Manufacturing method of a tray, a socket for inspection, and a semiconductor device

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME

Semiconductor apparatus, manufacturing method thereof, semiconductor module apparatus using semiconductor apparatus, and wire substrate for semiconductor apparatus

Semiconductor device

Flip chip with interposer, and methods of making same

Semiconductor device and manufacturing method thereof

Chip package

SEMICONDUCTOR DEVICE

Electromigration-Resistant Flip-Chip Solder Joints

UBM structure for strengthening solder bumps

Semiconductor device

Multi-chip module

Curing layers of a semiconductor product using electromagnetic fields

Plastic package and method of fabricating the same

Semiconductor device

Semiconductor device

Semiconductor device

Mounted body and method for manufacturing the same

LOW-STRESS HERMETIC DIE ATTACH

Semiconductor module including semiconductor chips coupled to external contact elements

Semiconductor light-emitting device, method for manufacturing the same, and light-emitting apparatus including the same

Electrical interconnect structure and method

Method to create a metal pattern using a damascene-like process

Solder connector structure and method

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

THERMAL BONDING PROCESS FOR CHIP PACKAGING

AI/AIN JOINT MATERIAL, BASE PLATE FOR POWER MODULE, POWER MODULE, AND MANUFACTURING METHOD OF AI/AIN JOINT MATERIAL

Chip package structure

Arrangement for Energy Conditioning

Semiconductor device and method of manufacturing same

Interconnect for chip level power distribution

Soldering Method, Solder Pellet for Die Bonding, Method for Manufacturing a Solder Pellet for Die Bonding, and Electronic Component

Top layers of metal for high performance IC's

Novel substrate design for semiconductor device

Mobile binding in an electronic connection

Integrated circuit device and method for the production thereof

Chips having rear contacts connected by through vias to front contacts

Stacked package module and board having exposed ends

Semiconductor device and method of manufacturing semiconductor device

Chip package structure

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

STACKED AND SHIELDED DIE PACKAGES WITH INTERCONNECTS

Semiconductor device including redistribution line structure and method of fabricating the same

Detector system and detector subassembly

Semiconductor light-emitting device

Heat cycle-able connection

Joining method and device produced by this method and joining unit

Variable interconnect geometry for electronic packages and fabrication methods

FABRICATION METHOD AND STRUCTURE OF PCB ASSEMBLY, AND TOOL FOR ASSEMBLY THEREOF

CIRCUIT BOARD STRUCTURE FOR EMBEDDING SEMICONDUCTOR CHIP THEREIN AND METHOD FOR FABRICATING THE SAME

Method of creating contour structures to highlight inspection region

Manufacturing method of tape carrier for TAB

Flux for soldering and soldering process

METHOD OF MAKING SEMICONDUCTOR DIE STACK HAVING HEIGHTENED CONTACT FOR WIRE BOND

Adhesive Composition, Adhesive Sheet and Production Process for Semiconductor Device

Inkjet printed wirebonds, encapsulant and shielding

Wafer-level-chip-scale package and method of fabrication

Adhesive Sheet For Both Dicing And Die Bonding And Semiconductor Device Manufacturing Method Using The Adhesive Sheet

Print mask and method of manufacturing electronic components using the same

Method of assembling chips

GANG FLIPPING FOR FLIP-CHIP PACKAGING

INTEGRATED CIRCUIT PACKAGE AND METHOD FOR THE SAME

SEMICONDUCTOR DIE STACK HAVING HEIGHTENED CONTACT FOR WIRE BOND

RECESSED SOLDER SOCKET IN A SEMICONDUCTOR SUBSTRATE

Semiconductor device package with die receiving through-hole and dual build-up layers over both side-surfaces for WLP and method of the same

Integrated circuit package system with bonding in via

Semiconductor Package and Method for Fabricating the Same

METHOD FOR FORMING CONTACT PADS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Semiconductor device, manufacturing method thereof, composite metal body and manufacturing method thereof

COMPLIANT BUMP STRUCTURE AND BONDING STRUCTURE

Method and apparatus providing integrated circuit having redistribution layer with recessed connectors

Semiconductor device

Semiconductor device and manufacturing method thereof

Packaging substrate structure with a semiconductor chip embedded therein

MULTI-CHIP SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE PACKAGE WITH DIE RECEIVING THROUGH-HOLE AND DUAL BUILD-UP LAYERS OVER BOTH SIDE-SURFACES FOR WLP AND METHOD OF THE SAME

Semiconductor device and method of manufacturing the same

Integrated circuits and interconnect structure for integrated circuits

Semiconductor device with different sized ESD protection elements

Apparatus and method for semiconductor wafer bumping via injection molded solder

Circuit board and circuit device

Heat sink mounted on a vehicle-transmission case

Method for producing electrically conductive bushings through non-conductive or semiconductive substrates

Method of wire bonding over active area of a semiconductor circuit

Method of fabricating microelectronic component assemblies employing lead frames having reduced-thickness inner lengths

Design of BEOL patterns to reduce the stresses on structures below chip bondpads

Method for manufacturing a semiconductor device

Circuit Card Assembly Including Individually Testable Layers

Antenna device and radio communication device

Contact carriers (tiles) for populating larger substrates with spring contacts

Module comprising a semiconductor chip

SOLDER-BUMPING STRUCTURES PRODUCED BY A SOLDER BUMPING METHOD

Semiconductor device, semiconductor package for use therein, and manufacturing method thereof

CHIP STACK PACKAGE AND METHOD OF MANUFACTURING THE CHIP STACK PACKAGE

Semiconductor device and its manufacturing method

Wire-bonded semiconductor component with reinforced inner connection metallization

SEMICONDUCTOR PACKAGE USING WIRES CONSISTING OF Ag OR Ag ALLOY

Stackable semiconductor device and fabrication method thereof

Wafer-level stack package and method of fabricating the same

Method of forming a silicide layer on a thinned silicon wafer, and related semiconducting structure

Power semiconductor module, method for producing a power semiconductor module, and semiconductor chip

Flip chip semiconductor device including an unconnected neutralizing electrode

Method of forming solder bump on high topography plated Cu

STRUCTURE FOR CONTROLLED COLLAPSE CHIP CONNECTION WITH DISPLACED CAPTURED PADS

Semiconductor device and manufacturing method thereof

Method of manufacturing electronic device, substrate and semiconductor device

Copper die bumps with electromigration cap and plated solder

Chip and wafer integration process using vertical connections

Semiconductor package

Methods and apparatus for flip-chip-on-lead semiconductor package

SEMICONDUCTOR PACKAGE HAVING WIRE REDISTRIBUTION LAYER AND METHOD OF FABRICATING THE SAME

Paste for forming an interconnect and interconnect formed from the paste

System for fabricating semiconductor components with conductive interconnects

Method of making an interconnect structure

Wire bonding method and related device for high-frequency applications

Method of making reliable wafer level chip scale package semiconductor devices

Method of joining chips utilizing copper pillar

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

TEMPORARY CHIP ATTACH USING INJECTION MOLDED SOLDER

Microelectronic substrate including bumping sites with nanostructures

Chip structure with bumps and testing pads

Wiring board for flip-chip mounting, mounting structure of electronic components on wiring board, and semiconductor device including wiring board

Semiconductor module with multiple semiconductor chips

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Device having a bonding structure for two elements

Method for manufacturing semiconductor device

SEMICONDUCTOR DEVICE MOUNTED ON SUBSTRATE, AND MANUFACTURING METHOD THEREOF

Semiconductor package and fabricating method thereof

MULTI-CHIPS PACKAGE AND METHOD OF FORMING THE SAME

Semiconductor module having deflecting conductive layer over a spacer structure

Base substrate for chip scale packaging

Apparatus comprising a device and method for producing it

Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components

Low cost lead-free preplated leadframe having improved adhesion and solderability

Multi-chip stack structure and fabrication method thereof

Power module having stacked flip-chip and method of fabricating the power module

Leadframe-based semiconductor package and fabrication method thereof

Semiconductor device and method of manufacturing same

Vertical electrical interconnect formed on support prior to die mount

Semiconductor device and method of manufacturing the same

Packaging methods for imager devices

BGA PACKAGE SUBSTRATE AND METHOD OF FABRICATING SAME

Wiring substrate and electronic device

Solar Cell (Sliver) Sub-Module Formation

Method of opening reservoir of containment device

Wireless communication system

Method of manufacturing device having a UV-curable adhesive

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Semiconductor module

Increased Stand-Off Height Integrated Circuit Assemblies, Systems, and Methods

Class D amplifier arrangement

Semiconductor device and method of manufacturing the same

Method of manufacturing semiconductor device that uses both a normal photomask and a phase shift mask for defining interconnect patterns

METHOD TO CREATE FLEXIBLE CONNECTIONS FOR INTEGRATED CIRCUITS

Semiconductor device manufacturing method and semiconductor device

Metallic electrode forming method and semiconductor device having metallic electrode

Mounting configuration of electronic component

Semiconductor module, method of manufacturing semiconductor module, and mobile device

System and method for increased stand-off height in stud bumping process

Semiconductor component and method of manufacture

Structure of semiconductor device package and method of the same

Substrate for mounting semiconductor element and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Space-efficient package for laterally conducting device

Conductive ball mounting apparatus and conductive ball mounting method

Method for manufacturing the BGA package board

Designs and methods for conductive bumps

Substrate based unmolded package

Thermosetting die bonding film

Method for fabricating semiconductor device and carrier applied therein

Method of forming a bump-on-lead flip chip interconnection having higher escape routing density

Electronic part mounting board and method of mounting the same

Collective mounting method of electronic components and manufacturing method of electronic component-embedded substrate

Semiconductor apparatus and mobile apparatus

Semiconductor device and a method of manufacturing the same

Method of assembling chips

High temperature, stable SiC device interconnects and packages having low thermal resistance

Semiconductor device and manufacturing method of the semiconductor device

Semiconductor device having conductive bumps, metallic layers, covering layers and fabrication method thereof

Power semiconductor module and method for producing the same

Interposer for die stacking in semiconductor packages and the method of making the same

Mounting method of electronic components, manufacturing method of electronic component-embedded substrate, and electronic component-embedded substrate

Semiconductor device and a method of manufacturing for high output MOSFET

Planar multi semiconductor chip package and method of manufacturing the same

Memory IC package assembly having stair step metal layer and apertures

Method for manufacturing leadframe, packaging method for using the leadframe and semiconductor package product

Semiconductor device

Semiconductor device

Semiconductor wafer, semiconductor device, and semiconductor device manufacturing method

Method for manufacturing circuit modules and circuit module

Bonding device

Method and device for transferring a chip to a contact substrate

Methods for fabricating semiconductor components with conductive interconnects

Interconnections for flip-chip using lead-free solders and having reaction barrier layers

REWORKABLE CHIP STACK

Systems and methods for compressing an encapsulant adjacent a semiconductor workpiece

Electronic component structure and method of making

CONNECTING MATERIAL, METHOD FOR MANUFACTURING CONNECTING MATERIAL, AND SEMICONDUCTOR DEVICE

Layer sequence and method of manufacturing a layer sequence

Method of manufacturing an electronic component and an electronic device

Plastic Conductive Particles and Manufacturing Method Thereof

Solder layer and device bonding substrate using the same and method for manufacturing such a substrate

SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THE SAME, AND POWER CONVERSION APPARATUS INCORPORATING THIS SEMICONDUCTOR DEVICE

Packaged integrated circuit

Interconnections for flip-chip using lead-free solders and having reaction barrier layers

Circuit device, a method for manufacturing a circuit device, and a semiconductor module

Semiconductor integrated circuit device and fabrication method for the same

Semiconductor device and manufacturing method thereof

Method of semiconductor device protection, package of semiconductor device

SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME

Component, power component, apparatus, method of manufacturing a component, and method of manufacturing a power semiconductor component

Stackable integrated circuit package system with multiple interconnect interface

High current semiconductor power device SOIC package

Semiconductor components with conductive interconnects

Semiconductor device equipped with thin-film circuit elements

Method of mounting an electronic component and mounting apparatus

Wiring structure, forming method of the same and printed wiring board

Method for manufacturing a circuit board structure

INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING REACTION BARRIER LAYERS

Mask and substrate alignment for solder bump process

Multilayer printed circuit board and multilayer printed circuit board manufacturing method

Integrated Circuit (IC) Chip Input/Output (I/O) Cell Design Optimization Method And IC chip With Optimized I/O Cells

Method and apparatus for manufacturing electronic integrated circuit chip

Leadframe enhancement and method of producing a multi-row semiconductor package

Method of manufacturing a semiconductor integrated circuit device

Package board and method for manufacturing thereof

Semiconductor device and method for manufacturing the same

CHIP PACKAGE

Integrated circuit including conductive bumps

Semiconductor device, connecting member, method for manufacturing a semiconductor device and method for manufacturing a connecting member

Semiconductor device with resin layers and wirings and method for manufacturing the same

Module comprising a semiconductor chip comprising a movable element

Method of manufacturing electronic component package, and wafer and substructure used for manufacturing electronic component package

Semiconductor module, portable device and method for manufacturing semiconductor module

Semiconductor device package with multi-chips and method of the same

Semiconductor package, integrated circuit cards incorporating the semiconductor package, and method of manufacturing the same

Integrated package circuit with stiffener

SEMICONDUCTOR DEVICE

Semiconductor device package with multi-chips and method of the same

Semiconductor device and semiconductor module using the same

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Encapsulated chip scale package having flip-chip on lead frame structure

SEMICONDUCTOR DEVICE FOR WHICH ELECTRICAL TEST IS PERFORMED WHILE PROBE IS IN CONTACT WITH CONDUCTIVE PAD

Method for forming solder bump and method for mounting semiconductor device using a solder powder resin composition

Bond head link assembly for a wire bonding machine

Wire cleaning guide

Printed circuit board having embedded components and method for manufacturing thereof

Method for mounting electronic components

SD Flash Memory Card Manufacturing Using Rigid-Flex PCB

Undercut-free BLM process for Pb-free and Pb-reduced C4

Method for producing a metal article intended for at least partially coating with a substance

Semiconductor device and method of manufacturing the same

Electronics module and method for manufacturing the same

Method For Establishing an Electrical and Mechanical Connection Between Chip Contact Surfaces and Antenna Contact Surfaces and Transponder

Panel, semiconductor device and method for the production thereof

SOLDER DEPOSITION ON WAFER BACKSIDE FOR THIN-DIE THERMAL INTERFACE MATERIAL

Semiconductor device comprising electromigration prevention film and manufacturing method thereof

Power Semiconductor

Bump structure and manufacturing method thereof

Integrated circuit package system with bump over via

Multi-chip module

Surface mount electronic component and process for manufacturing same

CHIP PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

Sensor device having stopper for limitting displacement

Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices

Component with buried ductile conductive bumps and method of electrical connection between said component and a component equipped with hard conductive points

Apparatus and method for semiconductor wafer bumping via injection molded solder

Low fabrication cost, fine pitch and high reliability solder bump

Apparatus and method for semiconductor wafer bumping via injection molded solder

Apparatus and method for semiconductor wafer bumping via injection molded solder

Semiconductor device and manufacturing method thereof

Method of manufacturing semiconductor device

Method of manufacturing semiconductor chip assembly with sacrificial metal-based core carrier

Electronics Package And Manufacturing Method Thereof

METAL TRACE FABRICATION FOR OPTICAL ELEMENT

Semiconductor Substrate Having Enhanced Adhesion And Method For Manufacturing The Same

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

INTEGRATED CIRCUIT SYSTEM WITH PRE-CONFIGURED BOND WIRE BALL

Multiple selectable function integrated circuit module

Stacked structure of semiconductor chips, memory card, and method of manufacturing stacked structure of semiconductor chips

SEMICONDUCTOR ELEMENT UNIT AND COMPLEX THEREOF, SEMICONDUCTOR DEVICE AND MODULE THEREOF, ASSEMBLED STRUCTURE THEREOF AND FILM SUBSTRATE CONNECTION STRUCTURE

Aluminum-based interconnection in bond pad layer

Package structure and method for chip with two arrays of bonding pads on BGA substrate for preventing gold bonding wires from collapse

Integrated circuit packaging system with interposer

Nanostructure-Based Package Interconnect

Bump structure having a reinforcement member

CHIP PACKAGE AND PROCESS THEREOF

Microelectronic packages and methods therefor

Injection molded soldering process and arrangement for three-dimensional structures

Adhesive Film and Method for Manufacturing Semiconductor Device Using Same

Semiconductor die package including leadframe with die attach pad with folded edge

Electronic device with connection bumps

Circuit board and method for manufacturing the same, semiconductor package, component built-in module and board for electronic equipment

Passivation layer for a circuit device and method of manufacture

CONDUCTOR FABRICATION FOR OPTICAL ELEMENT

System and method for separating and packaging integrated circuits

Fabrication method of a semiconductor device

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE