Method and system for forming conductive bumping with copper interconnection

Thermal compressive bond head

Vertical semiconductor device with thinned substrate

Integrated circuit tampering protection and reverse engineering prevention coatings and methods

Wafer level stack die package

Airgap micro-spring interconnect with bonded underfill seal

Semiconductor multi-project or multi-product wafer process

Light source, device including light source, and/or methods of making the same

Printed Circuit Board For Board-On-Chip Package, Board-On-Chip Package Including The Same, And Method Of Fabricating The Board-On-Chip Package

Printed circuit board having electronic components embedded therein

Semiconductor device comprising thin-film terminal with deformed portion

Manufacturing of a device including a semiconductor chip

Package systems having a eutectic bonding material and manufacturing methods thereof

Package systems having an opening in a substrate thereof and manufacturing methods thereof

Semiconductor having chip stack, semiconductor system, and method of fabricating the semiconductor apparatus

Method for manufacturing semiconductor device, and semiconductor device

CHIP STACKED STRUCTURE

Semiconductor package and method of fabricating the same

Integrated circuit packaging system with interposer interconnections and method of manufacture thereof

MILLIMETER DEVICES ON AN INTEGRATED CIRCUIT

Multi-component electronic system having leadframe with support-free with cantilever leads

IC PACKAGE

Semiconductor device including shielding layer and fabrication method thereof

Chip level EMI shielding structure and manufacture method thereof

Methods of forming integrated circuits

Massively parallel interconnect fabric for complex semiconductor devices

Vertical semiconductor device with thinned substrate

Insulating glass (IG) or vacuum insulating glass (VIG) unit including light source, and/or methods of making the same

Light source with light scattering features, device including light source with light scattering features, and/or methods of making the same

Wiring board and method for manufacturing the same

Integrated circuit combination of a target integrated circuit and a plurality of photovoltaic cells connected thereto using the top conductive layer

Cost-effective TSV formation

Dimensionally decoupled ball limiting metalurgy

Creation of lead-free solder joint with intermetallics

Manufacturing method of semiconductor device

Flexible packaging for chip-on-chip and package-on-package technologies

THERMAL WARP COMPENSATION IC PACKAGE

Electronic assemblies and methods of forming electronic assemblies

Voltage conversion module

Chip Capacitor Precursors

Resin composition for encapsulating semiconductor and semiconductor device

SEMICONDUCTOR CHIP AND MOUNTING STRUCTURE OF THE SAME (as amended)

Semiconductor device having multilayer wiring structure and manufacturing method of the same

Electronic Package and Method of Making an Electronic Package

Delamination resistant device package having raised bond surface and mold locking aperture

Sheet-molded chip-scale package

Method for producing display device

Assembly method for converting the precursors to capacitors

Semiconductor device manufacturing method using laser irradiation and dicing saw and semiconductor device thereof

Multilayered printed circuit board and method for manufacturing the same

Brace for wire bond

Semiconductor package having buried post in encapsulant and method of manufacturing the same

Integrated circuit packaging system with a shield and method of manufacture thereof

Embedded printed circuit board and method of manufacturing the same

Circuit device and method of manufacturing the same

MULTI-CHIP PACKAGE

Portable storage device and its operating method

Tool management method of die bonder and die bonder

Flexible underfill compositions for enhanced reliability

Wafer-level packaging method using composite material as a base

Corner structure for IC die

Integrated circuit packaging system with warpage control and method of manufacture thereof

Semiconductor device and method of bonding different size semiconductor die at the wafer level

Semiconductor device and method of forming TSV interposer with semiconductor die and build-up interconnect structure on opposing surfaces of the interposer

Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same

Semiconductor chip with reinforcing through-silicon-vias

Semiconductor structure and method for making same

Semiconductor structure having metal oxide or nirtride passivation layer on fill layer and method for making same

Semiconductor structure and method for making same

Semiconductor device and method of forming vertical interconnect structure between non-linear portions of conductive layers

Package for semiconductor device including guide rings and manufacturing method of the same

SEMICONDUCTOR DEVICE PROVIDED WITH REAR PROTECTIVE FILM ON OTHER SIDE OF SEMICONDUCTOR SUBSTRATE AND MANUFACTURING METHOD OF THE SAME

Semiconductor device and manufacturing method of the same

BACKMETAL REPLACEMENT FOR USE IN THE PACKAGING OF INTEGRATED CIRCUITS

Integrated circuit packaging system with warpage control and method of manufacture thereof

Method and system for improving reliability of a semiconductor device

Circuit device having an improved heat dissipitation, and the method of manufacturing the same

Lead frame, semiconductor device, and method of manufacturing semiconductor device

SEMICONDUCTOR DEVICE WITH EXPOSED PAD

Integrated circuit packaging system with interlock and method of manufacture thereof

Integrated circuit packaging system with lead encapsulation and method of manufacture thereof

Multi-chip semiconductor packages and assembly thereof

Semiconductor device and manufacturing method therefor

Semiconductor device and a method of manufacturing the same

Semiconductor chip package

Device and methods for electrostatic discharge protection

Semiconductor device and method of forming protective structure around semiconductor die for localized planarization of insulating layer

SEMICONDUCTOR PACKAGE WITH THROUGH ELECTRODES AND METHOD FOR MANUFACTURING THE SAME

Packaging structure

POLYMER CORE WIRE

Embedded printed circuit board and method of manufacturing the same

Methods and apparatus for measuring analytes using large scale FET arrays

Module with silicon-based layer

Integrated circuit with intra-chip clock interface and methods for use therewith

Chip to dielectric waveguide interface for sub-millimeter wave communications link

Device and method for manufacturing a device

Integrated circuit packaging system with die paddles and method of manufacture thereof

Stacked semiconductor device assembly

Semiconductor device and method for manufacturing the same

Semiconductor device and method of forming dam material with openings around semiconductor die for mold underfill using dispenser and vacuum assist

Stacked chip assembly having vertical vias

Chip assembly having via interconnects joined by plating

SEMICONDUCTOR PACKAGES, ELECTRONIC DEVICES AND ELECTRONIC SYSTEMS EMPLOYING THE SAME

LAYER STACKS AND INTEGRATED CIRCUIT ARRANGEMENTS

Method for depackaging prepackaged integrated circuit die and a product from the method

VLSI Package for High Performance Integrated Circuit

Semiconductor device and method of forming composite bump-on-lead interconnection

Method for fabricating a neo-layer using stud bumped bare die

Wire bond through-via structure and method

Integrated circuit packaging system with post and method of manufacture thereof

Microsprings partially embedded in a laminate structure and methods for producing same

Staged via formation from both sides of chip

Integrated circuit packaging system with active surface heat removal and method of manufacture thereof

Multi-function and shielded 3D interconnects

Anti-tamper microchip package based on thermal nanofluids or fluids

Semiconductor device with parasitic bipolar transistor

Integrated power converter package with die stacking

Integrated circuit packaging system with stack interconnect and method of manufacture thereof

Integrated circuit packaging system with paddle molding and method of manufacture thereof

Transition from a chip to a waveguide port

SEMICONDUCTOR PACKAGE INCLUDING DECOUPLING SEMICONDUCTOR CAPACITOR

Vertical discrete devices with trench contacts and associated methods of manufacturing

Systems and methods for integrating radio-frequency identification circuitry into flexible circuits

ELECTRICAL CONTACT STRUCTURES SUITABLE FOR USE ON WAFER TRANSLATORS AND METHODS OF MAKING SAME

METHOD AND APPARATUS FOR LOADING SOLDER BALLS

Interposer with microspring contacts

Printed wiring board

Soldering entities to a monolithic metallic sheet

Method of making a high frequency device package

Connector assembly and method of manufacture

Method for reducing UBM undercut in metal bump structures

Method for packaging circuits

Apparatus for restricting moisture ingress

Method of manufacture of integrated circuit packaging system with stacked integrated circuit

SEMICONDUCTOR DIE PACKAGE INCLUDING MULTIPLE DIES AND A COMMON NODE STRUCTURE

MANUFACTURING METHOD OF SUBSTRATE FOR A SEMICONDUCTOR PACKAGE, MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE, SUBSTRATE FOR A SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE

Complex semiconductor device for use in mobile equipment

Module board

Semiconductor component and method of manufacture

Semiconductor package with integrated substrate thermal slug

Electronic module with laterally-conducting heat distributor layer

COOLING MECHANISM FOR STACKED DIE PACKAGE AND METHOD OF MANUFACTURING THE SAME

Semiconductor package integrated with conformal shield and antenna

Semiconductor device

Power amplifier circuit

Resin composition for encapsulating semiconductor and semiconductor device

Method for constructing an electrical circuit, and electrical circuit

Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor die

Apparatus and methods for high-density chip connectivity

Integrated circuit packaging system with film encapsulation and method of manufacture thereof

Integrated circuit packaging system with package-on-package and method of manufacture thereof

Semiconductor chip device with underfill

Semiconductor chip device with polymeric filler trench

Simulated wirebond semiconductor package

Semiconductor device and method of manufacturing the same

Semiconductor component and device provided with heat dissipation means

Compliant printed circuit area array semiconductor device package

Methods for filling a contact hole in a chip package arrangement and chip package arrangements

Die structure, die arrangement and method of processing a die

Embedded ball grid array substrate and manufacturing method thereof

Collar structure around solder balls that connect semiconductor die to semiconductor chip package substrate

BACK SIDE PROTECTIVE STRUCTURE FOR A SEMICONDUCTOR PACKAGE

Semiconductor device and method of forming bond-on-lead interconnection for mounting semiconductor die in FO-WLCSP

Semiconductor device having pad structure with stress buffer layer

Semiconductor device and method of forming base substrate with cavities formed through etch-resistant conductive layer for bump locking

Semiconductor chip with redundant thru-silicon-vias

Semiconductor module and method for production thereof

Semiconductor device having a pin mounted heat sink

Semiconductor device and method of forming leadframe interposer over semiconductor die and TSV substrate for vertical electrical interconnect

Power semiconductor chip package

Apparatus and method configured to lower thermal stresses

Semiconductor packages having increased input/output capacity and related methods

Systems and methods for enabling ESD protection on 3-D stacked devices

Programmable anti-fuse wire bond pads

Liquid electrical interconnect and devices using same

Power semiconductor package

METHOD AND SYSTEM FOR PROVIDING A RELIABLE LIGHT EMITTING DIODE SEMICONDUCTOR DEVICE

High-frequency circuit package and high-frequency circuit device

Fabrication method of semiconductor integrated circuit device

Discrete bootstrapping in an optical receiver to prevent signal feedback

RFIC chip mounting structure

Multi-chip package with offset die stacking

Semiconductor device and method of forming pre-molded substrate to reduce warpage during die mounting

Compliant printed circuit wafer level semiconductor package

Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect

Die edge contacts for semiconductor devices

Semiconductor device with pads of enhanced moisture blocking ability

Semiconductor device and method of forming WLP with semiconductor die embedded within penetrable encapsulant between TSV interposers

Semiconductor device and manufacturing method of semiconductor device

Semiconductor device and method of forming different height conductive pillars to electrically interconnect stacked laterally offset semiconductor die

Alignment marks in substrate having through-substrate via (TSV)

Semiconductor device and method of forming base leads from base substrate as standoff for stacking semiconductor die

Semiconductor device and method of forming TSV semiconductor wafer with embedded semiconductor die

Lead frame for semiconductor device

Package structure having MEMS element and fabrication method thereof

Contacting means and method for contacting electrical components

Methods and Apparatus for Measuring Analytes Using Large Scale FET Arrays

Methods and Apparatus for Measuring Analytes Using Large Scale FET Arrays

Use of Aliphatic Hydrocarbons and Paraffins as Solvents for Silver Sinter Pastes

SYSTEM FOR CLAMPING HEAT SINK

Wide input/output memory with low density, low latency and high density, high latency blocks

Method for Forming Lead-Free Solder Balls with a Stable Oxide Layer Based on a Plasma Process

Leadless array plastic package with various IC packaging configurations

Process for assembling two parts of a circuit

Method of manufacturing semiconductor device

Method for detecting the under-fill void in flip chip BGA

FILM FOR USE IN MANUFACTURING SEMICONDUCTOR DEVICES, METHOD FOR PRODUCING THE FILM AND SEMICONDUCTOR DEVICE

Assessing thermal mechanical characteristics of complex semiconductor devices by integrated heating systems

Semiconductor package with thermal heat spreader

System for and method of providing high resolution images using monolithic arrays of light emitting diodes

Semiconductor device and method of forming adhesive material over semiconductor die and carrier to reduce die shifting during encapsulation

Bumpless build-up layer package with pre-stacked microelectronic devices

Semiconductor device and method for manufacturing the same

Substrate dicing technique for separating semiconductor dies with reduced area consumption

Method and system for routing electrical connections of semiconductor chips

Integrated circuit including interconnect levels

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Structures embedded within core material and methods of manufacturing thereof

Semiconductor device and method for manufacturing thereof

SEMICONDUCTOR INTEGRATED CIRCUIT

BALL GRID ARRAY PACKAGE

Bump structure with underbump metallization structure and integrated redistribution layer

Low-cost 3D face-to-face out assembly

Stress reduction in chip packaging by using a low-temperature chip-package connection regime

Helical springs electrical connecting a plurality of packages

Semiconductor structure having conductive vias and method for manufacturing the same

Pillar bumps and process for making same

Semiconductor device and method of forming FO-WLCSP with discrete semiconductor components mounted under and over semiconductor die

Conductive connection structure with stress reduction arrangement for a semiconductor device, and related fabrication method

Semiconductor die terminal

Semiconductor package structure and manufacturing process thereof

Semiconductor device

Semiconductor Device and Method of Forming Leadframe as Vertical Interconnect Structure Between Stacked Semiconductor Die

Semiconductor device, method for manufacturing same, and semiconductor apparatus

Cylindrical embedded capacitors

ELECTRONIC ASSEMBLY

APPARATUS FOR FORMING ASYMMETRICAL ENCAPSULANT BEADS ON WIRE BONDS

SQUEEGEE MODULE

Multilevel interconnection system

Method of manufacturing semiconductor package

Method of manufacturing leadless integrated circuit packages having electrically routed contacts

METHODS AND APPARATUS FOR MEASURING ANALYTES USING LARGE SCALE FET ARRAYS

Isolated epitaxial modulation device

Method of making a compliant printed circuit peripheral lead semiconductor package

Terminal structure, printed wiring board, module substrate, and electronic device

Compact folded configuration for integrated circuit packaging

MULTILAYERED POLYIMIDE FILM

Semiconductor device and method of forming vertically offset conductive pillars over first substrate aligned to vertically offset BOT interconnect sites formed over second substrate

Semiconductor module system having stacked components with encapsulated through wire interconnects (TWI)

Compliant printed circuit semiconductor package

Power and ground routing of integrated circuit devices with improved IR drop and chip performance

Foil-based method for packaging intergrated circuits

Semiconductor device, manufacturing method thereof, and manufacturing method of semiconductor module

WAFER-LEVEL PACKAGE USING STUD BUMP COATED WITH SOLDER

Mechanisms for forming copper pillar bumps using patterned anodes

Leadframe, leadframe type package and lead lane

Method of packaging an integrated circuit using a laser to remove material from a portion of a lead frame

Image sensor package with dual substrates and the method of the same

Methods and apparatus for measuring analytes using large scale FET arrays

Process for making conductive post with footing profile

Bundle of long thin carbon structures, manufacturing method therefor, and electronic device

Method of fabricating a semiconductor device package including a heat radiation plate

Component arrangement and method for production thereof

DEVICE MOUNTING STRUCTURE AND DEVICE MOUNTING METHOD

Wireless communication device and semiconductor package device having a power amplifier therefor

High-frequency switch

Method for Producing an Electrical Circuit and Electrical Circuit

Semiconductor device and method of forming wafer-level multi-row etched leadframe with base leads and embedded semiconductor die

Repairable semiconductor device and method

Method of manufacturing and assembling semiconductor chips with offset pads

Stacking method and stacking carrier

Stitch bump stacking design for overall package size reduction for multiple stack

Thermal enhancement for multi-layer semiconductor stacks

Impedance controlled electrical interconnection employing meta-materials

Semiconductor device and method of forming Fo-WLCSP having conductive layers and conductive vias separated by polymer layers

Semiconductor device and method of forming B-stage conductive polymer over contact pads of semiconductor die in Fo-WLCSP

Semi-conductor chip with compressible contact structure and electronic package utilizing same

Stacked Semiconductor Device And Method Of Fabricating The Same

MANUFACTURING FAN-OUT WAFER LEVEL PACKAGING

Integrated circuit packaging system with stacked lead and method of manufacture thereof

Semiconductor device and method of forming vertical interconnect in FO-WLCSP using leadframe disposed between semiconductor die

Multiple seal ring structure

Integrated inductor

Seal ring structure with metal pad

Monolithic microwave integrated circuit

Methods and apparatus for measuring analytes using large scale FET arrays

SEMICONDUCTOR DEVICE WITH LESS POWER SUPPLY NOISE

Overmolded electronic module with an integrated electromagnetic shield using SMT shield wall components

Through hole vias at saw streets including protrusions or recesses for interconnection

Bond pad for low K dielectric materials and method for manufacture for semiconductor devices

Method of manufacturing semiconductor device

SEMICONDUCTOR DEVICE

Process for chip capacitive coupling

Methods and apparatus for measuring analytes using large scale FET arrays

Multiple bonding layers for thin-wafer handling

Semiconductor device and power supply unit utilizing the same

High temperature operating package and circuit design

Active pin connection monitoring system and method

WIREBONDING METHOD AND DEVICE ENABLING HIGH-SPEED REVERSE WEDGE BONDING OF WIRE BONDS