212706 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Frame; Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C Copper [Cu] as principal constituent
BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT PACKAGE DESIGN
#2LEADLESS SEMICONDUCTOR PACKAGES, LEADFRAMES THEREFOR, AND METHODS OF MAKING
#3Electronic device with multi-layer contact and system
#4SEMICONDUCTOR SYSTEMS WITH ANTI-WARPAGE MECHANISMS AND ASSOCIATED SYSTEMS, DEVICES, AND METHODS
#5Flip-chip package assembly
#6Flip-chip package assembly
#7BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT PACKAGE DESIGN
#8Hermetic package for high CTE mismatch
#9Hermetic package for high CTE mismatch
#10LEADLESS SEMICONDUCTOR PACKAGES, LEADFRAMES THEREFOR, AND METHODS OF MAKING
#11ASSEMBLY COMPRISING A VERTICAL POWER COMPONENT ASSEMBLED ON A METAL CONNECTION PLATE
#12Wafer-level chip-scale package including power semiconductor and manufacturing method thereof
#13Electronic device with multi-layer contact and system
#14Bottom package exposed die MEMS pressure sensor integrated circuit package design
#15Semiconductor device with island and associated leads
#16Method of making a wire support leadframe for a semiconductor device
#17Leadless semiconductor packages, leadframes therefor, and methods of making
#18PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF
#19Wire support for a leadframe
#20Method for producing electronic device with multi-layer contact
#21Integrated circuit device with plating on lead interconnection point and method of forming the device
#22Power module
#23Semiconductor device
#24Method of manufacturing a semiconductor device
#25Method of making a wire support leadframe for a semiconductor device
#26Power module of square flat pin-free packaging structure
#27Integrated circuit package for assembling various dice in a single IC package
#283D CHIP ASSEMBLIES USING STACKED LEADFRAMES
#29Chip package and a wafer level package
#30Semiconductor device with island and associated leads
#31SEMICONDUCTOR DEVICE HAVING TWO ENCAPSULANTS
#32WFCQFN (Very-Very Thin Flip Chip Quad Flat No Lead) with Embedded Component on Leadframe and Method Therefor
#33Bottom package exposed die MEMS pressure sensor integrated circuit package design
#34Wafer-level chip-scale package including power semiconductor and manufacturing method thereof
#35Flat No-Leads Package With Improved Contact Pins
#36Electronic apparatus with pocket of low permittivity material to reduce electromagnetic interference
#37Structure and method for stabilizing leads in wire-bonded semiconductor devices
#38Semiconductor device
#39ELECTRONIC DEVICE
#40Semiconductor device and portable apparatus using the same
#41Wire support for a leadframe
#42Flip-chip on leadframe having partially etched landing sites
#43Power module
#44Semiconductor device
#45Semiconductor device and method of making a semiconductor device
#46Package structure and fabricating method thereof
#47Strip-shaped substrate for producing chip carriers, electronic module with a chip carrier of this type, electronic device with a module of this type, and method for producing a substrate
#48Leadless semiconductor packages, leadframes therefor, and methods of making
#49Die attachment for packaged semiconductor device
#50SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
#51Electronic Device with Multi-Layer Contact
#52Semiconductor device manufacturing method
#53Shaped lead terminals for packaging a semiconductor device for electric power
#54Electrically insulating thermal interface on the discontinuity of an encapsulation structure
#55Package for a surface-mount semiconductor device and manufacturing method thereof
#56SEMICONDUCTOR DEVICE PACKAGE
#57Semiconductor lead frame, semiconductor package, and manufacturing method thereof
#58Waterproof electronic device and manufacturing method thereof
#59Semiconductor device
#60Packaging solutions for devices and systems comprising lateral GaN power transistors
#61Packaging solutions for devices and systems comprising lateral GaN power transistors
#62Packaging solutions for devices and systems comprising lateral GaN power transistors
#63Power semiconductor module and composite module
#64Integrated circuit package and method of making the same
#65Method of manufacturing semiconductor device and semiconductor device
#66Singulation method for semiconductor package with plating on side of connectors
#67Semiconductor device
#68SEMICONDUCTOR DEVICE
#69Semiconductor package structure with preferred heat dissipating efficacy without formation of short circuit
#70Chip package and a wafer level package
#71Integrated circuit device with plating on lead interconnection point and method of forming the device
#72Lead frame construct for lead-free solder connections
#73Semiconductor package having etched foil capacitor integrated into leadframe
#74Matrix lid heatspreader for flip chip package
#75Semiconductor package and method for manufacturing the same
#76Metal base substrate, power module, and method for manufacturing metal base substrate
#77Semiconductor device
#78Semiconductor device, method of manufacturing a semiconductor device, and positioning jig
#79Matrix lid heatspreader for flip chip package
#80Method for manufacturing a chip package, a method for manufacturing a wafer level package, a chip package and a wafer level package
#81Electronic device with multi-layer contact
#82Semiconductor device
#83Singulation method for semiconductor package with plating on side of connectors
#843D chip assemblies using stacked leadframes
#85Clip based semiconductor package for increasing exposed leads
#86IC package with integrated inductor
#87Angle referenced lead frame design
#88Semiconductor packaging identifier
#89Molded flip-clip semiconductor package