6121Method for fabricating a circuit component
#6122Semiconductor component comprising a semiconductor chip and semiconductor component carrier with external connection strips
#6123Manufacturing method for micro-SD flash memory card
#6124Adhesive film composition, associated dicing die bonding film, and die package
#6125Semiconductor apparatus and manufacturing method of semiconductor apparatus
#6126Printed circuit board
#6127Flip chip semiconductor packaging device and testing method using first and second reflectors for determining gap between chip and circuit board or first and second chips
#6128Thin passivation layer on 3D devices
#6129Semiconductor integrated circuit
#6130DEVICE HAVING CONTACT PAD WITH A CONDUCTIVE LAYER AND A CONDUCTIVE PASSIVATION LAYER
#6131Top layers of metal for high performance IC's
#6132Top layers of metal for high performance IC's
#6133Chip structure and process for forming the same
#6134Chip structure and process for forming the same
#6135Dummy patterns and method of manufacture for mechanical strength of low K dielectric materials in copper interconnect structures for semiconductor devices
#6136Semiconductor device
#6137Metal particles-dispersed composition and flip chip mounting process and bump-forming process using the same
#6138Tubular-shaped bumps for integrated circuit devices and methods of fabrication
#6139Three-dimensional package and method of making the same
#6140Semiconductor assembly for improved device warpage and solder ball coplanarity
#6141WAFER LEVEL PACKAGE WITH GOOD CTE PERFORMANCE
#61423D ELECTRONIC PACKAGING STRUCTURE WITH ENHANCED GROUNDING PERFORMANCE AND EMBEDDED ANTENNA
#6143Semiconductor device package diepad having features formed by electroplating
#6144Semiconductor device encapsulated by an electrically conductive plastic housing composition with conductive particles
#6145Semiconductor device having active element formation region provided under a bump pad
#6146Semiconductor device
#6147Semiconductor device and method for manufacturing the same
#6148Method for the production of a soldered joint
#6149Printed circuit board
#6150Semiconductor chip and production process therefor
#6151Manufacturing method of semiconductor device
#6152Semiconductor device and fabrication method thereof
#6153Method of making semiconductor device
#6154Liquid metal thermal interface material system
#6155Lighting device and lighting method
#6156Semiconductor device
#6157Electronic device and method of manufacturing the same, chip carrier, circuit board, and electronic instrument
#6158Stacked die in die BGA package
#6159INTEGRATED CIRCUITS WITH CONDUCTIVE FEATURES IN THROUGH HOLES PASSING THROUGH OTHER CONDUCTIVE FEATURES AND THROUGH A SEMICONDUCTOR SUBSTRATE
#6160Packaging board and manufacturing method therefor, semiconductor module and mobile apparatus
#6161Semiconductor device
#6162Method for manufacturing semiconductor device and semiconductor device
#6163Function element and function element mounting structure
#6164Packaged integrated circuit with enhanced thermal dissipation
#6165Semiconductor device with hollow structure
#6166MULTI-CHIP PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
#6167Wire bond interconnection
#6168Electronic component with layered frame
#6169Semiconductor device having plurality of leads
#6170Semiconductor component including a semiconductor chip and a passive component
#6171Amplifier chip mounted on a lead frame
#6172Articles and assembly for magnetically directed self assembly and methods of manufacture
#6173Semiconductor wafer
#6174Method for manufacturing an electrode and electrode component mounted body
#6175Method for redirecting void diffusion away from vias in an integrated circuit design
#6176Method for Preparing an Intergrated Circuits Device Having a Reinforcement Structure
#6177Semiconductor device and manufacturing method of the same
#6178Method of processing wafer
#6179Packaged microelectronic devices and methods for packaging microelectronic devices
#6180Electroplating method for a semiconductor device
#6181Semiconductor chip package and method for fabricating the same
#6182METHOD OF DIE STACKING USING INSULATED WIRE BONDS
#6183Method of fabricating a film-on-wire bond semiconductor device
#6184Single Layer Carbon Nanotube-Based Structures and Methods for Removing Heat from Solid-State Devices
#6185Double Layer Carbon Nanotube-Based Structures and Methods for Removing Heat from Solid-State Devices
#6186Microchip assembly including an inductor and fabrication method
#6187Method of fabricating an electronic device
#6188Semiconductor device and method of manufacture thereof, circuit board and electronic instrument
#6189Semiconductor device including microstrip line and coplanar line
#6190Semiconductor device and method of manufacturing the same
#6191Semiconductor device and manufacturing method thereof
#6192Semiconductor module, method for manufacturing semiconductor modules and mobile device
#6193Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#6194Intergrated Circuits Device Having a Reinforcement Structure
#6195Semiconductor chip package, printed circuit board assembly including the same and manufacturing methods thereof
#6196Semiconductor device having elastic solder bump to prevent disconnection
#6197Stacked die package
#6198DIE STACKING USING INSULATED WIRE BONDS
#6199FILM-ON-WIRE BOND SEMICONDUCTOR DEVICE
#6200SEMICONDUCTOR DEVICE
#6201Semiconductor chip and method of producing the same
#6202Solid-state imaging device
#6203Semiconductor device and manufacturing method thereof
#6204SEMICONDUCTOR INTEGRATED CIRCUIT AND FABRICATION METHOD FOR THE SAME
#6205Semiconductor integrated circuit providing for wire bonding directly above an active circuit region, and manufacturing method thereof
#6206Light emitting device having a mirror portion
#6207Flip-chip mounting resin composition and bump forming resin composition
#6208Container for piece goods
#6209Component mounting apparatus and component mounting method
#6210Stacked structures and methods of fabricating stacked structures
#6211Resin for sealing semiconductor device, resin-sealed semiconductor device and the method of manufacturing the semiconductor device
#6212Adhesive composition, adhesive sheet and production process for semiconductor device
#6213Method of mounting semiconductor chip to circuit substrate using solder bumps and dummy bumps
#6214Envelopment of Components Arranged on a Substrate
#6215MULTI-COMPONENT ELECTRONIC PACKAGE WITH PLANARIZED EMBEDDED-COMPONENTS SUBSTRATE
#6216METHOD AND APPARATUS FOR CREATING RFID DEVICES USING MASKING TECHNIQUES
#6217Fusible I/O interconnection systems and methods for flip-chip packaging involving substrate-mounted stud-bumps
#6218METHOD OF FORMING METAL LAYER WIRING STRUCTURE ON BACKSIDE OF WAFER, METAL LAYER WIRING STRUCTURE FORMED USING THE METHOD, METHOD OF STACKING CHIP PACKAGE, AND CHIP PACKAGE STACK STRUCTURE FORMED USING THE METHOD
#6219Three-dimensional wafer stacking with vertical interconnects
#6220Bonding structures and methods of forming bonding structures
#6221Rotation joint and semiconductor device having the same
#6222Bond pad design to minimize dielectric cracking
#6223Chip structure and process for forming the same
#6224Semiconductor device including a power device with first metal layer and second metal layer laterally spaced apart
#6225Semiconductor device and a method of manufacturing the same
#6226SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE CONTAINING THE SAME
#6227Method of fabricating electronic device having sacrificial anode, and electronic device fabricated by the same
#6228PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
#6229Systems and methods to passivate on-die redistribution interconnects
#6230Semiconductor module with at least two substrates
#6231Semiconductor device
#6232Semiconductor device
#6233Module comprising polymer-containing electrical connecting element
#6234Semiconductor Device And Production Method For Semiconductor Device
#6235Method for producing a semiconductor device including connecting a functional wafer to a carrier substrate and selectively etching the carrier substrate
#6236Semiconductor chips for TAG applications, devices for mounting the same, and mounting method
#6237Assembly for a microstimulator
#6238Interconnect For Microelectronic Structures With Enhanced Spring Characteristics
#6239Spread spectrum isolator
#6240Manufacturing method of electronic board and multilayer wiring board
#6241METHOD FOR IMPROVED COPPER LAYER ETCHING OF WAFERS WITH C4 CONNECTION STRUCTURES
#6242Method for manufacturing semiconductor device with reduced damage to metal wiring layer
#6243Vias having varying diameters and fills for use with a semiconductor device and methods of forming semiconductor device structures including same
#6244Use of palladium in IC manufacturing with conductive polymer bump
#6245Method for manufacturing semiconductor device
#6246Wire and solder bond forming methods
#6247Wire and solder bond forming methods
#6248WAFER SCALE THIN FILM PACKAGE
#6249Lithographic apparatus and method
#6250Semiconductor device and method for manufacturing same
#6251Method of packaging a device having a multi-contact elastomer connector contact area and device thereof
#6252Method of packaging a device having a tangible element and device thereof
#6253Wirebond Package Design for High Speed Data Rates
#6254CHIP-PACKAGING COMPOSITIONS INCLUDING CATALYSTS AND HARDENERS, PACKAGES MADE THEREWITH, AND METHODS OF ASSEMBLING SAME
#6255System and method for solder bump plating
#6256Method of making lithographic contact elements
#6257Method of manufacturing a component-embedded printed circuit board
#6258LOW FABRICATION COST, HIGH PERFORMANCE, HIGH RELIABILITY CHIP SCALE PACKAGE
#6259Low fabrication cost, high performance, high reliability chip scale package
#6260Film and chip packaging process using the same
#6261Method for manufacturing electronic component, and electronic component
#6262Module with carrier element
#6263Semiconductor integrated circuit and multi-chip module
#6264Low loop height ball bonding method and apparatus
#6265Structure and method for enhancing resistance to fracture of bonding pads
#6266COPPER-METALLIZED INTEGRATED CIRCUITS HAVING AN OVERCOAT FOR PROTECTING BONDABLE METAL CONTACTS AND IMPROVING MOLD COMPOUND ADHESION
#6267High performance system-on-chip using post passivation process
#6268Integrated circuit chips with fine-line metal and over-passivation metal
#6269Low fabrication cost, high performance, high reliability chip scale package
#6270Semiconductor package with embedded die
#6271Semiconductor package
#6272Radiation hardened lateral MOSFET structure
#6273PACKAGE DESIGNS FOR VERTICAL CONDUCTION DIE
#6274Component-embedded circuit board fabrication method
#6275Wiring board and method of manufacturing the same
#6276Circuit device and method of manufacturing the same
#6277Electronic Device, a Chip Contacting Method and a Contacting Device
#6278SEMICONDUCTOR CHIP STACK PACKAGE WITH REINFORCING MEMBER FOR PREVENTING PACKAGE WARPAGE CONNECTED TO SUBSTRATE
#6279Metal filled through via structure for providing vertical wafer-to-wafer interconnection
#6280Gold wire for connecting semiconductor chip
#6281Semiconductor device and manufacturing method of the same
#6282Fan out type wafer level package structure and method of the same
#6283Semiconductor module including components in plastic casing
#6284Integrated Circuit Package and Method for Manufacturing an Integrated Circuit Package
#6285Thin, thermally enhanced flip chip in a leaded molded package
#6286Semiconductor device, wiring of semiconductor device, and method of forming wiring
#6287Sensor-type semiconductor package and fabrication
#6288Semiconductor chip, semiconductor device and methods for producing the same
#6289Plating Device, Plating Method, Semiconductor Device, And Method For Manufacturing Semiconductor Device
#6290Method for manufacturing electronic substrate
#6291Solder ball mounting method and solder ball mounting substrate manufacturing method
#6292Method of manufacturing complementary metal oxide semiconductor image sensor
#6293Technique for forming a passivation layer without a terminal metal
#6294Wire-bonding method for wire-bonding apparatus
#6295Base plate for a power semiconductor module
#6296Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices
#6297Low fabrication cost, high performance, high reliability chip scale package
#6298Semiconductor device
#6299Packaged microelectronic devices and methods for packaging microelectronic devices
#6300Semiconductor device and a method of manufacturing the same