Method of manufacturing semiconductor device with improved design freedom of external terminal

Panel and semiconductor component having a composite board with semiconductor chips and plastic package molding compound and method for the production thereof

Semiconductor device, stacked semiconductor device, and manufacturing method for semiconductor device

Electronic module with a conductive-pattern layer and a method of manufacturing same

Contact-based encapsulation

Bond capillary design for ribbon wire bonding

Membrane-based chip tooling

Mounting device and method thereof

METHOD FOR FORMING BUMPS

Nickel bonding cap over copper metalized bondpads

Microelectronic assemblies having low profile connections

Semiconductor components and methods of fabrication with circuit side contacts, conductive vias and backside conductors

Electronic circuit protection device

Superimposed displays

Silicon wafer with solderable coating on its wafer rear side, and process for producing it

Semiconductor device and method of manufacturing a semiconductor device

Semiconductor device having reduced number of external pad portions

Locking mechanism for die assembly

Semiconductor IC and its manufacturing method, and module with embedded semiconductor IC and its manufacturing method

Electronic package structures and methods

Semiconductor device for use as multimedia memory card, has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of substrate is covered by encapsulant

Semiconductor device

Method of wafer-level packaging using low-aspect ratio through-wafer holes

High density trench MOSFET with low gate resistance and reduced source contact space

Heating apparatus

Wiring board and method for manufacturing the same

Wiring board and manufacturing method of wiring board

Method of fabricating wiring board and method of fabricating semiconductor device

Semiconductor chip with flip chip contacts and a passivation layer with varying thickness portions surrounding contact surfaces of the semiconductor chip

Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat

Surface mount type semiconductor device and method of manufacturing the same

Method for modified bus bar with Kapton™ tape or insulative material on LOC packaged part

Method for connecting a semiconductor chip onto an interconnection support

Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contacts

Method of assembling semiconductor devices with LEDs

Method for attaching dice to a package and arrangement of dice in a package

Method and circuit structure employing a photo-imaged solder mask

Nanotube materials for thermal management of electronic components

Optical element

Semiconductor element and manufacturing method thereof

Method for mounting an electronic part on a substrate using a liquid containing metal particles

Semiconductor chip manufacturing method, semiconductor chip, semiconductor device manufacturing method, and semiconductor device

Power module package structure

Semiconductor device

Redistribution layer with microstrips

Semiconductor device

Method for efficiently producing removable peripheral cards

Solder joints for copper metallization having reduced interfacial voids

Capacitor device, semiconductor devioce, and setting method of terminal capacitance of pad electrode thereof

Circuit arrangement placed on a substrate and method for producing the same

Semiconductor bond pad structures and methods of manufacturing thereof

Soldering method, electronic part, and part-exchanging method

Multi-chip die bonder and method

Method of manufacturing shielded electronic circuit units

Panel and semiconductor device having a composite plate with semiconductor chips

Self assembly of elements for displays

Semiconductor device

Semiconductor device

Offset solder bump method and apparatus

Semiconductor device

System and method for die attach using a backside heat spreader

Electronic substrate manufacturing method, semiconductor device manufacturing method, and electronic equipment manufacturing method

Assembly of a semiconductor die attached to substrate with oxazoline derivative bearing an electron donor or acceptor functionality

Semiconductor chip with coil element over passivation layer

CHIP PACKAGE STRUCTURE

Semiconductor device and method of manufacturing the same

Semiconductor device and manufacturing method thereof

Semiconductor device and method for manufacturing the same

Semiconductor device packages with substrates for redistributing semiconductor device electrodes

Sealing membrane for thermal interface material

Chip package having chip extension and method

Low cost power semiconductor module without substrate

Semiconductor device

LED package structure and method making of the same

Backside method for fabricating semiconductor components with conductive interconnects

Light emitting device package and method for manufacturing the same

Adherence of a solid-state image-sensing device to a substrate

Low range bonding tool

Mask and method for electrokinetic deposition and patterning process on substrates

Thermal management of systems having localized regions of elevated heat flux

NANO IC

Integrated circuit with additional mini-pads connected by an under-bump metallization and method for production thereof

Electrical/optical integration scheme using direct copper bonding

Method for manufacturing electronic component-embedded printed circuit board

Method of bonding solder pads of flip-chip package

Semiconductor device and method of fabricating the same

Method of manufacturing a semiconductor device comprising stacked chips and a corresponding semiconductor device

Fabrication method of IC inlet, ID tag, ID tag reader and method of reading date thereof

Semiconductor device including wire bonding pads and pad layout method

Packaging structure and method

Flip chip interconnect solder mask

Semiconductor device chip and semiconductor device chip package

Composite multi-layer substrate and module using the substrate

Semiconductor device with sealed semiconductor chip

Methods of packaging and testing microelectronic imaging devices

Semiconductor device and manufacturing method of the same

Wire loop, semiconductor device having same and wire bonding method

Method for making a flat-top pad

Method of manufacturing a device having a contacting structure

Solder ball pad surface finish structure of circuit board and fabrication method thereof

Fabrication method of under bump metallurgy structure

Hardenable pressure sensitive adhesive sheet for dicing/die-bonding and method for manufacturing semiconductor device

Circuit device and method of manufacturing thereof

Intermediate semiconductor device structures

Semiconductor device and method for the fabrication thereof including grinding a major portion of the frame

Transparent member, optical device using transparent member and method of manufacturing optical device

Surface protection film and method for producing the same

Growth of carbon nanotubes to join surfaces

Au alloy bonding wire

Bond pad structure comprising multiple bond pads with metal overlap

Methods for forming openings in a substrate and apparatuses with these openings and methods for creating assemblies with openings

Stencil and method for depositing material onto a substrate

Bumpless semiconductor device

Device with area array pads for test probing

Semiconductor device with passivation layer covering wiring layer

Method of making the semiconductor device, circuit board, and electronic instrument

Semiconductor device and fabrication method thereof

Method for fabricating structure of polymer-matrix conductive film

Semiconductor device with substrate having penetrating hole having a protrusion

Stacked type semiconductor device

Stack type surface acoustic wave package, and method for manufacturing the same

Semiconductor light-emitting device and method for manufacturing the device

Method of manufacturing self-supporting contacting structures

Working method of metal material and semiconductor apparatus fabricated by the method

Multi-chip module and method of manufacture

Post bump passivation for soft error protection

Flip chip method

Multiple etch-stop layer deposition scheme and materials

Passive element chip and manufacturing method thereof, and highly integrated module and manufacturing method thereof

Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment

Methods for applying front side and edge protection material to electronic devices at the wafer level, devices made by the methods, and systems including the devices

Semiconductor device having a plurality of semiconductor chips and method for manufacturing the same

Semiconductor device

Three dimensional packaging optimized for high frequency circuitry

Semiconductor power module package

Package substrate with built-in capacitor and manufacturing method thereof

Methods for providing bias to a monolithic microwave integrated circuit

Bond pad structures and semiconductor devices using the same

Conductive ball mounting apparatus

Memory packages having stair step interconnection layers

Semiconductor device production method and semiconductor device

Solder deposition on wafer backside for thin-die thermal interface material

Electronic component and electronic configuration

Solder bumps in flip-chip technologies

Techniques for improving bond pad performance

Semiconductor device including a base member and a semiconductor constructing body directly fixed to thermosetting resin of the base member

Microelectronic component and assembly having leads with offset portions

Multilayer printed wiring board

Dicing die adhesive film for semiconductor

Method of manufacturing a semiconductor apparatus

Semiconductor device and method of manufacturing the same

Composite electronic component

Semiconductor device with a rewiring level and method for producing the same

Circuit board with built-in electronic component and method for manufacturing the same

Semiconductor device having a flexible board for connection to a semiconductor chip mounted on an insulating substrate

Method for fabricating connection regions of an integrated circuit, and integrated circuit having connection regions

Structure of polymer-matrix conductive film and method for fabricating the same

Microelectronic package interconnect and method of fabrication thereof

Semiconductor device assemblies with compliant spring contact structures

Methods and apparatus for interconnecting a ball grid array to a printed circuit board

Multilayer printed wiring board

Fabrication of compliant spring contact structures and use thereof

Method of making a circuitized substrate

Pressure contract spring for contact arrangement in power semiconductor module

Method of manufacturing multi-layered substrate

Semiconductor device and method of manufacturing the same

Method of manufacturing a semiconductor device

Semiconductor device with terminals, and method of manufacturing the same

Methods relating to the reconstruction of semiconductor wafers for wafer-level processing

Method of repairing an image display unit

Circuit device

Carrying structure of electronic components

Semiconductor device having a leading wiring layer

Semiconductor integrated circuit package having electrically disconnected solder balls for mounting

Semiconductor integrated circuit package having electrically disconnected solder balls for mounting

Semiconductor device including an under electrode and a bump electrode

Semiconductor device and method for producing the same

Apparatus for conducting heat in a flip-chip assembly

Thermal interconnect systems methods of production and uses thereof

System having semiconductor component with multiple stacked dice

Standoffs for centralizing internals in packaging process

Semiconductor device and electronic device

Semiconductor device with electrically isolated ground structures

Thermal enhanced low profile package structure

Device packages having a III-nitride based power semiconductor device

Semiconductor substrate

Substrate for mounting electronic part and electronic part

Multilayer printed wiring board

Die attach adhesives with improved stress performance

Bumping process and bump structure

Semiconductor chip having a soldering layer sequence, and process for soldering a semiconductor chip

Thin passivation layer on 3D devices

System for providing a redistribution metal layer in an integrated circuit

Method of forming a substrateless semiconductor package

Semiconductor device with self-aligning contactless interface

Electric circuit module with improved heat dissipation characteristics using a fixing tool for fixing an electric apparatus to a heat sink

Coolant cooled type semiconductor device

Inlet for an electronic tag

Semiconductor device and manufacturing method thereof

Fan out type wafer level package structure and method of the same

Structure for mounting semiconductor part in which bump and land portion are hardly detached from each other and method of manufacturing mounting substrate used therein

Electronic devices including offset conductive bumps

Thermally enhanced semiconductor package and fabrication method thereof

Semiconductor device

Thin multiple semiconductor die package

Semiconductor device having resin-sealed area on circuit board thereof

Semiconductor device

Semiconductor light-emitting device and its manufacturing method

Semiconductor light-emitting device, method for manufacturing the same, and light-emitting apparatus including the same

Process for precise arrangement of micro-bodies

Ultrasonic tool and ultrasonic bonder

Conductive ball mounting apparatus

Intermetallic Spring Structure

Method for fabricating a flip chip package

Method for fabricating semiconductor components with through wire interconnects

Semiconductor chip capable of implementing wire bonding over active circuits

Semiconductor device

Semiconductor package substrate having contact pad protective layer formed thereon

Method of fabricating a substrate with a concave surface

Multilayer circuit board and method of manufacturing the same

Structure and assembly method of integrated circuit package

Semiconductor device

Semiconductor device, method for manufacturing the semiconductor device and semiconductor substrate

Area mount type semiconductor device, and die bonding resin composition and encapsulating resin composition used for the same

Method of manufacturing stack-type semiconductor device and method of manufacturing stack-type electronic component

Elimination of low frequency oscillations in semiconductor circuitry

Power semiconductor device and method therefor

Strobe light control circuit and IGBT device

Semiconductor integrated circuit device and vehicle-mounted radar system using the same

Method of assembling soldered packages utilizing selective solder deposition by self-assembly of nano-sized solder particles

SOCKETS FOR "SPRINGED" SEMICONDUCTOR DEVICES

Manufacturing managing method of semiconductor devices and a semiconductor substrate

Copper interconnect post for connecting a semiconductor chip to a substrate and method of fabricating the same

Semiconductor device and method of manufacturing the same

Leadless semiconductor package and manufacturing method thereof

Resin-encapsulated type semiconductor packages, and production method and apparatus therefor

Method for forming laminated structure and method for manufacturing semiconductor device using the method thereof

Packing method for electronic components

SEMICONDUCTOR PACKAGE SUBSTRATE HAVING CONTACT PAD PROTECTIVE LAYER FORMED THEREON AND METHOD FOR FABRICATING THE SAME

Fluidic heterogeneous microsystems assembly and packaging

Method of assembling displays on substrates

Semiconductor device and an image sensing device

Alignment fences and devices and assemblies including the same

Mounting structure and mounting method of a semiconductor device, and liquid crystal display device

Semiconductor device to be applied to various types of semiconductor package

Stacked die package

Semiconductor device having stress relaxation sections

Chip package with dam bar restricting flow of underfill

Method for mounting semiconductor chips on a substrate and corresponding assembly

Semiconductor device

Reducing cracking of high-lead or lead-free bumps by matching sizes of contact pads and bump pads

ELECTRONIC DEVICE PACKAGE

Electronic component mounting package and package assembled substrate

Semiconductor device having bonding pad of the first chip thicker than bonding pad of the second chip

Semiconductor device and method of manufacturing thereof

Integrated heat spreader with intermetallic layer and method for making

Semiconductor packages and methods of manufacturing thereof

Semiconductor device and a manufacturing method of the same

Electronic device and method for fabricating the same

Embedded-type power semiconductor package device

Semiconductor device and manufacturing method thereof

Method for manufacturing semiconductor apparatus, and semiconductor apparatus and electric appliance

Semiconductor integrated circuit (IC) packaging with carbon nanotubes (CNT) to reduce IC/package stress

Method of forming self-passivating interconnects and resulting devices

Lead frame for a magnetic sensor

Package structure having mixed circuit and composite substrate

Semiconductor device with extraction electrode

Semiconductor device and method of manufacturing the same

Semiconductor device suitable for a ferroelectric memory and manufacturing method of the same

CURRENT SENSOR

Method for manufacturing an electronic module

Liquid epoxy resin composition and semiconductor device

Method for manufacturing semiconductor device, and method and structure for implementing semicondutor device

Method of room temperature covalent bonding

Method of manufacturing a semiconductor device

Method of manufacturing semiconductor device

Flip chip interconnection having narrow interconnection sites on the substrate

Vertically stacked semiconductor device

Circuit board and the manufacturing method

Methods for the electronic, homogeneous assembly and fabrication of devices

Semiconductor structure with RF element

Secure system for tracking elements using tags

Method for fabricating flip-attached and underfilled semiconductor devices

Flip-chip semiconductor package and method for fabricating the same

Semiconductor chip and method manufacturing the same

Wiring board, electronic circuit board, electronic apparatus and manufacturing method of electronic circuit board

Semiconductor device and semiconductor-device manufacturing method

Semiconductor device having a functional surface

Wafer level chip scale package having a gap and method for manufacturing the same

C4 joint reliability

Semiconductor device

Semiconductor device with interlocking clip

Semiconductor device having a frame portion and an opening portion with mountable semiconductor chips therein

Flexible printed wiring board, method for fabricating flexible printed wiring board, and semiconductor device

Semiconductor device

Semiconductor device and manufacturing method thereof

LED package structure and method for making the same

Semiconductor device with two or more bond pad connections for each input/output cell and method of manufacture thereof

System for tracking elements using tags

Method for producing a wire connection