212705 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Frame; Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
Sub-classes:Electronic device with multi-layer contact and system
#2Electronic device with multi-layer contact and system
#3Method for producing electronic device with multi-layer contact
#4Integrated circuit device with plating on lead interconnection point and method of forming the device
#5Power module of square flat pin-free packaging structure
#6Integrated circuit package for assembling various dice in a single IC package
#7Chip package and a wafer level package
#8Electronic Device with Multi-Layer Contact
#9Semiconductor lead frame, semiconductor package, and manufacturing method thereof
#10Semiconductor device and method for manufacturing the same
#11Encapsulating resin composition, semiconductor device using the encapsulating resin composition, and method for manufacturing semiconductor device using the encapsulating resin composition
#12SEMICONDUCTOR DEVICE
#13Integrated circuit (IC) package with thick die pad functioning as a heat sink
#14Chip package and a wafer level package
#15Integrated circuit device with plating on lead interconnection point and method of forming the device
#16Matrix lid heatspreader for flip chip package
#17Glass/ceramic replacement of epoxy for high temperature hermetically sealed non-axial electronic packages
#18Semiconductor device and method for manufacturing the same
#19Matrix lid heatspreader for flip chip package
#20Method for manufacturing a chip package, a method for manufacturing a wafer level package, a chip package and a wafer level package
#21Electronic device with multi-layer contact
#22Glass/ceramics replacement of epoxy for high temperature hermetically sealed non-axial electronic packages
#23Semiconductor device and method for manufacturing the same
#24Molded flip-clip semiconductor package