Circuit arrangement placed on a substrate and method for producing the same

Soldering method, electronic part, and part-exchanging method

Panel and semiconductor device having a composite plate with semiconductor chips

Self assembly of elements for displays

Semiconductor device

Semiconductor device

Offset solder bump method and apparatus

Semiconductor device

Electronic substrate manufacturing method, semiconductor device manufacturing method, and electronic equipment manufacturing method

Assembly of a semiconductor die attached to substrate with oxazoline derivative bearing an electron donor or acceptor functionality

Semiconductor chip with coil element over passivation layer

Semiconductor device and method of manufacturing the same

Semiconductor device and manufacturing method thereof

Wafer level pre-packaged flip chip systems

Wafer level pre-packaged flip chip

Semiconductor device packages with substrates for redistributing semiconductor device electrodes

Chip package having chip extension and method

Low cost power semiconductor module without substrate

Semiconductor device

LED package structure and method making of the same

Leadframeless package structure and method

Backside method for fabricating semiconductor components with conductive interconnects

Light emitting device package and method for manufacturing the same

Adherence of a solid-state image-sensing device to a substrate

Low range bonding tool

Mask and method for electrokinetic deposition and patterning process on substrates

Thermal management of systems having localized regions of elevated heat flux

NANO IC

Ball film for integrated circuit fabrication and testing

Integrated circuit with additional mini-pads connected by an under-bump metallization and method for production thereof

Method for producing a chip panel by means of a heating and pressing process using a thermoplastic material

Method for manufacturing electronic component-embedded printed circuit board

Wafer level pre-packaged flip chip

Semiconductor device and method of fabricating the same

Method of manufacturing a semiconductor device comprising stacked chips and a corresponding semiconductor device

Fabrication method of IC inlet, ID tag, ID tag reader and method of reading date thereof

Semiconductor device including wire bonding pads and pad layout method

Wafer level pre-packaged flip chip system

Flip chip interconnect solder mask

Composite multi-layer substrate and module using the substrate

Semiconductor device with sealed semiconductor chip

Methods of packaging and testing microelectronic imaging devices

Semiconductor device and manufacturing method of the same

Wire loop, semiconductor device having same and wire bonding method

Method and Device for Producing a System Having a Component Applied to a Predetermined Location of a Surface of a Substrate

Method for making a flat-top pad

Method of manufacturing a device having a contacting structure

Hardenable pressure sensitive adhesive sheet for dicing/die-bonding and method for manufacturing semiconductor device

Circuit device and method of manufacturing thereof

Semiconductor device and method for the fabrication thereof including grinding a major portion of the frame

Transparent member, optical device using transparent member and method of manufacturing optical device

Surface protection film and method for producing the same

Growth of carbon nanotubes to join surfaces

Au alloy bonding wire

Bond pad structure comprising multiple bond pads with metal overlap

Methods for forming openings in a substrate and apparatuses with these openings and methods for creating assemblies with openings

Metrology system and method for stacked wafer alignment

Stencil and method for depositing material onto a substrate

Bumpless semiconductor device

Device with area array pads for test probing

Semiconductor device with passivation layer covering wiring layer

Method of making the semiconductor device, circuit board, and electronic instrument

Semiconductor device and fabrication method thereof

Method for fabricating structure of polymer-matrix conductive film

Semiconductor device with substrate having penetrating hole having a protrusion

Stacked type semiconductor device

Stack type surface acoustic wave package, and method for manufacturing the same

Semiconductor light-emitting device and method for manufacturing the device

Method of manufacturing self-supporting contacting structures

Working method of metal material and semiconductor apparatus fabricated by the method

Post bump passivation for soft error protection

Passive element chip and manufacturing method thereof, and highly integrated module and manufacturing method thereof

Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment

Methods for applying front side and edge protection material to electronic devices at the wafer level, devices made by the methods, and systems including the devices

Semiconductor device having a plurality of semiconductor chips and method for manufacturing the same

Semiconductor device

Three dimensional packaging optimized for high frequency circuitry

Semiconductor power module package

Package substrate with built-in capacitor and manufacturing method thereof

Methods for providing bias to a monolithic microwave integrated circuit

Conductive ball mounting apparatus

Memory packages having stair step interconnection layers

Semiconductor device production method and semiconductor device

Solder deposition on wafer backside for thin-die thermal interface material

Electronic component and electronic configuration

Solder bumps in flip-chip technologies

Semiconductor package board using a metal base

Semiconductor device including a base member and a semiconductor constructing body directly fixed to thermosetting resin of the base member

Microelectronic component and assembly having leads with offset portions

Multilayer printed wiring board

Method of manufacturing a semiconductor apparatus

Semiconductor device and method of manufacturing the same

Semiconductor device with a rewiring level and method for producing the same

Circuit board with built-in electronic component and method for manufacturing the same

Semiconductor package including second substrate and having exposed substrate surfaces on upper and lower sides

Semiconductor device having a flexible board for connection to a semiconductor chip mounted on an insulating substrate

Method for fabricating connection regions of an integrated circuit, and integrated circuit having connection regions

Structure of polymer-matrix conductive film and method for fabricating the same

Microelectronic package interconnect and method of fabrication thereof

Semiconductor device assemblies with compliant spring contact structures

Multilayer printed wiring board

Fabrication of compliant spring contact structures and use thereof

Pressure contract spring for contact arrangement in power semiconductor module

Method of manufacturing multi-layered substrate

Semiconductor device and method of manufacturing the same

Method of manufacturing a semiconductor device

Chip-scale package

Semiconductor device with terminals, and method of manufacturing the same

Methods relating to the reconstruction of semiconductor wafers for wafer-level processing

Method of repairing an image display unit

Circuit device

Microelectronic contact structure and method of making same

Carrying structure of electronic components

Semiconductor device having a leading wiring layer

Semiconductor device including an under electrode and a bump electrode

Semiconductor device and method for producing the same

Semiconductor package

Apparatus for conducting heat in a flip-chip assembly

Thermal interconnect systems methods of production and uses thereof

System having semiconductor component with multiple stacked dice

Standoffs for centralizing internals in packaging process

Semiconductor device and electronic device

Semiconductor device with electrically isolated ground structures

Thermal enhanced low profile package structure

Device packages having a III-nitride based power semiconductor device

Semiconductor substrate

Substrate for mounting electronic part and electronic part

Multilayer printed wiring board

Die attach adhesives with improved stress performance

Thin passivation layer on 3D devices

Method of forming a substrateless semiconductor package

Electric circuit module with improved heat dissipation characteristics using a fixing tool for fixing an electric apparatus to a heat sink

Coolant cooled type semiconductor device

Inlet for an electronic tag

Semiconductor device and manufacturing method thereof

Electronic devices including offset conductive bumps

Semiconductor package accomplishing fan-out structure through wire bonding

Thermally enhanced semiconductor package and fabrication method thereof

Semiconductor device

High density direct connect LOC assembly

Thin multiple semiconductor die package

Semiconductor device having resin-sealed area on circuit board thereof

Semiconductor device

Semiconductor light-emitting device and its manufacturing method

Semiconductor light-emitting device, method for manufacturing the same, and light-emitting apparatus including the same

Process for precise arrangement of micro-bodies

Intermetallic Spring Structure

Method for fabricating semiconductor components with through wire interconnects

Semiconductor chip capable of implementing wire bonding over active circuits

Semiconductor device

Semiconductor package substrate having contact pad protective layer formed thereon

Method of fabricating a substrate with a concave surface

Multilayer circuit board and method of manufacturing the same

Semiconductor device

Semiconductor device, method for manufacturing the semiconductor device and semiconductor substrate

Area mount type semiconductor device, and die bonding resin composition and encapsulating resin composition used for the same

Method of manufacturing stack-type semiconductor device and method of manufacturing stack-type electronic component

Elimination of low frequency oscillations in semiconductor circuitry

Power semiconductor device and method therefor

Semiconductor integrated circuit device and vehicle-mounted radar system using the same

Method of assembling soldered packages utilizing selective solder deposition by self-assembly of nano-sized solder particles

Manufacturing managing method of semiconductor devices and a semiconductor substrate

Copper interconnect post for connecting a semiconductor chip to a substrate and method of fabricating the same

Semiconductor device and method of manufacturing the same

Leadless semiconductor package and manufacturing method thereof

Resin-encapsulated type semiconductor packages, and production method and apparatus therefor

Method for forming laminated structure and method for manufacturing semiconductor device using the method thereof

Packing method for electronic components

SEMICONDUCTOR PACKAGE SUBSTRATE HAVING CONTACT PAD PROTECTIVE LAYER FORMED THEREON AND METHOD FOR FABRICATING THE SAME

Fluidic heterogeneous microsystems assembly and packaging

Method of assembling displays on substrates

Semiconductor device and an image sensing device

Alignment fences and devices and assemblies including the same

Semiconductor device to be applied to various types of semiconductor package

Stacked die package

Semiconductor device having stress relaxation sections

Chip package with dam bar restricting flow of underfill

Method for mounting semiconductor chips on a substrate and corresponding assembly

Semiconductor device

ELECTRONIC DEVICE PACKAGE

Electronic component mounting package and package assembled substrate

Semiconductor device having bonding pad of the first chip thicker than bonding pad of the second chip

Semiconductor device and method of manufacturing thereof

Integrated heat spreader with intermetallic layer and method for making

Semiconductor device and a manufacturing method of the same

Electronic device and method for fabricating the same

Semiconductor device and manufacturing method thereof

Method for manufacturing semiconductor apparatus, and semiconductor apparatus and electric appliance

Semiconductor integrated circuit (IC) packaging with carbon nanotubes (CNT) to reduce IC/package stress

Method of forming self-passivating interconnects and resulting devices

Lead frame for a magnetic sensor

Semiconductor device with extraction electrode

Semiconductor device and method of manufacturing the same

Semiconductor device suitable for a ferroelectric memory and manufacturing method of the same

CURRENT SENSOR

Method for manufacturing an electronic module

Liquid epoxy resin composition and semiconductor device

Method for manufacturing semiconductor device, and method and structure for implementing semicondutor device

Method of room temperature covalent bonding

Method of manufacturing a semiconductor device

Universal interconnect die

Stacked die-in-die BGA package with die having a recess

Method of manufacturing semiconductor device

Flip chip interconnection having narrow interconnection sites on the substrate

Vertically stacked semiconductor device

Circuit board and the manufacturing method

Methods for the electronic, homogeneous assembly and fabrication of devices

Semiconductor structure with RF element

Secure system for tracking elements using tags

Method for fabricating flip-attached and underfilled semiconductor devices

Semiconductor chip and method manufacturing the same

Semiconductor device and semiconductor-device manufacturing method

Semiconductor device having a functional surface

Semiconductor device having a frame portion and an opening portion with mountable semiconductor chips therein

Flexible printed wiring board, method for fabricating flexible printed wiring board, and semiconductor device

Semiconductor device

Semiconductor device and manufacturing method thereof

LED package structure and method for making the same

Semiconductor device with two or more bond pad connections for each input/output cell and method of manufacture thereof

System for tracking elements using tags

Method for producing a wire connection

Signal transmission arrangement and method

Method of forming an interconnection element

ELECTRICAL CONTACT

Lapping of gold pads in a liquid medium for work hardening the surface of the pads

Flip-chip adaptor package for bare die

Underfill on substrate process and ultra-fine pitch, low standoff chip-to-package interconnections produced thereby

Method of producing a package for semiconductor chips

Method of making a flexible substrate containing self-assembling microstructures

Electronic function part mounted body and method of manufacturing the electronic function part mounted body

Microelectronic component assemblies with recessed wire bonds and methods of making same

Three-dimensional package

Top via pattern for bond pad structure

Double density method for wirebond interconnect

Semiconductor device and manufacturing method for the same

Stacked semiconductor package

Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device

RFID tag, module component, and RFID tag fabrication method

Forming solder balls on substrates

Contact securing element for bonding a contact wire and for establishing an electrical connection

Method, device and system for bonding a semiconductor element

Method to accommodate increase in volume expansion during solder reflow

Semiconductor device and a method for manufacturing the same

Method for producing a semiconductor device and resulting device

Semiconductor package fabrication

Wafer-processing tape

Optical semiconductor device, electronic device, and method for producing optical semiconductor device

Electronic package with integrated capacitor

Self assembly of elements for displays

Apparatus and method for predetermined component placement to a target platform

Material for forming insulating film with low dielectric constant, low dielectric insulating film, method for forming low dielectric insulating film and semiconductor device

Configuration for testing the bonding positions of conductive drops and test method for using the same

Semiconductor device with via hole for electric connection

Copper interconnection with conductive polymer layer and method of forming the same

Printed wiring board and method for manufacturing the same

Semiconductor device, semiconductor body and method of manufacturing thereof

High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package

Semiconductor device

Device mounting substrate and image display device

Wafer-level package having test terminal

Integrated circuit card and a method for manufacturing the same

Low profile small outline leadless semiconductor device package

Methods of refining lead-containing materials

Underfill method

Semiconductor package having an optical device and a method of making the same

Junction-isolated vias

Wafer bonding of thinned electronic materials and circuits to high performance substrate

Process for manufacturing sawing type leadless semiconductor packages

Semiconductor device and a manufacturing method of the same

Hybrid module and production method for same, and hybrid circuit device

Nano memory, light, energy, antenna and strand-based systems and methods

FLEXIBLE TYPE UNIT, FLEXIBLE TYPE REEL, AND METHOD OF MANUFACTURING FLEXIBLE TYPE REEL

Laser processing method and laser beam processing machine

Composition of aromatic or cycloaliphatic amine-derived polyepoxide and polyamine

Semiconductor device including a semiconductor chip with signal contact areas and supply contact areas, and method for producing the semiconductor device

Planar microspring integrated circuit chip interconnection to next level

System for different bond pads in an integrated circuit package

Arrangement of an electrical component placed on a substrate, and method for producing the same

Semiconductor device having a plastic housing and external connections and method for producing the same

Semiconductor device, method for designing the same and recording medium that can be read by computer in which program for designing semiconductor device is recorded

MOSFET package

MOSFET package

Integrated circuit package with lead fingers extending into a slot of a die paddle

Semiconductor device and method for producing same

Semiconductor device, magnetic sensor, and magnetic sensor unit

Low stress conductive adhesive

METHOD AND APPARATUS FOR MOUNTING AND REMOVING AN ELECTRONIC COMPONENT

Methods of fabricating integrated circuit devices having self-aligned contact structures

Anisotropic conductive adhesive, electrode connection structure and method using the adhesive

Microfeature devices and methods for manufacturing microfeature devices

Application of impressed-current cathodic protection to prevent metal corrosion and oxidation

Semiconductor device production method and semiconductor device

Microelectronic assemblies having compliancy

Underfill encapsulant for wafer packaging and method for its application

Integrated circuit with staggered differential wire bond pairs

Manufacturing method for electronic device

Chip scale package having flip chip interconnect on die paddle

Si power device mounted on a substrate including arrangements to prevent damage to connection layers due to heat treatment

Connection technology for power semiconductors comprising a layer of electrically insulating material that follows the surface contours

Integrated connection arrangements