212013 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Carbon [C]
Display panel package
#9602Method for hybridization of two components by using different sized solder protrusions and a device that uses two components hybridized according to this method
#9603Semiconductor device and method of manufacturing the same
#9604Approach to high temperature wafer processing
#9605Integrated circuit device
#9606Method for producing semiconductor device and semiconductor device
#9607Methods and apparatus for high-density chip connectivity
#9608Hybridization of polynucleotides conjugated with chromophores and fluorophores to generate donor-to-donor energy transfer system
#9609Ternary alloy column grid array
#9610Bonding program
#9611RFID inlays and methods of their manufacture
#9612RFID inlays and methods of their manufacture
#9613Actuator and bonding apparatus
#9614Printed circuit board and method thereof and a solder ball land and method thereof
#9615Multi-chip package for reducing parasitic load of pin
#9616Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods
#9617Method of packaging and interconnection of integrated circuits
#9618Semiconductor device
#9619MOSFET package
#9620MOSFET package
#9621Leadframe package with dual lead configurations
#9622Bi-directional switch, and use of said switch
#9623Semiconductor connection component
#9624Power semiconductor packaging method and structure
#9625Integrated circuit device
#96263D IC method and device
#9627Method for forming metal pad in semiconductor device
#9628Tin-silver solder bumping in electronics manufacture
#9629Manufacturing method of semiconductor device
#9630Semiconductor device and a manufacturing method of the same
#9631Semiconductor package with contact support layer and method to produce the package
#9632Method and device for attaching a chip in a housing
#9633Method And Device For Enhancing Solderability
#9634Assembly of an electrical component comprising an electrical insulation film on a substrate and method for producing said assembly
#9635Bonding apparatus
#9636Bonding pattern discrimination device
#9637Bonding pattern discrimination program
#9638Semiconductor device, laminated semiconductor device, and wiring substrate
#9639Bonded structure and bonding method
#9640Tier structure with tier frame having a feedthrough structure
#9641Semiconductor device with improved contacts
#9642Semiconductor device and method of manufacturing the same
#9643Printed circuit board and electronic apparatus including printed circuit board
#9644Semiconductor component and method of manufacture
#9645Mount for a programmable electronic processing device
#9646Multi-chip semiconductor device package
#9647Stack structure with semiconductor chip embedded in carrier
#9648Semiconductor module
#9649Semiconductor device and a manufacturing method of the same
#9650Semiconductor device electronic component, circuit board, and electronic device
#9651Semiconductor device with conductor tracks between semiconductor chip and circuit carrier and method for producing the same
#9652Insulated gate semiconductor device and manufacturing method thereof
#9653Semiconductor device
#9654Method of making wafer level package structure by grinding the backside thereof and then forming metal layer on the ground side
#9655Mounting structure, electro-optical device, and electronic apparatus
#9656Apparatuses and methods facilitating functional block deposition
#9657Solder composition for electronic devices
#9658Method of making a conformal electromagnetic interference shield
#9659Liquid crystal display devices
#9660Display device having an anisotropic-conductive adhesive film
#9661Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same
#9662Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
#9663Semiconductor device
#9664Semiconductor device
#9665Integrated circuit with low-stress under-bump metallurgy
#9666SEMICONDUCTOR DEVICE
#9667Semiconductor device and method of manufacturing the same
#9668Semiconductor device
#9669Radio frequency over-molded leadframe package
#9670Polysilicon film with increased roughness
#9671Semiconductor device
#9672SEMICONDUCTOR DEVICE
#9673Fluxless bumping process
#9674High frequency semiconductor integrated circuit device, wireless electric unit and wireless communication system
#9675METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
#9676Method for manufacturing semiconductor device
#9677Metal pad or metal bump over pad exposed by passivation layer
#9678No flow underfill device and method
#9679Electrical interconnect structures for integrated circuits and methods of manufacturing the same
#9680Method of making a stacked die package
#9681Methods of bonding two semiconductor devices
#9682Semiconductor module comprising components for microwave engineering in plastic casing and method for the production thereof
#9683Laminated electronic component and method for producing the same
#9684Connection structure semiconductor chip and electronic component including the connection structure and methods for producing the connection structure
#9685Output match transistor
#9686Semiconductor power device and RF signal amplifier
#9687Technique for efficiently patterning an underbump metallization layer using a dry etch process
#9688Semiconductor device
#9689Semiconductor device and method of manufacturing the same
#9690Flip chip package with reduced thermal stress
#9691Bonding pad on IC substrate and method for making the same
#9692ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE ELECTRONIC DEVICE
#9693Self-assembled interconnection particles
#9694Semiconductor device-composing substrate and semiconductor device
#9695Semiconductor device, electronic module, and method of manufacturing electronic module
#9696Semiconductor package with ferrite shielding structure
#9697Microelectronic bond pad
#9698Bonding pad fabrication method, method for fabricating a bonding pad and an electronic device, and electronic device
#9699Semiconductor device, power amplifier device and PC card
#9700Semiconductor device for radio frequencies of more than 10 GHz and method for producing the device
#9701Multi-chip semiconductor package featuring wiring chip incorporated therein, and method for manufacturing such multi-chip semiconductor package
#9702METHOD FOR PRODUCING A CHIP ARRANGEMENT, A CHIP ARRANGEMENT AND A MULTICHIP DEVICE
#9703Packaged integrated circuit with enhanced thermal dissipation
#9704IC with on-die power-gating circuit
#9705Semiconductor package and manufacturing method thereof
#9706Semiconductor device
#9707Wire bonding method and device of performing the same
#9708Packaging method
#9709Method for modifying surface of substrate and method for manufacturing semiconductor device
#9710Manufacturing method for electronic substrate, manufacturing method for electro-optical device, and manufacturing method for electronic device
#9711Methods for forming flexible column die interconnects and resulting structures
#9712Method of forming solder bump with reduced surface defects
#9713Semiconductor element and a producing method for the same, and a semiconductor device and a producing method for the same
#9714Method of forming a connecting conductor and wirings of a semiconductor chip
#9715Semiconductor device and a method of manufacturing the same
#9716Process for exposing solder bumps on an underfill coated semiconductor
#9717Method and apparatus for attaching microelectronic substrates and support members
#9718Thermoplastic/thermoset composition material and method of attaching a wafer to a substrate
#9719Method of manufacturing electronic circuit device
#9720Packaging method for segregating die paddles of a leadframe
#9721IC chip mounting method
#9722Integrated circuit pad with separate probing and bonding areas
#9723Relay board with bonding pads connected by wirings
#9724Connection element for a semiconductor component and method for producing the same
#9725Method and apparatus for attaching microelectronic substrates and support members
#9726Multi-component integrated circuit contacts
#9727Semiconductor chip production method, semiconductor device production method, semiconductor chip, and semiconductor device
#9728Semiconductor device
#9729Wiring substrate and semiconductor package implementing the same
#9730Semiconductor device and method of manufacturing the same
#9731Packaging for high speed integrated circuits
#9732Composite metal column for mounting semiconductor device
#9733Semiconductor device and method of manufacturing the same
#9734Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby
#9735Packaging for high speed integrated circuits
#9736Packaging for high speed integrated circuits
#9737Packaging for high speed integrated circuits
#9738Packaging for high speed integrated circuits
#9739Packaging for high speed integrated circuits
#9740Semiconductor device and manufacturing method thereof
#9741Electronic board and manufacturing method thereof, electro-optical device, and electronic apparatus
#9742Method of realizing thermosonic wire bonding between metal wires and copper pads by depositing a thin film to surface of semiconductor chip with copper pads
#9743Process for making a semiconductor device having a roughened surface
#9744Fabrication method of semiconductor circuit device
#9745Method and structure for interfacing electronic devices
#9746Substrate applicable to both wire bonding and flip chip bonding, smart card modules having the substrate and methods for fabricating the same
#9747Adhesive/spacer island structure for multiple die package
#9748Method for forming bump protective collars on a bumped wafer
#9749Method for mounting electronic element on a circuit board
#9750ELECTRONIC MODULE WITH STACKED IC CHIP STRUCTURE
#9751Method and structure for reduction of soft error rates in integrated circuits
#9752Probing pads in kerf area for wafer testing
#9753Electronic component unit
#9754Semiconductor package and fabrication method thereof
#9755Semiconductor device
#9756Semiconductor device and electronic apparatus of multi-chip packaging
#9757Semiconductor device
#9758Semiconductor power module with SiC power diodes and method for its production
#9759Tape wiring substrate and chip-on-film package using the same
#9760Electronic parts packaging structure and method of manufacturing the same
#9761Package substrate and semiconductor package using the same
#9762Direct FET device for high frequency application
#9763Micro-package, multi-stack micro-package, and manufacturing method therefor
#9764Temperature dependent semiconductor module connectors
#9765Method of realizing direct bonding between metal wires and copper pads by means of thermosonic wire bonding using shielding gas spraying device
#9766Manufacturing method improving the reliability of a bump electrode
#9767Integrated circuit for driving semiconductor device and power converter
#9768Wire-bonding method and semiconductor package using the same
#9769Substrate for manufacturing semiconductor device, semiconductor device manufacturing method
#9770Structure and method for producing multiple size interconnections
#9771Semiconductor package having dual interconnection form and manufacturing method thereof
#9772Semiconductor device
#9773Hybrid conductive coating method for electrical bridging connection of RFID die chip to composite antenna
#9774Seedless wirebond pad plating
#9775Semiconductor device
#9776Semiconductor device
#9777Ball grid array package enhanced with a thermal and electrical connector
#9778Chip-embedded interposer structure and fabrication method thereof, wafer level stack structure and resultant package structure
#9779Surface mount package
#9780Multi-layered substrate assembly with vialess electrical interconnect scheme
#9781Parallel chip embedded printed circuit board and manufacturing method thereof
#9782Method for manufacturing semiconductor chip package
#9783Semiconductor sensor and manufacturing method therefor
#9784Semiconductor device
#9785Method for self-assembling microstructures
#9786Electronic assembly and method for producing an electronic assembly
#9787METHOD OF FABRICATING A HIGH-DENSITY LEAD ARRANGEMENT PACKAGE STRUCTURE
#9788Semiconductor device manufacturing method
#9789Semiconductor device and manufacturing method thereof
#9790Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same
#9791Chip and multi-chip semiconductor device using the chip, and method for manufacturing same
#9792Dicing die bonding film
#9793Image display and manufacturing method thereof having particular internal wiring structure
#9794Apparatuses and methods for forming assemblies
#9795Lighting device
#9796Bonding apparatus and method
#9797Semiconductor device with semiconductor device components embedded in a plastics composition
#9798Semiconductor device
#9799Method of interconnecting terminals and method of mounting semiconductor devices
#9800Thermal interface material with carbon nanotubes and particles
#9801Semiconductor device advantageous in improving water resistance and oxidation resistance
#9802Semiconductor device and manufacturing method of the same
#9803Adhesive layer forming a capacitor dielectric between semiconductor chips
#9804Low profile stacked semiconductor chip package
#9805Semiconductor assemblies including redistribution layers and packages and assemblies formed therefrom
#9806Anti-warp heat spreader for semiconductor devices
#9807Arrangement for electrically connecting semiconductor circuit arrangements to an external contact device and method for producing the same
#9808Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages
#9809Semiconductor die package and method for making the same
#9810Semiconductor device and package, and method of manufacturer therefor
#9811Multi-part lead frame with dissimilar materials
#9812Semiconductor device
#9813Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#9814Semiconductor device and method of manufacturing the same
#9815SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE DESIGN METHOD, SEMICONDUCTOR DEVICE DESIGN METHOD RECORDING MEDIUM, AND SEMICONDUCTOR DEVICE DESIGN SUPPORT SYSTEM
#9816Circuit device and method of manufacturing the same
#9817Assembly method for semiconductor die and lead frame
#9818Apparatus and method to operate on one or more attach sites in die package assembly
#9819Cure catalyst, composition, electronic device and associated method
#9820Circuitry component and method for forming the same
#9821Ultrathin semiconductor circuit having contact bumps
#9822Methods for bonding and micro-electronic devices produced according to such methods
#9823Method and apparatus for bonding wafers
#9824Method of manufacturing a semiconductor device
#9825Method for fabricating board on chip (BOC) semiconductor package with circuit side polymer layer
#9826Standoffs for centralizing internals in packaging process
#9827Three dimensional device integration method and integrated device
#9828Mounting and adhesive layer for semiconductor components
#9829Semiconductor integrated circuit device
#9830Printed circuit board having embedded RF module power stage circuit
#9831Printed circuit board with embedded electronic components
#9832Wire bonding structure to electrically connect a printhead chip to a flexible printed circuit of an ink cartridge and method thereof
#9833Semiconductor device and method for manufacturing the same
#9834Semiconductor device and a method of manufacturing the same
#9835Semiconductor device
#9836Semiconductor device and manufacturing method of the same
#9837Intrinsic thermal enhancement for FBGA package
#9838Packaging logic and memory integrated circuits
#9839Lead-free semiconductor package
#9840Alignment using fiducial features
#9841Semiconductor device
#9842Wire bonding machine capable of removing particles from capillary and cleaning method of capillary bottom tip
#9843Method of manufacturing semiconductor device
#9844Transmission-line spring structure
#9845Semiconductor wafer package and manufacturing method thereof
#9846Method of manufacturing a semiconductor device
#9847Stretchable form of single crystal silicon for high performance electronics on rubber substrates
#9848Semiconductor packages and methods of manufacturing thereof
#9849Substrate structure and the fabrication method thereof
#9850Adhesive tape for electronic components
#9851Conductive particles and method and device for manufacturing the same, anisotropic conductive adhesive and conductive connection structure, and electronic circuit components and method of manufacturing the same
#9852Micro solder pot
#9853Electronic board, method of manufacturing the same, and electronic device
#9854Electronic board, method of manufacturing the same, and electronic device
#9855Chip-on-board assemblies
#9856Semiconductor device and circuit board
#9857Low stress chip attachment with shape memory materials
#9858Flip chip packaging using recessed interposer terminals
#9859Wirebond electronic package with enhanced chip pad design, method of making same, and information handling system utilizing same
#9860CSP semiconductor chip and BGA assembly with enhanced physical protection, protective members and assemblies used with same, and methods of enhancing physical protection of chips and assemblies
#9861Package structure of chip and the package method thereof
#9862Lead frame structure with aperture or groove for flip chip in a leaded molded package
#9863Chip-package structure and fabrication process thereof
#9864Manufacturing method for a semiconductor device
#9865Power semiconductor module
#9866Method of soldering or brazing articles having surfaces that are difficult to bond
#9867Wiring board, method for manufacturing same, and semiconductor package
#9868Adhesive resin composition and adhesive agent in film form, and semiconductor device using the same
#9869Remote chip attachment
#9870Process of manufacture of ultra thin semiconductor wafers with bonded conductive hard carrier
#9871Coaxial through chip connection
#9872Post-attachment chip-to-chip connection
#9873Tack & fuse chip bonding
#9874Routingless chip architecture
#9875Semiconductor device and method for manufacturing the same
#9876Rigid-backed, membrane-based chip tooling
#9877Through chip connection
#9878Packaging method and package using the same
#9879Semiconductor device packaging substrate and semiconductor device packaging structure
#9880Chip-based thermo-stack
#9881Interposers with alignment fences and semiconductor device assemblies including the interposers
#9882Non-contact ID card and manufacturing method thereof
#9883Probe card assembly and kit
#9884Method of testing a semiconductor device and suctioning a semiconductor device in the wafer state
#9885Protected chip stack
#9886Semiconductor device and manufacturing method therefor
#9887Substrate for pre-soldering material and fabrication method thereof
#9888Integrated electronic chip and interconnect device and process for making the same
#9889Chip spanning connection
#9890Inverse chip connector
#9891Chip connector
#9892Post & penetration interconnection
#9893Stack circuit member and method
#9894Triaxial through-chip connection
#9895Profiled contact
#9896Chip capacitive coupling
#9897Semiconductor device with a diffusion barrier film having a spacing for stress relief of solder bump
#9898Metal bump with an insulation for the side walls and method of fabricating a chip with such a metal bump
#9899Electronic chip contact structure
#9900Patterned contact