Electronic device and method of manufacturing electronic device

Semiconductor device and method of manufacture thereof

Integrated circuit packaging system with vertical interconnection and method of manufacture thereof

Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor device

Integrated circuit chip and fabrication method

Wafer-level interconnect for high mechanical reliability applications

Semiconductor package device with cavity structure and the packaging method thereof

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

BONDING PAD STRUCTURE AND INTEGRATED CIRCUIT COMPRISING A PLURALITY OF BONDING PAD STRUCTURES

High performance low profile QFN/LGA

Solder bump connections

Semiconductor device including a DC-DC converter with schottky barrier diode

PIN ATTACHMENT

Multi-chip module (MCM) power quad flat no-lead (PQFN) semiconductor package utilizing a leadframe for electrical interconnections

SEMICONDUCTOR DEVICES AND ELECTRICAL PARTS MANUFACTURING USING METAL COATED WIRES

Integrated circuit packaging system with multiple row leads and method of manufacture thereof

Top exposed package and assembly method

Die arrangement and method of forming a die arrangement

Pre-bonded substrate for integrated circuit package and method of making the same

Substrate for integrated circuit package with selective exposure of bonding compound and method of making thereof

INTEGRATED CIRCUITS AND FABRICATION PROCESS THEREOF

Integrated circuit mounting system with paddle interlock and method of manufacture thereof

Semiconductor device and method of forming an inductor within interconnect layer vertically separated from semiconductor die

Semiconductor device and method of forming recesses in substrate for same size or different sized die with vertical integration

Image sensor unit and image sensor apparatus

MAGNETIC FIELD CURRENT SENSORS

Magnetic field current sensors

Chip package and method for forming the same

Method for producing a semiconductor component with insulated semiconductor mesas

Chip package and method for forming the same

Brace for long wire bond

Aluminum enhanced palladium CMP process

Method of Avoiding Resin Outflow from the Wafer Scribe line in WLCSP

WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

Integrated circuits secure from invasion and methods of manufacturing the same

Semiconductor device including a DC-DC converter

Stacked microelectronic assembly with TSVs formed in stages with plural active chips

Offset solder vias, methods of manufacturing and design structures

Integrated circuit packaging system with pad connection and method of manufacture thereof

Semiconductor device and method of forming openings through encapsulant to reduce warpage and stress on semiconductor package

Bumpless build-up layer and laminated core hybrid structures and methods of assembling same

Integrated Circuit Device

Undercut-repair of barrier layer metallurgy for solder bumps and methods thereof

Semiconductor device and a method of manufacturing the same

Integrated circuit packaging system with pad connection and method of manufacture thereof

Semiconductor device with stacked power converter

System and method for integrated waveguide packaging

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device having shield layer and chip-side power supply terminal capacitively coupled therein

Stacked package structure including insulating layer between two stacked packages

MODULE IC PACKAGE STRUCTURE AND METHOD FOR MAKING THE SAME

Stacked microelectronic assemby with TSVS formed in stages and carrier above chip

Multi-chip package

Pressure sensor and method of assembling same

Techniques for forming solder bump interconnects

Methods and Apparatus for Measuring Analytes Using Large Scale FET Arrays

Stacked microelectronic dies and methods for stacking microelectronic dies

Semiconductor device and manufacturing method of a semiconductor device

Soft error rate mitigation by interconnect structure

Radiofrequency amplifier

Transistor power switch device and method of measuring its characteristics

Mechanisms for resistivity measurement of bump structures

Semiconductor device having semiconductor substrate electrode pads, and external electrodes

Edge connect wafer level stacking

Semiconductor chip and semiconductor device

Detector array with a through-via interposer

Solder joint flip chip interconnection

Integrated circuit package system with stacked die

Clip interconnect with encapsulation material locking feature

Integrated circuit packaging system with connection supports and method of manufacture thereof

Integrated circuit packaging system with multi-row leads and method of manufacture thereof

Through silicon via for use in integrated circuit chips

Micro-fluidic injection molded solder (IMS)

Printed wiring board and method for manufacturing the same

ADHESIVE COMPOSITION, ADHESIVE SHEET, CIRCUIT BOARD AND SEMICONDUCTOR DEVICE BOTH PRODUCED USING THESE, AND PROCESSES FOR PRODUCING THESE

Methods and Apparatus for Measuring Analytes Using Large Scale FET Arrays

Methods and apparatus for measuring analytes using large scale FET arrays

Methods and Apparatus for Measuring Analytes Using Large Scale FET Arrays

STRUCTURES AND METHODS FOR IMPROVING SOLDER BUMP CONNECTIONS IN SEMICONDUCTOR DEVICES

Semiconductor packages and methods of manufacturing the same

Method of constructing a semiconductor device and structure

Method of making thermally enhanced semiconductor assembly with bump/base/flange heat spreader and build-up circuitry

Method and apparatus for sharing internal power supplies in integrated circuit devices

Semiconductor device and electronic device

Integrated circuit package strip with stiffener

Stacked packaged integrated circuit devices

ELECTRONIC DEVICE, RESONATOR, OSCILLATOR AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING ELONGATED FASTENERS

Multi-chip module

Directly injected forced convection cooling for electronics

CYLINDRICAL PACKAGES, ELECTRONIC APPARATUS INCLUDING THE SAME, AND METHODS OF FABRICATING THE SAME

Semiconductor device

Semiconductor Device with Cross-shaped Bumps and Test Pads Alignment

Semiconductor device and method of forming base substrate with recesses for capturing bumped semiconductor die

Integrated circuit packaging system with stack interconnect and method of manufacture thereof

Memory device, laminated semiconductor substrate and method of manufacturing the same

Substrate Arrangement and a Method of Manufacturing a Substrate Arrangement

Integrated circuit device having die bonded to the polymer side of a polymer substrate

Method of forming partially-etched conductive layer recessed within substrate for bonding to semiconductor die

Integrated circuit manufacturing method and integrated circuit

Wafer level chip package and a method of fabricating thereof

Solder interconnect pads with current spreading layers

STACKABLE SEMICONDUCTOR ASSEMBLY WITH BUMP/BASE/FLANGE HEAT SPREADER AND ELECTROMAGNETIC SHIELDING

THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH BUMP/BASE/FLANGE HEAT SPREADER AND BUILD-UP CIRCUITRY

Integrated circuit package and physical layer interface arrangement

DIE DOWN DEVICE WITH THERMAL CONNECTOR

Semiconductor device and method of forming uniform height insulating layer over interposer frame as standoff for semiconductor die

Integrated circuit device having through via and method for preparing the same

Stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitry

ENHANCED HEAT SPREADER FOR USE IN AN ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

PACKAGE STRUCTURE

Thin film resistors and methods of manufacture

Semiconductor device and method of forming passive devices

BATCH FABRICATED 3D INTERCONNECT

ULTRA THIN DIE TO IMPROVE SERIES RESISTANCE OF A FET

Light emitting diode package and method for manufacturing the same

Interconnection structures and methods for transfer-printed integrated circuit elements with improved interconnection alignment tolerance

Thermal gradient reflow for forming columnar grain structures for solder bumps

Insulating Resin Film, Bonded Structure Using Insulating Resin Film, and Production Method of Bonded Structure

Wiring structure for improving crown-like defect and fabrication method thereof

Solder mold plates used in packaging process and method of manufacturing solder mold plates

Connecting and bonding adjacent layers with nanostructures

Automatic guided flash disk and its operation method

System for clamping heat sink

3D optoelectronic packaging

3D optoelectronic packaging

SEMICONDUCTOR DEVICE

Integrated antenna package

Heater design for heat-trimmed thin film resistors

Input/output core design and method of manufacture therefor

Integrated circuit packaging system with foldable substrate and method of manufacture thereof

LEAD-FREE HIGH TEMPERATURE COMPOUND

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor structure and a method of manufacturing a semiconductor structure

Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die

Electrical connector between die pad and z-interconnect for stacked die assemblies

Stacked integrated circuit package having recessed sidewalls

Electric part package and manufacturing method thereof

Semiconductor packages and methods of packaging semiconductor devices

SEMICONDUCTOR CHIPS AND METHODS OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Wafer level semiconductor package and manufacturing methods thereof

Semiconductor device and method of manufacturing the same

Conductive pads defined by embedded traces

Adding cap to copper passivation flow for electroless plating

Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure

Integrated circuit packaging system with connection structure and method of manufacture thereof

Bump structure including nano-wires and a body connecting ends of the nano-wires, semiconductor package having the bump structure and method of manufacturing the semiconductor package

Protecting flip-chip package using pre-applied fillet

System for clamping heat sink

Semiconductor device having conductive vias in peripheral region connecting shielding layer to ground

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DEVICE MOUNT AND METHOD OF MANUFACTURE THEREOF

Microelectronic devices and methods for manufacturing microelectronic devices

Stacked leadframe implementation for DC/DC convertor power module incorporating a stacked controller and stacked leadframe construction methodology

Semiconductor packages with reduced solder voiding

Method of forming top electrode for capacitor and interconnection in integrated passive device (IPD)

Glass thick film embedded passive material

Method for manufacturing a substrate for a semiconductor package

Packaging or mounting a component

Chip-scale semiconductor die packaging method

Laser assisted transfer welding process

In-package microelectronic apparatus, and methods of using same

Quad flat package with exposed paddle

Systems and methods for ESD protection for RF couplers in semiconductor packages

Semiconductor integrated circuit

Vialess integration for dual thin films—thin film resistor and heater

Transistor structure having an electrical contact structure with multiple metal interconnect levels staggering one another

DIFFERENTIAL SIGNAL TRANSMISSION LINE, IC PACKAGE, AND METHOD FOR TESTING SAID DIFFERENTIAL SIGNAL TRANSMISSION LINE AND IC PACKAGE

Semiconductor packages and methods for producing the same

Semiconductor devices and methods of manufacturing the same

SEMICONDUCTOR CHIP, STACKED SEMICONDUCTOR PACKAGE HAVING THE SAME, AND METHOD FOR MANUFACTURING STACKED SEMICONDUCTOR PACKAGE

Stacked semiconductor devices and fabrication methods thereof

Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor die

Integrated circuit system with distributed power supply comprising interposer and voltage regulator module

Flexible electronic devices and related methods

Electroplated posts with reduced topography and stress

Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief

SEMICONDUCTOR DEVICE WITH NESTED ROWS OF CONTACTS

Dual lead frame semiconductor package and method of manufacture

Semiconductor device including pre-fabricated shielding frame disposed over semiconductor die

Semiconductor device and method of forming prefabricated EMI shielding frame with cavities containing penetrable material over semiconductor die

Semiconductor device and method of forming prefabricated EMI shielding frame with cavities containing penetrable material over semiconductor die

Accessing or interconnecting integrated circuits

MICROELECTRONIC INTERCONNECT SUBSTRATE AND PACKAGING TECHNIQUES

Anisotropic conductive adhesive

Etching composition for an under-bump metallurgy layer

ALUMINUM BOND PADS WITH ENHANCED WIRE BOND STABILITY

Reducing formation of oxide on solder

Thermal compressive bonding with separate die-attach and reflow processes

MANUFACTURING PROCESS OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Apparatus, system, and method for wireless connection in integrated circuit packages

Underfill flow guide structures and method of using same

Method for manufacturing semiconductor device

Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices

ELECTRICALLY CONDUCTIVE INTERCONNECT SYSTEM AND METHOD

Manufacturing light emitting diode (LED) packages

Method for fabrication of a semiconductor device and structure

Chip Attachment Layer Having Traverse-Aligned Conductive Filler Particles

Pattern layout in semiconductor device

Method for Producing an Electrical Circuit and Electrical Circuit

ANISOTROPIC ELECTRICALLY AND THERMALLY CONDUCTIVE ADHESIVE WITH MAGNETIC NANO-PARTICLES

Hybrid integrated circuit device and electronic device

Multilayered printed circuit board and method for manufacturing the same

Low-noise flip-chip packages and flip chips thereof

VACUUM SEALED PACKAGE, PRINTED CIRCUIT BOARD HAVING VACUUM SEALED PACKAGE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING VACUUM SEALED PACKAGE

ANTENNA

Electronic device and electronic apparatus

Semiconductor module

Semiconductor packages

Semiconductor device and method of stacking semiconductor die in mold laser package interconnected by bumps and conductive vias

Semiconductor device and method of forming stepped interposer for stacking and electrically connecting semiconductor die

Semiconductor structure with insulated through silicon via

BALL GRID ARRAY SEMICONDUCTOR DEVICE AND ITS MANUFACTURE

Chip design having integrated fuse and method for the production thereof

Crack arrest vias for IC devices

Interconnect assemblies and methods of making and using same

Semiconductor device and method of forming wafer level ground plane and power ring

Structure, semiconductor structure and method of manufacturing a semiconductor structure and packaging thereof

Semiconductor package having semiconductor die with internal vertical interconnect structure and method therefor

PACKAGE STRUCTURE HAVING EMBEDDED SEMICONDUCTOR COMPONENT AND FABRICATION METHOD THEREOF

Grounded seal ring structure in semiconductor devices

Semiconductor module having a semiconductor chip stack and method

Systems and methods for improved heat dissipation in semiconductor packages

Semiconductor device and method of forming penetrable film encapsulant around semiconductor die and interconnect structure

Method for manufacturing leadframe, packaging method for using the leadframe and semiconductor package product

Direct contact semiconductor package with power transistor

Direct contact flip chip package with power transistors

Integrated circuit packaging system with lead frame and method of manufacture thereof

Semiconductor device having die pads isolated from interconnect portion and method of assembling same

Substrateless power device packages

Integrated circuit package system with encapsulation lock

Approach for bonding dies onto interposers

Interconnect structure for high frequency signal transmissions

Integrated antennas in wafer level package

Semiconductor device and method of shielding semiconductor die from inter-device interference

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor die

Light emitting diode optical emitter with transparent electrical connectors

LIGHT EMITTING DIODE PACKAGE STRUCTURE

Leadframe package with recessed cavity for LED

METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PRINTED WIRING BOARD

Mounting structure of electronic component

Wiring substrate, electronic device, and method of manufacturing wiring substrate

FILM FOR SEMICONDUCTOR AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Methods and apparatus for a stacked-die interposer

Semiconductor package and method of manufacturing the same

Integrated circuits with backside metalization and production method thereof

Connecting member for connecting a semiconductor element and a frame, formed of an Al-based layer and first and second Zn-based layers provided on surfaces of the Al-based layer

METHOD OF MAKING A MULTI-CHIP MODULE HAVING A REDUCED THICKNESS AND RELATED DEVICES

Power/ground layout for chips

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

Integrated circuit package and physical layer interface arrangement

SEMICONDUCTOR DEVICE HAVING UNDER-BUMP METALLIZATION (UBM) STRUCTURE AND METHOD OF FORMING THE SAME

Molded chip interposer structure and methods

Semiconductor component having a second passivation layer having a first opening exposing a bond pad and a plurality of second openings exposing a top surface of an underlying first passivation layer

CENTRIPETAL LAYOUT FOR LOW STRESS CHIP PACKAGE

POWER AND THERMAL DESIGN USING A COMMON HEAT SINK ON TOP OF HIGH THERMAL CONDUCTIVE RESIN PACKAGE

Device with semiconductor die attached to a leadframe

Chip package and manufacturing method thereof

Bond pad for wafer and package for CMOS imager

Shielding techniques for an integrated circuit

HIGH-EFFICIENCY POWER CONVERTERS WITH INTEGRATED CAPACITORS

Light emitting diode package having improved wire bonding structure

Chip package

Wafer level reflector for LED packaging

Atomic layer deposition encapsulation for power amplifiers in RF circuits

Light emitting diode chip and manufacturing method thereof

Test structures for through silicon vias (TSVs) of three dimensional integrated circuit (3DIC)

System and method for packaging electronic devices

Method For Low Temperature Bonding And Bonded Structure

Method and system for bonding electrical devices using an electrically conductive adhesive

TAPE APPLYING APPARATUS

Apparatus for thermal control of semiconductor chip assembly and underfill

Incident radiation detector packaging

Microelectronic devices and methods for filing vias in microelectronic devices

Process for realizing a connecting structure

Semiconductor package having semiconductor die with internal vertical interconnect structure and method therefor

Semiconductor Chip Attach Configuration Having Improved Thermal Characteristics

METHOD FOR MANUFACTURING LED PACKAGE

COMPOSITE ALLOY BONDING WIRE AND MANUFACTURING METHOD THEREOF

MEMS microphone

ENCAPSULATED CIRCUIT DEVICE FOR SUBSTRATES HAVING AN ABSORPTION LAYER, AND METHOD FOR THE MANUFACTURE THEREOF

Method and structure for top metal formation of liquid crystal on silicon devices

Electronic apparatus, method of making the same, and transceiving device

Chip-to-chip multi-signaling communication system with common conductive layer

Layered Integrated Circuit Apparatus

Method of producing a chip package, and chip package

Integrated circuit device and structure

Semiconductor device and method of manufacturing the same

Semiconductor device for semiconductor package having through silicon vias of different heights

Copper pillar bump with cobalt-containing sidewall protection

Under-bump metallization (UBM) structure and method of forming the same

Conductive pillar structure

Mixed wire semiconductor lead frame package

Semiconductor die and method of forming noise absorbing regions between THVs in peripheral region of the die

Submount and manufacturing method thereof

Pad structure having contact bars extending into substrate and wafer having the pad structure

Semiconductor device and the method of manufacturing the same