Integrated conductive structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system

Method of making a wafer level integration package

Parallel chip embedded printed circuit board and manufacturing method thereof

Thick film circuit component and method for manufacturing the same

Method of producing a transponder and a transponder

Embedded chip package

CHIP PACKAGE

CHIP PACKAGE

Structure for stochastic integrated circuit personalization

Semiconductor device

BOND HEAD FOR A WIRE BONDER

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Method for fabricating semiconductor device installed with passive components

Circuit arrangement and integrated circuit

Through silicon via dies and packages

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Through-silicon via interconnection formed with a cap layer

Electronic Component

Semiconductor device and method for manufacturing same

Wiring method and device

Conductive ball arraying apparatus

Multi-die wafer level packaging

Semiconductor packaging system with stacking and method of manufacturing thereof

Protection and Connection of Devices Underneath Bondpads

Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipment

Method of manufacturing chip integrated substrate

Semiconductor device and manufacturing method of the same

Reactive solder material

Method for mounting anisotropically-shaped members

Silicon-on-insulator structures for through via in silicon carriers

Post passivation interconnection process and structures

SEMICONDUCTOR DEVICE WITH BONDING PAD SUPPORT STRUCTURE

Semiconductor device and fabrication method thereof

Chip Assembly and Method of Manufacturing Thereof

SEMICONDUCTOR DEVICE, LEADFRAME AND STRUCTURE FOR MOUNTING SEMICONDUCTOR DEVICE

Semiconductor device and a method of manufacturing the same

Temporary chip attach carrier

Apparatus and Methods for Constructing Semiconductor Chip Packages with Silicon Space Transformer Carriers

Chip assembly with interconnection by metal bump

Semiconductor device

Semiconductor package having die with recess and discrete component embedded within the recess

Compact multi-port CAM cell implemented in 3D vertical integration

Semiconductor device

Manufacturing method of semiconductor device and electronic device

Device comprising an element with electrodes coupled to connections

Semiconductor device for high frequency

Method of manufacturing a semiconductor device having an insulating protective film covering at least a portion of a tile-shaped element

Electronic device manufacturing method and supporter

Methods of forming a semiconductor device including a diffusion barrier film

Semiconductor device and method of fabricating the same, circuit board, and electronic instrument

SEMICONDUCTOR DEVICE INCLUDING MULTILAYER WIRING BOARD WITH POWER SUPPLY CIRCUIT

Package-in-package using through-hole via die on saw streets

PLANAR INTERCONNECT STRUCTURE FOR HYBRID CIRCUITS

SYSTEM FOR IMPLEMENTING HARD-METAL WIRE BONDS

High Density Nanotube Devices

METHOD, SYSTEM, AND APPARATUS FOR TRANSFER OF DIES USING A DIE PLATE

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Bidirectional multiplexed RF isolator

Structure for electrostatic discharge in embedded wafer level packages

Semiconductor chip with post-passivation scheme formed over passivation layer

Integrated chip package structure using organic substrate and method of manufacturing the same

Semiconductor device and method for manufacturing the same

Semiconductor device

IC chip and its manufacturing method

Semiconductor layer structure and method of making the same

Structure and method for self protection of power device with expanded voltage ranges

Electronic Device Installed in an Engine Room

Semiconductor layer structure and method of making the same

On chip transformer isolator

3-dimensional integrated circuit architecture, structure and method for fabrication thereof

Power semiconductor module

Method of manufacturing a semiconductor device having an even coating thickness using electro-less plating, and related device

SEMICONDUCTOR DEVICE PACKAGE TO IMPROVE FUNCTIONS OF HEAT SINK AND GROUND SHIELD

Partially patterned lead frames and methods of making and using the same in semiconductor packaging

Semiconductor device comprising a semiconductor chip stack and method for producing the same

Semiconductor device with power noise suppression

Semiconductor device

Semiconductor device and a method of manufacturing the same

Semiconductor device and process for manufacturing the same

Flip chip with interposer, and methods of making same

Chip package

SEMICONDUCTOR DEVICE INCLUDING WIRING SUBSTRATE HAVING ELEMENT MOUNTING SURFACE COATED BY RESIN LAYER

Package-on-package secure module having anti-tamper mesh in the substrate of the upper package

Mounted body and method for manufacturing the same

SEMICONDUCTOR PACKAGE

LOW-STRESS HERMETIC DIE ATTACH

Method for aligning microscopic structures and substrate having microscopic structures aligned, as well as integrated circuit apparatus and display element

Method to create a metal pattern using a damascene-like process

Wafer level package with good CTE performance

Method And System for Output Matching of Rf Transistors

Interconnect for chip level power distribution

Top layers of metal for high performance IC's

Novel substrate design for semiconductor device

Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chip

Method for fabricating a low cost integrated circuit (IC) package

Manufacturing method of semiconductor device

Print mask and method of manufacturing electronic components using the same

Integrated circuit package system with protected conductive layers for pads and method of manufacturing thereof

Semiconductor device package with die receiving through-hole and dual build-up layers over both side-surfaces for WLP and method of the same

Semiconductor device

SEMICONDUCTOR DEVICE WITH STRENGTHENED PADS

SEMICONDUCTOR DEVICE PACKAGE WITH DIE RECEIVING THROUGH-HOLE AND DUAL BUILD-UP LAYERS OVER BOTH SIDE-SURFACES FOR WLP AND METHOD OF THE SAME

Method of wire bonding over active area of a semiconductor circuit

Method of forming top electrode for capacitor and interconnection in integrated passive device (IPD)

Output Circuit

Contact carriers (tiles) for populating larger substrates with spring contacts

Semiconductor device and its manufacturing method

Wire-bonded semiconductor component with reinforced inner connection metallization

Wafer-level stack package and method of fabricating the same

Integrated circuit and method for producing the same

Copper die bumps with electromigration cap and plated solder

Power delivery package having through wafer vias

Wiring board for flip-chip mounting, mounting structure of electronic components on wiring board, and semiconductor device including wiring board

MULTI-CHIPS PACKAGE AND METHOD OF FORMING THE SAME

Semiconductor module having deflecting conductive layer over a spacer structure

Apparatus comprising a device and method for producing it

Power module having stacked flip-chip and method of fabricating the power module

Semiconductor device and manufacturing method of the same

BGA PACKAGE SUBSTRATE AND METHOD OF FABRICATING SAME

Method of opening reservoir of containment device

Method and structure for magnetically-directed, self-assembly of three-dimensional structures

Class D amplifier arrangement

Mounting configuration of electronic component

Semiconductor component and method of manufacture

Structure of semiconductor device package and method of the same

Resin molded semiconductor device and differential amplifier circuit

Substrate based unmolded package

Compression connection for vertical IC packages

SEMICONDUCTOR COMPONENT

Carbon nanotube bond pad structure and method therefor

Semiconductor device and a method of manufacturing the same

Power semiconductor module and method for producing the same

Method for manufacturing leadframe, packaging method for using the leadframe and semiconductor package product

Semiconductor wafer, semiconductor device, and semiconductor device manufacturing method

Method for manufacturing circuit modules and circuit module

Method and device for transferring a chip to a contact substrate

Soldering method and method of manufacturing semiconductor device including soldering method

Electronic component structure and method of making

Layer sequence and method of manufacturing a layer sequence

Semiconductor memory device and defect remedying method thereof

Clocking architecture in stacked and bonded dice

Semiconductor integrated circuit device and fabrication method for the same

Semiconductor device including a coupling region which includes layers of aluminum and copper alloys

Component, power component, apparatus, method of manufacturing a component, and method of manufacturing a power semiconductor component

Wiring structure, forming method of the same and printed wiring board

Method and apparatus for manufacturing electronic integrated circuit chip

Leadframe enhancement and method of producing a multi-row semiconductor package

CHIP PACKAGE

Integrated circuit including conductive bumps

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Electronic component and method for manufacturing an electronic component

Gate pullback at ends of high-voltage vertical transistor structure

Multilayer substrate including components therein

Fabrication of Electronic Components In Plastic

Method for producing a metal article intended for at least partially coating with a substance

Method for manufacturing passive device and semiconductor package using thin metal piece

Electronic component module and method for manufacturing the same

SOLDER DEPOSITION ON WAFER BACKSIDE FOR THIN-DIE THERMAL INTERFACE MATERIAL

Bump structure and manufacturing method thereof

Surface mount electronic component and process for manufacturing same

Semiconductor circuit

Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices

Method of manufacturing semiconductor chip assembly with sacrificial metal-based core carrier

Versatile Si-based packaging with integrated passive components for mmWave applications

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

INTEGRATED CIRCUIT SYSTEM WITH PRE-CONFIGURED BOND WIRE BALL

Semiconductor die package including leadframe with die attach pad with folded edge

Electronic device with connection bumps

Passivation layer for a circuit device and method of manufacture

Method for producing semiconductor device

Structure and method for self protection of power device

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICE MANUFACTURED THEREBY

Wiring board and semiconductor device

Modular board device, high frequency module, and method of manufacturing the same

Stress free package and laminate-based isolator package

Thermal interconnect systems methods of production and uses thereof

Electronic component built-in substrate and method of manufacturing electronic component built-in substrate

Chip having side pad, method of fabricating the same and package using the same

Pre-molded clip structure

Low temperature bonding material comprising metal particles and bonding method

Method and device for mutual contacting of two wafers

Electrically conductive interconnect system and method

MOSFET package

Semiconductor device and electronic device having the same

Bonding pad structure for back illuminated optoelectronic device and fabricating method thereof

Semiconductor package including connected upper and lower interconnections, and manufacturing method thereof

HIGHLY CONDUCTIVE COMPOSITION FOR WAFER COATING

THREE-DIMENSIONAL ARCHITECTURE FOR SELF-CHECKING AND SELF-REPAIRING INTEGRATED CIRCUITS

Flip chip mounting process and bump-forming process using electrically-conductive particles as nuclei

Circuit board structure having electronic components integrated therein

Semiconductor package with flow controller

Highly conductive composition for wafer coating

Method for reduction of soft error rates in integrated circuits

APPARATUS FOR INTEGRATED INPUT/OUTPUT CIRCUIT AND VERIFICATION METHOD THEREOF

MICROELECTRONIC DIE INCLUDING SOLDER CAPS ON BUMPING SITES THEREOF AND METHOD OF MAKING SAME

CONDUCTIVE SINTERED LAYER FORMING COMPOSITION AND CONDUCTIVE COATING FILM FORMING METHOD AND BONDING METHOD USING THE SAME

Semiconductor device package having pseudo chips

Wafer level package with die receiving through-hole and method of the same

METHODS OF FORMING STEPPED BUMPS AND STRUCTURES FORMED THEREBY

Conductive systems and devices including wires coupled to anisotropic conductive film, and methods of forming the same

Wafer level package with die receiving through-hole and method of the same

Methods of forming stepped bumps and structures formed thereby

RF module package for releasing stress

RF module package

Wafer level package with die receiving through-hole and method of the same

Multi-chips package and method of forming the same

Structure and method for stochastic integrated circuit personalization

Transfer assembly for manufacturing electronic devices

Bonding method and bonding material using metal particle

Method for integrating pre-fabricated chip structures into functional electronic systems

Circuit board structure having embedded semiconductor element and fabrication method thereof

Semiconductor device and method of forming passive devices

Chip mounting with flowable layer

Circuit board structure with embedded electronic components

Printed-wiring board, method of manufacturing printed-wiring board, and electronic equipment

Voltage regulator integrated with semiconductor chip

METHOD FOR FABRICATING A CIRCUIT

Local control of underfill flow on high density packages, packages and systems made therewith, and methods of making same

Power transistor featuring a double-sided feed design and method of making the same

Wiring structure of printed wiring board and method for manufacturing the same

Semiconductor Sensor Component Comprising Protected Feeders, and Method for the Production Thereof

Semiconductor device and electronic device

Top layers of metal for high performance IC's

Semiconductor component comprising a semiconductor chip and semiconductor component carrier with external connection strips

Electronic package

Display drive circuit

Thin passivation layer on 3D devices

DEVICE HAVING CONTACT PAD WITH A CONDUCTIVE LAYER AND A CONDUCTIVE PASSIVATION LAYER

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Semiconductor device

Tubular-shaped bumps for integrated circuit devices and methods of fabrication

WAFER LEVEL PACKAGE WITH GOOD CTE PERFORMANCE

Semiconductor device having active element formation region provided under a bump pad

Semiconductor device

Semiconductor device and method for manufacturing the same

Post passivation interconnection schemes on top of the IC chips

Semiconductor device and fabrication method thereof

Electronic device and method of manufacturing the same, chip carrier, circuit board, and electronic instrument

Structure and process for WL-CSP with metal cover

Method for manufacturing semiconductor device and semiconductor device

Packaged integrated circuit with enhanced thermal dissipation

MULTI-CHIP PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

LDO regulator with ground connection through package bottom

Semiconductor component including a semiconductor chip and a passive component

Amplifier chip mounted on a lead frame

Articles and assembly for magnetically directed self assembly and methods of manufacture

Semiconductor wafer

Optimum padset for wire bonding RF technologies with high-Q inductors

Electroplating method for a semiconductor device

Single Layer Carbon Nanotube-Based Structures and Methods for Removing Heat from Solid-State Devices

Double Layer Carbon Nanotube-Based Structures and Methods for Removing Heat from Solid-State Devices

Microchip assembly including an inductor and fabrication method

Method of fabricating an electronic device

Semiconductor device and method of manufacture thereof, circuit board and electronic instrument

Resin-sealed electronic device and method of manufacturing the same

Semiconductor device including microstrip line and coplanar line

Post passivation interconnection process and structures

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE

Semiconductor device and manufacturing method thereof

SEMICONDUCTOR INTEGRATED CIRCUIT AND FABRICATION METHOD FOR THE SAME

Semiconductor integrated circuit providing for wire bonding directly above an active circuit region, and manufacturing method thereof

Method of disposing and arranging dummy patterns

Mounting method of semiconductor element using outside connection projection electyrode and manufacturing method of semiconductor device using outside connection projection electrode

Silica nanoparticles thermoset resin compositions

Three-dimensional wafer stacking with vertical interconnects

Bonding structures and methods of forming bonding structures

Semiconductor device with no base member and method of manufacturing the same

Semiconductor die with reduced bump-to-pad ratio

Systems and methods to passivate on-die redistribution interconnects

Spread spectrum isolator

Method of packaging a device using a dielectric layer

METHOD OF PACKAGING A DEVICE HAVING A KEYPAD SWITCH POINT

Self-aligned through vias for chip stacking

Post passivation interconnection schemes on top of the IC chips

Wafer level package with die receiving cavity and method of the same

Overmolded electronic module with an integrated electromagnetic shield using SMT shield wall components

Integrated circuit having an uppermost layer comprising landing pads that are distributed thoughout one side of the integrated circuit

High performance system-on-chip using post passivation process

Integrated circuit chips with fine-line metal and over-passivation metal

Radiation hardened lateral MOSFET structure

PACKAGE DESIGNS FOR VERTICAL CONDUCTION DIE

Component-embedded circuit board fabrication method

Semiconductor device, wiring of semiconductor device, and method of forming wiring

Method for manufacturing electronic substrate

Technique for forming a passivation layer without a terminal metal

Semiconductor device

Semiconductor device and a method of manufacturing the same

METALLIZATION LAYER STACK WITHOUT A TERMINAL ALUMINUM METAL LAYER

Flip-Chip Semiconductor Package with Encapsulant Retaining Structure and Strip

Bondwire utilized for coulomb counting and safety circuits

Semiconductor device and a method of manufacturing the same

Semiconductor device, method of manufacturing the same

Method for forming conductive layer and substrate having the same, and method for manufacturing semiconductor device

Three dimensional device integration method and integrated device

High performance system-on-chip using post passivation process

Metallised film for sheet contacting

Probe arrays and method for making

Methods of fabricating nanostructures and nanowires and devices fabricated therefrom