Method of forming a semiconductor device including a stress buffer material formed above a low-k metallization system

Integrated circuit packaging system with through silicon via base and method of manufacture thereof

Low noise high thermal conductivity mixed signal package

Semiconductor package and method of manufacturing the same

Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipation

Electronic device, method of producing the same, and semiconductor device

Method for the low-temperature pressure sintering of electronic units to heat sinks

Manufacturing process for embedded semiconductor device

Electronic component module and method of manufacturing the electronic component module

METHOD OF DESIGNING SEMICONDUCTOR INTEGRATED CIRCUIT, DESIGNING APPARATUS, SEMICONDUCTOR INTEGRATED CIRCUIT SYSTEM, SEMICONDUCTOR INTEGRATED CIRCUIT MOUNTING SUBSTRATE, PACKAGE AND SEMICONDUCTOR INTEGRATED CIRCUIT

Semiconductor package having discrete components and system containing the package

Semiconductor chip package

Semiconductor chip package

Semiconductor device and method of manufacturing the same

SEMICONDUCTOR DIE PACKAGE INCLUDING LEADFRAME WITH DIE ATTACH PAD WITH FOLDED EDGE

Liner formation in 3DIC structures

Solder interconnect pads with current spreading layers

Semiconductor device and method of manufacturing semiconductor device

Three-dimensional integrated circuit structure

Method of making an integrated circuit package with shielding via ring structure

Method of forming monolithic CMOS-MEMS hybrid integrated, packaged structures

Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereof

Lead frame routed chip pads for semiconductor packages

THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURE

Power converter integrated circuit floor plan and package

Formation of TSV backside interconnects by modifying carrier wafers

Method of manufacturing semiconductor device

Adhesive, method of connecting wiring terminals and wiring structure

Linked semiconductor module unit and electronic circuit-integrated motor vehicle device using same

ELECTRONIC COMPONENT AND MANUFACTURE METHOD THEREOF

Electrical property altering, planar member with solder element in IC chip package

Bond pad with integrated transient over-voltage protection

Semiconductor chip

Circuit board having semiconductor chip

Method for forming integrated circuit assembly

ADHESIVE, METHOD OF CONNECTING WIRING TERMINALS AND WIRING STRUCTURE

Semiconductor device and manufacturing method thereof

Multilayer printed wiring board

Integrated circuit packaging system with interposer and method of manufacture thereof

Semiconductor device

Surface depressions for die-to-die interconnects and associated systems

Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die

Packaged integrated circuit devices with through-body conductive vias, and methods of making same

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE HAVING AN EVEN COATING THICKNESS USING ELECTRO-LESS PLATING AND RELATED DEVICE

PRINTED WIRING BOARD, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

Applying chiplets to substrates

Explosion-proof module structure for power components, particularly power semiconductor components, and production thereof

Semiconductor substrate with interlayer connection and method for production of a semiconductor substrate with interlayer connection

Through-silicon via structure and a process for forming the same

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Interconnect structures having lead-free solder bumps

Methods to fabricate integrated circuits by assembling components

Processes and structures for IC fabrication

Methods for interconnecting bonding pads between components

Processes and structures for IC fabrication

Processes and structures for beveled slope integrated circuits for interconnect fabrication

High-voltage semiconductor device

Radio frequency unit analog level detector and feedback control system

Semiconductor device and method for manufacturing the same

Semiconductor integrated circuit device

Method of manufacturing an electronic device

Semiconductor device and method of forming an interconnect structure with TSV using encapsulant for structural support

CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE AND METHOD FOR PRODUCING THE SAME

Processed wafer via

Method of manufacturing electronic device and electronic device

Thermal interface material and method of using the same and electronic assembly having the same

Power electronics power module with imbedded gate circuitry

Structure and method for power field effect transistor

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Packaged electronic devices having die attach regions with selective thin dielectric layer

Semiconductor device

Semiconductor device package structure and method for the same

Wiring board and method for manufacturing the same

Composite multi-layer substrate and module using the substrate

Electronic component mounting structure, electronic component mounting method, and electronic component mounting board

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, CIRCUIT SUBSTRATE, ELECTRO-OPTICAL APPARATUS, AND ELECTRONIC EQUIPMENT

Semiconductor device including double-sided multi-electrode chip embedded in multilayer wiring substrate

STACKABLE SEMICONDUCTOR CHIP LAYER COMPRISING PREFABRICATED TRENCH INTERCONNECT VIAS

System-in packages

Substrate structure

3D integration structure and method using bonded metal planes

Semiconductor chip package

Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure

Semiconductor device and method of forming a 3D inductor from prefabricated pillar frame

Power semiconductor devices integrated with clamp diodes having separated gate metal pads to avoid breakdown voltage degradation

Die down ball grid array packages and method for making same

Packaging techniques and configurations

Semiconductor chip and semiconductor device including the same

Structure and method for forming a capacitively coupled chip-to-chip signaling interface

Semiconductor device

In-situ cavity integrated circuit package

Package on package having a conductive post with height lower than an upper surface of an encapsulation layer to prevent circuit pattern lift defect and method of fabricating the same

Dicing structures for semiconductor substrates and methods of fabrication thereof

Semiconductor device and method of manufacturing the same

DIE ATTACH FILM-PROVIDED DICING TAPE AND PRODUCTION PROCESS OF SEMICONDUCTOR DEVICE

Electronic component for surface mounting

Semiconductor module

Semiconductor device

Reworkable electronic device assembly and method

Wafer backside structures having copper pillars

Shielding for a micro electro-mechanical device and method therefor

Method of interconnecting electronic wafers

Method of making electronic device

Thermally enhanced wafer level package

SEMICONDUCTOR DEVICE

High quality electrical contacts between integrated circuit chips

Method for connecting two joining surfaces

Dual Interconnection in Stacked Memory and Controller Module

Semiconductor device and method of forming conductive pillars in recessed region of peripheral area around the device for electrical interconnection to other devices

Electrically conductive bonding material, method of bonding with the same, and semiconductor device bonded with the same

Semiconductor device and method for manufacturing the same

Receive circuit for connectors with variable complex impedance

Circuit device, method of manufacturing the circuit device, device mounting board and semiconductor module

Semiconductor chip package

Semiconductor device and method of forming high-frequency circuit structure and method thereof

Semiconductor integrated circuit device and method of manufacturing same

Metal wiring structures for uniform current density in C4 balls

Manufacturing method of semiconductor integrated circuit device

Remote chip attachment

Semiconductor device capable of switching operation modes

Electrode structure and its manufacturing method, and semiconductor module

Ball-limiting-metallurgy layers in solder ball structures

Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer

Semiconductor die package and method for making the same

Pre-molded clip structure

Pre-molded clip structure

Method of transferring device

Method of manufacturing a semiconductor device including plural semiconductor chips

STACK-TYPE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Systems and methods for printing electronic device assembly

Semiconductor optical communication module and manufacturing method thereof

Electronic board, method of manufacturing the same, and electronic device

RF POWER AMPLIFIER CIRCUIT UTILIZING BONDWIRES IN IMPEDANCE MATCHING

Semiconductor package having underfill agent dispersion

Three-dimensional semiconductor architecture

Semiconductor device

CARBON NANOTUBE CONTACT STRUCTURES FOR USE WITH SEMICONDUCTOR DIES AND OTHER ELECTRONIC DEVICES

Methods and apparatuses for assembling components onto substrates

Method of handling a thin wafer

Integrated circuit chip using top post-passivation technology and bottom structure technology

CONNECTION MEMBER AND PRINTED CIRCUIT BOARD UNIT

Method and apparatus for distributing a thermal interface material

Method of forming a sensing circuit and structure therefor

Integrated circuit package system with multiple device units and method for manufacturing thereof

Chip packages

Semiconductor device and method of forming a thin wafer without a carrier

Semiconductor device and method of forming enhanced UBM structure for improving solder joint reliability

Stackable electronics package and method of fabricating same

Stackable electronic package

Semiconductor device and method of forming no-flow underfill material around vertical interconnect structure

Integrated circuit having wiring structure, solid image pickup element having the wiring structure, and imaging device having the solid image pickup element

Multilayer wiring substrate having a castellation structure

Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module

Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument

Power module

Barrier for through-silicon via

Semiconductor Substrate and Method of Forming Conformal Solder Wet-Enhancement Layer on Bump-on-Lead Site

Semiconductor device and method of providing z-interconnect conductive pillars with inner polymer core

Semiconductor device and method of mounting pre-fabricated shielding frame over semiconductor die

Making a semiconductor device having conductive through organic vias

Semiconductor device and method for manufacturing the same

Multiple layer strain gauge

System for improving flip chip performance

Semiconductor die and method of forming noise absorbing regions between THVS in peripheral region of the die

Semiconductor Carrier for Multi-Chip Packaging

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Printed wiring board, printed IC board having the printed wiring board, and method of manufacturing the same

Integrated circuit for driving semiconductor device and power converter

Three-dimensional system-in-package architecture

System and method for stacked die embedded chip build-up

Stress buffering package for a semiconductor component

Mounted body and method for manufacturing the same

Routable array metal integrated circuit package

Leadless integrated circuit package having standoff contacts and die attach pad

Leadless integrated circuit package having electrically routed contacts

Leadless integrated circuit package having standoff contacts and die attach pad

Stress barrier structures for semiconductor chips

Two-sided semiconductor structure

TCP-type semiconductor device

Adhesive composition, electronic-component-mounted substrate and semiconductor device using the adhesive composition

Electronic substrate, semiconductor device, and electronic device

Metallization system of a semiconductor device including metal pillars having a reduced diameter at the bottom

Chip capacitive coupling

Integrated circuit mounted board, printed wiring board, and method of manufacturing integrated circuit mounted board

DIE ATTACH AREA CUT-ON-FLY METHOD AND APPARATUS

Semiconductor device and method of forming through vias with reflowed conductive material

Integrated circuit micro-module

Semiconductor device and method of forming through vias with reflowed conductive material

Integrated circuit micro-module

Integrated circuit micro-module

Integrated circuit micro-module

Integrated circuit micro-module

Integrated circuit micro-module

Apparatus having thermal-enhanced and cost-effective 3D IC integration structure with through silicon via interposers

Semiconductor Module, Terminal Strip, Method for Manufacturing Terminal Strip, and Method for Manufacturing Semiconductor Module

Reduced-crosstalk wirebonding in an optical communication system

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

MODULE, CIRCUIT BOARD, AND MODULE MANUFACTURING METHOD

Semiconductor device packages with electromagnetic interference shielding

Process for placing, securing and interconnecting electronic components

Electronic component bonding method and apparatus using vibration energy

Semiconductor package and method for manufacturing the same for decreasing number of processes

Method for fabricating semiconductor packages with discrete components

Electronic module with EMI protection

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device and a method of manufacturing the same

Package structure for wireless communication module

Method of forming top electrode for capacitor and interconnection in integrated passive device (IPD)

SUPER GTO-BASED POWER BLOCKS

Large substrate structural vias

Anisotropic conductive adhesive

Coaxial through chip connection

Dicing film having shrinkage release film and method for manufacturing semiconductor package using the same

Integrated multicomponent device in a semiconducting die

Electronic member, electronic part and manufacturing method therefor

Barrier structures and methods for through substrate vias

WAFER LEVEL, CHIP SCALE SEMICONDUCTOR DEVICE PACKAGING COMPOSITIONS, AND METHODS RELATING THERETO

Reinforced structure for a stack of layers in a semiconductor component

Wiring substrate with a wire terminal

Semiconductor device including semiconductor constituent

Memory card and method for manufacturing memory card

Method of disposing an electronic device on an electrode formed on substrate

THREE-DIMENSIONAL SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Power device and a method for controlling a power device

Through-Silicon Via Sidewall Isolation Structure

Reduced bottom roughness of stress buffering element of a semiconductor component

Method for manufacturing a semiconductor component and structure therefor

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING THE SAME

Monolithic semiconductor switches and method for manufacturing

Semiconductor device and production method therefor

Method for packing electric components on a substrate

FLUIDIC SELF-ASSEMBLY FOR SYSTEM INTEGRATION

Semiconductor device

Semiconductor device including single circuit element for soldering

CONTACT STRUCTURE FOR A SEMICONDUCTOR AND METHOD FOR PRODUCING THE SAME

Method of forming an isolation structure

Semiconductor device and method for manufacturing

Methods and applications of non-planar imaging arrays

Substrate having optional circuits and structure of flip chip bonding

Contact pad supporting structure and integrated circuit for crack suppresion

Method and apparatus for stacked die package with insulated wire bonds

Through-silicon via with low-K dielectric liner

Electronic device and electronic apparatus

Isolation Structure for Stacked Dies

Structure and process for a contact grid array formed in a circuitized substrate

SEMICONDUCTOR PACKAGE SUBSTRATE WITH METAL BUMPS

Through-silicon via with air gap

Backside metal of redistribution line with silicide layer on through-silicon via of semiconductor chips

SEMICONDUCTOR DEVICE INCLUDING A COST-EFFICIENT CHIP-PACKAGE CONNECTION BASED ON METAL PILLARS

Semiconductor device and method of confining conductive bump material during reflow with solder mask patch

Semiconductor chip, semiconductor mounting module, mobile communication device, and process for producing semiconductor chip

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Semiconductor device

Semiconductor device

Semiconductor device

Semiconductor device and method of forming recessed conductive vias in saw streets

Power module having stacked flip-chip and method of fabricating the power module

Method for forming thin film resistor and terminal bond pad simultaneously

Silicon interposer testing for three dimensional chip stack

Nano memory, light, energy, antenna and strand-based systems and methods

Microprobe Tips and Methods for Making

Wiring board and method for manufacturing the same

Doping of lead-free solder alloys and structures formed thereby

Semiconductor device and manufacturing method of a semiconductor device

Semiconductor element and electrical apparatus

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

Semiconductor device and method for fabricating the same

Semiconductor device with a vertical interconnect structure for 3-D FO-WLCSP

Double-sided semiconductor device and method of forming top-side and bottom-side interconnect structures

Semiconductor die package including low stress configuration

Electronic devices including flexible electrical circuits and related methods

Semiconductor die package with clip interconnection

Thermally enhanced electronic package

Semiconductor device and method of forming topside and bottom-side interconnect structures around core die with TSV

Semiconductor device having a mounting substrate with a capacitor interposed therebetween

Semiconductor element and electrical apparatus

NANOTUBE ESD PROTECTIVE DEVICES AND CORRESPONDING NONVOLATILE AND VOLATILE NANOTUBE SWITCHES

Method of mounting electronic circuit constituting member and relevant mounting apparatus

Method for manufacturing passive device and semiconductor package using thin metal piece

Semiconductor device and fabrication method thereof

ELECTRONIC, IN PARTICULAR MICROELECTRONIC, FUNCTIONAL GROUP AND METHOD FOR ITS PRODUCTION

Semiconductor device including DC-DC converter

Method of forming bump structure having tapered sidewalls for stacked dies

Semiconductor device and method of forming conductive pillars in recessed region of peripheral area around the device for electrical interconnection to other devices

Semiconductor device and method of forming bond wires and stud bumps in recessed region of peripheral area around the device for electrical interconnection to other devices

Semiconductor device and method of forming an IPD beneath a semiconductor die with direct connection to external devices

Semiconductor package with semiconductor core structure and method of forming same

Triaxial through-chip connection

Semiconductor package and method of forming Z-direction conductive posts embedded in structurally protective encapsulant

Wire-on-lead package system having leadfingers positioned between paddle extensions and method of manufacture thereof

Semiconductor device and method of forming compliant polymer layer between UBM and conformal dielectric layer/RDL for stress relief

Package for Semiconductor Devices

Bonding tool, electronic component mounting apparatus and electronic component mounting method

CIRCUIT-CONNECTING MATERIAL, AND CONNECTION STRUCTURE FOR CIRCUIT MEMBER

Method for manufacturing semiconductor device

Semiconductor device having electrode pad, and wireless circuit device including the semiconductor device

Semiconductor device and method of forming an interposer package with through silicon vias

ELECTRONIC CIRCUIT WITH EMBEDDED MEMORY

Semiconductor integrated circuit device

A POWER SEMICONDUCTOR ARRANGEMENT AND A SEMICONDUCTOR VALVE PROVIDED THEREWITH