Fine pitch interconnect and method of making

Solvent Assisted Burnishing of Pre-Underfilled Solder-Bumped Wafers for Flipchip Bonding

Bumping process with self-aligned A1-cap and the elimination of 2nd passivation layer

Semiconductor device, method of manufacturing a semiconductor device and substrate to be used to manufacture a semiconductor device

Reduction of macro level stresses in copper/low-K wafers

Composite carbon nanotube thermal interface device

Method for making stacked integrated circuits (ICs) using prepackaged parts

Multi-stack chip package with wired bonded chips

Electrode package for semiconductor device

Power semiconductor module

Lead arrangement and chip package using the same

Low profile semiconductor package

WIRE EMBEDDED BRIDGE

Printed circuit board, electronic device, and manufacturing method for printed circuit board

Power module having at least two substrates

Method for forming multi-layer bumps on a substrate

Soldering method for mounting semiconductor device on wiring board to ensure invariable gap therebetween, and soldering apparatus therefor

Reflow apparatus, a reflow method, and a manufacturing method of semiconductor device

Semiconductor device and method of manufacturing the same

Manufacturing method for magnetic sensor and lead frame therefor

Methods and apparatus for Flip-Chip-On-Lead semiconductor package

Method for producing through-contacts and a semiconductor component with through-contacts

Method of making stacked die package

Method of manufacturing flash memory cards

Fabrication method for a chip packaging structure

Adhesive film and process for preparing the same as well as adhesive sheet and semiconductor device

Device for making an in-mold circuit

Semiconductor device including a particular dummy terminal

METHOD FOR REDUCING OR ELIMINATING SEMICONDUCTOR DEVICE WIRE SWEEP IN A MULTI-TIER BONDING DEVICE AND A DEVICE PRODUCED BY THE METHOD

Junction structure for a terminal pad and solder, and semiconductor device having the same

Semiconductor package having non-solder mask defined bonding pads and solder mask defined bonding pads, printed circuit board and semiconductor module having the same

Void-free circuit board and semiconductor package having the same

Electronic component, module, module assembling method, module identification method and module environment setting method

Semiconductor device with inclined through holes

Semiconductor device and manufacturing method of the same

Printed wiring board

Semiconductor device

Semiconductor device with solder balls having high reliability

Semiconductor device featuring electrode terminals forming superior heat-radiation system

Semiconductor device and manufacturing method thereof

Structure and self-locating method of making capped chips

Structure and method of making capped chips having vertical interconnects

Semiconductor device

Semiconductor device having an electronic circuit disposed therein

Semiconductor component with a thin semiconductor chip and a stiff wiring substrate, and methods for producing and further processing of thin semiconductor chips

Back-face and edge interconnects for lidded package

Package device with electromagnetic interference shield

Multilayered circuit substrate with semiconductor device incorporated therein

Semiconductor die package including construction for preventing delamination and/or cracking of the semiconductor die

Implantable microelectronic device and method of manufacture

Structure for protecting electronic packaging contacts from stress

Packaging for high speed integrated circuits

Integrated circuit packaging

High frequency chip packages with connecting elements

Multilayered printed circuit board and method for manufacturing the same

Method and apparatus for attaching a workpiece to a workpiece support

Heat treatment for a panel and apparatus for carrying out the heat treatment method

Method for mounting electronic component

Production method for device

Method for evaluating and modifying solder attach design for integrated circuit packaging assembly

METHOD OF MAKING SEMICONDUCTOR PACKAGE WITH REDUCED MOISTURE SENSITIVITY

Semiconductor device packaging for avoiding metal contamination

Method for manufacturing a semiconductor device

Methods and apparatuses for fluidic self assembly

Semiconductor device and method for producing the same

Semiconductor component of semiconductor chip size with flip-chip-like external contacts

Chip-packaging composition of resin and cycloaliphatic amine hardener

Technique for moderating stresses cause by a difference in thermal expansion coeffiecients between a substrate and an electronic component

Semiconductor device that attains a high integration

Structure and method of molded QFN device suitable for miniaturization, multiple rows and stacking

Integrated circuit mounting for thermal stress relief useable in a multi-chip module

Semiconductor structure and method of assembly

Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages

Housed DRAM chip for high-speed applications

Production process for manufacturing such semiconductor package

Leadframes for improved moisture reliability of semiconductor devices

Electronic module and method of assembling the same

Wafer-to-wafer stack with supporting pedestal

Semiconductor device with a dummy electrode

Radio frequency power semiconductor device package comprising dielectric platform and shielding plate

Light emitting diode chip with reflective layer thereon

Adhesive composition and sheet having an adhesive layer of the composition

Method for forming solder contacts on mounted substrates

Semiconductor device and method for manufacturing thereof

Electronic part mounting substrate and method for producing same

Method of producing image display unit

Semiconductor component and method for contracting said semiconductor component

Etchant and method for forming bumps

Method for applying a structure of joining material to the back surfaces of semiconductor chips

METHOD AND STRUCTURE FOR VERTICALLY-STACKED DEVICE CONTACT

Underfill aiding process for a tape

Method for manufacturing semiconductor module using interconnection structure

Semiconductor device having strong adhesion between wiring and protective film, and manufacturing method therefor

Semiconductor device with multiple designation marks

Method for manufacture of wafer level package with air pads

Semiconductor device having a semiconductor chip, and method for the production thereof

Semiconductor device with electroless plating metal connecting layer and method for fabricating the same

Chip scale power LDMOS device

Power semiconductor device in lead frame employing connecting element with conductive film

Semiconductor insulation structure

Semiconductor chip and method of manufacturing semiconductor chip

Semiconductor device and fabrication method thereof

Power semiconductor module with overcurrent protective device

Conductor substrate, semiconductor device and production method thereof

Semiconductor package with position member

SELECTIVE SOLDER DEPOSITION BY SELF-ASSEMBLY OF NANO-SIZED SOLDER PARTICLES, AND METHODS OF ASSEMBLING SOLDERED PACKAGES

Method and apparatus for providing double-sided cooling of leadframe-based wire-bonded electronic packages

Method and apparatus for manufacturing IC chip packaged device

Methods for aligning a device and for stacking two devices in an aligned manner and device for improved stacking

Bonding apparatus comprising improved oscillation amplification device

Low stress conductive polymer bump

Method for manufacturing nitride based single crystal substrate and method for manufacturing nitride based semiconductor device

Method for forming bonding pad and semiconductor device having the bonding pad formed thereby

Apparatus for block assembly process

Semiconductor device with semiconductor chip and adhesive film and method for producing the same

Connecting structure, printed substrate, circuit, circuit package and method of forming connecting structure

Support structures for semiconductor devices

Bond pads and methods for fabricating the same

SEMICONDUCTORS AND METHODS OF MAKING

Semiconductor chip having a bump with conductive particles and method of manufacturing the same

Bump structure and its forming method

Intermetallic solder with low melting point

Electronic apparatus

Electronic circuit chip, and electronic circuit device and method for manufacturing the same

Integrated circuit package system

Semiconductor packaging process and carrier for semiconductor package

Semiconductor device and a method of manufacturing the same

Semiconductor device with front side metallization and method for the production thereof

Ultrasonic horn

Wiring board, semiconductor device, and method of manufacturing the same

Methods and apparatuses relating to block receptor configurations and block assembly processes

Method of manufacturing a semiconductor device including a bump forming process

Semiconductor device and a manufacturing method of the same

Method and device for extracting an electronic chip from a silicon wafer and transporting the chip to its installation location on an electronic device

Microelectronic packages and methods therefor

Wiring board and capacitor

Chip embedded packaging structure

Power semiconductor module

Hard disk drive and wireless data terminal using the same

Contact carriers (tiles) for populating larger substrates with spring contacts

Method and apparatus for facilitating proximity communication and power delivery

Relay board and semiconductor device having the relay board

Electronic device and manufacturing method of the same

Semiconductor device

Solder joint intermetallic compounds with improved ductility and toughness

Wiring board

Semiconductor chip and semiconductor device

Electronic device, semiconductor device using same, and method for manufacturing semiconductor device

Semiconductor device having metallic lead and electronic device having lead frame

Semiconductor device and semiconductor device production method

Semiconductor device and a manufacturing method of the same

Semiconductor package

Method of forming a molded array package device having an exposed tab and structure

Semiconductor device and radiation detector employing it

Attachment system incorporating a recess in a structure

Printed circuit board and manufacturing method thereof

Semiconductor device and method for manufacturing the same

Method of assembly for multi-flip chip on lead frame on overmolded IC package

Semiconductor device and method for manufacturing the same

PROCESS FOR FABRICATING CHIP PACKAGE STRUCTURE

Method for separating package of WLP

Methods for protecting metal surfaces

Contacts to microdevices

Semiconductor device with improved design freedom of external terminal

Solder bump structure for flip chip semiconductor devices and method of manufacture therefore

Stackable device, device stack and method for fabricating the same

Semiconductor device featuring large reinforcing elements in pad area

Semiconductor device having shield structure

Flash memory card

Packaged die on PCB with heat sink encapsulant and methods

Semiconductor IC-embedded substrate and method for manufacturing same

Bumpless chip package and fabricating process thereof

Integrated circuit solder bumping system

Power semiconductor module with MOS chip

Molded semiconductor package

Wiring structure of a semiconductor package and method of manufacturing the same, and wafer level package having the wiring structure and method of manufacturing the same

Optoelectronics processing module and method for manufacturing thereof

Insulated gate semiconductor device having a clamping element to clamp gate-emitter voltage and method of manufacturing thereof

Semiconductor device with a resin-sealed optical semiconductor element

LSI design support apparatus and LSI design support method

Electric contact and method for producing the same and connector using the electric contacts

Method for establishing anisotropic conductive connection and anisotropic conductive adhesive film

Alkylated hydroxyaromatic compound from conventional and high vinylidene polyisobutylenes and compositions and processes thereof

Semiconductor device and a method of manufacturing the same

Method for patterning and etching a passivation layer

Method of electrically connecting a microelectronic component

Semiconductor manufacturing method

Microfeature workpieces and methods of forming a redistribution layer on microfeature workpieces

Method of forming a semiconductor device

Bonding apparatus and method of bonding for a semiconductor chip

THERMAL ENHANCED PACKAGE FOR BLOCK MOLD ASSEMBLY

Substrate sheet material for a semiconductor device and a manufacturing method thereof, a molding method using a substrate sheet material, a manufacturing method of semiconductor devices

Routing under bond pad for the replacement of an interconnect layer

Packages, anisotropic conductive films, and conductive particles utilized therein

Display device and manufacturing method of the same

Semiconductor device

Chip package structure and bumping process

Complete power management system implemented in a single surface mount package

Complete power management system implemented in a single surface mount package

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Chip package structure and bumping process

Semiconductor apparatus integrating an electrical device under an electrode pad

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications

Method for manufacturing electronic modules

Monitoring deformation and time to logically constrain a bonding process

Selective consolidation methods for fabricating semiconductor device components and conductive features thereof

Flexible assembly of stacked chips

Fan out type wafer level package structure and method of the same

Apparatuses and methods for high speed bonding

Semiconductor chip having bond pads

Electronic device and manufacturing method therefor

Semiconductor memory device comprising pseudo ground pad and related method

Semiconductor device having metallic plate with groove

Semiconductor device

Semiconductor device

Semiconductor chip having bond pads and multi-chip package

Semiconductor IC-embedded module with multilayer substrates with multiple chips embedded therein

Multi-part lead frame with dissimilar materials

Multi-part lead frame with dissimilar materials

Structure of IC packaging and method forming the same

Power semiconductor device and method therefor

Component mounting method and component-mounted body

Semiconductor device and automotive AC generator

Bonding structure with buffer layer and method of forming the same

Methods for electronic fluorescent perturbation for analysis and electronic perturbation catalysis for synthesis

METHODS OF FABRICATING AND USING SHAPED SPRINGS

Grooved substrates for uniform underfilling solder ball assembled electronic devices

METHOD FOR FABRICATING SEMICONDUCTOR PACKAGES

Metal duplex method

Manufacturing method of electronic device

Support with solder ball elements and a method for populating substrates with solder balls

Flip-chip packaging process using copper pillar as bump structure

Semiconductor device and method for fabricating the same

Metal duplex method

Protective barrier layer for semiconductor device electrodes

Semiconductor device and manufacturing method thereof

Electronic device and method of manufacturing same

Semiconductor chip package and method of manufacturing the same

Adhesive film having multiple filler distribution and method of manufacturing the same, and chip stack package having the adhesive film and method of manufacturing the same

Encapsulated electronic part packaging structure

Semiconductor device having a probing region

High density interconnect assembly comprising stacked electronic module

Partially patterned lead frames and methods of making and using the same in semiconductor packaging

Semiconductor device and method of manufacturing the same

Resin mold type semiconductor device

Die pad for semiconductor packages and methods of making and using same

Semiconductor device having pads and which minimizes defects due to bonding and probing processes

Semiconductor device and power conversion apparatus using the same

Nitride-based semiconductor light-emitting device and method of manufacturing the same

Light emitting diode and method for manufacturing the same

Stack type package module and method for manufacturing the same

Quinolinols as fluxing and accelerating agents for underfill compositions

Quinolinols and quinolinol derivatives as adhesion promoters in die attach adhesives

Method for fabricating semiconductor component having conductors and bonding pads with wire bondable surfaces and selected thickness

Method for fabricating semiconductor components having encapsulated, bonded, interconnect contacts on redistribution contacts

Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices

Stacked chip package using photosensitive polymer and manufacturing method thereof

Radiant energy heating for die attach

Microfeature workpieces, carriers, and associated methods

Wafer-level package and IC module assembly method for the wafer-level package

Underfill compounds including electrically charged filler elements, microelectronic devices having underfill compounds including electrically charged filler elements, and methods of underfilling micoelectronic devices

Device transferring method, and device arraying method

Heat transfer plate

Solid image pickup unit and camera module

Mounting Spring Elements on Semiconductor Devices, and Wafer-Level Testing Methodology

Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods

Lithographic type microelectronic spring structures with improved contours

Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts

Chip package and bump connecting structure thereof

Microfeature workpieces and methods of forming a redistribution layer on microfeature workpieces

Semiconductor device including a plurality of semiconductor chips stacked three-dimensionally, and method of manufacturing the same

PACKAGE STRUCTURE AND FABRICATION PROCESS THEREOF

Stacked microelectronic devices and methods for manufacturing microelectronic devices

Semiconductor device, semiconductor package for use therein, and manufacturing method thereof

Method for forming a double embossing structure

Wafer structure with a multi-layer barrier in an UBM layer network device with power supply

Semiconductor packages for surface mounting and method of producing same

Alpha particle shields in chip packaging

Lead-containing solder bumps

Insulating layer between bumps of semiconductor chip, and display panel using the same with anisotropic conductive film between semiconductor chip and substrate

METHOD OF SOLDER BUMPING A CIRCUIT COMPONENT AND CIRCUIT COMPONENT FORMED THEREBY

Lead-containing solder paste

Lead-containing anodes

Semiconductor device and semiconductor chip

Stacked chip package using warp preventing insulative material and manufacturing method thereof

Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices

Copper bump barrier cap to reduce electrical resistance

Wafer integrated rigid support ring

Wiring board construction including embedded ceramic capacitors(s)

Microfeature assemblies including interconnect structures and methods for forming such interconnect structures

Microelectronic devices and methods for manufacturing microelectronic devices

Microelectronic devices and microelectronic support devices, and associated assemblies and methods

Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices

Semiconductor device and manufacturing method thereof

Reversible-multiple footprint package and method of manufacturing

Blue LED with phosphor layer for producing white light and different phosphor in outer lens for reducing color temperature

Semiconductor device and method of manufacturing the same