212040 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Arsenic [As]
Method for alloying a wiring portion for a image display device
#14102Alloying method, and wiring forming method, display device forming method, and image display unit fabricating method
#14103Method of manufacturing a display panel
#14104Microelectronic packages and methods therefor
#14105Single mask via method and device
#14106Wafer level semiconductor component having thinned, encapsulated dice and polymer dam
#14107Semiconductor device for wire-bonding and flip-chip bonding package and manufacturing method thereof
#14108Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#14109Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#14110Electronic circuit module
#14111Semiconductor device and method of manufacturing the same
#14112Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#14113Thermal head and bonding connection method therefor
#14114Flip-chip attach structure
#14115Semiconductor device and manufacturing method thereof
#14116Semiconductor device and method of manufacturing the same
#14117Semiconductor integrated circuit device
#14118Lateral conduction Schottky diode with plural mesas
#14119System semiconductor device and method of manufacturing the same
#14120Method for preparing integrated circuit modules for attachment to printed circuit substrates
#14121Adhesive, method of connecting wiring terminals and wiring structure
#14122Wiring structure having a wiring-terminal-connecting adhesive comprising silicone particles
#14123Manufacturing method of semiconductor device
#14124BUMPING PROCESS OF LIGHT EMITTING DIODE
#14125Wafer-level chip scale package and method for fabricating and using the same
#14126Methods and apparatus for integrated circuit ball bonding with substantially perpendicular wire bond profiles
#14127Bumping process of light emitting diode
#14128Alloy method using laser irradiation
#14129Method for manufacturing semiconductor device
#14130Ball transferring method and apparatus
#14131Method of manufacturing hybrid integrated circuit device
#14132Manufacturing method of a semiconductor device utilizing a flexible adhesive tape
#14133High-frequency power amplifier module
#14134Electronic component and fabricating method
#14135Optically interactive device package array
#14136Method of manufacturing a sensor device with binding material having a foaming agent
#14137Wafer-level package and method for production thereof
#14138Electronic component and fabricating method
#14139Semiconductor device having bonding pad above low-k dielectric film
#14140Electrode pad section for external connection
#14141Semiconductor device and method of manufacturing the same
#14142Electronic component and fabricating method
#14143Microelectronic assembly having array including passive elements and interconnects
#14144Socket grid array
#14145Connector assembly
#14146Quad flat non-leaded package comprising a semiconductor device
#14147Wire-bonding method and semiconductor package using the same
#14148Semiconductor package with wire bonded stacked dice and multi-layer metal bumps
#14149Semiconductor package with passive device integration
#14150Trench-gate semiconductor devices
#14151Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#14152Brazing filler metal, assembly method for semiconductor device using same, and semiconductor device
#14153System and method for automated wire bonding
#14154Dies bonding apparatus and dies bonding method
#14155Reworkable thermosetting resin compositions
#14156High performance system-on-chip discrete components using post passivation process
#14157Methods for reducing flip chip stress
#14158Semiconductor device and method for fabricating the device
#14159Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#14160Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment
#14161Fabrication method of semiconductor package with photosensitive chip
#14162Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#14163Compliant wirebond pedestal
#14164Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#14165Method for making a micromechanical device by using a sacrificial substrate
#14166Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#14167Resin compositions and methods of use thereof
#14168Resin-encapsulation semiconductor device and method for fabricating the same
#14169Carrier
#14170Flip-chip adaptor package for bare die
#14171Via structure for semiconductor chip
#14172DEVICE WITH AREA ARRAY PADS FOR TEST PROBING
#14173Semiconductor device including semiconductor element mounted on another semiconductor element
#14174Bumped IC, display device and electronic device using the same
#14175Semiconductor device and method for manufacturing the same
#14176Semiconductor device and method of fabricating the same
#14177Partially etched dielectric film with conductive features
#14178Solder alloy and semiconductor device
#14179Bumpless wafer scale device and board assembly
#14180Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods
#14181Semiconductor device having radiation structure
#14182Method of making microelectronic packages including electrically and/or thermally conductive element
#14183Semiconductor device, three-dimensional semiconductor device, and method of manufacturing semiconductor device
#14184Enhanced adhesion strength between mold resin and polyimide
#14185Film substrate, fabrication method thereof, and image display substrate
#14186Semiconductor device
#14187Semiconductor device and method of manufacturing same
#14188Method of fabricating wafer-level packaging with sidewall passivation and related apparatus
#14189Die-wafer package and method of fabricating same
#14190Integrated circuit package with transparent encapsulant and method for making thereof
#14191Surface mountable hermetically sealed package
#14192High Q factor integrated circuit inductor
#14193Active matrix substrate, method of manufacturing the same, and display device
#14194Active matrix substrate display device
#14195METHOD FOR PRODUCING WEDGE-WEDGE WIRE CONNECTION
#14196Bonding method, bonding apparatus and bonding program
#14197Bonding pattern discrimination method, bonding pattern discrimination device and bonding pattern discrimination program
#14198Interconnection device and system
#14199Method and system for batch forming spring elements in three dimensions
#14200High performance interposer for a chip package using deformable button contacts
#14201Selective passivation of exposed silicon
#14202Semiconductor substrates including I/O redistribution using wire bonds and anisotropically conductive film, methods of fabrication and assemblies including same
#14203Method for fabricating semiconductor device and apparatus for fabricating the same
#14204Method of fabricating a pad over active circuit I.C. with meshed support structure
#14205Method of forming solder bump with reduced surface defects
#14206Method for fabricating a chip scale package using wafer level processing
#14207Method for processing an integrated circuit
#14208Circuit substrate for packaging semiconductor device, method for producing the same, and method for producing semiconductor device package structure using the same
#14209Direct writeTM system
#14210Semiconductor device and manufacturing method of them
#14211Method for mounting a driver IC chip and a FPC board/TCP/COF device using a single anisotropic conductive film
#14212Driver chip and display apparatus having the same
#14213Method and apparatus for underfilling semiconductor devices
#14214Chip and multi-chip semiconductor device using thereof and method for manufacturing same
#14215Semiconductor integrated circuit having connection pads over active elements
#14216Adhesion by plasma conditioning of semiconductor chip
#14217Package structure having semiconductor device embedded within wiring board
#14218Method and structure to reduce risk of gold embrittlement in solder joints
#14219Semiconductor device
#14220Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatus
#14221WAFER-LEVEL PACKAGE STRUCTURE
#14222Method of fabricating a semiconductor package utilizing a thermosetting resin base member
#14223Semiconductor device with a solder creep-up prevention zone
#14224Semiconductor device having conducting portion of upper and lower conductive layers
#14225Semiconductor device
#14226Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
#14227Room temperature metal direct bonding
#14228Semiconductor device and stacked semiconductor device that can increase flexibility in designing a stacked semiconductor device
#14229Junction member comprising junction pads arranged in matrix and multichip package using same
#14230Integrated circuit arrangement
#14231Hermetic surface mounted power package
#14232Semiconductor device
#14233Method for manufacturing circuit board, circuit board, and electronic equipment
#14234HYBRID INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF
#14235Strip-fabricated flip chip in package and flip chip in system heat spreader assemblies and fabrication methods therefor
#14236Method of making wireless semiconductor device, and leadframe used therefor
#14237Interconnect structure for power transistors
#14238Optical sensor module with semiconductor device for drive
#14239ULTRA-FINE CONTACT ALIGNMENT
#14240Method and apparatus for forming metal contacts on a substrate
#14241Microparticle loaded solder preform allowing bond site control of device spacing at micron, submicron, and nanostructure scale
#14242System for reducing oxidation of electronic devices
#14243Method and resulting structure for manufacturing semiconductor substrates
#14244Method of manufacturing high performance copper inductors with bond pads
#14245Method of forming segmented ball limiting metallurgy
#14246Hermetic passivation structure with low capacitance
#14247Manufacturing method for resin sealed semiconductor device
#14248Semiconductor device and method of fabricating the same
#14249Device transferring method
#14250Device transferring method
#14251Device transferring method
#14252Resin composition for encapsulating semiconductor
#14253Structure and method for temporarily holding integrated circuit chips in accurate alignment
#14254Method for manufacturing optical module, optical communication device, and electronic device
#14255Electronic device and production method thereof
#14256Driver chip and display apparatus including the same
#14257Display unit
#14258Damascene interconnection and semiconductor device
#14259Semiconductor devices having stereolithographically fabricated protective layers thereon through which contact pads are exposed and assemblies including the same
#14260Colored conductive wires for a semiconductor package
#14261Die attach by temperature gradient lead free soft solder metal sheet or film
#14262Method for manufacturing connection construction
#14263Process for producing a semiconductor device
#14264Integrated device including connections on a separate wafer
#14265Support ring for use with a contact pad and semiconductor device components including the same
#14266Self-supporting connecting element for a semiconductor chip
#14267Structure of gold fingers
#14268Semiconductor device including semiconductor elements mounted on base plate
#14269Reduced size semiconductor package with stacked dies
#14270Flipchip QFN package
#14271Integrated circuit packages with sandwiched capacitors
#14272Semiconductor device
#14273Fuse structure for semiconductor integrated circuit with improved insulation film thickness uniformity and moisture resistance
#14274Semiconductor device using LED chip
#14275Test assembly including a test die for testing a semiconductor product die
#14276Mounting board and electronic device using same
#14277Electronic component mounting method and apparatus
#14278Device transferring method, and device arraying method and image display unit fabricating method using the same
#14279Method for compensating for CTE mismatch using phase change lead-free super plastic solders
#14280Wafer level chip stack method
#14281Carrier, method of manufacturing a carrier and an electronic device
#14282Porous adhesive sheet, semiconductor wafer with porous adhesive sheet and method of manufacture thereof
#14283Interconnect circuitry, multichip module, and methods for making them
#14284Method of embedding components in multi-layer circuit boards
#14285Stacked IC device having functions for selecting and counting IC chips
#14286Cooling devices and methods of using them
#14287Semiconductor chip package
#14288Adhesive film for circuit connection, and circuit connection structure
#14289Materials for electronic devices
#14290UBM for fine pitch solder ball and flip-chip packaging method using the same
#14291Efficient use of wafer area with device under the pad approach
#14292Semiconductor device and method of manufacturing the same
#14293Semiconductor device
#14294Semiconductor device having capacitors for reducing power source noise
#14295Mounting substrate and electronic component using the same
#14296Semiconductor device and manufacturing method thereof
#14297Low profile package having multiple die
#14298Semiconductor device and manufacturing method for the same
#14299Electronic device having wiring substrate and lead frame
#14300LED substrate
#14301Semiconductor device, optoelectronic board, and production methods therefor
#14302Bumping electronic components using transfer substrates
#14303System and method for increasing the strength of a bond made by a small diameter wire in ball bonding
#14304Arrangement for wire bonding and method for producing a bonding connection
#14305Method for producing an electronic device connected to a printed circuit board
#14306Electronic device and method for producing the same
#14307Electronic circuit device having circuit board electrically connected to semiconductor element via metallic plate
#14308Lithographic contact elements
#14309Photoresist process to enable sloped passivation bondpad openings for ease of metal step coverings
#14310Encapsulated semiconductor components and methods of fabrication
#14311Method of manufacturing an electronic device, and electronic device
#14312Capacitor device and method of manufacturing the same
#14313Solid image-pickup device and method for manufacturing the solid image pickup device
#14314Method of manufacturing semiconductor device
#14315Micro lead frame package having transparent encapsulant
#14316Semiconductor chip with external connecting terminal
#14317Semiconductor chip with external connecting terminal
#14318Wafer stacking with anisotropic conductive adhesive
#14319Semiconductor device and method of manufacturing the same
#14320FLIP CHIP PACKAGE STRUCTURE AND CHIP STRUCTURE THEREOF
#14321Method for fabricating a semiconductor interconnect having conductive spring contacts
#14322Method of forming a bonding pad structure
#14323Semiconductor device and method for manufacturing the same
#14324Semiconductor chip with external connecting terminal
#14325Low profile stacking system and method
#14326Solder ball pad structure
#14327Semiconductor element having protruded bump electrodes
#14328Package circuit board with a reduced number of pins and package including a package circuit board with a reduced number of pins and methods of manufacturing the same
#14329Method of fabricating a pad over active circuit I.C. with frame support structure
#14330Semiconductor device
#14331Semiconductor device and manufacturing method thereof
#14332Multi-part lead frame with dissimilar materials
#14333Semiconductor device
#14334Integrated circuit package for semiconductor devices having a reduced leadframe pad and an increased bonding area
#14335I/O architecture for integrated circuit package
#14336Apparatus and methods for an underfilled integrated circuit package
#14337Method for preparing arylphosphonite antioxidant
#14338Method of forming bump pad of flip chip and structure thereof
#14339Method of disposing conductive bumps onto a semiconductor device and semiconductor devices so formed
#14340Method of manufacturing a semiconductor device by using a matrix frame
#14341Induction-based heating for chip attach
#14342Semiconductor device with intermediate connector
#14343Mounting structure of semiconductor chip, semiconductor device and method of making the semiconductor device
#14344Electrical connection of components
#14345Dual band power amplifier module for wireless communication devices
#14346Forming a chip package having a no-flow underfill
#14347Method and device for manufacturing bonding pads for chip scale packaging
#14348Fabrication methods for electronic system modules
#14349Semiconductor device, manufacturing method thereof and electronic equipment
#14350Method of manufacturing a semiconductor device
#14351Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof
#14352Semiconductor device including a hard sheet to reduce warping of a base plate and method of fabricating the same
#14353Semiconductor device and method of fabricating the same
#14354Method and apparatus for applying body bias to integrated circuit die
#14355Thermal intermediate apparatus, systems, and methods
#14356Methods of making microelectronic assemblies including compliant interfaces
#14357Semiconductor chip package and multichip package
#14358Method of manufacturing a semiconductor device
#14359High-frequency device
#14360Dicing die-bonding film
#14361Leadless semiconductor package
#14362Methods for depositing, releasing and packaging microelectromechanical devices on wafer substrates
#14363Package structure for semiconductor
#14364Wire bonder for ball bonding insulated wire and method of using same
#14365Mounting device and method thereof
#14366Novel process for improved hot carrier injection
#14367Methods of providing solder structures for out plane connections
#14368Die exhibiting an effective coefficient of thermal expansion equivalent to a substrate mounted thereon, and processes of making same
#14369Method for manufacturing metal structure having different heights
#14370Process for producing optical semiconductor device
#14371Plastic lead frames utilizing reel-to-reel processing
#14372Warpage control of array packaging
#14373Stacked semiconductor device assembly and method for forming
#14374Chip packaging compositions, packages and systems made therewith, and methods of making same
#14375Various structure/height bumps for wafer level-chip scale package
#14376Semiconductor module with a semiconductor stack, and methods for its production
#14377Wire loop grid array package
#14378Metal article intended for at least partially coating with a substance and a method for producing the same
#14379Dual semiconductor die package with reverse lead form
#14380Microelectronic assemblies with composite conductive elements
#14381Semiconductor package with a flip chip on a solder-resist leadframe
#14382Manufacturing method of a semiconductor device
#14383Method and apparatus for improved power routing
#14384Lead frame structure with aperture or groove for flip chip in a leaded molded package
#14385Semiconductor device and method for the fabrication thereof grinding frame portion such that plural electrode constituent portions
#14386System and method for increasing the ball pitch of an electronic circuit package
#14387Semiconductor device having pad structure for preventing and buffering stress of silicon nitride film
#14388Method for manufacturing semiconductor device, adhesive sheet for use therein and semiconductor device
#14389Opto-electronic assembly having an encapsulant with at least two different functional zones
#14390Methods of forming solder areas on electronic components and electronic components having solder areas
#14391Flip-chip solder bump formation using a wirebonder apparatus
#14392Wire bonding simulation
#14393Wire bonding apparatus and method for clamping a wire
#14394Method and apparatus for trace shielding and routing on a substrate
#14395Chip orientation and attachment method
#14396Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat
#14397Flip clip attach and copper clip attach on MOSFET device
#14398Electronic parts built-in substrate and method of manufacturing the same
#14399Castellation wafer level packaging of integrated circuit chips
#14400Method of making a microelectronic assembly