212741 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected; Structure; Component type being a resistor
Dicing die-bonding film
#2402ATTACHING AND INTERCONNECTING DIES TO A SUBSTRATE
#2403Semiconductor device with bonding pad support structure
#2404Top layers of metal for high performance IC's
#2405Top layers of metal for high performance IC's
#2406CMOS IMAGE SENSOR CHIP SCALE PACKAGE WITH DIE RECEIVING THROUGH-HOLE AND METHOD OF THE SAME
#2407Stacked structures and methods of fabricating stacked structures
#2408Dual layer dielectric stack for microelectronics having thick metal lines
#2409Integrated circuit chips with fine-line metal and over-passivation metal
#2410INTEGRATED CIRCUIT CHIPS WITH FINE-LINE METAL AND OVER-PASSIVATION METAL
#2411Fuse structure for semiconductor integrated circuit with improved insulation film thickness uniformity and moisture resistance
#2412Processes and packaging for high voltage integrated circuits, electronic devices, and circuits
#2413Electronic device including a nickel-palladium alloy layer
#2414Integrated circuit chips with fine-line metal and over-passivation metal
#2415Integrated circuit chips with fine-line metal and over-passivation metal
#2416Integrated circuit chips with fine-line metal and over-passivation metal
#2417INTEGRATED CIRCUIT CHIPS WITH FINE-LINE METAL AND OVER-PASSIVATION METAL
#2418Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument
#2419Pin Array No Lead Package and Assembly Method Thereof
#2420Process of forming an electronic device including an inductor
#2421Wire Bump Material
#2422SEMICONDUCTOR APPARATUS AND FABRICATION METHOD THEREOF
#2423Electronic device and method for production
#2424LAMINATED CIRCUIT BOARD AND ITS MANUFACTURING METHOD, AND MANUFACTURING METHOD FOR MODULE USING THE LAMINATED CIRCUIT BOARD AND ITS MANUFACTURING APPARATUS
#2425Method of actuating implanted medical device
#2426Semiconductor assembly with component attached on die back side
#2427Bonding pad for contacting a device
#2428Semiconductor device and method for fabricating the same
#2429Integrated circuit devices with multi-dimensional pad structures
#2430Semiconductor device, lead-frame product used for the same and method for manufacturing the same
#2431Circuit-connecting material and circuit terminal connected structure and connecting method
#2432INTEGRATED DEVICE
#2433METHOD OF FORMING A MULTI-LAYER SEMICONDUCTOR STRUCTURE INCORPORATING A PROCESSING HANDLE MEMBER
#2434Three dimensional device integration method and integrated device
#2435Three dimensional device integration method and integrated device
#2436Method for electrically connecting to a contact of a microelectronic component on a circuit board or substrate
#2437Circuit-connecting material and circuit terminal connected structure and connecting method
#2438Electrical conductivity bridge in a conductive multilayer article
#2439Method for manufacturing SIP semiconductor device
#2440Method of manufacturing a combined multilayer circuit board having embedded chips
#2441Thin embedded active IC circuit integration techniques for flexible and rigid circuits
#2442Passive component and electronic component module
#2443Compact impedance transformation circuit
#2444Structure of wafer level package with area bump
#2445Electronic device and method of manufacturing the same
#2446Semiconductor chip and method for fabricating the same
#2447Chip package and method for fabricating the same
#2448Semiconductor device and manufacturing method thereof
#2449Method for making high-performance RF integrated circuits
#2450Device structures including backside contacts, and methods for forming same
#2451COMPOSITIONS FOR USE IN ELECTRONICS DEVICES
#2452Circuit-connecting material and circuit terminal connected structure and connecting method
#2453Top layers of metal for high performance IC's
#2454Top layers of metal for high performance IC's
#2455METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#2456Au Alloy Bonding Wire
#2457Top layers of metal for high performance IC's
#2458SEMICONDUCTOR PACKAGE INCLUDING REDISTRIBUTION PATTERN AND METHOD OF MANUFACTURING THE SAME
#2459Semiconductor device having pads
#2460Semiconductor package and method for manufacturing the same
#2461Circuit Board Assembly Having Passive Component and Stack Structure Thereof
#2462Method of wire bonding over active area of a semiconductor circuit
#2463High performance system-on-chip using post passivation process
#2464High performance system-on-chip using post passivation process
#2465Semiconductor die package using leadframe and clip and method of manufacturing
#2466Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof
#2467Circuit substrate and semiconductor device
#2468Post passivation interconnection schemes on top of the IC chips
#2469High performance system-on-chip using post passivation process
#2470Semiconductor chip structure
#2471High performance system-on-chip using post passivation process
#2472DIE PAD ARRANGEMENT AND BUMPLESS CHIP PACKAGE APPLYING THE SAME
#2473High performance system-on-chip using post passivation process
#2474High performance system-on-chip using post passivation process
#2475Diamond heat sink
#2476Interconnect for improved die to substrate electrical coupling
#2477Semiconductor bonding and layer transfer method
#2478Chip package and method for fabricating the same
#2479High performance system-on-chip using post passivation process
#2480Method of packaging and interconnection of integrated circuits
#2481Electronic device and method for producing a device
#2482Lead frame with included passive devices
#2483High performance system-on-chip using post passivation process
#2484High performance system-on-chip using post passivation process
#2485SEMICONDUCTOR MEMORY DEVICE
#2486Method of fabricating microelectronic devices
#2487Multiplexed RF isolator
#2488EMBEDDED CHIP PACKAGE PROCESS AND CIRCUIT BOARD WITH EMBEDDED CHIP
#2489Electronic device including a conductive stud over a bonding pad region
#2490Versatile Si-based packaging with integrated passive components for mmWave applications
#2491Method for placing material onto a target board by means of a transfer board
#2492On-chip magnetic components
#2493Composite photoresist for modifying die-side bumps
#2494Multiplexed RF isolator circuit
#2495Substrate structure integrated with passive components
#2496Double-sided die
#2497Substrate structure integrated with passive components
#2498Contact device for use in a power semiconductor module or in a disc-type thyristor
#2499Array-Processed Stacked Semiconductor Packages
#2500Method of designing semiconductor integrated circuit, designing apparatus, semiconductor integrated circuit system, semiconductor integrated circuit mounting substrate, package and semiconductor integrated circuit
#2501Method of fabricating semiconductor device having conducting portion of upper and lower conductive layers on a peripheral surface of the semiconductor device
#2502SEMICONDUCTOR CHIP
#2503Semiconductor device with reduced contact resistance
#2504Flip-chip semiconductor package and chip carrier for preventing corner delamination
#2505Electronic circuit in a package-on-package configuration and method for producing the same
#2506Device With Mounted Electronic Parts, Method Of Producing The Same, Protection Circuit Module Of Secondary Battery, And Battery Package
#2507Transformer coils for providing voltage isolation
#2508ESD protection circuit for semiconductor device
#2509Component and method for producing a component
#2510Chip structure with redistribution traces
#2511Semiconductor device having pillar-shaped terminal
#2512Power semiconductor module with connection elements electrically insulated from one another
#2513BONDING PAD STRUCTURE FOR ELECTRONIC DEVICE
#2514Semiconductor device including semiconductor element surrounded by an insulating member wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof
#2515Composite multi-layer substrate and module using the substrate
#2516Manufacturing process for single-chip MMC/SD flash memory device with molded asymmetric circuit board
#2517Thermal release adhesive-backed carrier tapes
#2518Bond and method for bonding two contact surfaces
#2519Tapered die-side bumps
#2520Semiconductor device
#2521High density nanostructured interconnection
#2522Multiple-dies semiconductor device with redistributed layer pads
#2523Integrated circuit (IC) chip and method for fabricating the same
#2524Semiconductor device having an inductor
#2525Semiconductor package having embedded passive elements and method for manufacturing the same
#2526IC chip, antenna, and manufacturing method of the IC chip and the antenna
#2527Circuit-connecting material and circuit terminal connected structure and connecting method
#2528Die configurations and methods of manufacture
#2529Au bonding wire for semiconductor device
#2530BONDING MATERIALS HAVING PARTICLE WITH ANISOTROPIC SHAPE
#2531Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
#2532Semiconductor device, and life prediction circuit and life prediction method for semiconductor device
#2533Micro universal serial bus (USB) memory package
#2534Top layers of metal for high performance IC's
#2535Top layers of metal for high performance IC's
#2536METHOD OF ALIGNING A CONTACTLESS SEMICONDUCTOR DEVICE INTERFACE
#2537Integrated circuit (IC) package stacking and IC packages formed by same
#2538Top layers of metal for high performance IC's
#2539INTEGRATED INDUCTORS AND COMPLIANT INTERCONNECTS FOR SEMICONDUCTOR PACKAGING
#2540Via layout with via groups placed in interlocked arrangement
#2541Top layers of metal for high performance IC's
#2542Top layers of metal for high performance IC's
#2543Top layers of metal for high performance IC's
#2544Top layers of metal for high performance IC's
#2545Top layers of metal for high performance IC's
#2546Top layers of metal for high performance IC's
#2547Top layers of metal for high performance IC's
#2548Top layers of metal for high performance IC's
#2549Top layers of metal for high performance IC's
#2550Top layers of metal for high performance IC's
#2551Top layers of metal for high performance IC's
#2552Electronic component, semiconductor device employing same, and method for manufacturing electronic component
#2553Electrically conductive connection, electronic component and method for their production
#2554Bond wireless power module with double-sided single device cooling and immersion bath cooling
#2555Top layers of metal for high performance IC's
#2556Substrate treating method and method of manufacturing semiconductor apparatus
#2557Wiring module
#2558Computer systems having an interposer including a flexible material
#2559Socket for making with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component
#2560Semiconductor device, manufacturing method of the semiconductor device, and mounting method of the semiconductor device
#2561Top layers of metal for high performance IC's
#2562Top layers of metal for high performance IC's
#2563Top layers of metal for high performance IC's
#2564Top layers of metal for high performance IC's
#2565Top layers of metal for high performance IC's
#2566Semiconductor Device
#2567Method of making thermally enhanced substrate-base package
#2568Flip-chip bonding structure using multi chip module-deposited substrate
#2569SEMICONDUCTOR HAVING A BONDING WIRE AND PROCESS
#2570Structure comprising 3-dimensional integrated circuit architecture, circuit structure, and instructions for fabrication thereof
#2571Top layers of metal for high performance IC's
#2572Top layers of metal for high performance IC's
#2573Top layers of metal for high performance IC's
#2574Top layers of metal for high performance IC's
#2575METHOD FOR FORMING INTERCONNECTS ON THIN WAFERS
#2576Top layers of metal for high performance IC's
#2577Top layers of metal for high performance IC's
#2578Top layers of metal for high performance IC's
#2579Top layers of metal for high performance IC's
#2580Top layers of metal for high performance IC's
#2581Top layers of metal for high performance IC's
#2582Top layers of metal for high performance IC's
#2583Top layers of metal for high performance IC's
#2584Top layers of metal for high performance IC's
#2585POWER SEMICONDUCTOR ARRANGEMENT WITH SOLDERED CLIP CONNECTION AND METHOD
#2586Semiconductor device having a bonding wire and method for manufacturing the same
#2587Contact surrounded by passivation and polymide and method therefor
#2588Separation method of semiconductor device
#2589Non-cyanide gold electroplating for fine-line gold traces and gold pads
#2590Interconnect structure and formation for package stacking of molded plastic area array package
#2591Top layers of metal for high performance IC's
#2592Top layers of metal for high performance IC's
#2593Top layers of metal for high performance IC's
#2594Top layers of metal for high performance IC's
#2595Top layers of metal for high performance IC's
#2596Top layers of metal for high performance IC's
#2597Top layers of metal for high performance IC's
#2598Top layers of metal for high performance IC's
#2599Top layers of metal for high performance IC's
#2600Top layers of metal for high performance IC's
#2601Method of wire bonding over active area of a semiconductor circuit
#2602Dividable semiconductor device having ceramic substrate and surface mount components collectively sealed on principle surface of ceramic substrate
#2603Highly efficient both-side-cooled discrete power package, especially basic element for innovative power modules
#2604Semiconductor device and method for manufacturing the same
#2605Stub-tuned wirebond package
#2606No-lead IC packages having integrated heat spreader for electromagnetic interference (EMI) shielding and thermal enhancement
#2607Wafer level semiconductor chip packages and methods of making the same
#2608Top layers of metal for high performance IC's
#2609Methods and apparatus having an integrated circuit attached to fused silica
#2610Top layers of metal for high performance IC's
#2611Top layers of metal for high performance IC's
#2612Top layers of metal for high performance IC's
#2613Top layers of metal for high performance IC's
#2614Top layers of metal for high performance IC's
#2615Top layers of metal for high performance IC's
#2616Integrated circuit device with semiconductor device components embedded in plastic housing composition
#2617Increased interconnect density electronic package and method of fabrication
#2618CHIP PACKAGE
#2619Low resistance integrated MOS structure
#2620Method of making a radio frequency identification (RFID) tag
#2621Systems and methods for high density multi-component modules
#2622Method of preventing dielectric breakdown of semiconductor device and semiconductor device preventing dielectric breakdown
#2623Wirebond pad for semiconductor chip or wafer
#2624Circuit apparatus and method of fabricating the apparatus
#2625Semiconductor device, method for manufacturing semiconductor device, and electronic appliance having the semiconductor device
#2626Method of manufacturing semiconductor apparatus
#2627Surface mounting electronic component and manufacturing method thereof
#2628Semiconductor module featuring solder balls having lower melting point than that of solder electrode terminals of electronic device containing additional metal powder component
#2629Leadframe enhancement and method of producing a multi-row semiconductor package
#2630Method for Electroplating and Contact Projection Arrangement
#2631Semiconductor memory device and defect remedying method thereof
#2632Conductive structures including titanium-tungsten base layers
#2633ELECTRICALLY CONDUCTING TRACK AND METHOD OF MANUFACTURE THEREOF
#2634Method for bonding a semiconductor substrate to a metal substrate
#2635Apparatuses and methods to enhance passivation and ILD reliability
#2636Methods and apparatus for a reduced inductance wirebond array
#2637Capacitor structure of semiconductor device and method of fabricating the same
#2638Wire bonding capillary tool having multiple outer steps
#2639Devices with microjetted polymer standoffs
#2640QFN housing having optimized connecting surface geometry
#2641Method for fabricating thermal compliant semiconductor chip wiring structure for chip scale packaging
#2642Functional blocks for assembly
#2643Isolating chip-to-chip contact
#2644Semiconductor device and manufacturing method thereof
#2645Semiconductor device that improves electrical connection reliability
#2646Semiconductor device including a DC-DC converter
#2647Semiconductor module with current connection element
#26483-dimensional integrated circuit architecture, structure and method for fabrication thereof
#2649Method Of Wirebonding That Utilizes A Gas Flow Within A Capillary From Which A Wire Is Played Out
#2650Solder layer and electronic device bonding substrate and submount using the same
#2651Connecting device for electronic components
#2652HYBRID INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
#2653Method of forming a semiconductor device having bonding pad of the second chip thinner than bonding pad of the first chip
#2654Method for fabricating a BGA device and BGA device
#2655Electronic-parts-packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film
#2656Conductor composition, a mounting substrate and a mounting structure utilizing the composition
#2657Reactive foil assembly
#2658Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film
#2659Semiconductor devices and electrical parts manufacturing using metal coated wires
#2660Semiconductor device and manufacturing method of a semiconductor device
#2661Electronic component and its manufacturing method
#2662Device having a contacting structure
#2663METHOD FOR MOUNTING AN ELECTRONIC PART ON A SUBSTRATE USING A LIQUID CONTAINING METAL PARTICLES
#2664Semiconductor package with heat spreader
#2665Semiconductor device
#2666Vertical semiconductor power switch, electronic component and methods of producing the same
#2667Wire bonding method for preventing polymer cracking
#2668Method for manufacturing semiconductor device
#2669Perforated embedded plane package and method
#2670Semiconductor device packaging
#2671SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#2672Method and apparatus for providing structural support for interconnect pad while allowing signal conductance
#2673Warp compensated package and method
#2674Wafer bonding of damascene-patterned metal/adhesive redistribution layers
#2675Electronic substrate, semiconductor device, and electronic device
#2676Chip package and method for fabricating the same
#2677Bond pad structure for wire bonding
#2678Method for diffusion soldering
#2679Post passivation interconnection schemes on top of the IC chips
#2680Power semiconductor arrangement
#2681Power semiconductor device and method for producing it
#2682Method and apparatus for manufacturing electronic component-mounted component, and electronic component-mounted component
#2683INTEGRATED CIRCUIT CHIP AND PACKAGE
#2684Semiconductor device and heat radiation member
#2685Apparatus And Method For Temperature-Interrupting Protection Of An Electric Device
#2686Methods of making semiconductor-based electronic devices on a wire and articles that can be made thereby
#2687Processed wafer via
#2688Stacked chip-based system and method
#2689Cap layer for an aluminum copper bond pad
#2690Apparatus for integrated input/output circuit and verification method thereof
#2691Pressure contact power semiconductor module
#2692RF module including control IC without the aid of a relay pad
#2693Integrated circuit package system with exposed interconnects
#2694Image sensor packaging structure and method of manufacturing the same
#2695Electronic assembly with detachable components
#2696Semiconductor device having improved wire-bonding reliability and method of manufacturing the same
#2697Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument
#2698Semiconductor device
#2699Patterned gold bump structure for semiconductor chip
#2700Power semiconductor modules and method for producing them