Semiconductor device including spacer element

Integrated circuit package-in-package system and method for making thereof

Semiconductor Carrier for Multi-Chip Packaging

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor Packaging with Integrated Passive Componentry

Semiconductor device which can transmit electrical signals between two circuits

Semiconductor device

WIRING MEMBER, METAL COMPONENT WITH RESIN AND RESIN SEALED SEMICONDUCTOR DEVICE, AND PROCESSES FOR PRODUCING THEM

REDUCED OXIDATION SYSTEM FOR WIRE BONDING

Joint Structure Between a Wound Coil and An IC-Chip for a Noncontact RFID Device and Methods of Manufacturing The Same

Method for manufacturing integrated circuit device having antenna conductors

Method of fabricating a semiconductor package with mold lock opening

Light emitting diode package and manufacturing method thereof

Gold alloy wire for ball bonding

All optical fast distributed arbitration in a computer system device

Printed wiring board, printed IC board having the printed wiring board, and method of manufacturing the same

Heat conductive sheet and method for producing same, and powder module

Semiconductor device

Integrated circuit for driving semiconductor device and power converter

Wire bond interconnection

Integrated circuit packaging system with stacked die and method of manufacture thereof

Semiconductor device

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE

Semiconductor device

Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts

SEMICONDUCTOR PACKAGE SUBSTRATE, SEMICONDUCTOR PACKAGE USING THE SUBSTRATE, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE SUBSTRATE

Mounted body and method for manufacturing the same

Lead and lead frame for power package

Routable array metal integrated circuit package

Integrated circuit packaging system with a dual board-on-chip structure and method of manufacture thereof

Leadless integrated circuit package having standoff contacts and die attach pad

Leadless integrated circuit package having electrically routed contacts

Leadless integrated circuit package having standoff contacts and die attach pad

RF-IC PACKAGING METHOD AND CIRCUITS OBTAINED THEREBY

Composition encapsulating optical semiconductor and optical semiconductor device using same

Light emitting diode chip with electrical insulation element

Semiconductor device having a junction FET and a MISFET for control

Module substrate and production method

Wireless communication device integrated into a single package

Reversible leadless package and methods of making and using same

Multi-surface IC packaging structures and methods for their manufacture

Component-containing module

Semiconductor device having shifted stacked chips

SEMICONDUCTOR DEVICE

Semiconductor device

CHIP SCALE PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS

WINDOW TYPE SEMICONDUCTOR PACKAGE

Lead frame

Complete power management system implemented in a single surface mount package

Quad flat non-leaded package

Molding die with tilted runner, method of manufacturing semiconductor device using the same, and semiconductor device made by the method

Lead frame

Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same

Light emitting device having luminescent layer with opening to exposed bond pad on light emitting die for wire bonding pad to substrate

Integrated circuit mounted board, printed wiring board, and method of manufacturing integrated circuit mounted board

Printed wiring board

LOW COST BONDING TECHNIQUE FOR INTEGRATED CIRCUIT CHIPS AND PDMS STRUCTURES

Semiconductor device and method of forming through vias with reflowed conductive material

Integrated circuit package having integrated faraday shield

Ribbon bonding in an electronic package

Module having a stacked magnetic device and semiconductor device and method of forming the same

Chip and Transmitter for Wireless Communication System

Method of manufacturing a semiconductor device and a semiconductor device produced thereby

Moisture-proof device, moisture-proof IC, and method for increasing moisture-proof capability of IC

Manufacturing method of substrate for a semiconductor package, manufacturing method of semiconductor package, substrate for a semiconductor package and semiconductor package

Wire bonding structure and method for forming same

Semiconductor device and method of forming through vias with reflowed conductive material

Semiconductor device and a method of manufacturing the same, and an electronic device

Arrangement for electrically connecting semiconductor circuit arrangements to an external contact device and method for producing the same

Semiconductor device having wiring layers with power-supply plane and ground plane

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Apparatus having thermal-enhanced and cost-effective 3D IC integration structure with through silicon via interposers

Circuit carrier and semiconductor package using the same

Stack package

SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME

Stacked semiconductor package having reduced height

Systems and methods of tamper proof packaging of a semiconductor device

MULTI-CHIP PACKAGE

WIRE BOND CHIP PACKAGE

Electronic device

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor device with stacked semiconductor chips

Ultra wideband hermetically sealed surface mount technology for microwave monolithic integrated circuit package

Reduced-crosstalk wirebonding in an optical communication system

Bidirectional switch module

Optical semiconductor device encapsulated with silicone resin

Lead frame assembly, package structure and LED package structure

Fully reflective and highly thermoconductive electronic module and method of manufacturing the same

Method for fabricating a bond

Module having a stacked magnetic device and semiconductor device and method of forming the same

Semiconductor package, integrated circuit cards incorporating the semiconductor package, and method of manufacturing the same

Method of manufacturing semiconductor devices

Semiconductor device with additional power supply paths

Wire bonding method and semiconductor device

Semiconductor package with ribbon with metal layers

Hybrid integrated circuit device, and method for fabricating the same, and electronic device

Micro Ball Feeding Method

Semiconductor device

Package-on-package system with through vias and method of manufacture thereof

Quad flat package with exposed common electrode bars

Semiconductor device packages with electromagnetic interference shielding

Chip package and manufacturing method thereof

Manufacturing method of semiconductor device

Semiconductor apparatus with decoupling capacitor

Semiconductor device and wire bonding method

Electronic component device, and method of manufacturing the same

Thin film light emitting diode

Wire bonding method, wire bonding apparatus, and wire bonding control program

Wire bonding apparatus, record medium storing bonding control program, and bonding method

Connection structure, power module and method of manufacturing the same

PACKAGE SUBSTRATE STRUCUTRE WITH CAVITY AND METHOD FOR MAKING THE SAME

Method of manufacturing a semiconductor package with fine pitch lead fingers

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Method of manufacturing semiconductor device, and wire bonder

Method for fabricating semiconductor packages with discrete components

Thermoplastic material

Wireless radio frequency signal transceiving system

Carrier assembly for an integrated circuit

III-nitride devices and circuits

Electronic component

Semiconductor device and manufacturing method thereof

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device

Power transistor package with integrated bus bar

Layered chip package with wiring on the side surfaces

Semiconductor device and semiconductor memory device

Semiconductor device and method of manufacturing the same, and electronic apparatus

SEMICONDUCTOR PACKAGE STRUCTURE USING THE SAME

Leadframe structure for electronic packages

BGA package with leads on chip

Semiconductor assembly with one metal layer after base metal removal

Wirebonded semiconductor package

Integrated circuit package system including shield

Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packages

Electronic-component-housing package and electronic device

Method of bonding core wires to electrodes and electronic unit formed by bonding electrodes and core wires

Adhesive sheet for manufacturing semiconductor device, manufacturing method of semiconductor device using the sheet, and semiconductor device obtained by the method

Method of making semiconductor device packaged by sealing resin member

Power semiconductor devices having integrated inductor

Electronic member, electronic part and manufacturing method therefor

ELECTRICAL DEVICE HAVING A POWER SOURCE WITH A MAGNETIC CAPACITOR AS AN ENERGY STORAGE DEVICE

SPHERICAL SINTERED FERRITE PARTICLES, RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION COMPRISING THEM AND SEMICONDUCTOR DEVICES PRODUCED BY USING THE SAME

Adhesive composition for electronic components, and adhesive sheet for electronic components using the same

Semiconductor Device and a Method of Manufacturing the Same

Semiconductor device, printed wiring board for mounting the semiconductor device and connecting structure for these

Thermally enhanced semiconductor package

SEMICONDUCTOR MODULE

Semiconductor device having a sealing body and partially exposed conductors

Semiconductor device stack with bonding layer and wire retaining member

Package-on-package using through-hole via die on saw streets

MULTI-CHIP SEMICONDUCTOR DEVICES HAVING CONDUCTIVE VIAS AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE

Integrated circuit package system with offset stacked die

LEADFRAME FOR SEMICONDUCTOR PACKAGES

Semiconductor device

Semiconductor device and manufacturing method therefor

Semiconductor chip package

SEMICONDUCTOR DEVICE, LEADFRAME AND METHOD OF ENCAPSULATING

Integrated Circuit Package for Magnetic Capacitor

Semiconductor light emitting device, method of manufacturing the same, and semiconductor light emitting device package using the same

Package for an optical device

Simple radio frequency integrated circuit (RFIC) packages with integrated antennas

Electronic packages with fine particle wetting and non-wetting zones

Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity in the post

Method of manufacturing semiconductor device

Power device and a method for controlling a power device

Circuit device

Chip package without core and stacked chip package structure

CHIP PACKAGE WITHOUT CORE AND STACKED CHIP PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE

Semiconductor device and method of manufacturing the same

Package substrate structure and chip package structure and manufacturing process thereof

Adhesive tape and semiconductor package using the same

Process for packaging components, and packaged components

Method for manufacturing a semiconductor component and structure therefor

Monolithic semiconductor switches and method for manufacturing

Electronic device

CONDUCTIVE BUMPS, WIRE LOOPS INCLUDING THE IMPROVED CONDUCTIVE BUMPS, AND METHODS OF FORMING THE SAME

Method for producing a metal-ceramic substrate for electric circuits on modules

Method to prevent corrosion of bond pad structure

Metallized substrate and method for producing the same

Semiconductor device

Semiconductor device

Semiconductor device and manufacturing method of the same

3D integration of vertical components in reconstituted substrates

SEMICONDUCTOR PACKAGE WITH WEDGE BONDED CHIP

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor device having lead free solders between semiconductor chip and frame and fabrication method thereof

INTEGRATED CIRCUIT CHIP PACKAGE MODULE

Stackable layer containing ball grid array package

Multi-chip semiconductor package

Lead frames with improved adhesion to plastic encapsulant

Semiconductor device which exposes die pad without covered by interposer and its manufacturing method

SEMICONDUCTOR DEVICE

Method for forming a patterned thick metallization atop a power semiconductor chip

Semiconductor device including bonding pads and semiconductor package including the semiconductor device

Method of teaching eyepoints for wire bonding and related semiconductor processing operations

Leadless semiconductor package with electroplated layer embedded in encapsulant and the method for manufacturing the same

Thin quad flat package with no leads (QFN) fabrication methods

Laser bonding for stacking semiconductor substrates

ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE MADE WITH THE SAME

Semiconductor circuit and switching power supply apparatus

Electronic device

Semiconductor device and method of fabricating the same

SEMICONDUCTOR-BASED SUBMOUNT WITH ELECTRICALLY CONDUCTIVE FEED-THROUGHS

Semiconductor package system with thermal die bonding

Wafer level vertical diode package structure and method for making the same

Method and apparatus for stacked die package with insulated wire bonds

Semiconductor device including wires connecting electrodes to an inner lead

Semiconductor device with lead terminals having portions thereof extending obliquely

Power module package having excellent heat sink emission capability and method for manufacturing the same

Integrated circuit package-on-package stacking system

Semiconductor device, method for manufacturing the same, and multilayer substrate having the same

Metal schemes of trench MOSFET for copper bonding

Semiconductor device with circuit for reduced parasitic inductance

IC PACKAGE HAVING COLORED PATTERN

Methods for making microelectronic die systems

ADHESIVE FILM AND SEMICONDUCTOR DEVICE HAVING THE SAME

Power module

SHIELDED ELECTRONIC COMPONENTS AND METHOD OF MANUFACTURING THE SAME

Methods for forming packaged products

PACKAGED POWER SWITCHING DEVICE

Integrated circuit package system and method of manufacture thereof

Marking method for semiconductor device and semiconductor device provided with markings

Semiconductor package structure with protection bar

SEMICONDUCTOR DEVICE

Method for forming stackable semiconductor device packages including openings with conductive bumps of specified geometries

Package-on-Package Device, Semiconductor Package, and Method for Manufacturing The Same

Stackable semiconductor device packages including openings partially exposing connecting elements, conductive bumps, or conductive conductors

Three-dimensional package

CHIP ON LEAD WITH SMALL POWER PAD DESIGN

SEMICONDUCTOR CHIP PACKAGE

Thin film light emitting diode

Condenser for power module and power module

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE SUBSTRATE WITH METAL BUMPS

Method of making a semiconductor chip assembly with an aluminum post/base heat spreader and a silver/copper conductive trace

Light emitting diode lamp

Semiconductor package and plasma display device including the same

CHIP PACKAGES WITH POWER MANAGEMENT INTEGRATED CIRCUITS AND RELATED TECHNIQUES

Power semiconductor module system

Low profile discrete electronic components and applications of same

Integrated electronic device with transceiving antenna and magnetic interconnection

Illumination system

METHOD OF EVALUATING THE FLAME RETARDANCY OF SEALING RESIN AND TEST SAMPLE FOR EVALUATION OF FLAME RETARDANCY

Semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor device

Ball land structure having barrier pattern

Semiconductor device and method of confining conductive bump material during reflow with solder mask patch

Silicon substrate and chip package structure with silicon base having stepped recess for accommodating chip

System-in-package packaging for minimizing bond wire contamination and yield loss

SEMICONDUCTOR PACKAGE, MANUFACTURING METHOD THEREOF AND IC CHIP

PROTECTIVE THIN FILM COATING IN CHIP PACKAGING

Manufacturing method for semiconductor devices and semiconductor device

Micro-optical device packaging system

Semiconductor device

PACKAGE ASSEMBLY FOR SEMICONDUCTOR DEVICES

Semiconductor device and method of manufacturing same

Stacked semiconductor package

CHIP PACKAGE WITH STACKED INDUCTORS

Semiconductor chip assembly with aluminum post/base heat spreader and silver/copper conductive trace

Light emitting diode

THERMOELECTRIC DEVICE AND FABRICATION METHOD THEREOF, CHIP STACK STRUCTURE, AND CHIP PACKAGE STRUCTURE

Method of manufacturing semiconductor device that uses both a normal photomask and a phase shift mask for defining interconnect patterns

Electric power converter

HEAT RADIATING MEMBER, CIRCUIT BOARD USING THE HEAT RADIATING MEMBER, ELECTRONIC COMPONENT MODULE, AND METHOD OF MANUFACTURING THE ELECTRONIC COMPONENT MODULE

Electrical assembly

Resin paste for die bonding, containing a polyurethaneimide resin and thermosetting resin method for manufacturing semiconductor device, and semiconductor device, using the resin paste

Grid array packages

Adhesive Tape, Semiconductor Package and Electronics

Semiconductor device

Bonding pad structure and manufacturing method thereof

Face-to-face (F2F) hybrid structure for an integrated circuit

Molding compound including a carbon nano-tube dispersion

Stackable semiconductor device assemblies

Integrated circuit packaging system substrates and method of manufacture thereof

Semiconductor device and method of forming recessed conductive vias in saw streets

Stacked semiconductor package, semiconductor package module and method of manufacturing the stacked semiconductor package

High-density multifunctional PoP-type multi-chip package structure

Integrated circuit packaging system with package stacking and method of manufacture thereof

Power module having stacked flip-chip and method of fabricating the power module

Apparatus for shielding integrated circuit devices

Multilayered lead frame for a semiconductor light-emitting device

Semiconductor chip assembly with post/base heat spreader and cavity in post

Light emitting diode and method for manufacturing the same

Semiconductor integrated circuit

Nano memory, light, energy, antenna and strand-based systems and methods

Wire bonding method

Passive component incorporating interposer

Wiring board

LIGHT EMITTING MODULE, FABRICATION METHOD THEREFOR, AND LAMP UNIT

INTEGRATED CIRCUIT PACKAGES HAVING SHARED DIE-TO-DIE CONTACTS AND METHODS TO MANUFACTURE THE SAME

Package module for a memory IC chip

Semiconductor element and electrical apparatus

Intermediate structure of semiconductor device and method of manufacturing the same

Wire bonding method and semiconductor device

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE