MULTI-CHIP SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE PACKAGE WITH DIE RECEIVING THROUGH-HOLE AND DUAL BUILD-UP LAYERS OVER BOTH SIDE-SURFACES FOR WLP AND METHOD OF THE SAME

Stacked integrated circuit package system with conductive spacer

Stacked electronic component package having single-sided film spacer

Package structure and manufacturing method thereof

Package structure and method of manufacturing the same

Integrated circuit package system with heat sink spacer structures

Controlling substrate surface properties via colloidal coatings

Semiconductor device and method of manufacturing the same

Semiconductor device comprising circuit substrate with inspection connection pads and manufacturing method thereof

Circuit board and circuit device

Power core devices and methods of making thereof

Multilayer printed circuit board

Method of removing metallic, inorganic and organic contaminants from chip passivation layer surfaces

Method of fabricating microelectronic component assemblies employing lead frames having reduced-thickness inner lengths

Integrated circuit device with embedded passive component by flip-chip connection and method for manufacturing the same

FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

OPTICAL DEVICE, CAMERA MODULE, MOBILE PHONE, DIGITAL STILL CAMERA, AND MEDICAL ENDOSCOPE

Antenna device and radio communication device

Physically highly secure multi-chip assembly

RESIN SEALING METHOD, MOLD FOR RESIN SEALING, AND RESIN SEALING APPARATUS

Surface treatments for contact pads used in semiconductor chip packagages and methods of providing such surface treatments

Semiconductor device, semiconductor package for use therein, and manufacturing method thereof

CHIP STACK PACKAGE AND METHOD OF MANUFACTURING THE CHIP STACK PACKAGE

Semiconductor device and its manufacturing method

Semiconductor device and method for manufacturing the same

Semiconductor element connected to printed circuit board

Determining the placement of semiconductor components on an integrated circuit

Semiconductor device and method for manufacturing thereof

Carbon nanotubes for active direct and indirect cooling of electronics device

Chip package module

Semiconductor device including mounting board with stitches and first and second semiconductor chips

Semiconductor package and the method of making the same

Stacked package module

Semiconductor device package having multi-chips with side-by-side configuration and method of the same

Multi-layer Package Structure for an Acoustic Microsensor

Integrated circuit package system employing multi-package module techniques

Method of joining chips utilizing copper pillar

Electronic components on trenched substrates and method of forming same

Pump structures integral to a fluid filled heat transfer apparatus

Apparatus, unit and method for testing image sensor packages

Semiconductor device and method of manufacturing the same

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Wiring board for flip-chip mounting, mounting structure of electronic components on wiring board, and semiconductor device including wiring board

Semiconductor device having stacked dice disposed on base substrate

Base substrate for chip scale packaging

Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components

Package structure and stacked package module using the same

Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components

Semiconductor device package

BGA PACKAGE SUBSTRATE AND METHOD OF FABRICATING SAME

Wiring board and capacitor to be built into wiring board

Ball attaching apparatus for correcting warpage of substrate and method of attaching solder balls using the same

Method for manufacturing hybrid printed circuit board

Design techniques for stacking identical memory dies

Method of fabricating module having stacked chip scale semiconductor packages

Electronic components on trenched substrates and method of forming same

Multilayer printed circuit board and method of manufacturing same

Electronic device, package having the same, and electronic apparatus

Semiconductor device and method of manufacturing the same

Method of manufacturing semiconductor device that uses both a normal photomask and a phase shift mask for defining interconnect patterns

Substrate with feedthrough and method for producing the same

Semiconductor device

Stacked-Chip Semiconductor Device

Structure of semiconductor device package and method of the same

Chip package substrate and structure thereof

Package substrate strip, metal surface treatment method thereof and chip package structure

Semiconductor device and method of manufacturing the same

Substrate for mounting semiconductor element and method of manufacturing the same

LOW COST AND LOW COEFFICIENT OF THERMAL EXPANSION PACKAGING STRUCTURES AND PROCESSES

Illuminance detecting apparatus comprising a light shielding element containing openings for each detector element

ILLUMINANCE DETECTION APPARATUS AND SENSOR MODULE

Multi-layered interconnect structure using liquid crystalline polymer dielectric

Method for manufacturing the BGA package board

SEMICONDUCTOR PACKAGE HAVING ENHANCED HEAT DISSIPATION AND METHOD OF FABRICATING THE SAME

Integrated circuit package system with underfill

Semiconductor apparatus and mobile apparatus

Method of assembling chips

Semiconductor device and manufacturing method of the semiconductor device

Interposer for die stacking in semiconductor packages and the method of making the same

Semiconductor device having improved heat sink

Integrated circuit package system with interposer

Electronic package and manufacturing method thereof

Planar multi semiconductor chip package and method of manufacturing the same

Package structure to improve the reliability for WLP

Heat dissipation methods and structures for semiconductor device

SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURING THE SAME

Structure and method for forming accumulation-mode field effect transistor with improved current capability

Method and system for prototyping electronic devices with multi-configuration CHIP carriers

Method for achieving very high bandwidth between the levels of a cache hierarchy in 3-dimensional structures, and a 3-dimensional structure resulting therefrom

Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board

Method for fabricating semiconductor device to which test is performed at wafer level and apparatus for testing semiconductor device

Electronic components on trenched substrates and method of forming same

ELECTRONIC COMPONENTS ON TRENCHED SUBSTRATES AND METHOD OF FORMING SAME

Module board

THREE-DIMENSIONAL INTERCONNECT INTERPOSER ADAPTED FOR USE IN SYSTEM IN PACKAGE AND METHOD OF MAKING THE SAME

Low profile flip chip power module and method of making

Stacked semiconductor chip package with shared DLL signal and method for fabricating stacked semiconductor chip package with shared DLL signal

Packaged integrated circuit

Stacked-type semiconductor package

Semiconductor package and fabrication method thereof

Integrated circuit with re-route layer and stacked die assembly

Semiconductor device including a coupling region which includes layers of aluminum and copper alloys

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE USING THE SAME

Stress buffer layer for packaging process

Semiconductor device and method of manufacturing the same

Method of semiconductor device protection, package of semiconductor device

Semiconductor integrated circuit device

Stackable bare-die package

Stacked Package and Method of Fabricating the Same

Stackable integrated circuit package system with multiple interconnect interface

Sensor-type semiconductor package and method for fabricating the same

Multilayer printed circuit board and multilayer printed circuit board manufacturing method

Method for fabricating an electronic device substrate

Methods of forming inter-poly dielectric (IPD) layers in power semiconductor devices

Conductive pattern formation method

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Electronic device including electronic component, heat dissipating member and alloy layer

SEMICONDUCTOR CHIP, MULTI-CHIP SEMICONDUCTOR DEVICE, INSPECTION METHOD OF THE SAME, AND ELECTRIC APPLIANCE INTEGRATING THE SAME

CHIP PACKAGE

Semiconductor device and method for producing the same

Semiconductor device package with multi-chips and method of the same

Semiconductor package, integrated circuit cards incorporating the semiconductor package, and method of manufacturing the same

SEMICONDUCTOR DEVICE PACKAGE WITH DIE RECEIVING THROUGH-HOLE AND CONNECTING THROUGH-HOLE AND METHOD OF THE SAME

Integrated package circuit with stiffener

Semiconductor device package with multi-chips and method of the same

Chip holder with wafer level redistribution layer

Semiconductor device and semiconductor module using the same

Stacked electronic component and manufacturing method thereof

Package structure and manufacturing method thereof

Power Semiconductor Devices with Barrier Layer to Reduce Substrate Up-Diffusion and Methods of Manufacture

Method for mounting electronic components

Transfer mask in micro ball mounter

Structure and method of high performance two layer ball grid array substrate

Semiconductor device and method of manufacturing the same

Method for manufacturing passive device and semiconductor package using thin metal piece

Interface module-mounted LSI package

APPARATUS FOR STACKING SEMICONDUCTOR CHIPS, METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME AND SEMICONDUCTOR PACKAGE MANUFACTURED THEREBY

Circuitized substrate with continuous thermoplastic support film dielectric layers

CONDUCTIVE BALL-OR PIN-MOUNTED SEMICONDUCTOR PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING THE SAME AND CONDUCTIVE BONDING MATERIAL

Prevention of backside cracks in semiconductor chips or wafers using backside film or backside wet etch

SEMICONDUCTOR CHIP SUPPRESSING A VOID DURING A DIE ATTACHING PROCESS AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

WAFER LEVEL IMAGE SENSOR PACKAGE WITH DIE RECEIVING CAVITY AND METHOD OF THE SAME

Multilayer printed wiring board

Method of manufacturing a multilayered printed circuit board

Memory configured on a common substrate

Semiconductor device

Method of manufacturing semiconductor device

Method of manufacturing semiconductor chip assembly with sacrificial metal-based core carrier

Electronic board incorporating a heating resistor

Film type package for fingerprint sensor

Electronics Package And Manufacturing Method Thereof

Versatile Si-based packaging with integrated passive components for mmWave applications

INTEGRATED CIRCUIT SYSTEM WITH PRE-CONFIGURED BOND WIRE BALL

POWER CONTROL STRUCTURE FOR MANAGING A PLURALITY OF VOLTAGE ISLANDS

Stacked structure using semiconductor devices and semiconductor device package including the same

Stacked structure of semiconductor chips, memory card, and method of manufacturing stacked structure of semiconductor chips

SEMICONDUCTOR ELEMENT UNIT AND COMPLEX THEREOF, SEMICONDUCTOR DEVICE AND MODULE THEREOF, ASSEMBLED STRUCTURE THEREOF AND FILM SUBSTRATE CONNECTION STRUCTURE

Semiconductor device

Package structure and method for chip with two arrays of bonding pads on BGA substrate for preventing gold bonding wires from collapse

Integrated circuit packaging system with interposer

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

CHIP PACKAGE AND PROCESS THEREOF

Semiconductor device including semiconductor elements and method of producing semiconductor device

Stackable semiconductor package having metal pin within through hole of package

Carrier plate structure havign a chip embedded therein and the manufacturing method of the same

PACKAGE-ON-PACKAGE DEVICE AND METHOD FOR MANUFACTURING THE SAME BY USING A LEADFRAME

Package-level electromagnetic interference shielding

High performance sub-system design and assembly

Portable memory devices

Circuit board and method for manufacturing the same, semiconductor package, component built-in module and board for electronic equipment

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Varied Solder Mask Opening Diameters Within a Ball Grid Array Substrate

Hybrid module and method of manufacturing the same

Integrated circuit device package having both wire bond and flip-chip interconnections and method of making the same

METHOD FOR FORMING A MICROELECTRONIC ASSEMBLY INCLUDING ENCAPSULATING A DIE USING A SACRIFICIAL LAYER

Techniques for providing decoupling capacitance

Techniques for providing decoupling capacitance

Structure and method for self protection of power device

Configurable IC with interconnect circuits that also perform storage operations

SEMICONDUCTOR PACKAGE HAVING EVAPORATED SYMBOLIZATION

Stacked integrated circuit assembly

Stacked semiconductor device and method of manufacturing the same

PACKAGE SUBSTRATE, METHOD OF FABRICATING THE SAME AND CHIP PACKAGE

FLIP CHIP PACKAGE WITH ANTI-FLOATING STRUCTURE

Wiring board and semiconductor device

Semiconductor device

System in package device

Semiconductor multi-package module including tape substrate land grid array package stacked over ball grid array package

Anti-Impact memory module

Integrated circuit package system with an encapsulant cavity and method of fabrication thereof

Multi-chip semiconductor package and method for fabricating the same

Package structure with circuits directly connected to semiconductor chip

Semiconductor package with electromagnetic shielding capabilities

Multi-layered interconnect structure using liquid crystalline polymer dielectric

Techniques for providing decoupling capacitance

Stress free package and laminate-based isolator package

Electronic component built-in substrate and method of manufacturing electronic component built-in substrate

Electronic component contained substrate

Wireless chip and electronic device having wireless chip

IC package reducing wiring layers on substrate and its chip carrier

Semiconductor chip structure, method of manufacturing the semiconductor chip structure, semiconductor chip package, and method of manufacturing the semiconductor chip package

Chip having side pad, method of fabricating the same and package using the same

Semiconductor device manufacturing method, semiconductor device, and wiring board

Package, electronic device, substrate having a separation region and a wiring layers, and method for manufacturing

Semiconductor device using wiring substrate having a wiring structure reducing wiring disconnection

Semiconductor device having a high frequency electrode positioned with a via hole

STACK PACKAGE AND METHOD OF MANUFACTURING THE SAME

Semiconductor card package and method of forming the same

SEMICONDUCTOR DEVICE, MAGNETIC SENSOR, AND MAGNETIC SENSOR UNIT

Multilayered printed circuit board and manufacturing method thereof

Integrated circuit package system with leads having multiple sides exposed

Method of fabricating a semiconductor multi package module having an inverted package stacked over ball grid array (BGA) package

Optical element, package substrate and device for optical communication

MULTICHIP PACKAGE HAVING A PLURALITY OF SEMICONDUCTOR CHIPS SHARING TEMPERATURE INFORMATION

System-in-package packaging for minimizing bond wire contamination and yield loss

Semiconductor device and programming method

IC chip package with near substrate scale chip attachment

Thin planar semiconductor device

Stacked integrated circuit package system and method of manufacture therefor

Stack type semiconductor chip package having different type of chips and fabrication method thereof

Semiconductor device and method of fabricating the same

Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board

Printed circuit board

Semiconductor package including connected upper and lower interconnections, and manufacturing method thereof

Method of bonding a solder ball and a base plate and method of manufacturing packaging structure of using the same

Electronic component built-in substrate and method for manufacturing the same

Semiconductor chip package and method of manufacturing the same

Semiconductor package with flow controller

Substrate improving immobilization of ball pads for BGA packages

MULTI-CHIP PACKAGE

Heat dissipating semiconductor package

Chip package structure

Ball grid array structures having tape-based circuitry

Plate structure having chip embedded therein and the manufacturing method of the same

Semiconductor package, manufacturing method thereof and IC chip

STACKABLE SEMICONDUCTOR PACKAGE AND THE METHOD FOR MAKING THE SAME

Method of packaging semiconductor devices

Microelectronic component assemblies with recessed wire bonds and methods of making same

Method for manufacturing a three-dimensional semiconductor device and a wafer used therein

Methods for fabricating silicon carriers with conductive through-vias with low stress and low defect density

Isolation structures for CMOS image sensor chip scale packages

Method of making circuitized substrate with solder balls having roughened surfaces, method of making electrical assembly including said circuitized substrate, and method of making multiple circuitized substrate assembly

Ceramic electronic component and method for manufacturing the same

Manufacture including shield structure

Method for fabricating semiconductor package

Ball-mounting method for coplanarity improvement in large package

Heat transfer device in a rotating structure

Stacked type chip package structure

Mounting board, height adjusting apparatus and mounting method

STRESS AND COLLAPSE RESISTANT INTERCONNECT FOR MOUNTING AN INTEGRATED CIRCUIT PACKAGE TO A SUBSTRATE

Printed circuit board

Printed circuit board

HEAT TRANSFER APPARATUS CONTAINING A COMPLIANT FLUID FILM INTERFACE AND METHOD THEREFOR

Universal energy conditioning interposer with circuit architecture

Semiconductor module and mobile apparatus

Dual molded multi-chip package system

Semiconductor device package having pseudo chips

Wafer level package with die receiving through-hole and method of the same

Semiconductor packages, stacked semiconductor packages, and methods of manufacturing the semiconductor packages and the stacked semiconductor packages

Conductive systems and devices including wires coupled to anisotropic conductive film, and methods of forming the same

Control of Standoff Height Between Packages with a Solder-Embedded Tape

Package on package design to improve functionality and efficiency

Method for fabricating heat-dissipating package and heat-dissipating structure applicable thereto

Package with a marking structure and method of the same

RF module package for releasing stress

RF module package

Wafer level package with die receiving through-hole and method of the same

Memory module for improving impact resistance

Stacked semiconductor packages and methods of manufacturing stacked semiconductor packages

Semiconductor device and method of manufacturing the same

Semiconductor device with chip mounted on a substrate

Multiple electronic component containing substrate

Method of making a multi-layered semiconductor device

IC package and method of manufacturing the same

Integrated circuit package with molded cavity

Double side stacked die package

Laterally Interconnected IC Packages and Methods

Mountable integrated circuit package-in-package system with adhesive spacing structures

Bridge stack integrated circuit package-on-package system

High capacity memory module using flexible substrate

Package having shield case

Package level noise isolation

Wiring substrate, manufacturing method thereof, and semiconductor device

Thinned die integrated circuit package

Stacked semiconductor components

Chip-probing and bumping solutions for stacked dies having through-silicon vias

On-chip power management for a mobile communication device and method for use therewith

Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board

Multilayer printed circuit board

Multilayer printed circuit board

Multilayer printed circuit board

Printed-wiring board, method of manufacturing printed-wiring board, and electronic equipment

Method of making circuitized substrate with a resistor

Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication

Voltage regulator integrated with semiconductor chip

Carrier structure embedded with semiconductor chips and method for manufacturing the same

Semiconductor Package with Perforated Substrate

Semiconductor device and manufacturing method of the same

Stacked die package with stud spacers