212040 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Arsenic [As]
Method for manufacturing semiconductor device, and semiconductor manufacturing apparatus used in said method
#4202Substrate for semiconductor device, resin-sealed semiconductor device, method for manufacturing said substrate for semiconductor device and method for manufacturing said resin-sealed semiconductor device
#4203Manufacturing process for embedded semiconductor device
#4204Method for packaging semiconductor dies having through-silicon vias
#4205Semiconductor packages, stacked semiconductor packages, and methods of manufacturing the semiconductor packages and the stacked semiconductor packages
#4206Stackable packages for three-dimensional packaging of semiconductor dice
#4207Electronic component module and method of manufacturing the electronic component module
#4208Method of making a thin film device
#4209Semiconductor device and manufacturing method of the same
#4210Semiconductor device and method of manufacturing the same
#4211Post bump and method of forming the same
#4212METHOD OF DESIGNING SEMICONDUCTOR INTEGRATED CIRCUIT, DESIGNING APPARATUS, SEMICONDUCTOR INTEGRATED CIRCUIT SYSTEM, SEMICONDUCTOR INTEGRATED CIRCUIT MOUNTING SUBSTRATE, PACKAGE AND SEMICONDUCTOR INTEGRATED CIRCUIT
#4213Packaged semiconductor chips
#4214Air cavity package with copper heat sink and ceramic window frame
#4215Semiconductor package having discrete components and system containing the package
#4216Semiconductor device and method of fabrication
#4217SEMICONDUCTOR DEVICE
#4218Semiconductor chip package
#4219Leadframe having delamination resistant die pad
#4220Semiconductor chip package
#4221Multi-Connect Lead
#4222Barrier Layer On Polymer Passivation For Integrated Circuit Packaging
#4223Multi-die DC-DC buck power converter with efficient packaging
#4224BONDING APPARATUS AND BONDING METHOD
#4225Semiconductor device and method of manufacturing the same
#4226Electrical conductor
#4227Bonding wire for semiconductor devices
#4228Copper alloy bonding wire for semiconductor device
#4229Method of plasma preparation of metallic contacts to enhance mechanical and electrical integrity of subsequent interconnect bonds
#4230Method for exposing and cleaning insulating coats from metal contact surfaces
#4231SEMICONDUCTOR DIE PACKAGE INCLUDING LEADFRAME WITH DIE ATTACH PAD WITH FOLDED EDGE
#4232Near chip scale package integration process
#4233Dual side cooling integrated power device module and methods of manufacture
#4234METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
#4235Self-aligned wafer bonding
#4236RESIN VARNISH USED FOR ADHESIVE FILM FOR SEMICONDUCTOR ELEMENT, ADHESIVE FILM FOR SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE
#4237System and method to reduce the bondwire/trace inductance
#4238Reconstituted wafer stack packaging with after-applied pad extensions
#4239Method for aligning and bonding elements and a device comprising aligned and bonded elements
#4240Structures and methods to improve lead-free C4 interconnect reliability
#4241Solder interconnect pads with current spreading layers
#4242Semiconductor device
#4243Film for use in manufacturing semiconductor device, method for producing semiconductor device and semiconductor device
#4244Semiconductor device provided with wire that electrically connects printed wiring board and semiconductor chip each other
#4245Semiconductor device and method of manufacturing semiconductor device
#4246Structure and method for forming pillar bump structure having sidewall protection
#4247Solder interconnect by addition of copper
#4248Substrate for semiconductor package, semiconductor package including the same, and stack package using the semiconductor package
#4249SEMICONDUCTOR CHIP PACKAGE AND METHOD FOR MANUFACTURING THEREOF AND STACK PACKAGE USING THE SAME
#4250Simplified multichip packaging and package design
#4251Semiconductor wiring assembly, semiconductor composite wiring assembly, and resin-sealed semiconductor device
#4252NICKEL-TITANUM CONTACT LAYERS IN SEMICONDUCTOR DEVICES
#4253Chip package and manufacturing method thereof
#4254Connect and capacitor substrates in a multilayered substrate structure coupled by surface coulomb forces
#4255Method for manufacturing electronic component module
#4256STRUCTURE OF A PACKAGE FOR ELECTRONIC DEVICES AND METHOD FOR MANUFACTURING THE PACKAGE
#4257Ribbon connecting electrical components
#4258Board having connection terminal
#4259METHODS AND STRUCTURES FOR A VERTICAL PILLAR INTERCONNECT
#4260Method of manufacturing a semiconductor device
#4261SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY ELECTROPLATING
#4262Three-dimensional integrated circuit structure
#4263Placement method of an electronic module on a substrate
#4264Method of making an integrated circuit package with shielding via ring structure
#4265Flip chip MLP with folded heat sink
#4266METHOD OF DIE REARRANGEMENT PACKAGE STRUCTURE HAVING PATTERNED UNDER BUMP METALLURGIC LAYER CONNECTING METAL LEAD
#4267Method of forming monolithic CMOS-MEMS hybrid integrated, packaged structures
#4268Method of forming monolithic CMOS-MEMS hybrid integrated, packaged structures
#4269Semiconductor optical interconnection device and semiconductor optical interconnection method
#4270Die-to-die electrical isolation in a semiconductor package
#4271Method and structure for adhesion of intermetallic compound (IMC) on Cu pillar bump
#4272SEMICONDUCTOR DEVICE MANUFACTURING METHOD
#4273SEMICONDUCTOR DEVICE INCLUDING SEALING FILM FOR ENCAPSULATING SEMICONDUCTOR CHIP AND PROJECTION ELECTRODES AND MANUFACTURING METHOD THEREOF
#4274Method for producing a power semiconductor module, and power semiconductor module comprising a connection device
#4275Semiconductor device
#4276Compound semiconductor device and connectors
#4277Chip scale module package in BGA semiconductor package
#4278Semiconductor chip package and method for designing the same
#4279Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereof
#4280Assembly of a wire element with a microelectronic chip with a groove comprising at least one bump securing the wire element
#4281Semiconductor device and a method of manufacturing the same
#4282Stacked semiconductor device and fabrication method for same
#4283Semiconductor device and fabrication method thereof
#4284Semiconductor device mounted structure with an underfill sealing-bonding resin with voids
#4285Flip-chip module and method for the production thereof
#4286Semiconductor device and manufacturing method of the same
#4287Semiconductor Chip Secured to Leadframe by Friction
#4288SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#4289Lead frame routed chip pads for semiconductor packages
#4290Method of assembling a multi-component electronic package
#4291Semiconductor device and semiconductor device manufacturing method
#4292THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURE
#4293Power converter integrated circuit floor plan and package
#4294Wire payout measurement and calibration techniques for a wire bonding machine
#4295Multi-segments modeling bond wire interconnects with 2D simulations in high speed, high density wire bond packages
#4296SEMICONDUCTOR DEVICE AND PROCESS FOR PRODUCING THE SAME
#4297Formation of TSV backside interconnects by modifying carrier wafers
#4298Manufacturing method of semiconductor device including Au bump on seed film
#4299Interconnects for packaged semiconductor devices and methods for manufacturing such devices
#4300Process for producing a semiconductor device
#4301Methods for producing an ultrathin semiconductor circuit
#4302Three-dimensional integrated circuits with protection layers
#4303Method of manufacturing semiconductor device
#4304Method and apparatus providing integrated circuit having redistribution layer with recessed connectors
#4305Semiconductor device and method for producing the same
#4306Adhesive, method of connecting wiring terminals and wiring structure
#4307Multichip module, printed circuit board unit, and electronic apparatus
#4308Printed circuit board
#4309METHOD FOR THE PRODUCING AN ELECTRONIC SUBASSEMBLY, AS WELL AS ELECTRONIC SUBASSEMBLY
#4310Layered chip package
#4311Stacked structures and methods of fabricating stacked structures
#4312Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods
#4313Electrical interconnect for die stacked in zig-zag configuration
#4314SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE
#4315Semiconductor device bonding wire and wire bonding method
#4316JOINING STRUCTURE AND A SUBSTRATE-JOINING METHOD USING THE SAME
#4317Package and the Method for Making the Same, and a Stacked Package
#43183-D semiconductor die structure with containing feature and method
#4319Semiconductor package and method of forming the same
#4320Near chip scale semiconductor packages
#4321Wiring board and semiconductor device using the wiring board
#4322SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#4323Semiconductor package structure and package method thereof
#4324Package manufacturing method and semiconductor device
#4325Semiconductor chip package and method of manufacturing the same
#4326FLAT CHIP PACKAGE AND FABRICATION METHOD THEREOF
#4327Multi-chip package and method of providing die-to-die interconnects in same
#4328Semiconductor chip, method of fabricating the same, and stack module and memory card including the same
#4329IC PACKAGE DESIGN WITH STRESS RELIEF FEATURE
#4330Semiconductor device with embedded interconnect pad
#4331Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same
#4332Integrated circuit package system using heat slug
#4333Electrical property altering, planar member with solder element in IC chip package
#4334Bond pad with integrated transient over-voltage protection
#4335Semiconductor chip
#4336Compression-bonding apparatus
#4337Circuit board having semiconductor chip
#4338METHAL-BASED PACKAGE SUBSTRATE, THREE-DIMENSIONAL MULTI-LAYERED PACKAGE MODULE USING THE SAME, AND MANUFACTURING METHOD THEREOF
#4339Method for forming integrated circuit assembly
#4340ADHESIVE, METHOD OF CONNECTING WIRING TERMINALS AND WIRING STRUCTURE
#4341Circuit member, manufacturing method for circuit members, semiconductor device, and surface lamination structure for circuit member
#4342Semiconductor device and manufacturing method thereof
#4343Fabrication method of semiconductor device having conductive bumps
#4344Circuit Device and Method of Manufacturing Thereof
#4345Process for manufacturing a composite substrate
#4346ULTRASONIC BONDING EQUIPMENT FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
#4347Integrated circuit device
#4348Pressure-Sensitive Adhesive Tape
#4349Multilayer printed wiring board
#4350MEMORY CARD
#4351SEMICONDUCTOR DEVICE, CAMERA MODULE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#4352Die package including encapsulated die and method of manufacturing the same
#4353SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#4354Electronic component built-in wiring substrate
#4355Adhesive film for semiconductor and semiconductor device using the adhesive film
#4356Semiconductor device
#4357Semiconductor package with substrate having single metal layer and manufacturing methods thereof
#4358Surface depressions for die-to-die interconnects and associated systems
#4359Die stacking apparatus and method
#4360SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
#4361Wafer level stack structure for system-in-package and method thereof
#4362Method for fabricating a semiconductor package
#4363Semiconductor device with reinforcement plate and method of forming same
#4364Chip package structure and manufacturing methods thereof
#4365SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#4366Packaged integrated circuit devices with through-body conductive vias, and methods of making same
#4367Laminated body of semiconductor chips including pads mutually connected to conductive member
#4368Die-warpage compensation structures for thinned-die devices, and methods of assembling same
#4369Thru silicon enabled die stacking scheme
#4370Metallic Bump Structure Without Under Bump Metallurgy And a Manufacturing Method Thereof
#4371Standing chip scale package
#4372METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE HAVING AN EVEN COATING THICKNESS USING ELECTRO-LESS PLATING AND RELATED DEVICE
#4373Method for manufacturing semiconductor device
#4374Lead frame design to improve reliability
#4375PRINTED WIRING BOARD, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
#4376Applying chiplets to substrates
#4377MULTIFUNCTIONAL DIE ATTACHMENT FILM AND SEMICONDUCTOR PACKAGING USING THE SAME
#4378Semiconductor device and method for manufacturing the same
#4379Hermeticity testing
#4380Semiconductor device that suppresses malfunctions due to noise generated in internal circuit
#4381SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME
#4382Explosion-proof module structure for power components, particularly power semiconductor components, and production thereof
#4383Semiconductor substrate with interlayer connection and method for production of a semiconductor substrate with interlayer connection
#4384Semiconductor chip passivation structures and methods of making the same
#4385SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#4386Interconnect structures having lead-free solder bumps
#4387Method of forming wire bonds in semiconductor devices
#4388Chip packaging method and structure thereof
#4389Electronic device package and method of manufacture
#4390Copper pillar bonding for fine pitch flip chip devices
#4391Substrate having single patterned metal layer exposing patterned dielectric layer, chip package structure including the substrate, and manufacturing methods thereof
#4392Package-on-package technology for fan-out wafer-level packaging
#4393Apparatus for restricting moisture ingress
#4394Stacked chip package structure with leadframe having inner leads with transfer pad
#4395IC PACKAGE HAVING AN INDUCTOR ETCHED INTO A LEADFRAME THEREOF
#4396Semiconductor device
#4397Faraday cage for circuitry using substrates
#4398High-voltage semiconductor device
#4399Heat releasing semiconductor package, method for manufacturing the same, and display apparatus including the same
#4400SEMICONDUCTOR DEVICE
#4401Pads with different width in a scribe line region and method for manufacturing these pads
#4402Method for manufacturing tight pitch, flip chip integrated circuit packages
#4403Fabricating method of embedded package structure
#4404Substrate for flip chip bonding and method of fabricating the same
#4405AU ALLOY WIRE FOR BALL BONDING
#4406HERMETICALLY-SEALED ELECTRICAL CIRCUIT APPARATUS
#4407Die bonder providing a large bonding force
#4408Electrical connection and method of manufacturing the same
#4409Radio frequency unit analog level detector and feedback control system
#4410METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#4411Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor device
#4412MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#4413Method for producing display device
#4414Method and apparatus for no lead semiconductor package
#4415Semiconductor device and method of forming through hole vias in die extension region around periphery of die
#4416Semiconductor device
#4417Metallic electrode forming method and semiconductor device having metallic electrode
#4418In-package microelectronic apparatus, and methods of using same
#4419INTERPOSER SUBSTRATE, LSI CHIP AND INFORMATION TERMINAL DEVICE USING THE INTERPOSER SUBSTRATE, MANUFACTURING METHOD OF INTERPOSER SUBSTRATE, AND MANUFACTURING METHOD OF LSI CHIP
#4420COMPOSITE OF AT LEAST TWO SEMICONDUCTOR SUBSTRATES AND A PRODUCTION METHOD
#4421Semiconductor device and method for manufacturing the same
#4422Method for making an electrically conducting mechanical interconnection member
#4423Semiconductor chip having power supply line with minimized voltage drop
#4424Semiconductor device and method of forming through hole vias in die extension region around periphery of die
#4425Semiconductor device and method of forming through hole vias in die extension region around periphery of die
#4426Semiconductor integrated circuit device
#4427Semiconductor apparatus and manufacturing method of the same
#4428Method for manufacturing hetero-bonded wafer
#4429Power semiconductor device package and fabrication method
#4430Electronic module with feed through conductor between wiring patterns
#4431Integrated package
#4432SEMICONDUCTOR PACKAGES AND MANUFACTURING METHOD THEREOF
#4433Semiconductor Device and Method of Manufacturing the Same
#4434Semiconductor device
#4435Method of manufacturing an electronic device
#4436Semiconductor device, semiconductor wafer and manufacturing method of the same
#4437CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE AND METHOD FOR PRODUCING THE SAME
#4438Method for connecting a precious metal surface to a polymer
#4439UNIFIED SCALABLE HIGH SPEED INTERCONNECTS TECHNOLOGIES
#4440Processed wafer via
#4441Method of forming a bond pad
#4442Method for connecting a die attach pad to a lead frame and product thereof
#4443Method of manufacturing semiconductor device including exposing a dicing line on a wafer
#4444Semiconductor die attachment method using non-conductive screen print and dispense adhesive
#4445Method of manufacturing layered chip package
#4446METHOD OF MANUFACTURING DICING DIE-BONDING FILM
#4447OPTICAL WIRING CABLE
#4448Thermal interface material and method of using the same and electronic assembly having the same
#4449Source driver, method for manufacturing same, and liquid crystal module
#4450Structure and method for power field effect transistor
#4451Packaged electronic devices having die attach regions with selective thin dielectric layer
#4452Semiconductor device
#4453Electronic device, conductive composition, metal filling apparatus, and electronic device manufacturing method
#4454Joint structure and electronic component
#4455Stacked package and method for forming stacked package
#4456Forming semiconductor chip connections
#4457Semiconductor device package structure and method for the same
#4458Electronic component and method of connecting with multi-profile bumps
#4459SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#4460WIREBOND STRUCTURES
#4461Semiconductor device
#4462Lead frame, lead frame fabrication, and semiconductor device
#4463ASTERISK PAD
#4464METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE
#4465THIN FILM DEVICE, FLEXIBLE CIRCUIT BOARD INCLUDING THIN FILM DEVICE, AND METHOD FOR MANUFACTURING THIN FILM DEVICE
#4466SEMICONDUCTOR DEVICE AND METHOD OF INSPECTING AN ELECTRICAL CHARACTERISTIC OF A SEMICONDUCTOR DEVICE
#4467Bonding apparatus and bonding stage height adjustment method for the bonding apparatus
#4468Modified Pillar Design for Improved Flip Chip Packaging
#4469Aluminum bond pads with enhanced wire bond stability
#4470Wiring board and method for manufacturing the same
#4471Wiring board and method for manufacturing the same
#4472Composite multi-layer substrate and module using the substrate
#4473Method and Apparatus for Building Multilayer Circuits
#4474Method of manufacturing electronic component device
#4475Components packaging method
#4476Chair pad charging and communication system for a battery-powered microstimulator
#4477CONDUCTIVE BUMP STRUCTURE FOR SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
#4478Method for providing a redistribution metal layer in an integrated circuit
#4479Method of fabricating stacked semiconductor chips
#4480Electronic system modules and method of fabrication
#4481Semiconductor package with position member
#4482Method for stacking serially-connected integrated circuits and multi-chip device made from same
#4483Power semiconductor device and method for its production
#4484Method for producing electric contacts on a semiconductor component
#4485Semiconductor device having a semiconductor chip, and method for the production thereof
#4486Semiconductor device and method for fabricating the same
#4487WIRE BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF
#4488Semiconductor chip package with post electrodes
#4489Electronic component mounting structure, electronic component mounting method, and electronic component mounting board
#4490SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, CIRCUIT SUBSTRATE, ELECTRO-OPTICAL APPARATUS, AND ELECTRONIC EQUIPMENT
#4491Wafer level chip scale package
#4492Wiring substrate and semiconductor device having connection pads formed in non-solder mask defined structure
#4493Power electronic device
#4494Semiconductor device including double-sided multi-electrode chip embedded in multilayer wiring substrate
#4495Semiconductor substrate and method of connecting semiconductor die to substrate
#4496Semiconductor device and method of forming the same
#4497Semiconductor package
#4498Stress-engineered interconnect packages with activator-assisted molds
#4499Semiconductor device
#4500QUAD FLAT PACKAGE STRUCTURE HAVING EXPOSED HEAT SINK, ELECTRONIC ASSEMBLY AND MANUFACTURING METHODS THEREOF