METHOD OF FORMING PAD OF SEMICONDUCTOR DEVICE

Semiconductor device package and method for manufacturing same

Manufacturing method for electronic device

Method for fabricating a flip chip system in package

Method for fabricating semiconductor device and apparatus for fabricating the same

Packaged semiconductor device with dual exposed surfaces and method of manufacturing

Adhesion method using gray-scale photolithography

Printed circuit board and method of manufacturing semiconductor package using the same

Arrangement and method impedance matching

Power semiconductor module

Semiconductor device having a plurality of semiconductor constructs

Semiconductor-element mounting substrate, semiconductor device, and electronic equipment

Method for manufacturing mold type semiconductor device

Thermally balanced via

Circuit board, method for manufacturing the same, semiconductor device, and method for manufacturing the same

Semiconductor device

Circuit module

Connecting module having passive components

Semiconductor device and a method of manufacturing the same

Integrated capacitors in package-level structures, processes of making same, and systems containing same

Contact spring application to semiconductor devices

BGA-scale stacks comprised of layers containing integrated circuit die and a method for making the same

Semiconductor device, manufacturing method of semiconductor device, and RFID tag

Interconnected IC packages with vertical SMT pads

Semiconductor device

Semiconductor light-emitting device and method for manufacturing the device

Semiconductor light-emitting device and method for manufacturing the device

SEMICONDUCTOR DEVICE

Semiconductor device

Method for joining electronic parts finished with nickel and electronic parts finished with electroless nickel

Heater, reflow apparatus, and solder bump forming method and apparatus

Method to modulate the surface roughness of a plated deposit and create fine-grained flat bumps

Microchannel heat sink manufactured from graphite materials

Method for gluing a circuit component to a circuit substrate

Electronic component mounting method

Interconnect circuitry, multichip module, and methods of manufacturing thereof

Method and apparatus for redirecting void diffusion away from vias in an integrated circuit design

Manufacturing method for semiconductor device and semiconductor device

Clipless and wireless semiconductor die package and method for making the same

Electronic device and method of manufacturing the same, circuit board, and electronic instrument

Methods for packaging microelectronic devices and microelectronic devices formed using such methods

Wafer-level processing of chip-packaging compositions including bis-maleimides

Face down type semiconductor device and manufacturing process of face down type semiconductor device

Tin-bismuth (Sn-Bi) family alloy solder and semiconductor device using the same

Heat-radiating semiconductor chip, tape wiring substrate and tape package using the same

Methods including fluxless chip attach processes

Forced heat transfer apparatus for heating stacked dice

Semiconductor device, package structure thereof, and method for manufacturing the semiconductor device

Low stress stacked die packages

Light emitting diode

Method of fabricating passivation

Test pads on flash memory cards

Horizontal Carbon Nanotubes by Vertical Growth and Rolling

Package method for flash memory card and structure thereof

Electronic part mounting method

Object and bonding method thereof

Nanostructure-based package interconnect

Method for fabricating a chip scale package using wafer level processing

Common drain dual semiconductor chip scale package and method of fabricating same

Compliant terminal mountings with vented spaces and methods

Low temperature bumping process

Semiconductor package having improved thermal performance

Semiconductor chip, mounting structure thereof, and methods for forming a semiconductor chip and printed circuit board for the mounting structure thereof

SUBSTRATE WITH MULTI-LAYER INTERCONNECTION STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Conductive particles for anisotropic conductive interconnection

Semiconductor device and method of manufacturing the same

Vertical power semiconductor component, semiconductor device and methods for the production thereof

Semiconductor device having a metal plate conductor

Semiconductor device and method for producing the same

Semiconductor device

Sequential fabrication of vertical conductive interconnects in capped chips

Techniques for packaging multiple device components

Semiconductor structure with a plastic housing and separable carrier plate

Semiconductor device and its manufacture method capable of preventing short circuit of electrodes when semiconductor device is mounted on sub-mount substrate

Flip-chip mounting substrate and flip-chip mounting method

Microelectronic elements with compliant terminal mountings and methods for making the same

Stack-type semiconductor package and manufacturing method thereof

STACK TYPE SURFACE ACOUSTIC WAVE PACKAGE, AND METHOD FOR MANUFACTURING THE SAME

Semiconductor device having semiconductor element, insulation substrate and metal electrode

Compliant terminal mountings with vented spaces and methods

Semiconductor light emitting device, semiconductor element, and method for fabricating the semiconductor light emitting device

Three-dimensional integrated circuit structure

Electrostatic methods and apparatus for mounting and demounting particles from a surface having an array of tacky and non-tacky areas

Method for mounting chip component and circuit board

Carbon nanotubes solder composite for high performance interconnect

Miniaturized Contact Spring

Methods of fabricating interconnects for semiconductor components

Thin-film capacitor and method for fabricating the same, electronic device and circuit board

Method for manufacturing IC-embedded substrate

Ribbon bonding in an electronic package

Method of manufacturing semiconductor device

Method of producing a semiconductor device, and wafer-processing tape

Pressure-contact type rectifier with contact friction reducer

PAD STRUCTURE OF SEMICONDUCTOR DEVICE AND FORMATION METHOD

Peel strength simulating apparatus, peel strength simulating program storage medium, and peel strength simulating method

Package for high power density devices

Semiconductor device

PAD STRUCTURE IN A SEMICONDUCTOR DEVICE AND A METHOD OF FORMING A PAD STRUCTURE

Semiconductor device

Semiconductor device and manufacturing method of the same

Semiconductor device comprising a vertical semiconductor component and method for producing the same

Structure of circuit board and method for fabricating same

Apparatus and method for increasing the quantity of discrete electronic components in an integrated circuit package

Semiconductor device with thermoplastic resin to reduce warpage

Low temperature phase change thermal interface material dam

Semiconductor device and manufacturing method of the same

Semiconductor package structure and method of manufacture

HEAT FIXTURE FOR WIRE BONDING

Coaxial through chip connection

Methods and apparatus for packaging integrated circuit devices

Modified and doped solder alloys for electrical interconnects, methods of production and uses thereof

External electrode forming method

Multi-strand substrate for ball-grid array assemblies and method

Adhesive for bonding circuit members, circuit board and process for its production

Dicing die-bonding film, method of fixing chipped work and semiconductor device

DIE BONDING APPARATUS AND METHOD OF OPERATING THE SAME

Paste coater and PoP automatic mounting apparatus employing the same

Method for fabricating semiconductor component with adjustment circuit for adjusting physical or electrical characteristics of substrate conductors

Negative thermal expansion material filler for low CTE composites

Wireless communication system

Inhibiting underfill flow using nanoparticles

Package using array capacitor core

Method for mounting bumps on an under metallurgy layer

Integrated circuit having bond pad with improved thermal and mechanical properties

Space-efficient package for laterally conducting device

Method for embedding dies

Die-attaching paste composition and method for hardening the same

Electronic member fabricating method and ic chip with adhesive material

In-situ functionalization of carbon nanotubes

Printed circuit board having embedded electronic components and manufacturing method thereof

Semiconductor device and mold for resin-molding semiconductor device

Electrical microfilament to circuit interface

Semiconductor component having plate, stacked dice and conductive vias

Relay board provided in semiconductor device, semiconductor device, and manufacturing method of semiconductor device

Semiconductor device and method of manufacture thereof, circuit board and electronic instrument

Elastic conductive resin, and electronic device including elastic conductive bumps made of the elastic conductive resin

Projected contact structures for engaging bumped semiconductor devices

Microelectronic devices having a curved surface and methods for manufacturing the same

Power semiconductor component with semiconductor chip stack in a bridge circuit and method for producing the same

Flip chip MLP with conductive ink

High temperature package flip-chip bonding to ceramic

Structure and method for thin single or multichip semiconductor QFN packages

DEVICE AND METHOD FOR ASSEMBLING A TOP AND BOTTOM EXPOSED PACKAGED SEMICONDUCTOR

Substrate panel with plating bar structured to allow minimum kerf width

Radio frequency device

Method for the planar joining of components of semiconductor devices and a diffusion joining structure

Method for manufacturing an electronic module, and an electronic module

Method and apparatus for mounting conductive ball

Integrated Circuit With Dual Electrical Attachment Pad Configuration

Carbon nanotube reinforced metallic layer

Adhesion by plasma conditioning of semiconductor chip surfaces

Interconnect structure of an integrated circuit and manufacturing method thereof

Wafer street buffer layer

Method and system for increasing yield of vertically integrated devices

Method for bonding substrates and device for bonding substrates

System and method for implementing transformer on package substrate

Metal-base circuit board and its manufacturing method

Method of making exposed pad ball grid array package

Sensor component and panel used for the production thereof

Method for packaging microelectronic devices

Electronic circuit device and method of manufacturing the same

Liquid metal thermal interface material system

Die bonding adhesive tape

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor device with a wiring substrate and method for producing the same

Semiconductor element, production process thereof, semiconductor laser and production process thereof

Microelectronic packaging and components

CIRCUIT FILM WITH BUMP, FILM PACKAGE USING THE SAME, AND RELATED FABRICATION METHODS

Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit board, and electronic device

Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another

Chip package structure

Leadless semiconductor package and method of manufacture

SEMICONDUCTOR DEVICE

Semiconductor device and method for manufacturing same, and semiconductor wafer

Light emitting device

High-temperature solder, high-temperature solder paste and power semiconductor using same

CIRCUIT SUBSTRATES, SEMICONDUCTOR DEVICES, SEMICONDUCTOR MANUFACTURING APPARATUSES, METHODS FOR MANUFACTURING CIRCUIT SUBSTRATES, AND METHODS FOR MANUFACTURING SEMICONDUCTOR DEVICES

Interconnect assemblies and methods

Conductive ball arraying apparatus

Semiconductor device having high frequency components and manufacturing method thereof

Eliminate IMC cracking in post wirebonded dies: macro level stress reduction by modifying dielectric/metal film stack in be layers during Cu/Low-K processing

Semiconductor device manufacturing method

Method for forming solder balls with a stable oxide layer by controlling the reflow ambient

Individualized low parasitic power distribution lines deposited over active integrated circuits

Method of making semiconductor package having exposed heat spreader

Bonding structure with buffer layer and method of forming the same

Protection for an integrated circuit chip containing confidential data

Dicing and die bonding adhesive tape

Flip chip hermetic seal using pre-formed material

Intermediate connection for flip chip in packages

Semiconductor device

Semiconductor packages having leadframe-based connection arrays

Interposer and stacked chip package

Pin-type chip tooling

Circuit substrate and method of manufacture

Semiconductor integrated circuit

Leadframes for improved moisture reliability and enhanced solderability of semiconductor devices

Method and apparatus that provides differential connections with improved ESD protection and routing

Two-step high bottleneck type capillary for wire bonding device

Power module

Wiring board, electronic component mounting structure, and electronic component mounting method

THERMAL INTERFACE APPARATUS, SYSTEMS, AND METHODS

Multilayer circuit board and method for manufacturing the same

Head assembly for chip mounter

Inductive Heating of Microelectronic Components

Power semiconductor module with capacitors connected parallel to one another

Method for the interconnection of active and passive components and resulting thin heterogeneous component

Structure of bumps forming on an under metallurgy layer and method for making the same

Semiconductor device having align mark layer and method of fabricating the same

Methods for fabricating protective layers on semiconductor device components

Apparatus incorporating small-feature-size and large-feature-size components and method for making same

Method of making a semiconductor device with improved heat dissipation

Integrated heat spreader with intermetallic layer and method for making

Semiconductor Device with Improved Stud Bump

Flip-chip semiconductor device manufacturing method

Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material

Low Profile Stacking System and Method

Method of manufacturing optical module

Liquid epoxy resin composition

METAL LAYER FORMATION METHOD FOR DIODE CHIPS/WAFERS

Apparatuses and methods for forming wireless RF labels

Interconnecting a port of a microwave circuit package and a microwave component mounted in the microwave circuit package

Method of manufacturing surface mount type crystal oscillator

Semiconductor device and method of manufacturing the same

SEMICONDUCTOR DEVICE

Alternate pad structures/passivation inegration schemes to reduce or eliminate IMC cracking in post wire bonded dies during Cu/Low-K BEOL processing

Packaged device and method of forming same

Alloys for flip chip interconnects and bumps

Interconnecting element between semiconductor chip and circuit support and method

Rotary chip attach

Low Profile Stacking System and Method

Semiconductor device having a heat spreader exposed from a seal resin

Ultra-thin quad flat no-lead (QFN) package

Semiconductor devices including voltage switchable materials for over-voltage protection

SEMICONDUCTOR DEVICE

Flip-chip light emitting diode device without sub-mount

Optical module and method of manufacturing the same

Semiconductor die package using leadframe and clip and method of manufacturing

Method and device to elongate a solder joint

Circuit board and its manufacturing method

Electrical device comprising conductors made of carbonized plastic, and method and apparatus for the production thereof

Method and device for connecting chips

Method for producing and cleaning surface-mountable bases with external contacts

Damascene patterning of barrier layer metal for C4 solder bumps

Wafer redistribution structure with metallic pillar and method for fabricating the same

Bonding method of semiconductor substrate and sheet, and manufacturing method of semiconductor chips using the same

Dispensing device and mounting system

Integrated circuit package system with heat sink

Method of forming a leaded molded array package

Layer having functionality, method for forming flexible substrate having the same, and method for manufacturing semiconductor device

Manufacturing method of wiring board and manufacturing method of semiconductor device

Method of manufacturing a semiconductor device

Method for fabricating conductive bumps with non-conductive juxtaposed sidewalls

SOLDER BALL EXCELLENT IN MICRO-ADHESION PREVENTING PROPERTIES AND WETTING PROPERTIES AND METHOD FOR PREVENTING THE MICRO-ADHESION OF SOLDER BALLS

Reversible leadless package and methods of making and using same

Bonding method, device formed by such method, surface activating unit and bonding apparatus comprising such unit

Semiconductor device

Semiconductor chip having bond pads

Semiconductor chip having bond pads

Wired circuit board and method for manufacturing wired circuit board and mounting electronic component thereon

Semiconductor device and method for manufacturing the same

Bonding pad with high bonding strength to solder ball and bump

EMBEDDED SEMICONDUCTOR DEVICE SUBSTRATE AND PRODUCTION METHOD THEREOF

Semiconductor device

Semiconductor device

Integrated circuit package system including ribbon bond interconnect

Semiconductor device

Integrated circuit package system using heat slug

Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor

Chip stack package and manufacturing method thereof

Structure for reducing stress for vias and fabricating method thereof

Semiconductor device and method of manufacturing the same

Semiconductor device

Semiconductor chip having bond pads

Semiconductor device and fabrication method for the same

Wire bonding method

Method and apparatus for rapid thermal processing and bonding of materials using RF and microwaves

Method for pressure bonding and method for manufacturing semiconductor device

Joining method and joining device

Method for forming a joint

Method of Forming Bump, Method of Forming Image Sensor Using the Method, Semiconductor Chip and the Sensor so Formed

Electrical interconnection structure formation

Small chips with fan-out leads

Bonding a non-metal body to a metal surface using inductive heating

Semiconductor device, fabrication method therefor, and film fabrication method

Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package

BRACE FOR WIRE LOOP

Solder joint flip chip interconnection

Microelectronic devices and microelectronic support devices, and associated assemblies and methods

Packaging methods

Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices

Photosensitive composition

Low-temperature setting adhesive and anisotropically electroconductive adhesive film using the same

Liquid epoxy resin composition

Liquid epoxy resin composition

Mm-wave antenna using conventional IC packaging

Constant voltage diode

Universal wafer carrier for wafer level die burn-in

CHIP STRUCTURE WITH SOLDER BUMP AND METHOD FOR PRODUCING THE SAME