212741 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected; Structure; Component type being a resistor
Wire bonding apparatus, record medium storing bonding control program, and bonding method
#2702Methods of forming metal layers using multi-layer lift-off patterns
#2703SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING SEMICONDUCTOR COMPONENTS
#2704CHIP CONNECTOR
#2705Semiconductor device, reticle used in fabricating method for the same and fabrication method thereof
#2706Electronic devices including solder bumps on compliant dielectric layers
#2707Semiconductor device
#2708Module part
#2709Highly reliable, cost effective and thermally enhanced AuSn die-attach technology
#2710Semiconductor device having an antenna with anisotropic conductive adhesive
#2711Direct write# system
#2712Method for forming multi-layer bumps on a substrate
#2713Probe For Semiconductor Devices
#2714Low temperature co-fired ceramic module and method of manufacturing the same
#2715Power semiconductor component having chip stack
#2716Tooling for coupling multiple electronic chips
#2717Composite integrated device and methods for forming thereof
#2718Semiconductor interconnect having adjacent reservoir for bonding and method for formation
#2719Semiconductor device, interposer chip and manufacturing method of semiconductor device
#2720Triaxial through-chip connection
#2721Method for fabricating last level copper-to-C4 connection with interfacial cap structure
#2722Electronic component and method for its assembly
#2723Glass material for radio-frequency applications
#2724Method of wire bonding over active area of a semiconductor circuit
#2725Method of wire bonding over active area of a semiconductor circuit
#2726Substrate and semiconductor device
#2727Method of wire bonding over active area of a semiconductor circuit
#2728Carbon nanotube circuit component structure
#2729METHOD OF WIRE BONDING OVER ACTIVE AREA OF A SEMICONDUCTOR CIRCUIT
#2730Semiconductor package structure and fabrication method thereof
#2731Semiconductor package with integrated heatsink and electromagnetic shield
#2732Semiconductor chip with bond area
#2733Methods of fabricating nanostructures and nanowires and devices fabricated therefrom
#2734Back-to-front via process
#2735Manufacturing method for electronic device
#2736Arrangement and method impedance matching
#2737Semiconductor component and apparatus for production of a semiconductor component
#2738Thermally balanced via
#2739Electrical connections made with dissimilar metals
#2740Electronic device and method of manufacturing the same
#2741Connecting module having passive components
#2742Semiconductor device, manufacturing method of semiconductor device, and RFID tag
#2743SEMICONDUCTOR DEVICE
#2744Interconnect circuitry, multichip module, and methods of manufacturing thereof
#2745Clipless and wireless semiconductor die package and method for making the same
#2746Electronic device and method of manufacturing the same, circuit board, and electronic instrument
#2747Electronic component assemblies with electrically conductive bonds
#2748Package structure and manufacturing method thereof
#2749Semiconductor device, package structure thereof, and method for manufacturing the semiconductor device
#2750Common drain dual semiconductor chip scale package and method of fabricating same
#2751Compliant terminal mountings with vented spaces and methods
#2752Semiconductor wafer substrate for power semiconductor components and method for producing the same
#2753Semiconductor device and method of manufacturing the same
#2754Vertical power semiconductor component, semiconductor device and methods for the production thereof
#2755Semiconductor device having a metal plate conductor
#2756Semiconductor device and method for producing the same
#2757Compliant terminal mountings with vented spaces and methods
#2758Three-dimensional integrated circuit structure
#2759Thin-film capacitor and method for fabricating the same, electronic device and circuit board
#2760Electrical device and method of manufacturing electrical devices using film embossing techniques to embed integrated circuits into film
#2761Chip on a board
#2762Package for high power density devices
#2763Semiconductor device and manufacturing method of the same
#2764Semiconductor device comprising a vertical semiconductor component and method for producing the same
#2765Coaxial through chip connection
#2766Adhesive for bonding circuit members, circuit board and process for its production
#2767Semiconductor device and method of manufacture thereof, circuit board and electronic instrument
#2768Method for the planar joining of components of semiconductor devices and a diffusion joining structure
#2769Carbon nanotube reinforced metallic layer
#2770Metal-base circuit board and its manufacturing method
#2771Electronic circuit device and method of manufacturing the same
#2772Semiconductor device and method of manufacturing the same
#2773Semiconductor device and method of manufacturing the same
#2774Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit board, and electronic device
#2775Method for forming solder balls with a stable oxide layer by controlling the reflow ambient
#2776Individualized low parasitic power distribution lines deposited over active integrated circuits
#2777Protection for an integrated circuit chip containing confidential data
#2778A SEMICONDUCTOR HAVING A COPPER-BASED METALLIZATION STACK WITH A LAST ALUMINUM METAL LINE LAYER
#2779Pin-type chip tooling
#2780Circuit substrate and method of manufacture
#2781Low cost bonding pad and method of fabricating same
#2782Head assembly for chip mounter
#2783Method for the interconnection of active and passive components and resulting thin heterogeneous component
#2784Semiconductor device having align mark layer and method of fabricating the same
#2785Output amplifier structure with bias compensation
#2786Interconnecting element between semiconductor chip and circuit support and method
#2787Carrier board structure with semiconductor chip embedded therein
#2788SEMICONDUCTOR DEVICE
#2789Semiconductor die package using leadframe and clip and method of manufacturing
#2790Circuit board and its manufacturing method
#2791Layer having functionality, method for forming flexible substrate having the same, and method for manufacturing semiconductor device
#2792Semiconductor device
#2793Semiconductor package including a semiconductor die having redistributed pads
#2794Method for pressure bonding and method for manufacturing semiconductor device
#2795Constant voltage diode
#2796Semiconductor device, method of manufacturing a semiconductor device and substrate to be used to manufacture a semiconductor device
#2797Method for making stacked integrated circuits (ICs) using prepackaged parts
#2798Multi-stack chip package with wired bonded chips
#2799Printed circuit board, electronic device, and manufacturing method for printed circuit board
#2800Method of manufacturing flash memory cards
#2801Semiconductor device including a particular dummy terminal
#2802Electronic assembly having graded wire bonding
#2803Void-free circuit board and semiconductor package having the same
#2804Semiconductor chip with post-passivation scheme formed over passivation layer
#2805Semiconductor device having an electronic circuit disposed therein
#2806Integrated circuit package system including high-density small footprint system-in-package
#2807High frequency chip packages with connecting elements
#2808Semiconductor device and method for providing a reduced surface area electrode
#2809Semiconductor component of semiconductor chip size with flip-chip-like external contacts
#2810Technique for moderating stresses cause by a difference in thermal expansion coeffiecients between a substrate and an electronic component
#2811Semiconductor structure and method of assembly
#2812Semiconductor structure and method of manufacture
#2813Electronic module and method of assembling the same
#2814Method for forming solder contacts on mounted substrates
#2815Electronic part mounting substrate and method for producing same
#2816Method of producing image display unit
#2817METHOD AND STRUCTURE FOR VERTICALLY-STACKED DEVICE CONTACT
#2818Semiconductor device, mounting substrate and method of manufacturing mounting substrate, circuit board, and electronic instrument
#2819Semiconductor device with multiple designation marks
#2820Semiconductor device and communication system using the semiconductor device
#2821Decoupling capacitor closely coupled with integrated circuit
#2822SEMICONDUCTORS AND METHODS OF MAKING
#2823Semiconductor module having a coupling substrate, and methods for its production
#2824Integrated circuit package system
#2825Semiconductor device and a method of manufacturing the same
#2826Wiring board, semiconductor device, and method of manufacturing the same
#2827Wiring board and capacitor
#2828Power semiconductor module
#2829Hard disk drive and wireless data terminal using the same
#2830Contact carriers (tiles) for populating larger substrates with spring contacts
#2831PROCESS FOR FABRICATING CHIP PACKAGE STRUCTURE
#2832Semiconductor device featuring large reinforcing elements in pad area
#2833Semiconductor device having shield structure
#2834Decoupling capacitor closely coupled with integrated circuit
#2835Semiconductor device
#2836QFN/SON compatible package with SMT land pads
#2837Semiconductor apparatus integrating an electrical device under an electrode pad
#2838Method for manufacturing electronic modules
#2839Semiconductor device
#2840Semiconductor device
#2841Semiconductor package having plate interconnections
#2842Semiconductor IC-embedded module with multilayer substrates with multiple chips embedded therein
#2843Component mounting method and component-mounted body
#2844Metal duplex method
#2845Semiconductor device and method for fabricating the same
#2846Metal duplex method
#2847Electronic device and method of manufacturing same
#2848Encapsulated electronic part packaging structure
#2849High density interconnect assembly comprising stacked electronic module
#2850Partially patterned lead frames and methods of making and using the same in semiconductor packaging
#2851Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices
#2852Method for forming a double embossing structure
#2853Alpha particle shields in chip packaging
#2854Semiconductor device and semiconductor chip
#2855Wiring board construction including embedded ceramic capacitors(s)
#2856Semiconductor device and method of manufacturing the same
#2857Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chip
#2858Aqueous solution for surface treatment of metal and method for preventing discoloration of metal surface
#2859Method of packaging and interconnection of integrated circuits
#2860Method and system for secure heat sink attachment on semiconductor devices with macroscopic uneven surface features
#2861Method of packaging and interconnection of integrated circuits
#2862Semiconductor power component with a vertical current path through a semiconductor power chip
#2863Semiconductor device
#2864MOSFET package
#2865MOSFET package
#2866Semiconductor connection component
#28673D IC method and device
#2868Manufacturing method of semiconductor device
#2869Semiconductor device and method of manufacturing the same
#2870Semiconductor component and method of manufacture
#2871Multi-chip semiconductor device package
#2872Stack structure with semiconductor chip embedded in carrier
#2873Semiconductor module
#2874Semiconductor device electronic component, circuit board, and electronic device
#2875Insulated gate semiconductor device and manufacturing method thereof
#2876Mounting structure, electro-optical device, and electronic apparatus
#2877Solder composition for electronic devices
#2878Semiconductor device
#2879SEMICONDUCTOR DEVICE
#2880Semiconductor device and method of manufacturing the same
#2881Semiconductor device
#2882Metal pad or metal bump over pad exposed by passivation layer
#2883Electrical interconnect structures for integrated circuits and methods of manufacturing the same
#2884Laminated electronic component and method for producing the same
#2885Output match transistor
#2886Semiconductor power device and RF signal amplifier
#2887Technique for efficiently patterning an underbump metallization layer using a dry etch process
#2888Planar bond pad design and method of making the same
#2889Technique for forming a copper-based contact layer without a terminal metal
#2890Semiconductor device, electronic module, and method of manufacturing electronic module
#2891Microelectronic bond pad
#2892Semiconductor device, power amplifier device and PC card
#2893METHOD FOR PRODUCING A CHIP ARRANGEMENT, A CHIP ARRANGEMENT AND A MULTICHIP DEVICE
#2894Packaged integrated circuit with enhanced thermal dissipation
#2895IC with on-die power-gating circuit
#2896Semiconductor device
#2897Manufacturing method for electronic substrate, manufacturing method for electro-optical device, and manufacturing method for electronic device
#2898Semiconductor device and a method of manufacturing the same
#2899Method of manufacturing electronic circuit device
#2900Connection element for a semiconductor component and method for producing the same
#2901Wafer level package and its manufacturing method
#2902Semiconductor device
#2903Semiconductor device and method of manufacturing the same
#2904Split control pad for multiple signal
#2905Semiconductor device and manufacturing method thereof
#2906Electronic board and manufacturing method thereof, electro-optical device, and electronic apparatus
#2907Method and structure for interfacing electronic devices
#2908Die pad arrangement and bumpless chip package applying the same
#2909Method and structure for reduction of soft error rates in integrated circuits
#2910Semiconductor device
#2911Electronic parts packaging structure and method of manufacturing the same
#2912Integrated circuit for driving semiconductor device and power converter
#2913Semiconductor device
#2914Hybrid conductive coating method for electrical bridging connection of RFID die chip to composite antenna
#2915Semiconductor device
#2916Semiconductor device
#2917Ball grid array package enhanced with a thermal and electrical connector
#2918Surface mount package
#2919Multi-layered substrate assembly with vialess electrical interconnect scheme
#2920Parallel chip embedded printed circuit board and manufacturing method thereof
#2921Semiconductor device
#2922Chip and multi-chip semiconductor device using the chip, and method for manufacturing same
#2923Image display and manufacturing method thereof having particular internal wiring structure
#2924Thermal interface material with carbon nanotubes and particles
#2925Semiconductor device advantageous in improving water resistance and oxidation resistance
#2926Adhesive layer forming a capacitor dielectric between semiconductor chips
#2927Semiconductor die package and method for making the same
#2928Semiconductor device and method of manufacturing the same
#2929Circuitry component and method for forming the same
#2930Three dimensional device integration method and integrated device
#2931Printed circuit board having embedded RF module power stage circuit
#2932Printed circuit board with embedded electronic components
#2933Post passivation structure for a semiconductor device and packaging process for same
#2934Method of manufacturing semiconductor device
#2935Contact Structures Comprising A Core Structure And An Overcoat
#2936Method of manufacturing a semiconductor device
#2937Conductive particles and method and device for manufacturing the same, anisotropic conductive adhesive and conductive connection structure, and electronic circuit components and method of manufacturing the same
#2938Micro solder pot
#2939Electronic board, method of manufacturing the same, and electronic device
#2940Electronic board, method of manufacturing the same, and electronic device
#2941CSP semiconductor chip and BGA assembly with enhanced physical protection, protective members and assemblies used with same, and methods of enhancing physical protection of chips and assemblies
#2942Lead frame structure with aperture or groove for flip chip in a leaded molded package
#2943Method of soldering or brazing articles having surfaces that are difficult to bond
#2944Remote chip attachment
#2945Coaxial through chip connection
#2946Post-attachment chip-to-chip connection
#2947Tack & fuse chip bonding
#2948Routingless chip architecture
#2949Semiconductor device and method for manufacturing the same
#2950Rigid-backed, membrane-based chip tooling
#2951Through chip connection
#2952Chip-based thermo-stack
#2953Chip spanning connection
#2954Inverse chip connector
#2955Chip connector
#2956Post & penetration interconnection
#2957Triaxial through-chip connection
#2958Profiled contact
#2959Chip capacitive coupling
#2960Electronic chip contact structure
#2961Patterned contact
#2962Contact-based encapsulation
#2963Membrane-based chip tooling
#2964Electronic circuit protection device
#2965Semiconductor device and method of manufacturing a semiconductor device
#2966Electronic package structures and methods
#2967Method of wafer-level packaging using low-aspect ratio through-wafer holes
#2968Method of forming overhang support for a stacked semiconductor device
#2969Method for mounting an electronic part on a substrate using a liquid containing metal particles
#2970Encapsulated power semiconductor assembly
#2971Capacitor device, semiconductor devioce, and setting method of terminal capacitance of pad electrode thereof
#2972Circuit arrangement placed on a substrate and method for producing the same
#2973Semiconductor device
#2974Electronic substrate manufacturing method, semiconductor device manufacturing method, and electronic equipment manufacturing method
#2975Semiconductor chip with coil element over passivation layer
#2976Semiconductor device
#2977System-in-a-package based flash memory card
#2978NANO IC
#2979Method for manufacturing electronic component-embedded printed circuit board
#2980Composite multi-layer substrate and module using the substrate
#2981Method of manufacturing a device having a contacting structure
#2982Intermediate semiconductor device structures
#2983Bond pad structure comprising multiple bond pads with metal overlap
#2984Methods for forming openings in a substrate and apparatuses with these openings and methods for creating assemblies with openings
#2985Semiconductor device with passivation layer covering wiring layer
#2986Method of making the semiconductor device, circuit board, and electronic instrument
#2987Semiconductor device with substrate having penetrating hole having a protrusion
#2988Bondwire utilized for coulomb counting and safety circuits
#2989Thin embedded active IC circuit integration techniques for flexible and rigid circuits
#2990Method of manufacturing self-supporting contacting structures
#2991Passive element chip and manufacturing method thereof, and highly integrated module and manufacturing method thereof
#2992Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment
#2993Three dimensional packaging optimized for high frequency circuitry
#2994Bond pad structures and semiconductor devices using the same
#2995Solder deposition on wafer backside for thin-die thermal interface material
#2996Semiconductor package board using a metal base
#2997Multilayer printed wiring board
#2998Method of manufacturing a semiconductor apparatus
#2999Composite electronic component
#3000Semiconductor device with a rewiring level and method for producing the same