Sensor device having a structure element

LIGHT-EMITTING DIODE WITH COMPENSATING CONVERSION ELEMENT AND CORRESPONDING CONVERSION ELEMENT

LED PACKAGE

White light emitting diode and method of manufacturing the same

Method for manufacturing magnetic memory chip device

Light emitting device, and method for manufacturing circuit board

SEMICONDUCTOR DEVICE

Integrated circuit packaging system with foldable substrate and method of manufacture thereof

Semiconductor structure and a method of manufacturing a semiconductor structure

Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die

Semiconductor package with bonding wires of reduced loop inductance

Stacked integrated circuit package having recessed sidewalls

Microelectronic package with terminals on dielectric mass

Semiconductor packages and methods of packaging semiconductor devices

Wafer level semiconductor package and manufacturing methods thereof

Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure

Semiconductor device

Semiconductor device having conductive vias in peripheral region connecting shielding layer to ground

Semiconductor device

Stacked leadframe implementation for DC/DC convertor power module incorporating a stacked controller and stacked leadframe construction methodology

ADVANCED QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Semiconductor packages with reduced solder voiding

Semiconductor device and method of manufacturing semiconductor device

Method for manufacturing a microelectromechanical component; and a microelectromechanical component

Phosphor, method of manufacturing the same, and light-emitting device

PROCESS AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE

Method for manufacturing a substrate for a semiconductor package

Methods of manufacturing semiconductor chips

FILM FOR SEMICONDUCTOR AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Multi-chip stacking method to reduce voids between stacked chips

Composite nanometal paste of two-metallic-component type, bonding method, and electronic part

BONDING SHEET

Quad flat package with exposed paddle

Semiconductor packages and methods for producing the same

Semiconductor devices and methods of manufacturing the same

Stacked semiconductor devices and fabrication methods thereof

System for relieving stress and improving heat management in a 3D chip stack

Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor die

SEMICONDUCTOR DEVICE AND STACKED SEMICONDUCTOR PACKAGE

Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief

Heat dissipating semiconductor device packages

ENCAPSULATED DIE, MICROELECTRONIC PACKAGE CONTAINING SAME, AND METHOD OF MANUFACTURING SAID MICROELECTRONIC PACKAGE

SEMICONDUCTOR DEVICE WITH NESTED ROWS OF CONTACTS

Resin-sealed semiconductor device and method for fabricating the same

Dual lead frame semiconductor package and method of manufacture

Semiconductor device including pre-fabricated shielding frame disposed over semiconductor die

Semiconductor device and method of forming prefabricated EMI shielding frame with cavities containing penetrable material over semiconductor die

Semiconductor device and method of forming prefabricated EMI shielding frame with cavities containing penetrable material over semiconductor die

SEMICONDUCTOR DEVICE, SEMICONDUCTOR GROUP MEMBER AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

LED chip assembly, LED package, and manufacturing method of LED package

Light emitting device and light emitting device package having the same

LED-based light source utilizing asymmetric conductors

LED-based light source utilizing asymmetric conductors

Molded image sensor package and method

Reducing formation of oxide on solder

Method for manufacturing semiconductor device

FILM FOR SEMICONDUCTOR AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices

Method for fabrication of a semiconductor device and structure

TAPE FOR HOLDING CHIP, METHOD OF HOLDING CHIP-SHAPED WORKPIECE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING TAPE FOR HOLDING CHIP, AND METHOD OF MANUFACTURING TAPE FOR HOLDING CHIP

Method for Producing an Electrical Circuit and Electrical Circuit

Hybrid integrated circuit device and electronic device

Power module using sintering die attach and manufacturing method thereof

Semiconductor module having an insert and method for producing a semiconductor module having an insert

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHODS THEREOF

Semiconductor module

Semiconductor device and method of stacking semiconductor die in mold laser package interconnected by bumps and conductive vias

Semiconductor device and method of forming stepped interposer for stacking and electrically connecting semiconductor die

Power package module with low and high power chips and method for fabricating the same

LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD

DISCRETE CIRCUIT COMPONENT HAVING COPPER BLOCK ELECTRODES AND METHOD OF FABRICATION

Stacked semiconductor packages and related methods

BALL GRID ARRAY SEMICONDUCTOR DEVICE AND ITS MANUFACTURE

Semiconductor device, method for manufacturing semiconductor device, and circuit device using semiconductor device

Semiconductor device and method of forming wafer level ground plane and power ring

Semiconductor package having semiconductor die with internal vertical interconnect structure and method therefor

Systems and methods for improved heat dissipation in semiconductor packages

Semiconductor device and method of forming penetrable film encapsulant around semiconductor die and interconnect structure

Method for manufacturing leadframe, packaging method for using the leadframe and semiconductor package product

Integrated circuit packaging system with lead frame and method of manufacture thereof

Semiconductor device packages with protective layer and related methods

Semiconductor device having die pads isolated from interconnect portion and method of assembling same

Semiconductor package device with a heat dissipation structure and the packaging method thereof

Substrateless power device packages

Integrated circuit package system with encapsulation lock

Approach for bonding dies onto interposers

Semiconductor package and electronic component package

Integrated antennas in wafer level package

Semiconductor device and method of shielding semiconductor die from inter-device interference

Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor die

Package structure with micro-electromechanical element and manufacturing method thereof

Light-emitting device

LIGHT EMITTING DIODE PACKAGE STRUCTURE

Side view surface mount LED

FILL ROLL FOR PRODUCING SEMICONDUCTOR DEVICE

Chip Package

FILM FOR SEMICONDUCTOR AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Method of manufacturing a flip chip package and apparatus to attach a semiconductor chip used in the method

Oxynitride fluorescent material and light-emitting device

LAMINATED SUBSTRATE WITH COILS

Semiconductor device and method of forming the same

Power semiconductor device

Element mounting substrate and semiconductor module

Connecting member for connecting a semiconductor element and a frame, formed of an Al-based layer and first and second Zn-based layers provided on surfaces of the Al-based layer

Power/ground layout for chips

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

Molded chip interposer structure and methods

POWER AND THERMAL DESIGN USING A COMMON HEAT SINK ON TOP OF HIGH THERMAL CONDUCTIVE RESIN PACKAGE

Semiconductor device including an insulating layer and heat sink plates formed in the insulating layer

Device with semiconductor die attached to a leadframe

Lead frame manufactured from low-priced material and not requiring strict process control, semiconductor package including the same, and method of manufacturing the lead frame and the semiconductor package

Carrier body for a semiconductor component, semiconductor component and method for producing a carrier body

Chip package and manufacturing method thereof

HIGH-EFFICIENCY POWER CONVERTERS WITH INTEGRATED CAPACITORS

Semiconductor device, mounted substrate to be used in semiconductor device, and manufacturing method of mounted substrate

LIGHT EMITTING DIODE PACKAGE WITH PHOTORESIST REFLECTOR AND METHOD OF MANUFACTURING

Light emitting diode package having improved wire bonding structure

Wafer level reflector for LED packaging

PACKAGING SUBSTRATE AND METHOD OF FABRICATING THE SAME

Package substrate and fabrication method thereof

Microelectronic devices and methods for filing vias in microelectronic devices

Semiconductor package having semiconductor die with internal vertical interconnect structure and method therefor

Method of making a semiconductor chip assembly with a bump/base/ledge heat spreader, dual adhesives and a cavity in the bump

Semiconductor Chip Attach Configuration Having Improved Thermal Characteristics

Method for positioning chips during the production of a reconstituted wafer

APPARATUS FOR AND METHODS OF ATTACHING HEAT SLUGS TO PACKAGE TOPS

Copper alloy bonding wire for semiconductor

Compression molding method for electronic component and compression molding apparatus employed therefor

ENCAPSULATED CIRCUIT DEVICE FOR SUBSTRATES HAVING AN ABSORPTION LAYER, AND METHOD FOR THE MANUFACTURE THEREOF

Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics

Package-based filtering and matching solutions

Phosphor and light emitting device

Stacked semiconductor package having electrical connections or varying heights between substrates, and semiconductor device including the stacked semiconductor package

Semiconductor device for semiconductor package having through silicon vias of different heights

Semiconductor packages and methods of fabricating the same

Semiconductor device

Semiconductor device

Chip package structure and chip packaging method

Leadframe package structure and manufacturing method thereof

Mixed wire semiconductor lead frame package

Semiconductor die and method of forming noise absorbing regions between THVs in peripheral region of the die

Semiconductor package

SEMICONDUCTOR DEVICE, METHOD FOR FORMING THE SAME, AND DATA PROCESSING SYSTEM

Submount and manufacturing method thereof

Semiconductor chip assembly with bump/base/ledge heat spreader, dual adhesives and cavity in bump

PHOSPHOR AND LIGHT EMITTING DEVICE

Light-emitting device

Integrated circuit tampering protection and reverse engineering prevention coatings and methods

Method of fabricating stacked chips in a semiconductor package

Airgap micro-spring interconnect with bonded underfill seal

Power module and power conversion device

Semiconductor device comprising thin-film terminal with deformed portion

Semiconductor element having conductive vias and semiconductor package having a semiconductor element with conductive vias and method for making the same

Layered chip package and method of manufacturing same

Semiconductor having chip stack, semiconductor system, and method of fabricating the semiconductor apparatus

Semiconductor assembly and semiconductor package including a solder channel

Semiconductor device and semiconductor package having the same

STACKED SEMICONDUCTOR PACKAGE HAVING CONDUCTIVE VIAS AND METHOD FOR MAKING THE SAME

Integrated circuit packaging system with interposer interconnections and method of manufacture thereof

SEMICONDUCTOR DEVICE

IC PACKAGE

Semiconductor device including shielding layer and fabrication method thereof

Sensor and method of providing a sensor

Massively parallel interconnect fabric for complex semiconductor devices

Light emitting device package

Group-III nitride compound semiconductor light-emitting device, method of manufacturing group-III nitride compound semiconductor light-emitting device, and lamp

Method of manufacturing semiconductor device

Manufacturing method of semiconductor device

Semiconductor die package including low stress configuration

Chip Capacitor Precursors

Phosphor and light emitting device

Resin composition for encapsulating semiconductor and semiconductor device

Semiconductor device packages stacked together having a redistribution layer

SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENT MODULE USING THE SAME

POWER MODULE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor module comprising an insert

Electronic Package and Method of Making an Electronic Package

Electronic component having encapsulated wiring board and method for manufacturing the same

Delamination resistant device package having raised bond surface and mold locking aperture

Sheet-molded chip-scale package

Method of providing a phosphor with a precisely controlled element composition, a phosphor provided by the same, a phosphor, and a light emitting device comprising the said phosphor

LIGHT EMITTING DIODE PACKAGE AND METHOD OF MAKING THE SAME

LED package

Transferring an antenna to an RFID inlay substrate

ELECTRONIC DEVICE, CIRCUIT BOARD, AND MANUFACTURING METHOD OF ELECTRONIC DEVICE

Assembly method for converting the precursors to capacitors

MEMORY DEVICE

Semiconductor device manufacturing method using laser irradiation and dicing saw and semiconductor device thereof

Brace for wire bond

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

FLIP-CHIP BONDING METHOD TO REDUCE VOIDS IN UNDERFILL MATERIAL

Semiconductor package having buried post in encapsulant and method of manufacturing the same

Manufacturing method of semiconductor device

METHOD OF MANUFACTURING LIGHT EMITTING DIODE PACKAGE

SINTERED CERAMIC AND SUBSTRATE COMPRISING SAME FOR SEMICONDUCTOR DEVICE

Circuit device and method of manufacturing the same

MULTI-CHIP PACKAGE

Electronic module for vehicle

Set of resin compositions for preparing system-in-package type semiconductor device

SEMICONDUCTOR PACKAGE

Integrated circuit packaging system with warpage control and method of manufacture thereof

Semiconductor device and method of bonding different size semiconductor die at the wafer level

Methods of fabricating package stack structure and method of mounting package stack structure on system board

Semiconductor device and method of forming TSV interposer with semiconductor die and build-up interconnect structure on opposing surfaces of the interposer

Methods of forming fully embedded bumpless build-up layer packages and structures formed thereby

Semiconductor device

Semiconductor device and method of forming vertical interconnect structure between non-linear portions of conductive layers

Package for semiconductor device including guide rings and manufacturing method of the same

BACKMETAL REPLACEMENT FOR USE IN THE PACKAGING OF INTEGRATED CIRCUITS

Circuit device having an improved heat dissipitation, and the method of manufacturing the same

Semiconductor device

Lead frame, semiconductor device, and method of manufacturing semiconductor device

SEMICONDUCTOR DEVICE WITH EXPOSED PAD

Integrated circuit packaging system with interlock and method of manufacture thereof

Integrated circuit packaging system with lead encapsulation and method of manufacture thereof

Multi-chip semiconductor packages and assembly thereof

Semiconductor device and manufacturing method therefor

Semiconductor device and a method of manufacturing the same

Semiconductor chip package

Package structure with ESD and EMI preventing functions

Semiconductor device and method of forming protective structure around semiconductor die for localized planarization of insulating layer

Semiconductor device

Coupling in and to RFID smart cards

POLYMER CORE WIRE

Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device

DICING DIE BOND FILM, METHOD OF MANUFACTURING DICING DIE BOND FILM, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Chip packaging method and structure thereof

Module with silicon-based layer

Method of making a light emitting device having a molded encapsulant

LED illuminator module with high heat-dissipating efficiency and manufacturing method therefor

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Power conversion module

Flexible distributed LED-based light source and method for making the same

Phosphor particle group and light emitting apparatus using the same

Metal can impedance control structure

Integrated circuit packaging system with die paddles and method of manufacture thereof

Stacked multi-die packages with impedance control

SEMICONDUCTOR DEVICE AND POWER SEMICONDUCTOR DEVICE

Semiconductor device and method of forming dam material with openings around semiconductor die for mold underfill using dispenser and vacuum assist

SEMICONDUCTOR PACKAGES, ELECTRONIC DEVICES AND ELECTRONIC SYSTEMS EMPLOYING THE SAME

Method for depackaging prepackaged integrated circuit die and a product from the method

Ball grid array semiconductor package and method of manufacturing the same

Impedance controlled packages with metal sheet or 2-layer RDL

Semiconductor device and method of forming composite bump-on-lead interconnection

Integrated circuit packaging system with active surface heat removal and method of manufacture thereof

Semiconductor device package and method of making a semiconductor device package

Integrated power converter package with die stacking

Integrated circuit packaging system with stack interconnect and method of manufacture thereof

Integrated circuit packaging system with paddle molding and method of manufacture thereof

TSOP with impedance control

Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device

SEMICONDUCTOR PACKAGE INCLUDING DECOUPLING SEMICONDUCTOR CAPACITOR

Vertical discrete devices with trench contacts and associated methods of manufacturing

Semiconductor light emitting devices with optical coatings and methods of making same

Electronic device comprising a chip disposed on a pin

Resin composition and semiconductor device produced by using the same

HEAT-RADIATING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

QFN PROCESS FOR STRIP TEST

Method of making a high frequency device package

Silicone Composition for Producing Transparent Silicone Materials and Optical Devices

Semiconductor device including coupling conductive pattern

Connector assembly and method of manufacture

Method of making a semiconductor chip assembly with a post/base heat spreader and a substrate using grinding

Method of manufacture of integrated circuit packaging system with stacked integrated circuit

SEMICONDUCTOR DIE PACKAGE INCLUDING MULTIPLE DIES AND A COMMON NODE STRUCTURE

MANUFACTURING METHOD OF SUBSTRATE FOR A SEMICONDUCTOR PACKAGE, MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE, SUBSTRATE FOR A SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE

Complex semiconductor device for use in mobile equipment

Semiconductor component and method of manufacture

Electronic Device, Circuit Board Assembly, and Semiconductor Device

Semiconductor package with integrated substrate thermal slug

Distributed coupler with first line on substrate and second line in package supporting substrate

Red light-emitting flourescent substance and light-emitting device employing the same

Silicon carbidonitride based phosphors and lighting devices using the same

Red light-emitting fluorescent substance and light-emitting device employing the same

Resin composition for encapsulating semiconductor and semiconductor device

Method for constructing an electrical circuit, and electrical circuit

Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor die

Electronic packaging with a variable thickness mold cap

Integrated circuit packaging system with film encapsulation and method of manufacture thereof

Integrated circuit packaging system with package-on-package and method of manufacture thereof

Simulated wirebond semiconductor package

Semiconductor device and method of manufacturing the same

Semiconductor device and manufacturing method thereof

Methods for filling a contact hole in a chip package arrangement and chip package arrangements

Semiconductor package and method for manufacturing the same

Die structure, die arrangement and method of processing a die

Embedded ball grid array substrate and manufacturing method thereof

Method of manufacturing substrate for semiconductor element, and semiconductor device

Semiconductor device

Semiconductor device and method of forming bond-on-lead interconnection for mounting semiconductor die in FO-WLCSP

Semiconductor device and method of forming base substrate with cavities formed through etch-resistant conductive layer for bump locking

Semiconductor module and method for production thereof

Semiconductor device having a pin mounted heat sink

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

POWER SEMICONDUCTOR MODULE HAVING SINTERED METAL CONNECTIONS, PREFERABLY SINTERED SILVER CONNECTIONS, AND PRODUCTION METHOD

Semiconductor device and method of forming leadframe interposer over semiconductor die and TSV substrate for vertical electrical interconnect

METHOD FOR MANUFACTURING SUBSTRATE FOR SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE

Semiconductor packages having increased input/output capacity and related methods

DICING DIE BOND FILM