Method of manufacturing electronic component built-in substrate

Capacitive isolation circuitry

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

Semiconductor device and method of supporting a wafer during backgrinding and reflow of solder bumps

Solder structures including barrier layers with nickel and/or copper

Semiconductor device and manufacturing method thereof

INTEGRATED CIRCUIT DEVICE AND METHOD FOR FABRICATING SAME

Thermal interface material design for enhanced thermal performance and improved package structural integrity

Wirebond over post passivation thick metal

Solder interconnect pads with current spreading layers

Semiconductor device and method of manufacturing semiconductor device

ELECTRICAL DEVICE AND METHOD OF MANUFACTURING ELECTRICAL DEVICES USING FILM EMBOSSING TECHNIQUES TO EMBED INTEGRATED CIRCUITS INTO FILM

System and method for integrated waveguide packaging

Electronic parts packaging structure and method of manufacturing the same

Semiconductor device and a method of manufacturing the same

Method of manufacturing printed wiring board with built-in electronic component

Method of manufacturing printed wiring board with built-in electronic component

Semiconductor device and method of manufacturing the same

Embedded die system and method

METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE

Method of producing electro-optical device using anisotropic conductive adhesive containing conductive particles to bond terminal portions and electro-optical device

Integrated circuit with supply line intra-chip clock interface and methods for use therewith

Semiconductor device including wiring and manufacturing method thereof

Integrated module for data processing system

Hermetically-packaged devices, and methods for hermetically packaging at least one device at the wafer level

Semiconductor device package and method of making a semiconductor device package

Semiconductor device packages with electromagnetic interference shielding

Semiconductor device packages with electromagnetic interference shielding

Electronic device and method of manufacturing same

Semiconductor device

Semiconductor device, method of manufacturing thereof, signal transmission/reception method using such semiconductor device, and tester apparatus

Manufacturing process and structure for embedded semiconductor device

Method of manufacturing semiconductor device

Multilayer wiring board with concave portion for accomodating electronic component

Dual metal stud bumping for flip chip applications

Semiconductor power device with bias circuit

Method of forming a semiconductor package and structure thereof

High performance system-on-chip inductor using post passivation process

Process for producing semiconductor device and apparatus therefor

Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument

Optoelectronic headlight, method for production of an optoelectronic headlight and a luminescence diode chip

Solid image capture device and electronic device incorporating same

Structure of embedded active components and manufacturing method thereof

Electronic module having a multi-layer conductor for reducing its resistivity and a method of assembling such a module

Solder contacts and methods of forming same

High power integrated RF amplifier

Semiconductor device, circuit board, and electronic instrument

Module with Flat Construction and Method for Placing Components

ELECTRONIC COMPONENT, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE

Semiconductor Device and Method of Forming the Device Using Sacrificial Carrier

Packaged integrated circuits having inductors and methods to form inductors in packaged integrated circuits

PACKAGED INTEGRATED CIRCUITS HAVING SURFACE MOUNT DEVICES AND METHODS TO FORM PACKAGED INTEGRATED CIRCUITS

WIRE BONDING OF ALUMINUM-FREE METALLIZATION LAYERS BY SURFACE CONDITIONING

Semiconductor chip having conductive member for reducing localized voltage drop

SEMICONDUCTOR STACK DEVICE AND MOUNTING METHOD

Semiconductor device with optical sensor and method of forming interconnect structure on front and backside of the device

Semiconductor chip

Low profile wire bonded USB device

Scalable radio receiver architecture providing three-dimensional packaging of multiple receivers

Forming robust solder interconnect structures by reducing effects of seed layer underetching

Semiconductor package board using a metal base

ELECTRONIC COMPONENTS MOUNTING ADHESIVE, MANUFACTURING METHOD OF AN ELECTRONIC COMPONENTS MOUNTING ADHESIVE, ELECTRONIC COMPONENTS MOUNTED STRUCTURE, AND MANUFACTURING METHOD OF AN ELECTRONIC COMPONENTS MOUNTED STRUCTURE

Semiconductor element chip, ink jet head employing semiconductor element chip, and method for bonding electrodes of semiconductor element chip

Surface-mount type crystal oscillator

Semiconductor element, semiconductor device, and fabrication method thereof

Introducing a metal layer between SiN and TiN to improve CBD contact resistance for P-TSV

Structure and process for the formation of TSVs

Semiconductor chip, method of fabricating the same and semiconductor chip stack package

SEMICONDUCTOR MODULE MOUNTING STRUCTURE

Semiconductor device and method of forming integrated passive device module

Multi-die wafer level packaging

Thermal enhanced low profile package structure and method for fabricating the same

Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer

Integrated circuit package system for shielding electromagnetic interference

Electronic device including an inductor

Method of manufacturing flexible semiconductor assemblies

ELECTRONIC COMPONENT DEVICE, METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE, ELECTRONIC COMPONENT ASSEMBLY, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT ASSEMBLY

Top layers of metal for high performance IC's

Post passivation interconnection schemes on top of the IC chips

MULTI-LAYERED WIRING SUBSTRATE, METHOD FOR PRODUCING THE SAME, AND SEMICONDUCTOR DEVICE

LCD Driver IC and Method for Manufacturing the Same

Wafer level package integration and method

Wafer level semiconductor package and method for manufacturing the same

SEMICONDUCTOR PACKAGE STRUCTURE, APPLICATIONS THEREOF AND MANUFACTURING METHOD OF THE SAME

Semiconductor module with switching components and driver electronics

Semiconductor device including a die region designed for aluminum-free solder bump connection and a test structure designed for aluminum-free wire bonding

ENCAPSULATED EPOXY RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE

Isolating chip-to-chip contact

Method for making a device including placing a semiconductor chip on a substrate

Method and apparatus for manufacturing semiconductor module

FILM-LIKE ADHESIVE AND METHOD FOR CARRYING THE SAME

Semiconductor apparatus

Flat Display Device

Soldering Method, Method for Manufacturing Semiconductor Module, and Soldering Apparatus

Electronic circuit device and method for manufacturing same

Substrate based unmolded package

High-volume on-wafer heterogeneous packaging of optical interconnects

Multilayer printed wiring board

Stacked-die package for battery power management

Device for measuring thickness and square resistivity of interconnecting lines

THERMAL CONDUCTOR LIDS FOR AREA ARRAY PACKAGED MULTI-CHIP MODULES AND METHODS TO DISSIPATE HEAT FROM MULTI-CHIP MODULES

Semiconductor power module packages with simplified structure and methods of fabricating the same

APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Substrate for mounting electronic part and electronic part

Wiring board and method for manufacturing the same

THERMOCOMPRESSION BONDING HEAD AND MOUNTING DEVICE USING THE SAME

Integrated circuit with intra-chip clock interface and methods for use therewith

Semiconductor device and a method of manufacturing the same

Flexible interposer for stacking semiconductor chips and connecting same to substrate

MANUFACTURING METHOD OF SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS

Gold alloy wire for bonding wire having high bonding reliability, high roundness of compression ball, high straightness and high resin flowability resistance

Component with bonding adhesive

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Mounted structure

Electronic component

Robust multi-layer wiring elements and assemblies with embedded microelectronic elements

Apparatus for electrically coupling a semiconductor package to a printed circuit board

Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument

Wafer bonding method

Modular chip integration techniques

Substrate anchor structure and method

Packaged gallium nitride material transistors and methods associated with the same

Assembly comprising a functional device and a resonator and method of making same

Solder-top enhanced semiconductor device for low parasitic impedance packaging

Semiconductor device

Semiconductor integrated circuit device, PDP driver, and plasma display panel

SEMICONDUCTOR DEVICE

Semiconductor structure and method of manufacture

Semiconductor chip with coil element over passivation layer

Image display unit with light emitting devices having a resin surrounding the light emitting devices

Power recovery circuit based on partial standing waves

Electrically enhanced wirebond package

Method of manufacturing a semiconductor component with a low cost leadframe using a non-metallic base structure

Through-silicon vias and methods for forming the same

Gold alloy wire for bonding wire having high initial bondability, high bonding reliability, high roundness of compression ball, high straightness, and high resin flowability resistance

Wiring terminal-connecting adhesive

Integrated circuit package including wire bonds

Semiconductor device comprising a housing containing a triggering unit

Layout schemes and apparatus for high performance DC-DC output stage

Semiconductor apparatus, manufacturing method of semiconductor apparatus, and joint material

Thermally enhanced wafer level package

Semiconductor device

Wiring board and method of manufacturing the same

Circuit module and radio communications equipment, and method for manufacturing circuit module

Stack structure of circuit boards embedded with semiconductor chips

On-chip identification circuit incorporating pairs of conductors, each having an essentially random chance of being shorted together as a result of process variations

Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device

Semiconductor device having interconnected contact groups

Heat-resistant resin paste and method for producing same

Shielding Apparatus and Manufacturing Method Thereof

Electronic circuit device and electronic key transceiver

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Power semiconductor arrangement

Semiconductor component comprising copper metallizations

Three-dimensional LADAR module with alignment reference insert circuitry comprising high density interconnect structure

MULTI-BAND TUNABLE RESONANT CIRCUIT

Method of testing using a temporary chip attach carrier

Integrated circuit package system with multiple device units

Stacked dual-die packages, methods of making, and systems incorporating said packages

Semiconductor device with conductive die attach material

Semiconductor device having low dielectric insulating film and manufacturing method of the same

Semiconductor device having low dielectric insulating film and manufacturing method of the same

Semiconductor device and method of forming interconnect structure in non-active area of wafer

Integrated circuit packaging system with passive components

Semiconductor device including electronic component coupled to a backside of a chip

Large substrate structural vias

Air cavity package for flip-chip

Center Conductor to Integrated Circuit for High Frequency Applications

Semiconductor device

Three dimensional packaging optimized for high frequency circuitry

Electromagnetic shield formation for integrated circuit die package

Power integrated circuit with high insensitivity to parasitic inductances of wires for connection to a package and package for said integrated circuit

High voltage interlock system and control strategy

Minimizing the number of external terminals required when compensation is to be provided for signal drop in bond wire of a package in which an integrated circuit is provided

Semiconductor device

Connecting and bonding adjacent layers with nanostructures

Semiconductor device and method of manufacturing same

Integrated circuit, circuit system, and method of manufacturing

Redistribution layer for wafer-level chip scale package and method therefor

Method of forming low stress multi-layer metallurgical structures and high reliable lead free solder termination electrodes

Semiconductor device and method for manufacturing the same

Structure and method for fabricating flip chip devices

Structure and method for forming a capacitively coupled chip-to-chip signaling interface

MICROELECTRONIC PACKAGE AND METHOD OF FORMING SAME

Semiconductor device

Integrated circuit package system with external interconnects at high density

Integrated shielding process for precision high density module packaging

3D IC method and device

Semiconductor connection component

Alkali silicate glass based coating and method for applying

Electronic device having stack-type semiconductor package and method of forming the same

Electronic device mounting structure

Chip module and a fabrication method thereof

Multi-chip semiconductor device

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor device and producing method of the same

MANUFACTURING METHOD OF PRINTED WIRING BOARD AND PRINTED WIRING BOARD INCLUDING POTTING DAM OBTAINED BY USING MANUFACTURING METHOD

Method of manufacturing a semiconductor device including plural semiconductor chips

Method of producing electronic apparatus

Semiconductor device having at least two terminals among the plurality of terminals electrically connected to each other while not being adjacent to one other and not being connected to internal circuit

Stack-type semiconductor package, method of forming the same and electronic system including the same

Semiconductor device with non-overlapped circuits

Wire bond pads

Post passivation structure for a semiconductor device and packaging process for same

Structure of gold bumps and gold conductors on one IC die and methods of manufacturing the structures

Semiconductor device and plural semiconductor elements with suppressed bending

Semiconductor device having an increased area of one of the opposing electrode parts for preventing generation of unconnected positions the electrodes on the bonded wafers

Semiconductor device comprising internal and external wiring

Multi-Chip Package

Through-chip via interconnects for stacked integrated circuit structures

Ball grid array package enhanced with a thermal and electrical connector

STACKED SEMICONDUCTOR PACKAGE WITH A REDUCED VOLUME

CO-PACKAGED HIGH-SIDE AND LOW-SIDE NMOSFETS FOR EFFICIENT DC-DC POWER CONVERSION

APPARATUS TO SAW WAFER AND HAVING NOZZLE TO REMOVE BURRS IN SCRIBE LANES, METHOD OF SAWING WAFER, AND SEMICONDUCTOR PACKAGE FABRICATED BY THE SAME

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE

Electronic component module

Method for manufacturing multilayer ceramic electronic device

METHOD OF MANUFACTURING A COMBINED MULTILAYER CIRCUIT BOARD HAVING EMBEDDED CHIPS

STRAP ASSEMBLY COMPRISING FUNCTIONAL BLOCK DEPOSITED THEREIN AND METHOD OF MAKING SAME

Wirebond pad for semiconductor chip or wafer

Semiconductor device including semiconductor constituent and manufacturing method thereof

Electronic device and electronic apparatus

Mounting structure of electronic component

Electronic component mounting method and electronic component mounting device

Top layers of metal for high performance IC's

Carrier substrate and integrated circuit

Electronic device

Semiconductor package through-electrode suitable for a stacked semiconductor package and semiconductor package having the same

Power semiconductor device

INTEGRATED DEVICE AND CIRCUIT SYSTEM

Manufacturing method of semiconductor device

Fabrication method of an organic substrate having embedded active-chips

Multilayer printed circuit board structure comprising an integrated electrical component, and production method therefor

Cascode current sensor for discrete power semiconductor devices

Packaged integrated circuit devices with through-body conductive vias, and methods of making same

Power semiconductor component with metal contact layer and production method therefor

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Mounting method, electric part-mounted substrate and an electric device

Method of manufacturing semiconductor device

Substrate and manufacturing method of the same, and semiconductor device and manufacturing method of the same

Laying apparatus, contact-making apparatus, movement system, laying and contact-making unit, production system, method for production and a transponder unit

Semiconductor device and method of providing common voltage bus and wire bondable redistribution

INTEGRATED CIRCUIT

Electronic device, method of producing the same, and semiconductor device

Substrate, substrate fabrication, semiconductor device, and semiconductor device fabrication

METHOD OF FORMING A STUD BUMP OVER PASSIVATION, AND RELATED DEVICE

Integrated Support Structure for Stacked Semiconductors With Overhang

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

INTERCONNECT STRUCTURE

MCU with integrated voltage isolator to provide a galvanic isolation between input and output

Semiconductor device

Semiconductor package having a stacked wafer level package and method for fabricating the same

Bond pad stacks for ESD under pad and active under pad bonding

SYSTEM IN PACKAGE AND METHOD FOR FABRICATING THE SAME

Semiconductor package and method for manufacturing the same for decreasing number of processes

SEMICONDUCTOR PACKAGE HAVING AN IMPROVED CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Method for manufacturing and making planar contact with an electronic apparatus, and correspondingly manufactured apparatus

Sensor package

Methods and apparatus for measuring analytes using large scale FET arrays

Electronic component-embedded board and method of manufacturing the same

Assembly substrate and method of manufacturing the same

Electronic component-embedded board and method of manufacturing the same

Weldable contact and method for the production thereof

Capacitive isolator

Electronic assemblies without solder and methods for their manufacture

Integrated circuit with electromagnetic intrachip communication and methods for use therewith

Semiconductor device

Integrated circuit package for semiconductor devices with improved electric resistance and inductance

Flip-Chip Packaging with Stud Bumps

COMPRESSION BONDING DEVICE

Film substrate, fabrication method thereof, and image display substrate

Hybrid integrated circuit device and manufacturing method thereof

INTEGRATED CIRCUIT WITH BONDING WIRE ANTENNA STRUCTURE AND METHODS FOR USE THEREWITH

Integrated circuit with power supply line antenna structure and methods for use therewith

RFID integrated circuit with integrated antenna structure

COPPER ON ORGANIC SOLDERABILITY PRESERVATIVE (OSP) INTERCONNECT

Three-dimensional chip-stack package and active component on a substrate

Composite carbon nanotube-based structures and methods for removing heat from solid-state devices

INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF THE SAME

Semiconductor device with welded leads and method of manufacturing the same

Semiconductor switching module

Chip embedded substrate and method of producing the same

Use of discrete conductive layer in semiconductor device to re-route bonding wires for semiconductor device package

Semiconductor composite device, method for manufacturing the semiconductor composite device, LED head that employs the semiconductor composite device, and image forming apparatus that employs the LED head

METHOD OF MULTI-CHIP PACKAGING IN A TSOP PACKAGE

Semiconductor device and manufacturing method therefor

Mount Board and Electronic Device

Electronic module and fabrication method thereof

Semiconductor package and method for manufacturing the same

Semiconductor package and multi-chip semiconductor package using the same

Semiconductor device

Formation of alpha particle shields in chip packaging

Integrated structures and fabrication methods thereof implementing a cell phone or other electronic system

Semiconductor package with passive elements embedded within a semiconductor chip

Integrated thermal structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system

Mold compound circuit structure for enhanced electrical and thermal performance

Integrated structures and methods of fabrication thereof with fan-out metallization on a chips-first chip layer

Bumpless flip-chip assembly with a complaint interposer contractor

Packaged electronic modules and fabrication methods thereof implementing a cell phone or other electronic system