212741 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected; Structure; Component type being a resistor
Semiconductor equipment having multiple semiconductor devices and multiple lead frames
#3302On chip transformer isolator
#3303Semiconductor module with high process accuracy, manufacturing method thereof, and semiconductor device therewith
#3304Top layers of metal for high performance IC's
#3305Integrated power amplifier module with power sensor
#3306Semiconductor device and method of manufacturing the same
#3307Circuit device and manufacturing method thereof
#3308Semiconductor device and a method of manufacturing the same
#3309Semiconductor device and method for manufacturing the same
#3310Semiconductor device formed having a metal layer for conducting the device current and for high contrast marking and method thereof
#3311Multi-band tunable resonant circuit
#3312Top layers of metal for high performance IC's
#3313Circuit device, manufacturing method thereof, and sheet-like board member
#3314Bump structure
#3315Method of manufacturing electronic part packaging structure
#3316Method and resulting structure for manufacturing semiconductor substrates
#3317Multilayer substrate including components therein
#3318Method for integrating pre-fabricated chip structures into functional electronic systems
#3319Integrated passive devices
#3320Semiconductor device capable of being connected to external terminals by wire bonding in stacked assembly
#3321Semiconductor micro device
#3322Under bump metallization layer to enable use of high tin content solder bumps
#3323Method of manufacturing a semiconductor device and a fabrication apparatus for a semiconductor device
#3324Electronic device including chip parts and a method for manufacturing the same
#3325Semiconductor device
#3326High data rate chip mounting
#3327Selectable decoupling capacitors for integrated circuits and associated methods
#3328Compositions for use in electronics devices
#3329Method for securing electronic components to a substrate
#3330Top layers of metal for high performance IC's
#3331Semiconductor package having a first conductive bump and a second conductive bump and methods for manufacturing the same
#3332Semiconductor device using semiconductor chip
#3333Semiconductor structure integrated under a pad
#3334Method for manufacturing an interconnect
#3335Compliant multi-composition interconnects
#3336Semiconductor device and its manufacturing process, electro-optical equipment, and electronic equipment
#3337High-frequency amplification device
#3338Semiconductor device
#3339Method for mounting semiconductor device, as well as circuit board, electrooptic device, and electronic device
#3340Method and apparatus for improved power routing
#3341Method for manufacturing semiconductor device having solder layer
#3342Semiconductor device
#3343NANO IC packaging
#3344Semiconductor device with improved design freedom of external terminal
#3345Semiconductor device
#3346High performance system-on-chip discrete components using post passivation process
#3347Programmable radio transceiver
#3348High density nanostructured interconnection
#3349Manufacturing method for semiconductor integrated circuit, semiconductor integrated circuit, and semiconductor integrated circuit apparatus
#3350Circuit device
#3351Lead frame, method of manufacturing the same, semiconductor device using lead frame and method of manufacturing semiconductor device
#3352Power semiconductor switching-device and semiconductor power module using the device
#3353Integrated circuit with intergrated capacitor and methods for making same
#3354Semiconductor device comprising through-electrode interconnect
#3355Wire bonding apparatus
#3356Circuitry module
#3357Split-gate power module for suppressing oscillation therein
#3358Semiconductor device with non-overlapping chip mounting sections
#3359Network electronic component, semiconductor device incorporating network electronic component, and methods of manufacturing both
#3360Underfill fluxing curative
#3361Structure and method for contact pads having an overcoat-protected bondable metal plug over copper-metallized integrated circuits
#3362Dicing film having shrinkage release film and method of manufacturing semiconductor package using the same
#3363Semiconductor device assembly method and semiconductor device assembly apparatus
#3364Method for attaching a semiconductor chip in a plastic encapsulant, optoelectronic semiconductor component and method for the production thereof
#3365Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
#3366Switched-capacitor power supply system and method
#3367Programmable radio transceiver
#3368Semiconductor package structure with reduced parasite capacitance and method of fabricating the same
#3369Under bump metallization layer to enable use of high tin content solder bumps
#3370Semiconductor device and method of manufacturing the same
#3371HYBRID INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
#3372Semiconductor apparatus and method of fabricating the apparatus
#3373High frequency circuit block unit, method for producing same, high frequency module device and method for producing same
#3374Top layers of metal for high performance IC's
#3375Method for forming robust solder interconnect structures by reducing effects of seed layer underetching
#3376Manufacturing method for semiconductor device and determination method for position of semiconductor element
#3377Marking on underfill
#3378Semiconductor device and method of manufacturing the same
#3379Circuit device and manufacturing method thereof
#3380Manufacturing and testing of electrostatic discharge protection circuits
#3381Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
#3382Top layers of metal for high performance IC's
#3383Semiconductor device and electronic device
#3384Electronic component having an integrated passive electronic component and associated production method
#3385Local control of underfill flow on high density packages, packages and systems made therewith, and methods of making same
#3386Power amplifier module for wireless communication devices
#3387Testable electrostatic discharge protection circuits
#3388LSI package, LSI element testing method, and semiconductor device manufacturing method
#3389Semiconductor package
#3390Method of surface mounting a semiconductor device
#3391Method and structure for interfacing electronic devices
#3392Electronic device configured as a multichip module, leadframe and panel with leadframe positions
#3393Circuit carrier
#3394High performance system-on-chip using post passivation process
#3395Semiconductor device and method of manufacturing the same
#3396Thermal head and bonding connection method therefor
#3397Semiconductor device and method of manufacturing the same
#3398Semiconductor memory device and defect remedying method thereof
#3399Adhesive, method of connecting wiring terminals and wiring structure
#3400Wiring structure having a wiring-terminal-connecting adhesive comprising silicone particles
#3401Method of manufacturing hybrid integrated circuit device
#3402High-frequency power amplifier module
#3403Electronic component and fabricating method
#3404Electronic component and fabricating method
#3405Electrode pad section for external connection
#3406Semiconductor device and method of manufacturing the same
#3407Electronic component and fabricating method
#3408Microelectronic assembly having array including passive elements and interconnects
#3409Quad flat non-leaded package comprising a semiconductor device
#3410Method for assembling a ball grid array package with two substrates
#3411High performance system-on-chip discrete components using post passivation process
#3412Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment
#3413Bumped IC, display device and electronic device using the same
#3414Film substrate, fabrication method thereof, and image display substrate
#3415Method and system for batch forming spring elements in three dimensions
#3416Semiconductor substrates including I/O redistribution using wire bonds and anisotropically conductive film, methods of fabrication and assemblies including same
#3417Direct writeTM system
#3418Chip and multi-chip semiconductor device using thereof and method for manufacturing same
#3419Semiconductor integrated circuit having connection pads over active elements
#3420Semiconductor device
#3421Semiconductor device having conducting portion of upper and lower conductive layers
#3422Semiconductor device
#3423HYBRID INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF
#3424Method of making wireless semiconductor device, and leadframe used therefor
#3425Methods of fabricating nanostructures and nanowires and devices fabricated therefrom
#3426Method and resulting structure for manufacturing semiconductor substrates
#3427Semiconductor device and method of fabricating the same
#3428Method for manufacturing connection construction
#3429Semiconductor integrated circuit device
#3430Fuse structure for semiconductor integrated circuit with improved insulation film thickness uniformity and moisture resistance
#3431Test assembly including a test die for testing a semiconductor product die
#3432Interconnect circuitry, multichip module, and methods for making them
#3433Method of embedding components in multi-layer circuit boards
#3434Stacked IC device having functions for selecting and counting IC chips
#3435Efficient use of wafer area with device under the pad approach
#3436Semiconductor device
#3437Bonding wire and an integrated circuit device using the same
#3438Mounting substrate and electronic component using the same
#3439Semiconductor device and manufacturing method thereof
#3440Method for producing an electronic device connected to a printed circuit board
#3441Electronic circuit device having circuit board electrically connected to semiconductor element via metallic plate
#3442Alignment and orientation features for a semiconductor package
#3443Semiconductor chip with external connecting terminal
#3444Semiconductor chip with external connecting terminal
#3445Wafer stacking with anisotropic conductive adhesive
#3446Semiconductor device and semiconductor module
#3447Semiconductor chip with external connecting terminal
#3448Package circuit board with a reduced number of pins and package including a package circuit board with a reduced number of pins and methods of manufacturing the same
#3449Surface mount package
#3450Integrated circuit package for semiconductor devices having a reduced leadframe pad and an increased bonding area
#3451Apparatus and methods for an underfilled integrated circuit package
#3452Electrical connection of components
#3453Dual band power amplifier module for wireless communication devices
#3454Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof
#3455Methods of making microelectronic assemblies including compliant interfaces
#3456Method of manufacturing a semiconductor device
#3457High-frequency device
#3458Dicing die-bonding film
#3459Wire bonder for ball bonding insulated wire and method of using same
#3460Novel process for improved hot carrier injection
#3461Methods of providing solder structures for out plane connections
#3462Stacked semiconductor device assembly and method for forming
#3463Integrating passive components on spacer in stacked dies
#3464Metal article intended for at least partially coating with a substance and a method for producing the same
#3465Method of assembling a ball grid array package with patterned stiffener layer
#3466Method and apparatus for improved power routing
#3467Lead frame structure with aperture or groove for flip chip in a leaded molded package
#3468Conductor composition, a mounting substrate and a mounting structure utilizing the composition
#3469Electronic component with flexible contacting pads and method for producing the electronic component
#3470Semiconductor device and method for fabricating the same
#3471Power semiconductor module and method for producing it
#3472Microelectronic device signal transmission by way of a lid
#3473Method of incorporating interconnect systems into an integrated circuit process flow
#3474Semiconductor packaging
#3475Module board having embedded chips and components and method of forming the same
#3476Power amplifier module for wireless communication devices
#3477Semiconductor device and a method of manufacturing the same
#3478Component
#3479Semiconductor device manufacturing method and semiconductor device manufactured thereby
#3480Semiconductor device with stacked chips
#3481Method for fabricating chip package
#3482Semiconductor device and method for fabricating the same
#3483Method of manufacturing circuits
#3484Electroplating method for a semiconductor device
#3485Laminated circuit board and its manufacturing method, and manufacturing method for module using the laminated circuit board and its manufacturing apparatus
#3486Electronic device and method of manufacturing same
#3487Semiconductor device and method of manufacturing the same
#3488Semiconductor device and its manufacturing method, and semiconductor device manufacturing system
#3489Electronics circuit manufacture
#3490Wire bond integrity test system
#3491Customized microelectronic device and method for making customized electrical interconnections
#3492Electronic circuit unit with semiconductor components disposed on both surfaces of board
#3493Encapsulated chip and procedure for its manufacture
#3494Low temperature solder chip attach structure and process to produce a high temperature interconnection
#3495Flip chip bonding tool tip
#3496Bonding tool with resistance
#3497Film adhesives containing maleimide compounds and methods for use thereof
#3498Wire bonding process for copper-metallized integrated circuits
#3499Environmentally tuned circuit card assembly and method for manufacturing the same
#3500Power amplifier device
#3501Bond pad for flip chip package
#3502Circuit device and manufacturing method thereof
#3503Semiconductor device with magnetically permeable heat sink
#3504Optimum padset for wire bonding RF technologies with high-Q inductors
#3505Semiconductor integrated circuit
#3506Integrated circuit device and the manufacturing method thereof
#3507Semiconductor device and method of manufacturing the same
#3508Semiconductor package board using a metal base
#3509Semiconductor device and manufacturing method thereof
#3510Bond pad scheme for Cu process
#3511Process for strengthening semiconductor substrates following thinning
#3512Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
#3513Passive element chip and manufacturing method thereof, and highly integrated module and manufacturing method thereof
#3514Chip package with die and substrate
#3515Semiconductor package capable of absorbing electromagnetic wave
#3516Semiconductor device and method of fabricating the same
#3517Circuit device
#3518Chip package with die and substrate
#3519Circuit device
#3520Electronic device
#3521Circuit device
#3522Electronic substrate, power module and motor driver
#3523Build-up structures with multi-angle vias for chip to chip interconnects and optical bussing
#3524Radio frequency unit analog level detector and feedback control system
#3525Method of manufacturing a semiconductor device
#3526Thinned, strengthened semiconductor substrates and packages including same
#3527Prevention of contamination on bonding pads of wafer during SMT
#3528Large bumps for optical flip chips
#3529Large bumps for optical flip chips
#3530Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same
#3531Semiconductor device having heat radiation plate and bonding member
#3532Structure and method for forming a capacitively coupled chip-to-chip signaling interface
#3533Local multilayered metallization
#3534Method of using pre-applied underfill encapsulant
#3535Integrated circuit package bond pad having plurality of conductive members
#3536Mobile millimetric wave radar
#3537Substrate having built-in semiconductor apparatus and manufacturing method thereof
#3538Group III nitride based flip-chip integrated circuit and method for fabricating
#3539Semiconductor module and method for producing a semiconductor module
#3540Method of forming a semiconductor package and structure thereof
#3541Pressure-contactable power semiconductor module
#3542Hybrid integrated circuit device and method of manufacturing the same
#3543Method of manufacturing a module
#3544Circuit carrier and production thereof
#3545Manufacturing method of electronic components embedded substrate
#3546Electrical or electronic component and method of producing same
#3547Method for mounting passive components on wafer
#3548Method of manufacturing a semiconductor device and a fabrication apparatus for a semiconductor device
#3549Microelectronic substrates with integrated devices
#3550Package assembly for electronic device
#3551Integrating chip scale packaging metallization into integrated circuit die structures
#3552Semiconductor integrated circuit and electronic apparatus having the same
#3553Semiconductor device capable of detecting an open bonding wire using weak current
#3554High frequency circuit block unit, method for producing same, high frequency module device and method for producing same
#3555High-frequency module and method for manufacturing the same
#3556Circuit device and manufacturing method of circuit device
#3557Semiconductor device and method of manufacturing the same
#3558Semiconductor device which employs an interlayer insulating film of a low mechanical strength and a highly reliable metal pad, and a method of manufacturing the same
#3559Solder bump structure and method for forming the same
#3560Semiconductor component arrangement with a reduced oscillation tendency
#3561Methods of processing thick ILD layers using spray coating or lamination for C4 wafer level thick metal integrated flow
#3562Stackable electronic assembly
#3563Thick metal layer integrated process flow to improve power delivery and mechanical buffering
#3564Semiconductor device having transferred integrated circuit
#3565Semiconductor package
#3566Coupler resource module
#3567Bond pad techniques for integrated circuits
#3568Method of forming a bond pad
#3569Electronic part mounting substrate and method for producing same
#3570Direct write™ system
#3571Zero capacitance bondpad utilizing active negative capacitance
#3572Adhesive sheet for producing a semiconductor device
#3573High-frequency chip packages
#3574Integrated circuit package having inductance loop formed from a bridge interconnect
#3575Integrated circuit package having inductance loop formed from same-pin-to-same-bonding-pad structure
#3576Integrated circuit package having an inductance loop formed from a multi-loop configuration
#3577Circuit board and method of manufacturing the same
#3578Electronic parts packaging structure and method of manufacturing the same
#3579Methods for processing semiconductor devices in a singulated form
#3580Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
#3581Microelectronic assemblies with springs
#3582Flip chip die bond pads, die bond pad placement and routing optimization
#3583Circuit device
#3584Semiconductor packaging structure and method for forming the same
#3585Wire bonding method for copper interconnects in semiconductor devices
#3586Method for making contact with electrical contact with electrical contact surfaces of substrate and device with substrate having electrical contact surfaces
#3587Method for creating flip-chip conductive-polymer bumps using photolithography and polishing
#3588Semiconductor memory module
#3589Multi-chip module
#3590Semiconductor device structural body and electronic device
#3591Protection circuit device using MOSFETs and a method of manufacturing the same
#3592Surface mounted electronic circuit module
#3593Contact structures and methods for making same
#3594Method of bonding semiconductor devices
#3595Low-inductance circuit arrangement for power semiconductor modules
#3596High frequency circuit using high output amplifier cell block and low output amplifier cell block
#3597Semiconductor device and method of fabricating the same, circuit board, and electronic instrument
#3598Semiconductor device and its manufacturing method
#3599Electronic device package
#3600Semiconductor device and manufacturing method thereof