Method and system for on-line controlling of solder bump deposition

Die-wafer package and method of fabricating same

Semiconductor device

Offset solder bump method and apparatus

Semiconductor device

Electronic substrate manufacturing method, semiconductor device manufacturing method, and electronic equipment manufacturing method

Assembly of a semiconductor die attached to substrate with oxazoline derivative bearing an electron donor or acceptor functionality

Semiconductor chip with coil element over passivation layer

Solder alloy and a semiconductor device using the solder alloy

Chip structure with bevel pad row

Chip structure with arrangement of side pads

Semiconductor device and method of manufacturing the same

Semiconductor device and manufacturing method thereof

Wafer level pre-packaged flip chip systems

Microelectronic assemblies having compliant layers

Wafer level pre-packaged flip chip

Semiconductor device packages with substrates for redistributing semiconductor device electrodes

Low cost power semiconductor module without substrate

Semiconductor device

Micromodule, particularly for chip card

LED package structure and method making of the same

Backside method for fabricating semiconductor components with conductive interconnects

Light emitting device package and method for manufacturing the same

Method and device for producing a bondable area region on a carrier

Mask and method for electrokinetic deposition and patterning process on substrates

Method of reducing process steps in metal line protective structure formation

Ball film for integrated circuit fabrication and testing

Integrated circuit with additional mini-pads connected by an under-bump metallization and method for production thereof

Semiconductor device and fabrication method thereof

Electrical/optical integration scheme using direct copper bonding

Method for manufacturing electronic component-embedded printed circuit board

Wafer level pre-packaged flip chip

Method and system for solder die attach

Method of bonding solder pads of flip-chip package

Method of producing a universal semiconductor housing with precrosslinked plastic embedding compounds

Semiconductor device and method of fabricating the same

Wafer level pre-packaged flip chip system

Packaging structure and method

Flip chip interconnect solder mask

Handling and positioning of metallic plated balls for socket application in ball grid array packages

Composite multi-layer substrate and module using the substrate

Semiconductor component in a housing with mechanically inforcing flat conductor webs

Technique for defining a wettable solder joint area for an electronic assembly substrate

Method for making a flat-top pad

Method of manufacturing a device having a contacting structure

Solder ball pad surface finish structure of circuit board and fabrication method thereof

Fabrication method of under bump metallurgy structure

Hardenable pressure sensitive adhesive sheet for dicing/die-bonding and method for manufacturing semiconductor device

Circuit device and method of manufacturing thereof

Intermediate semiconductor device structures

Growth of carbon nanotubes to join surfaces

Au alloy bonding wire

Layer capacitor element and production process as well as electronic device

Bond pad structure comprising multiple bond pads with metal overlap

Metrology system and method for stacked wafer alignment

Bumpless semiconductor device

Device with area array pads for test probing

Terminal pad structures and methods of fabricating same

Contact structure on chip and package thereof

Method of making the semiconductor device, circuit board, and electronic instrument

Chip-scale package

Method for fabricating structure of polymer-matrix conductive film

Semiconductor device with substrate having penetrating hole having a protrusion

Wirebonded device packages for semiconductor devices having elongated electrodes

Large die package and method for the fabrication thereof

Thin embedded active IC circuit integration techniques for flexible and rigid circuits

Method of manufacturing self-supporting contacting structures

Conductive bump structure for semiconductor device and fabrication method thereof

Multi-chip module and method of manufacture

Post bump passivation for soft error protection

Flip chip method

Passive element chip and manufacturing method thereof, and highly integrated module and manufacturing method thereof

Semiconductor package with controlled solder bump wetting and fabrication method therefor

Methods for applying front side and edge protection material to electronic devices at the wafer level, devices made by the methods, and systems including the devices

Semiconductor device with semiconductor chip and rewiring layer and method for producing the same

Semiconductor device having a plurality of semiconductor chips and method for manufacturing the same

Semiconductor device

Three dimensional packaging optimized for high frequency circuitry

Package substrate with built-in capacitor and manufacturing method thereof

Methods for providing bias to a monolithic microwave integrated circuit

Bond pad structures and semiconductor devices using the same

Conductive ball mounting apparatus

Wire bonded semiconductor device having low inductance and noise

Memory packages having stair step interconnection layers

Semiconductor device production method and semiconductor device

Solder deposition on wafer backside for thin-die thermal interface material

Electronic component and electronic configuration

Conductive bump structure of circuit board and method for forming the same

Solder bumps in flip-chip technologies

Semiconductor package board using a metal base

Semiconductor device including a base member and a semiconductor constructing body directly fixed to thermosetting resin of the base member

Microelectronic component and assembly having leads with offset portions

Multilayer printed wiring board

Method of manufacturing a semiconductor apparatus

Semiconductor device and method of manufacturing the same

Semiconductor device with a rewiring level and method for producing the same

Semiconductor device having a flexible board for connection to a semiconductor chip mounted on an insulating substrate

Systems, methods, and apparatus for connecting a set of contacts on an integrated circuit to a flex circuit via a contact beam

Method for fabricating connection regions of an integrated circuit, and integrated circuit having connection regions

Structure of polymer-matrix conductive film and method for fabricating the same

Microelectronic package interconnect and method of fabrication thereof

Semiconductor device assemblies with compliant spring contact structures

Methods and apparatus for interconnecting a ball grid array to a printed circuit board

Multilayer printed wiring board

Fabrication of compliant spring contact structures and use thereof

Method of making a circuitized substrate

Gap control between interposer and substrate in electronic assemblies

Semiconductor device and method of manufacturing the same

Method of manufacturing a semiconductor device

Chip-scale package

Carrying structure of electronic components

Semiconductor device having a leading wiring layer

Semiconductor integrated circuit package having electrically disconnected solder balls for mounting

Semiconductor integrated circuit package having electrically disconnected solder balls for mounting

Semiconductor device including an under electrode and a bump electrode

Semiconductor device and method for producing the same

Semiconductor package

Apparatus for conducting heat in a flip-chip assembly

Thermal interconnect systems methods of production and uses thereof

Microelectronic assemblies having compliant layers

System having semiconductor component with multiple stacked dice

Standoffs for centralizing internals in packaging process

Semiconductor device and electronic device

Semiconductor device with electrically isolated ground structures

Device packages having a III-nitride based power semiconductor device

Semiconductor substrate

Semiconductor device having surface mountable external contact areas and method for producing the same

Substrate for mounting electronic part and electronic part

Multilayer printed wiring board

Increased stand-off height integrated circuit assemblies, systems, and methods

Method of forming low stress multi-layer metallurgical structures and high reliable lead free solder termination electrodes

Semiconductor chip having a soldering layer sequence, and process for soldering a semiconductor chip

System for providing a redistribution metal layer in an integrated circuit

Semiconductor device with self-aligning contactless interface

Electric circuit module with improved heat dissipation characteristics using a fixing tool for fixing an electric apparatus to a heat sink

Bonding pad for a packaged integrated circuit

Electronic devices including offset conductive bumps

Semiconductor package accomplishing fan-out structure through wire bonding

Integrated circuit system for bonding

Semiconductor device

Thin multiple semiconductor die package

Semiconductor device having resin-sealed area on circuit board thereof

Semiconductor light-emitting device and its manufacturing method

Semiconductor light-emitting device, method for manufacturing the same, and light-emitting apparatus including the same

Ultrasonic tool and ultrasonic bonder

Conductive ball mounting apparatus

Method for fabricating a flip chip package

Method for fabricating semiconductor components with through wire interconnects

Semiconductor chip capable of implementing wire bonding over active circuits

Semiconductor device

Semiconductor package substrate having contact pad protective layer formed thereon

Semiconductor device and fabrication method thereof

Method of fabricating a substrate with a concave surface

Multilayer circuit board and method of manufacturing the same

Reinforced bond pad for a semiconductor device

Structure and assembly method of integrated circuit package

Semiconductor device

Semiconductor device, method for manufacturing the semiconductor device and semiconductor substrate

Area mount type semiconductor device, and die bonding resin composition and encapsulating resin composition used for the same

Method of manufacturing stack-type semiconductor device and method of manufacturing stack-type electronic component

Power semiconductor device and method therefor

Strobe light control circuit and IGBT device

Method of assembling soldered packages utilizing selective solder deposition by self-assembly of nano-sized solder particles

Method of fabricating semiconductor chip assemblies

Manufacturing managing method of semiconductor devices and a semiconductor substrate

Copper interconnect post for connecting a semiconductor chip to a substrate and method of fabricating the same

Semiconductor device and method of manufacturing the same

Fabricating process of an electrically conductive structure on a circuit board

Semiconductor wafer coat layers and methods therefor

Leadless semiconductor package and manufacturing method thereof

Packing method for electronic components

SEMICONDUCTOR PACKAGE SUBSTRATE HAVING CONTACT PAD PROTECTIVE LAYER FORMED THEREON AND METHOD FOR FABRICATING THE SAME

Semiconductor device and an image sensing device

Semiconductor device to be applied to various types of semiconductor package

Stacked die package

Chip package with dam bar restricting flow of underfill

Method for mounting semiconductor chips on a substrate and corresponding assembly

Semiconductor device

Flip chip package and the fabrication thereof

Reducing cracking of high-lead or lead-free bumps by matching sizes of contact pads and bump pads

ELECTRONIC DEVICE PACKAGE

Semiconductor device and method of manufacturing thereof

Semiconductor device and a manufacturing method of the same

Electronic device and method for fabricating the same

Semiconductor device and manufacturing method thereof

Method for manufacturing semiconductor apparatus, and semiconductor apparatus and electric appliance

Vertically integrated system-in-a-package

Semiconductor integrated circuit (IC) packaging with carbon nanotubes (CNT) to reduce IC/package stress

Lead frame for a magnetic sensor

Package structure having mixed circuit and composite substrate

Semiconductor device and method of manufacturing the same

Wafer level package including a device wafer integrated with a passive component

Laser bonding tool with improved bonding accuracy

CURRENT SENSOR

Method for manufacturing an electronic module

Package structure and fabrication thereof

Stacked die-in-die BGA package with die having a recess

Method of manufacturing semiconductor device

Flip chip interconnection having narrow interconnection sites on the substrate

Schottky diode device with aluminum pickup of backside cathode

Methods for the electronic, homogeneous assembly and fabrication of devices

Method for fabricating flip-attached and underfilled semiconductor devices

Aluminum cap with electroless nickel/immersion gold

Flip-chip semiconductor package and method for fabricating the same

Semiconductor chip and method manufacturing the same

Manufacturing method for semiconductor device, semiconductor device, and electronic apparatus

Wiring board, electronic circuit board, electronic apparatus and manufacturing method of electronic circuit board

Semiconductor device and semiconductor-device manufacturing method

Semiconductor device having a functional surface

Wafer level chip scale package having a gap and method for manufacturing the same

C4 joint reliability

Semiconductor device

Semiconductor device having a frame portion and an opening portion with mountable semiconductor chips therein

Shield and semiconductor die assembly

Semiconductor device and manufacturing method thereof

LED package structure and method for making the same

Semiconductor device with two or more bond pad connections for each input/output cell and method of manufacture thereof

Method for producing a wire connection

Use of electrical power multiplication for power smoothing in power distribution

Method and apparatus for improving thermal energy dissipation in a direct-chip-attach coupling configuration of an integrated circuit and a circuit board

Method of forming an interconnection element

Lapping of gold pads in a liquid medium for work hardening the surface of the pads

Flip-chip adaptor package for bare die

System and method to increase die stand-off height

Underfill on substrate process and ultra-fine pitch, low standoff chip-to-package interconnections produced thereby

METHODS AND SYSTEMS FOR IMPROVING MICROELECTRONIC I/O CURRENT CAPABILITIES

Method of making a flexible substrate containing self-assembling microstructures

Electronic function part mounted body and method of manufacturing the electronic function part mounted body

Microelectronic component assemblies with recessed wire bonds and methods of making same

Integrated device and electronic system

Wiring board and method of manufacturing the same

Semiconductor device and manufacturing method for the same

Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device

Forming solder balls on substrates

Method to accommodate increase in volume expansion during solder reflow

Wiring board manufacturing method

Forming a barrier layer in interconnect joints and structures formed thereby

Low capacitance solder bump interface structure

Radio frequency identification (RFID) tag lamination process using liner

Radio frequency identification (RFID) tag lamination process

Semiconductor package fabrication

Electronic package with integrated capacitor

Apparatus and method for predetermined component placement to a target platform

Magnetron sputtered metallization of a nickel silicon alloy, especially useful as solder bump barrier

Semiconductor device with via hole for electric connection

Printed wiring board and method for manufacturing the same

Tape ball grid array package with electromagnetic interference protection and method for fabricating the package

METHOD OF FORMING REDISTRIBUTION BUMP AND SEMICONDUCTOR CHIP AND MOUNT STRUCTURE FABRICATED USING THE SAME

Conductive bump structure of circuit board and method for fabricating the same

Semiconductor device, semiconductor body and method of manufacturing thereof

Semiconductor package and method for manufacturing the same

FINE PAD PITCH ORGANIC CIRCUIT BOARD WITH PLATING SOLDER AND METHOD FOR FABRICATING THE SAME

System and method for increasing yield from semiconductor wafer electroplating

Methods of refining lead-containing materials

Semiconductor package having an optical device and a method of making the same

Solder bump and related intermediate structure having primary and secondary portions and method of manufacturing same

Hybrid module and production method for same, and hybrid circuit device

Nano memory, light, energy, antenna and strand-based systems and methods

FLEXIBLE TYPE UNIT, FLEXIBLE TYPE REEL, AND METHOD OF MANUFACTURING FLEXIBLE TYPE REEL

Composition of aromatic or cycloaliphatic amine-derived polyepoxide and polyamine

Semiconductor device including a semiconductor chip with signal contact areas and supply contact areas, and method for producing the semiconductor device

Die attach material for TBGA or flexible circuitry

Planar microspring integrated circuit chip interconnection to next level

Semiconductor device

System for different bond pads in an integrated circuit package

Arrangement of an electrical component placed on a substrate, and method for producing the same

Semiconductor device having a plastic housing and external connections and method for producing the same

Magnetic self-assembly for integrated circuit packages

Stack semiconductor package formed by multiple molding and method of manufacturing the same

Stacked integrated circuits package system with dense routability and high thermal conductivity

Die structure of package and method of manufacturing the same

MOSFET package

Semiconductor package with passive device integration

MOSFET package

Integrated circuit package with lead fingers extending into a slot of a die paddle

Apparatus for use in semiconductor wafer processing for laterally displacing individual semiconductor devices away from one another

Semiconductor device and method for producing same

Semiconductor device, magnetic sensor, and magnetic sensor unit

Low stress conductive adhesive

Anisotropic conductive adhesive, electrode connection structure and method using the adhesive

Microfeature devices and methods for manufacturing microfeature devices

Application of impressed-current cathodic protection to prevent metal corrosion and oxidation

Microelectronic assemblies having compliancy

Underfill encapsulant for wafer packaging and method for its application

Circuit device and manufacturing method thereof

Inductor formed in an integrated circuit

Semiconductor device, manufacturing method and mounting method of the semiconductor device, circuit board, and electronic apparatus

Manufacturing method for electronic device

Semiconductor device with a recessed bond pad

Semiconductor flip chip package having substantially non-collapsible spacer

Chip scale package having flip chip interconnect on die paddle

Si power device mounted on a substrate including arrangements to prevent damage to connection layers due to heat treatment

Connection technology for power semiconductors comprising a layer of electrically insulating material that follows the surface contours

Integrated connection arrangements

Semiconductor device, electrode member and electrode member fabrication method

Systems and methods for power smoothing in power distribution

Semiconductor device package, method of manufacturing the same, and semiconductor device

Microfeature devices and methods for manufacturing microfeature devices

Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment

Dual metal stud bumping for flip chip applications