Semiconductor device having a flexible board for connection to a semiconductor chip mounted on an insulating substrate

Method of manufacturing multi-layered substrate

Carrying structure of electronic components

Semiconductor device including an under electrode and a bump electrode

Thermal interconnect systems methods of production and uses thereof

Semiconductor device and electronic device

System and method for enhancing wafer chip scale packages

Thermal enhanced low profile package structure

Semiconductor substrate

Substrate for mounting electronic part and electronic part

Method of forming low stress multi-layer metallurgical structures and high reliable lead free solder termination electrodes

Thin passivation layer on 3D devices

Semiconductor device with self-aligning contactless interface

Electronic devices including offset conductive bumps

Multilayer circuit board and method of manufacturing the same

Semiconductor integrated circuit device and vehicle-mounted radar system using the same

Semiconductor device and method of manufacturing the same

Semiconductor device and an image sensing device

Semiconductor device to be applied to various types of semiconductor package

Method for mounting semiconductor chips on a substrate and corresponding assembly

Semiconductor device

ELECTRONIC DEVICE PACKAGE

Semiconductor device having bonding pad of the first chip thicker than bonding pad of the second chip

Method of forming self-passivating interconnects and resulting devices

Semiconductor device suitable for a ferroelectric memory and manufacturing method of the same

Method of manufacturing a semiconductor device

Circuit board and the manufacturing method

Top via pattern for bond pad structure

Stacked semiconductor package

Method, device and system for bonding a semiconductor element

Holder for electronic component, holding sheet for electronic component, electronic module using holder, electronic module using holding sheet, lamination of electronic modules, method for manufacturing electronic module, and method for testing electronic module

Low capacitance solder bump interface structure

Method for producing a semiconductor device and resulting device

Semiconductor package fabrication

Apparatus and method for predetermined component placement to a target platform

Semiconductor device and method of manufacturing the same

Copper interconnection with conductive polymer layer and method of forming the same

Semiconductor device, semiconductor body and method of manufacturing thereof

Semiconductor package and method for manufacturing the same

High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package

LOCAL MULTILAYERED METALLIZATION

Method for manufacturing flip-chip type semiconductor device featuring nickel electrode pads, and plating apparatus used in such method

Nano memory, light, energy, antenna and strand-based systems and methods

Semiconductor device having a plastic housing and external connections and method for producing the same

Stacked integrated circuits package system with dense routability and high thermal conductivity

MOSFET package

MOSFET package

Method of manufacturing semiconductor device

Underfill encapsulant for wafer packaging and method for its application

Circuit device and manufacturing method thereof

Manufacturing method for electronic device

Connection technology for power semiconductors comprising a layer of electrically insulating material that follows the surface contours

Integrated connection arrangements

Embedded chip printed circuit board and method of manufacturing the same

Dual metal stud bumping for flip chip applications

Method for integrating an electronic component or similar into a substrate

Method of manufacturing semiconductor device

Substrate assembly with direct electrical connection as a semiconductor package

High frequency arrangement

Semiconductor device

Semiconductor package and method for manufacturing the same

Semiconductor device, method of manufacturing the same, capacitor structure, and method of manufacturing the same

Component arrangement for series terminal for high-voltage applications

Semiconductor device and method of manufacturing the same

Method and system for transferring dies between surfaces

Implantable, tissue conforming drug delivery device

Method for fabricating semiconductor packages with semiconductor chips

Package or pre-applied foamable underfill for lead-free process

Interposers with flexible solder pad elements

Antenna designs for radio frequency identification tags

Semiconductor device and method of manufacture thereof, circuit board and electronic instrument

Efficient method of forming and assembling a microelectronic chip including solder bumps

Semiconductor device featuring probe area definition mark for defining probe area in electrode pad, and proof test system for proving proper contact of test probe with probe area

Module structure having embedded chips

Circuit board and semiconductor device

High-density inter-die interconnect structure

Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipment

Semiconductor device with sense structure

System-in-package wireless communication device comprising prepackaged power amplifier

Method of manufacturing semiconductor device and method of treating electrical connection section

Semiconductor device and manufacturing method thereof

Interconnection structure through passive component

Semiconductor module including circuit component and dielectric film, manufacturing method thereof, and application thereof

Electronic component, electro-optical device, and electronic apparatus

Flip-chip package structure with direct electrical connection of semiconductor chip

Reader / writer and method for manufacturing the same

Printed-circuit board and circuit unit incorporating the circuit board

Contact maker for power semiconductor modules and disc cells

Method and apparatus for providing structural support for interconnect pad while allowing signal conductance

Heat conductive sheet, manufacturing method of the same, and manufacturing method of a liquid crystal display using the same

Semiconductor apparatus and manufacturing method

Package for gallium nitride semiconductor devices

On-pad broadband matching network

Semiconductor device with split pad design

Assembly comprising functional devices and method of making same

Electronic parts packaging structure

BGA package substrate and method of fabricating same

Semiconductor package having passive component disposed between semiconductor device and substrate

Printed circuit board including embedded chips and method of fabricating the same using plating

NANO IC packaging

Flip chip contact (FCC) power package

Coupler resource module

Method of forming contact pads

Method for producing a module including an integrated circuit on a substrate and an integrated module manufactured thereby

Solder structures for out of plane connections

Integrated circuit packaging device and method for matching impedance

Power semiconductor device

Semiconductor device and radio communication device

Electronic device including a substrate structure and a process for forming the same

Method of marking a low profile packaged semiconductor device

Package that integrates passive and active devices with or without a lead frame

Thermally controlled fluidic self-assembly

Module

Semiconductor device and manufacturing method therefor

Package for a high-frequency electronic device

Repairable three-dimensional semiconductor subsystem

Semiconductor device, method for manufacturing semiconductor device, circuit board, and electronic instrument

Semiconductor die positioning system and a method of bonding a semiconductor die to a substrate

Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument

Package structure with embedded chip and method for fabricating the same

Electrical or electronic component and method of producing same

Fabrication of stacked die and structures formed thereby

Protection of an integrated capacitor

B-stageable underfill encapsulant and method for its application

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Multi-chip module

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Circuit boards, electronic devices, and methods of manufacturing thereof

Micro-C-4 semiconductor die and method for depositing connection sites thereon

Method of manufacturing a device-incorporated substrate

Semiconductor memory device and defect remedying method thereof

Fabricating stacked chips using fluidic templated-assembly

Semiconductor device, its manufacturing method, and radio communication device

Semiconductor device and method of fabricating the same, circuit board, and electronic instrument

Microelectronic assemblies incorporating inductors

Semiconductor device having low-k dielectric film in pad region and method for manufacture thereof

Semiconductor device, and method for manufacturing the same

Ultra-thin semiconductor package device and method for manufacturing the same

Structure of embedded active components and manufacturing method thereof

Radio frequency identification (RFID) tag for an item having a conductive layer included or attached

Probe arrays and method for making

Integrated circuit component and mounting method thereof

Structure of electronic package and method for fabricating the same

Circuit board with embedded component and method of manufacturing same

Method for mounting an electronic element on a wiring board

Power amplifier module

Module substrate and disk apparatus

Electronic device package and electronic equipment

Flip-chip component

Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same

Method for flip-chip mounting utilizing a delay curing-type adhesive with two-part hardening resin

Semiconductor device and method of manufacture thereof, circuit board and electronic instrument

Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same

Electronic device package and electronic equipment

Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument

Semiconductor device having through electrode and method of manufacturing the same

Structured semiconductor element for reducing charging effects

Interconnect including a pliable surface and use thereof

Structure and method for contact pads having an overcoat-protected bondable metal plug over copper-metallized integrated circuits

Methods of manufacturing interposers with flexible solder pad elements

Bond pad structure for integrated circuit chip

Semiconductor chip with passivation layer comprising metal interconnect and contact pads

Bond pad structure with stress-buffering layer capping interconnection metal layer

Functional coating of the SCFM preform

Multi-layer integrated semiconductor structure having an electrical shielding portion

Circuit carrier and production thereof

Semiconductor device and method of manufacturing the same

Plating method, semiconductor device fabrication method and circuit board fabrication method

Plating method, semiconductor device fabrication method and circuit board fabrication method

Methods of making microelectronic packages with conductive elastomeric posts

Soldered material, semiconductor device, method of soldering, and method of manufacturing semiconductor device

Integrated circuit package having inductance loop formed from same-pin-to-same-bonding-pad structure

Semiconductor device and its manufacturing method

Method of manufacturing electric device

Polymer encapsulated dicing lane (PEDL) technology for Cu/low/ultra-low k devices

Stacked die module

Thick metal layer integrated process flow to improve power delivery and mechanical buffering

Power transistor including a leadframe and a semiconductor chip arranged on the leadframe

Electronic parts packaging structure and method of manufacturing the same

Fabrication of stacked die and structures formed thereby

Inverter and vehicle drive unit using the same

Integrated circuit with at least one bump

Semiconductor substrate thinning method for manufacturing thinned die

Die down ball grid array package

Circuit-connecting material and circuit terminal connected structure and connecting method

Solder foil, semiconductor device and electronic device

Production methods for a leadframe and electronic devices

Electronic circuit including circuit-connecting material

Semiconductor device having a switch circuit

Chip structure

Semiconductor device and fabrication process thereof

Wire bond pads

Method for producing bumps on an electrical component

Thin glass chip for an electronic component and manufacturing method

Silicone-based adhesive sheet, method of bonding a semiconductor chip to a chip attachment component, and a semiconductor device

Thermally controlled fluidic self-assembly

Semiconductor equipment having a pair of heat radiation plates

Microelectronic device chip including hybrid Au bump, package of the same, LCD apparatus including microelectronic device chip and method of fabricating microelectronic device chip

Semiconductor composite device, LED head that employs the semiconductor composite device, and image forming apparatus that employs the LED head

Top layers of metal for high performance IC's

Semiconductor device manufacturing method and electronic equipment using same

Microprobe tips and methods for making

Thermally controlled fluidic self-assembly method and support

Electronic device and method of manufacturing the same

Post passivation interconnection structures

Post passivation interconnection process and structures

Integrated semiconductor circuit and method for producing an integrated semiconductor circuit

Methods of making microelectronic assemblies including compliant interfaces

Post passivation interconnection process and structures

Method for connecting a chip and a substrate

Method for assembling micro-components to binding sites

Semiconductor device having laminated structure

Top layers of metal for high performance IC's

Semiconductor device and process for manufacturing the same

Semiconductor integrated circuit device which restricts an increase in the area of a chip, an increase in the number of lead terminals of a package, and can reduce parasitic inductance

Integrated inductors and compliant interconnects for semiconductor packaging

Submember mounted on a chip of electrical device for electrical connection

High frequency module and manufacturing method thereof

Method and resulting structure for manufacturing semiconductor substrates

Probe for semiconductor devices

Stacked packages

Power gridding scheme

Microwave-monolithic-integrated-circuit-mounted substrate, transmitter device for transmission only and transceiver device for transmission/reception in microwave-band communication

Power gridding scheme

Package structure

Apparatus and method for printing micro metal structures

Methods of forming a contact array in situ on a substrate

Circuit device manufacturing method

Methods of forming lead free solder bumps

Component arrangement having an evaluation circuit for detecting wear on connections

Pressure-contact type semiconductor device

Interposer with flexible solder pad elements and methods of manufacturing the same

Semiconductor device, power converter device using it, and hybrid vehicle using the power converter device

Semiconductor device and manufacturing method thereof

Chip structure with redistribution traces

Semiconductor device and a manufacturing method of the same

Image sensor packaging structure

Apparatus and method for printing micro metal structures

Structure of gold bumps and gold conductors on one IC die and methods of manufacturing the structures

Device having contact pad with a conductive layer and a conductive passivation layer

Method for mounting a chip on a base and arrangement produced by this method

Bonding configurations for lead-frame-based and substrate-based semiconductor packages

Electronic part-containing elements, electronic devices and production methods

Electronic module with layer of adhesive and process for producing it

Circuit-connecting material and circuit terminal connected structure and connecting method

Method of fabricating an electronic component having at least one semiconductor chip on a circuit carrier with elastic external contacts

Top layers of metal for high performance IC's

Method for producing a component comprising a conductor structure that is suitable for use at high frequencies

Method for forming robust solder interconnect structures by reducing effects of seed layer underetching

Dicing sheet, manufacturing method thereof, and manufacturing method of semiconductor apparatus

Substrate having built-in semiconductor apparatus and manufacturing method thereof

Electronic device package

Substrate based unmolded package

Semiconductor integrated circuit device

Substrate based unmolded package

Electrode contact structure

Chip-to-chip trench circuit structure

Direct connection multi-chip semiconductor element structure

Wafer level mounting frame with passive components integration for ball grid array packaging

Modular board device, high frequency module, and method of manufacturing same

Method of stacking wafers with anisotropic conductive adhesive

Leadless semiconductor package and method for manufacturing the same

Electronic device package

Semiconductor device with magnetically permeable heat sink

Methods of forming vias in multilayer substrates

Circuit apparatus provided with asperities on substrate surface

Adhesion and/or encapsulation of silicon carbide-based semiconductor devices on ceramic substrates

Die attach area cut-on-fly method and apparatus

Capillary for wire bonding

Bonding apparatus, bonding method, and method for manufacturing semiconductor device

Semiconductor layer structure and method of making the same

High density bonding of electrical devices

Semiconductor device with base support structure

Semiconductor bonding and layer transfer method

Semiconductor memory device

Multiple device package

Vertical memory device structures

Wafer bonding method

Semiconductor device

Stackable semiconductor chip layer comprising prefabricated trench interconnect vias

Compound semiconductor device and manufacturing method thereof

Stress mitigation layer to reduce under bump stress concentration

High density multilayer circuit module

High density chip scale leadframe package and method of manufacturing the package

Semiconductor device having inductor

Separately strained N-channel and P-channel transistors

Compound semiconductor device and manufacturing method thereof

Spread spectrum isolator

Method of manufacturing semiconductor device

Method for forming interconnects on thin wafers

RF isolator for isolating voltage sensing and gate drivers

RF isolator with differential input/output

Methods for making electronic devices with small functional elements supported on a carriers

Electronic devices with small functional elements supported on a carrier

Method of making photolithographically-patterned out-of-plane coil structures

Semiconductor device and method capable of scribing chips with high yield

Semiconductor device that improves electrical connection reliability

Build-up structures with multi-angle vias for Chip to Chip interconnects and optical bussing

Component built-in module and method for producing the same