Method and apparatus for improving thermal energy dissipation in a direct-chip-attach coupling configuration of an integrated circuit and a circuit board

Signal transmission arrangement and method

Method of forming an interconnection element

ELECTRICAL CONTACT

Lapping of gold pads in a liquid medium for work hardening the surface of the pads

Flip-chip adaptor package for bare die

Method of producing a package for semiconductor chips

Method of making a flexible substrate containing self-assembling microstructures

Electronic function part mounted body and method of manufacturing the electronic function part mounted body

Microelectronic component assemblies with recessed wire bonds and methods of making same

Three-dimensional package

Top via pattern for bond pad structure

Double density method for wirebond interconnect

Integrated device and electronic system

Wiring board and method of manufacturing the same

Strain silicon wafer with a crystal orientation (100) in flip chip BGA package

Semiconductor device and manufacturing method for the same

Stacked semiconductor package

Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device

RFID tag, module component, and RFID tag fabrication method

Forming solder balls on substrates

Contact securing element for bonding a contact wire and for establishing an electrical connection

Method to accommodate increase in volume expansion during solder reflow

Bonding pads having slotted metal pad and meshed via pattern

Holder for electronic component, holding sheet for electronic component, electronic module using holder, electronic module using holding sheet, lamination of electronic modules, method for manufacturing electronic module, and method for testing electronic module

Wiring board manufacturing method

Semiconductor device and a method for manufacturing the same

Temperature dependent semiconductor module connectors

Method for producing a semiconductor device and resulting device

Front-end processing of nickel plated bond pads

Semiconductor package fabrication

Wafer-processing tape

Optical semiconductor device, electronic device, and method for producing optical semiconductor device

Electronic package with integrated capacitor

Self assembly of elements for displays

Apparatus and method for predetermined component placement to a target platform

Material for forming insulating film with low dielectric constant, low dielectric insulating film, method for forming low dielectric insulating film and semiconductor device

Configuration for testing the bonding positions of conductive drops and test method for using the same

Semiconductor device and method of manufacturing the same

Magnetron sputtered metallization of a nickel silicon alloy, especially useful as solder bump barrier

Semiconductor device with via hole for electric connection

Copper interconnection with conductive polymer layer and method of forming the same

Printed wiring board and method for manufacturing the same

Tape ball grid array package with electromagnetic interference protection and method for fabricating the package

METHOD OF FORMING REDISTRIBUTION BUMP AND SEMICONDUCTOR CHIP AND MOUNT STRUCTURE FABRICATED USING THE SAME

Semiconductor device, semiconductor body and method of manufacturing thereof

High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package

Semiconductor device

Semiconductor device

Device mounting substrate and image display device

Wafer-level package having test terminal

Integrated circuit card and a method for manufacturing the same

FINE PAD PITCH ORGANIC CIRCUIT BOARD WITH PLATING SOLDER AND METHOD FOR FABRICATING THE SAME

Low profile small outline leadless semiconductor device package

Methods of refining lead-containing materials

Method for separating electronic component from organic board

Semiconductor package having an optical device and a method of making the same

Wafer bonding of thinned electronic materials and circuits to high performance substrate

Process for manufacturing sawing type leadless semiconductor packages

Semiconductor device and a manufacturing method of the same

Solder bump and related intermediate structure having primary and secondary portions and method of manufacturing same

Hybrid module and production method for same, and hybrid circuit device

Nano memory, light, energy, antenna and strand-based systems and methods

FLEXIBLE TYPE UNIT, FLEXIBLE TYPE REEL, AND METHOD OF MANUFACTURING FLEXIBLE TYPE REEL

Laser processing method and laser beam processing machine

Composition of aromatic or cycloaliphatic amine-derived polyepoxide and polyamine

Die attach material for TBGA or flexible circuitry

Planar microspring integrated circuit chip interconnection to next level

Semiconductor device

System for different bond pads in an integrated circuit package

Arrangement of an electrical component placed on a substrate, and method for producing the same

Magnetic self-assembly for integrated circuit packages

Semiconductor device, method for designing the same and recording medium that can be read by computer in which program for designing semiconductor device is recorded

MOSFET package

MOSFET package

Integrated circuit package with lead fingers extending into a slot of a die paddle

Semiconductor device and method for producing same

Semiconductor device, magnetic sensor, and magnetic sensor unit

Semiconductor light emitting device

Low stress conductive adhesive

METHOD AND APPARATUS FOR MOUNTING AND REMOVING AN ELECTRONIC COMPONENT

Methods of fabricating integrated circuit devices having self-aligned contact structures

Anisotropic conductive adhesive, electrode connection structure and method using the adhesive

Microfeature devices and methods for manufacturing microfeature devices

Application of impressed-current cathodic protection to prevent metal corrosion and oxidation

Methods for assembling semiconductor devices and interposers

Method of manufacturing semiconductor device

Radio frequency module and fabrication method thereof

Semiconductor device production method and semiconductor device

Microelectronic assemblies having compliancy

Underfill encapsulant for wafer packaging and method for its application

Circuit device and manufacturing method thereof

Inductor formed in an integrated circuit

Semiconductor device, manufacturing method and mounting method of the semiconductor device, circuit board, and electronic apparatus

Manufacturing method for electronic device

Semiconductor chip package and method of manufacture

Si power device mounted on a substrate including arrangements to prevent damage to connection layers due to heat treatment

Connection technology for power semiconductors comprising a layer of electrically insulating material that follows the surface contours

Integrated connection arrangements

Semiconductor package having double layer leadframe

Semiconductor device, electrode member and electrode member fabrication method

Embedded chip printed circuit board and method of manufacturing the same

Semiconductor device package, method of manufacturing the same, and semiconductor device

Electrical contact

Ta-TaN selective removal process for integrated device fabrication

Encapsulation of circuit components to reduce thermal cycling stress

Microfeature devices and methods for manufacturing microfeature devices

Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment

Dual metal stud bumping for flip chip applications

Method of manufacturing semiconductor device and semiconductor device

Method for integrating an electronic component or similar into a substrate

Method of manufacturing an electronic device

Semiconductor component and method of manufacture

Microfeature systems including adhered microfeature workpieces and support members

Method of manufacturing semiconductor device

Methods for fabricating semiconductor devices so as to stabilize the same when contact-bearing surfaces thereof face over test substrates

High frequency semiconductor device

Method of manufacturing an ink-jet assembly

Bonding apparatus

Resin sealing method for electronic part and mold used for the method

Semiconductor device with chip-on-board structure

Semiconductor device

Flip chip package with advanced electrical and thermal properties for high current designs

Semiconductor device and manufacturing method thereof

Method and system for bonding a semiconductor chip onto a carrier using micro-pins

Method to create flexible connections for integrated circuits

Chip scale package with heat spreader

High frequency arrangement

Semiconductor device

Semiconductor device and its writing method

Electronic component with stacked semiconductor chips and method for producing the same

Semiconductor packages and methods for making and using same

Semiconductor device and unit equipped with the same

Semiconductor device with semiconductor chip mounted in package

Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device

Semiconductor device and manufacturing process therefor

Semiconductor device

Ball mounting method

Accurate relative alignment and epoxy-free attachment of optical elements

Wire bonding method

Semiconductor device with micro connecting elements and method for producing the same

Semiconductor component sealed on five sides by polymer sealing layer

Methods for patterning dielectric material, and methods for aligning semiconductor fabrication molds and semiconductor substrates

METHOD OF FORMING CHIP-TYPE LOW-K DIELECTRIC LAYER

Tools and methods for forming conductive bumps on microelectronic elements

Method for producing a semiconductor component with a plastic housing and carrier plate for performing the method

Method of forming a wear-resistant dielectric layer

Semiconductor device

Semiconductor device, method of manufacturing the same, capacitor structure, and method of manufacturing the same

Semiconductor device

Semiconductor device and manufacturing method of the same

Semiconductor package with plated connection

Semiconductor chip having solder bumps and dummy bumps

Contact structure and method for manufacturing the same

Semiconductor device and method of manufacturing the same

Three-dimensional circuit module and method of manufacturing the same

Semiconductor device and process for fabrication thereof

Semiconductor device with signal wirings that pass through under the output electrode pads and dummy wirings near the peripheral portion

Thin-film semiconductor component and production method for said component

Method and system for transferring dies between surfaces

Stable electroless fine pitch interconnect plating

Multilayer printed wiring board and method of manufacturing the same

Implantable, tissue conforming drug delivery device

Methods of adhering microfeature workpieces, including a chip, to a support member

Manufacturing method of semiconductor device

Package or pre-applied foamable underfill for lead-free process

Semiconductor device and process for producing the same

Semiconductor apparatus

Semiconductor device including capsule type semiconductor package and semiconductor chip in stacking manner

Semiconductor device

Structure and method for bonding an IC chip

Integrated circuits and interconnect structure for integrated circuits

Dissociated fabrication of packages and chips of integrated circuits

Semiconductor device and method of manufacturing the same

Semiconductor device

Semiconductor device and fabrication method thereof

Smart card, smart card module, and a method for production of a smart card module

Wire bonding method

Antenna designs for radio frequency identification tags

Methods and apparatus for integrated circuit ball bonding with substantially perpendicular wire bond profiles

Method and system for 3D alignment in wafer scale integration

Device packages

Method of embedding semiconductor element in carrier and embedded structure thereof

Semiconductor device and method of manufacture thereof, circuit board and electronic instrument

Device packages having stable wirebonds

Efficient method of forming and assembling a microelectronic chip including solder bumps

Semiconductor laser, method of mounting semiconductor laser, semiconductor laser mounted structure, and optical disk system

Novel method for copper wafer wire bonding

Semiconductor device and method of manufacturing thereof

Semiconductor device featuring probe area definition mark for defining probe area in electrode pad, and proof test system for proving proper contact of test probe with probe area

Routing design to minimize electromigration damage to solder bumps

Chip scale package and method for manufacturing the same

Device package

Electronic device and method for fabricating the same

Semiconductor device and method of manufacturing the same

Circuit board and semiconductor device

Light receiving or light emitting modular sheet and process for producing the same

Semiconductor device

Resonator, ultrasonic die bonding head, and ultrasonic die bonding apparatus

Apparatus and method for filling a ball grid array template

Transducer assembly, capillary and wire bonding method using the same

Molding tool and a method of forming an electronic device package

Electronic device manufacture

Semiconductor manufacturing method for die bonding

Vias having varying diameters and fills for use with a semiconductor device and methods of forming semiconductor device structures including same

Method of making a semiconductor chip assembly using multiple etch steps to form a pillar after forming a routing line

Manufacturing method of semiconductor device

Integrated circuit die connection methods and apparatus

Thermal enhanced package for block mold assembly

High-density inter-die interconnect structure

Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipment

Semiconductor package and semiconductor module

Semiconductor device and method of fabricating the same

Rotating rectifier assembly with inner mounted diodes

IC chip package structure and underfill process

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device

Spaced, bumped component structure

Display apparatus

Semiconductor device and method of manufacturing a semiconductor device

Method for connection of an integrated circuit to a substrate, and a corresponding circuit arrangement

Semiconductor package with crossing conductor assembly and method of manufacture

Package structure and fabrication method thereof

Semiconductor device

Surface mount semiconductor device

Chip-type noise filter, manufacturing method thereof, and semiconductor package

Packaging designs for LEDs

Method and apparatus for forming a low profile wire loop

Ribbon bonding tool and process

Method of making an electronic assembly

System-in-package wireless communication device comprising prepackaged power amplifier

Method of making a compliant interconnect assembly

Method of manufacturing semiconductor device and method of treating electrical connection section

Substrate bump formation

Semiconductor device and manufacturing method thereof

Methods relating to forming interconnects

Method for producing an anisotropic conductive film on a substrate

Adhesive containing a filler, and a method for attaching and manufacturing a thin plate using the same

Semiconductor module including circuit component and dielectric film, manufacturing method thereof, and application thereof

Electronic component, electro-optical device, and electronic apparatus

Semiconductor substrate with conductive bumps having a stress relief buffer layer formed of an electrically insulating organic material

Circuit board and manufacturing method therefor and semiconductor package and manufacturing method therefor

Electronic device package and method of manufacturing the same

Semiconductor device and method for producing the same

Semiconductor device including multiple rows of peripheral circuit units

Electronic component with semiconductor chip and semiconductor wafer with contact pads, and method for the production thereof

Structure for joining a semiconductor package to a substrate using a solder column

Multi-surface IC packaging structures and methods for their manufacture

Fabrication method for chip size package and non-chip size package semiconductor devices

Low profile ball-grid array package for high power

Semiconductor package using flexible film and method of manufacturing the same

Semiconductor integrated circuit and method of manufacturing the same

Printed-circuit board and circuit unit incorporating the circuit board

Contact maker for power semiconductor modules and disc cells

Manufacturing method of semiconductor device, semiconductor device, circuit board, electro-optic device, and electronic apparatus

Method for fabricating semiconductor component with thinned substrate having pin contacts

Heat conductive sheet, manufacturing method of the same, and manufacturing method of a liquid crystal display using the same

Wafer-processing tape and method of producing the same

Semiconductor apparatus and manufacturing method

Semiconductor device having a particular electrode structure

High temperature, stable SiC device interconnects and packages having low thermal resistance

Package for gallium nitride semiconductor devices

Semiconductor chip stack package having dummy chip

On-pad broadband matching network

Multi-function card device

Wire loop, semiconductor device having same and wire bonding method

Semiconductor device and manufacturing method therefor

Method for cutting semiconductor substrate

Assembly comprising functional devices and method of making same

Dicing/die-bonding film, method of fixing chipped work and semiconductor device

Silicon direct bonding method

Method of manufacturing a cavity package

Thin film transistor substrate, method of manufacturing the same, liquid crystal display apparatus having the same and method of manufacturing the liquid crystal display apparatus

Packaging structure with coplanar filling paste and dice and with patterned glue for WL-CSP

Semiconductor device fabricating apparatus and semiconductor device fabricating method

Semiconductor device package and manufacturing method thereof

Electronic parts packaging structure

Semiconductor interconnect having dome shaped conductive spring contacts

BGA package substrate and method of fabricating same

Semiconductor device with improved arrangement of a through-hole in a wiring substrate

BGA package having half-etched bonding pad and cut plating line and method of fabricating same

Method for manufacturing semiconductor device having a pair of heat sinks

Printed circuit board including embedded chips and method of fabricating the same using plating

NANO IC packaging

Circuit device and portable device with symmetrical arrangement

Flip chip contact (FCC) power package

Semiconductor package device having reduced mounting height and method for manufacturing the same

Dual flat non-leaded semiconductor package

Low cost lead-free preplated leadframe having improved adhesion and solderability

On-chip circuit pad structure

Semiconductor device

Organic semiconductor device and its manufacturing method

Wire bonds having pressure-absorbing balls

Coupler resource module

Electrical contact

Interconnection device and system

Electrical contact and connector and method of manufacture

Method of forming pad and fuse in semiconductor device

Method of forming contact pads

Semiconductor integrated device and method for manufacturing same