Stacked semiconductor device and manufacturing method thereof

Co-axial restraint for connectors within flip-chip packages

Moisture barrier for a wire bond

Solder ball for semiconductor packaging and electronic member using the same

Flip chip package

IGBT power semiconductor package having a conductive clip

Optoelectronic component and method for producing an opto-electronic component

MOUNTING DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC MODULE

Through-hole electrode substrate and method of manufacturing the same

Interconnections for fine pitch semiconductor devices and manufacturing method thereof

Polymer and solder pillars for connecting chip and carrier

Semiconductor packages and methods of packaging semiconductor devices

Mechanical coupling in a multi-chip module using magnetic components

Methods of forming a microshield on standard QFN package

Carrier device, arrangement comprising such a carrier device, and method for patterning a layer stack comprising at least one ceramic layer

Heat radiation material, electronic device and method of manufacturing electronic device

Light emitting apparatus, illumination apparatus and display apparatus

MULTI-CHIP MODULE PACKAGE

SEMICONDUCTOR DEVICE AND NOISE SUPPRESSING METHOD

Semiconductor devices including a through-substrate conductive member with an exposed end

Semiconductor Device and Method of Forming Interconnect Structure for Encapsulated Die Having Pre-Applied Protective Layer

Semiconductor device and method of forming interposer and opposing build-up interconnect structure with connecting conductive TMV for electrical interconnect of Fo-WLCSP

Wiring connection method and functional device

Ni plating of a BLM edge for Pb-free C4 undercut control

Packaging Structure and Method

Semiconductor Device and Method of Forming the Device Using Sacrificial Carrier

Extending metal traces in bump-on-trace structures

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Integrated circuit micro-module

Semiconductor device and semiconductor device mounting structure

Sensor mounted in flip-chip technology at a substrate edge

Mosfet package

Electronic devices with yielding substrates

Routing method for flip chip package and apparatus using the same

Semiconductor device

Die bonder and semiconductor manufacturing method

CONDUCTIVE CONNECTING MATERIAL AND METHOD FOR CONNECTING TERMINALS USING THE SAME

METHOD FOR THE SELF-ASSEMBLY OF ELECTRICAL, ELECTRONIC OR MICROMECHANICAL COMPONENTS ON A SUBSTRATE

Electrical component having an electrical connection arrangement and method for the manufacture thereof

Wiring pattern having a stub wire

Bond pad structure

Semiconductor device, method for manufacturing the same, and power supply unit

Interconnects for packaged semiconductor devices and methods for manufacturing such devices

Joining electrode, method of manufacturing the same, semiconductor device, and method of manufacturing the same

Semiconductor device and method of forming WLCSP structure using protruded MLP

Bump-on-lead flip chip interconnection

Semiconductor Device and Method of Protecting Passivation Layer in a Solder Bump Process

Flip Chip Interconnection Having Narrow Interconnection Sites on the Substrate

Chip package with plank stack of semiconductor dies

POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING A POWER SEMICONDUCTOR MODULE

Low temperature high strength metal stack for die attachment

LIGHT EMITTING DEVICE PACKAGE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND ELECTRONIC CIRCUIT

Imaging apparatus and imaging system

Electroconductive bonding material, method for bonding conductor, and method for manufacturing semiconductor device

DEVICE MOUNTING BOARD AND METHOD OF MANUFACTURING THE SAME, SEMICONDUCTOR MODULE, AND MOBILE DEVICE

Pyramid bump structure

Method of manufacturing semiconductor device having a bumped wafer and protective layer

Semiconductor Device and Method of Forming Narrow Interconnect Sites on Substrate with Elongated Mask Openings

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor device and manufacturing method therefor

Passivation layer for semiconductor device packaging

On-Chip RF shields with front side redistribution lines

Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact pads

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

MEMS and protection structure thereof

Stack package and method for manufacturing the same

BUMP AND SEMICONDUCTOR DEVICE HAVING THE SAME

Semiconductor device including a lead frame

Semiconductor device and a method of manufacturing the same

Method of forming a light emitting diode emitter substrate with highly reflective metal bonding

RFID integrated circuit with integrated antenna structure

METHOD OF FORMING UNDERBUMP METALLURGY STRUCTURE EMPLOYING SPUTTER-DEPOSITED NICKEL COPPER ALLOY

IC device having low resistance TSV comprising ground connection

WAFER-LEVEL CHIP SCALE PACKAGING OF METAL-OXIDE-SEMICONDUCTOR FIELD-EFFECT-TRANSISTORS (MOSFET'S)

DIE BONDER INCLUDING AUTOMATIC BOND LINE THICKNESS MEASUREMENT

SURGE PROTECTION DEVICE

Semiconductor module having deflecting conductive layer over a spacer structure

CIRCUIT ARRANGEMENT AND MANUFACTURING METHOD THEREOF

METHOD OF MANUFACTURING ELECTRONIC DEVICE, ELECTRONIC DEVICE, AND APPARATUS FOR MANUFACTURING ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE

Semiconductor device having a vertical interconnect structure using stud bumps

Interconnection structure

Elongated bump structure for semiconductor devices

ELECTRONIC DEVICE HAVING STACK-TYPE SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

Package-on-package using through-hole via die on saw streets

Extended under-bump metal layer for blocking alpha particles in a semiconductor device

Sensor device having electrode draw-out portions through side of substrate

Charging and communication system for a battery-powered microstimulator

Chip package structure with ENIG plating

Semiconductor device and method of forming stud bumps over embedded die

Adhesive compositions for a semiconductor, an adhesive sheet for a semiconductor and a production method of a semiconductor device

Rule-based semiconductor die stacking and bonding within a multi-die package

Implementing multiple different types of dies for memory stacking

Method of making ferroelectric memory device with barrier layer and novolac resin passivation layer

INPUT/OUTPUT CORE DESIGN AND METHOD OF MANUFACTURE THEREFOR

IC device having low resistance TSV comprising ground connection

Semiconductor packages and methods of packaging semiconductor devices

Dual molded multi-chip package system

OHMIC CONNECTION USING WIDENED CONNECTION ZONES IN A PORTABLE ELECTRONIC OBJECT

Solder, soldering method, and semiconductor device

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Electrostatic chucking of an insulator handle substrate

Manufacturing method of semiconductor device and semiconductor device

Multichip Packages

METHOD FOR JOINING BONDING WIRE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor device, method of manufacturing semiconductor device, and electronic device

Contactless communication medium

COPPER-BASED METALLIZATION SYSTEM INCLUDING AN ALUMINUM-BASED TERMINAL LAYER

MRAM DEVICE AND METHOD OF ASSEMBLING SAME

Structure of mixed semiconductor encapsulation structure with multiple chips and capacitors

Dual-interface smart card

Electronic system with expansion feature

Method of clamping a semiconductor assembly

Area efficient through-hole connections

Pad bonding employing a self-aligned plated liner for adhesion enhancement

Light-emitting diode arrangement and method for producing the same

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

METHOD AND APPARATUS OF COMPRESSION MOLDING TO REDUCE VOIDS IN MOLDING COMPOUNDS OF SEMICONDUCTOR PACKAGES

Semiconductor device and wiring board

Direct edge connection for multi-chip integrated circuits

Three-dimensional integrated circuits with protection layers

Semiconductor package and method for fabricating the same

Forming semiconductor chip connections

Semiconductor package and method for manufacturing semiconductor package

SEMICONDUCTOR MODULE

DIRECT THROUGH VIA WAFER LEVEL FANOUT PACKAGE

Contact Arrangement For Establishing A Spaced, Electrically Conducting Connection Between Microstructured Components

Reflow apparatus, a reflow method, and a manufacturing method of a semiconductor device

Fixture to constrain laminate and method of assembly

Structure of electrolessly palladium and gold plated films and process for making the same, assembled structure of palladium and gold plated films bonded with copper or copper-palladium wire and assembling process therefore

Accurate alignment for stacked substrates

System and method for producing devices including a semiconductor part and a non-semiconductor part

Method of manufacturing semiconductor device

Method of room temperature covalent bonding

CONDUCTIVE CONNECTING MATERIAL, METHOD FOR CONNECTING TERMINALS AND METHOD FOR PRODUCING CONNECTION TERMINAL

Patternable adhesive composition, semiconductor package using the same, and method of manufacturing semiconductor package

PACKAGE STRUCTURE, PACKAGING SUBSTRATE AND CHIP

Method of forming vertically offset bond on trace interconnects on recessed and raised bond fingers

METHOD OF PREPARING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DIE FOR SEMICONDUCTOR PACKAGE

Semiconductor device

Semiconductor module

LEADLESS CHIP CARRIER HAVING IMPROVED MOUNTABILITY

SEMICONDUCTOR DEVICE PACKAGE WITH TWO COMPONENT LEAD FRAME

POWER SEMICONDUCTOR DEVICE PACKAGING

Semiconductor die package and method for making the same

Stacked half-bridge package with a common conductive clip

ADHESIVE FILM FOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING LED PACKAGE USING THE SAME

Multilayer printed wiring board

Multilayer pillar for reduced stress interconnect and method of making same

Increasing dielectric strength by optimizing dummy metal distribution

Dummy metal design for packaging structures

Semiconductor device having a semiconductor chip, and method for the production thereof

Device including two mounting surfaces

Routable array metal integrated circuit package fabricated using partial etching process

Chip Scale Package structure with can attachment

WAFER-TO-WAFER STACK WITH SUPPORTING PEDESTAL

Ceramic Substrate For Mounting Luminescent Element

Test contact system for testing integrated circuits with packages having an array of signal and power contacts

Optical element package and method of manufacturing the same

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor device and method of forming integrated passive device

Semiconductor device and method of forming conductive pillars in recessed region of peripheral area around the device for electrical interconnection to other devices

Achieving mechanical and thermal stability in a multi-chip package

Method for the production of an electronic component and electronic component produced according to this method

Semiconductor device having separated heatsink and chip mounting portion

Semiconductor device

Leadframe, semiconductor device, and method of manufacturing the same

Wiring device for semiconductor device, composite wiring device for semiconductor device, and resin-sealed semiconductor device

Lead frame and semiconductor package including the same

Method of manufacturing semiconductor apparatus, the semiconductor apparatus, and ignitor using the semiconductor apparatus

SEMICONDUCTOR DEVICE INCLUDING A HEAT SPREADER

Geometry of contact sites at brittle inorganic layers in electronic devices

Chip-exposed semiconductor device

Semiconductor Package with Reduced On-Resistance and Top Metal Spreading Resistance with Application to Power Transistor Packaging

Light-emitting device package and method of manufacturing the same

Solder joint reflow process for reducing packaging failure rate

Integrated circuit chip and fabrication method

Method of manufacturing semiconductor device

Dicing die bonding film, semiconductor wafer, and semiconductor device

Method of forming adaptive interconnect structure having programmable contacts

INTEGRATED CIRCUIT PACKAGE AND METHOD OF MAKING SAME

Semiconductor packages and methods of fabricating the same

METHOD OF MANUFACTURING A MULTILAYER PRINTED WIRING BOARD FOR PROVIDING AN ELECTRONIC COMPONENT THEREIN

Field barrier structures within a conformal shield

SPACER FORMATION FILM, METHOD OF MANUFACTURING SEMICONDUCTOR WAFER BONDING PRODUCT, SEMICONDUCTOR WAFER BONDING PRODUCT AND SEMICONDUCTOR DEVICE

Semiconductor device and a method of manufacturing the same

Thin wafer protection device

Semiconductor device

Multi chip package

Substrate bonding method and semiconductor device

Semiconductor device having a copper plug

Methods and designs for localized wafer thinning

Semiconductor device and production method therefor

Through hole via filling using electroless plating

PLASMA TREATMENT ON SEMICONDUCTOR WAFERS

Stackable electronic package and method of making same

Carbon nanotube structures for enhancement of thermal dissipation from semiconductor modules

Semiconductor device

LEADLESS SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURE

Stack type semiconductor package and method of fabricating the same

Anti-reflection structures for CMOS image sensors

ADHESIVE COMPOSITION

Fabrication of through-silicon vias on silicon wafers

Fabrication of through-silicon vias on silicon wafers

Semiconductor package with a metal post and manufacturing method thereof

Ultrasonic wire bonding method for a semiconductor device

Method of making a copper wire bond package

Substrate for semiconductor package and method for manufacturing the same

Method of manufacturing semiconductor device including plural semiconductor chips stacked together

Light-emitting diode package and wafer-level packaging process of light-emitting diode

Light bulb shaped lamp

BOND PACKAGE AND APPROACH THEREFOR

Die power structure

Semiconductor device and assembling method thereof

Semiconductor device package

Substrate with embedded stacked through-silicon via die

Template wafer and process for small pitch flip-chip interconnect hybridization

Dual-leadframe multi-chip package and method of manufacture

Semiconductor device and method for manufacturing the same

Method for producing an integrated circuit and resulting film chip

WIRE FEED SYSTEM AND METHOD OF OPERATING THE SAME

Method for connecting a plurality of unpackaged substrates

Chip pad resistant to antenna effect and method

Method of forming a ring-shaped metal structure

Solder paste, joining method using the same and joined structure

ADHESIVE FILM, MULTILAYER CIRCUIT BOARD, ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE

Enhanced stacked microelectronic assemblies with central contacts

Enhanced stacked microelectronic assemblies with central contacts and improved ground or power distribution

Semiconductor package and manufacturing method therefor

Microelectronic package and method of manufacturing same

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor device and method of forming the same

Integrated circuit having a three dimensional stack package structure

Light emitting semiconductor element bonded to a base by a silver coating

Method of assembling two integrated circuits and corresponding structure

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

Localized alloying for improved bond reliability

Semiconductor device and method of manufacturing semiconductor device

SEMICONDUCTOR COMPONENT, SEMICONDUCTOR WAFER COMPONENT, MANUFACTURING METHOD OF SEMICONDUCTOR COMPONENT, AND MANUFACTURING METHOD OF JOINING STRUCTURE

Bump structure and manufacturing method thereof

Method for chip scale package and package structure thereof

Self-organizing network with chip package having multiple interconnection configurations

Microelectronic flip chip packages with solder wetting pads and associated methods of manufacturing

SEMICONDUCTOR DEVICE

Enhanced stacked microelectronic assemblies with central contacts and improved ground or power distribution

Void-free wafer bonding using channels

Semiconductor apparatus

Metal paste with co-precursors

Metal paste with oxidizing agents

Apparatus for thermal melting process and method of thermal melting process

Electronic assemblies including mechanically secured protruding bonding conductor joints

Method of manufacturing semiconductor device, manufacturing program, and manufacturing apparatus

FOUR MOSFET FULL BRIDGE MODULE

MOLD RELEASE FILM AND PROCESS FOR PRODUCING LIGHT EMITTING DIODE

Semiconductor device and method of manufacturing the same

Semiconductor device for battery power voltage control

Integrated circuit packaging system with interposer

Semiconductor device with wireless communication

Method for packaging semiconductor dies having through-silicon vias

Semiconductor device package having high breakdown voltage and low parasitic inductance and method of manufacturing thereof

Electronic device and method of manufacturing electronic device

Integrated circuit chip and fabrication method

Wafer-level interconnect for high mechanical reliability applications

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

Solder bump connections

Semiconductor device including a DC-DC converter with schottky barrier diode

Compliant interconnects in wafers

Packaging substrate having through-holed interposer embedded therein and fabrication method thereof

Multi-chip module (MCM) power quad flat no-lead (PQFN) semiconductor package utilizing a leadframe for electrical interconnections

SEMICONDUCTOR DEVICES AND ELECTRICAL PARTS MANUFACTURING USING METAL COATED WIRES

Die arrangement and method of forming a die arrangement

INTEGRATED CIRCUITS AND FABRICATION PROCESS THEREOF

Integrated circuit mounting system with paddle interlock and method of manufacture thereof

Overmolded semiconductor package with wirebonds for electromagnetic shielding

Semiconductor component with a semiconductor via

Chip package and method for forming the same

Brace for long wire bond

Wiring board and electronic component device

Method of Avoiding Resin Outflow from the Wafer Scribe line in WLCSP

Integrated circuits secure from invasion and methods of manufacturing the same

Semiconductor device including a DC-DC converter

Wire bonding method and semiconductor device

Bonding structure of semiconductor package, method for fabricating the same, and stack-type semiconductor package

Multi-chip package and method of manufacturing thereof

Bumpless build-up layer and laminated core hybrid structures and methods of assembling same

Undercut-repair of barrier layer metallurgy for solder bumps and methods thereof

Electronic component

SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE USING THE CHIP

Semiconductor device and a method of manufacturing the same

System and method for integrated waveguide packaging

LOW-PROFILE MICROELECTRONIC PACKAGE, METHOD OF MANUFACTURING SAME, AND ELECTRONIC ASSEMBLY CONTAINING SAME

Semiconductor device having shield layer and chip-side power supply terminal capacitively coupled therein

MODULE IC PACKAGE STRUCTURE AND METHOD FOR MAKING THE SAME

Stacked microelectronic assemby with TSVS formed in stages and carrier above chip

WIRE BONDING METHOD

Methods for fabricating an overmolded semiconductor package with wirebonds for electromagnetic shielding

Semiconductor device and manufacturing method of a semiconductor device