FINE-PITCH OBLONG SOLDER CONNECTIONS FOR STACKING MULTI-CHIP PACKAGES

Semiconductor device and method of forming a wafer level package with top and bottom solder bump interconnection

Integrated circuit package system for stackable devices

Integrated circuit packaging system having planar interconnect

Semiconductor package and method for manufacturing the same

Integrated circuit package system with anti-peel contact pads

Semiconductor package system with die support pad

Quad flat pack in quad flat pack integrated circuit package system

Method of electrically connecting a shielding layer to ground through a conductive via disposed in peripheral region around semiconductor die

SEMICONDUCTOR CHIP ASSEMBLY WITH COPPER/ALUMINUM POST/BASE HEAT SPREADER

Semiconductor chip assembly with post/base/cap heat spreader

Lead frame assembly, lead frame and insulating housing combination, and led module having the same

Tack adhesion testing device

Connecting terminal, semiconductor package using connecting terminal and method for manufacturing semiconductor package

Substrate of window ball grid array package

Apparatus to manufacture a semiconductor package having a buffer disposed adjacent to a process unit of the apparatus

Method of manufacturing a semiconductor device

Semiconductor device and a method of manufacturing the same

Fabrication method of package structure with simplified encapsulation structure and simplified wiring

Semiconductor package and method using isolated Vplane to accommodate high speed circuitry ground isolation

Integrated circuit device

METHOD OF WIREBONDING THAT UTILIZES A GAS FLOW WITHIN A CAPILLARY FROM WHICH A WIRE IS PLAYED OUT

Power semiconductor module including a multilayer substrate

Electronic device and method of manufacturing same

Resin sheet, circuit device and method of manufacturing the same

Package substrate, semiconductor package having the package substrate

Integrated circuit devices with stacked package interposers

Method of manufacturing a semiconductor device

Semiconductor device and method of forming a fan-in package-on-package structure using through silicon vias

Method of fabicating a microelectronic die having a curved surface

Multi layer low cost cavity substrate fabrication for PoP packages

Mainboard assembly including a package overlying a die directly attached to the mainboard

Carrier structure of SoC with custom interface

Integrated circuit package system with redistribution layer

Leadless semiconductor chip carrier system

METHOD OF FORMING BALL BOND

ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device

Ball grid array package stacking system

Chip package structure including heat dissipation device and an insulation sheet

Package with power and ground through via

Integrated capacitors in package-level structures, processes of making same, and systems containing same

Semiconductor device and method of forming a fan-out structure with integrated passive device and discrete component

VERTICAL CURRENT TRANSPORT IN A POWER CONVERTER CIRCUIT

Semiconductor chip assembly with post/base heat spreader and substrate

LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME

Wire bonding method, wire bonding apparatus, and wire bonding control program

Electronic component storing package and electronic apparatus

Method for producing an LTCC substrate

Stacking integrated circuits containing serializer and deserializer blocks using through silicon via

Fabrication method of semiconductor device

Method of encapsulating wire bonds

Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards

Method of manufacturing semiconductor device

Thermosetting die-bonding film

Method of manufacturing a semiconductor device

Multi-chip module and methods

Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages

Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages

Method of making a semiconductor chip assembly with a post/base heat spreader and a conductive trace

Method of making a semiconductor chip assembly with a post/base heat spreader and a substrate

Inverter power module with distributed support for direct substrate cooling

Isolator with complementary configurable memory

SEMICONDUCTOR DEVICE

STACKED TYPE CHIP PACKAGE STRUCTURE

MICROFEATURE WORKPIECE SUBSTRATES HAVING THROUGH-SUBSTRATE VIAS, AND ASSOCIATED METHODS OF FORMATION

COPPER PAD FOR COPPER WIRE BONDING

CHIP SCALE PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards

Ball grid array package having one or more stiffeners

Integrated circuit package system with package substrate having corner contacts and method of manufacture thereof

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor package fabrication method

Semiconductor package and method therefor

Semiconductor device and method for fabricating semiconductor device

QFN package

Package structure utilizing high and low side drivers on separate dice

Semiconductor device and method for manufacturing the same, and semiconductor sealing resin

Resin molded semiconductor device and manufacturing method thereof

ENHANCED WIRE BOND STABILITY ON REACTIVE METAL SURFACES OF A SEMICONDUCTOR DEVICE BY ENCAPSULATION OF THE BOND STRUCTURE

Semiconductor device and method of forming the device using sacrificial carrier

Semiconductor package

Semiconductor package which includes an insulating layer located between package substrates which may prevent an electrical short caused by a bonding wire

Resin sealing type semiconductor device and method of manufacturing the same, and lead frame

Resin sealing type semiconductor device and method of manufacturing the same, and resin sealing type electronic device

WIRE BODNING PACKAGE STRUCTURE

Semiconductor system-in-a-package containing micro-layered lead frame

Semiconductor device having a suspended isolating interconnect

Micro-layered lead frame semiconductor packages

Stackable multi-chip package system with support structure

STACKED-CHIP DEVICE

Vias and method of making

Package device having crack arrest feature and method of forming

Stacked-chip device

SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER AND CONDUCTIVE TRACE

Wire bonding device and wire bonding process using same

Package, method of manufacturing a package and frame

Bonded structure and bonding method

ADHESIVE SHEET FOR PRODUCING A SEMICONDUCTOR DEVICE, AND A METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE USING THE SAME

Integrated circuit apparatus, systems, and methods

Method for fabricating semiconductor component having encapsulated through wire interconnect (TWI)

Electronic Component Union, Electronic Circuit Module Utilizing the Same, and Process for Manufacturing the Same

Thin foil semiconductor package

Radio-frequency package

Integrated circuit package system

Circuit for detecting bonding defect in multi-bonding wire

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

Integrated circuit package system having cavity

Semiconductor device and method of manufacturing the same

Semiconductor device

Vertical stack type multi-chip package having improved grounding performance and lower semiconductor chip reliability

ADVANCED QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Stacked integrated circuit package-in-package system and method of manufacture thereof

Semiconductor chip including a chip via plug penetrating a substrate, a semiconductor stack, a semiconductor device package and an electronic apparatus including the semiconductor chip

Lead frame, resin package, semiconductor device and resin package manufacturing method

Advanced quad flat non-leaded package structure and manufacturing method thereof

Semiconductor device having a sealant layer including carbon directly contact the chip and the carrier

Sensor device including two sensors embedded in a mold material

Semiconductor device and manufacturing method thereof

Heat dissipating package structure and method for fabricating the same

Method of manufacturing a single chip semiconductor integrated circuit device including a mask ROM in a short time

LOW FABRICATION COST, HIGH PERFORMANCE, HIGH RELIABILITY CHIP SCALE PACKAGE

Three dimensional nanoscale circuit interconnect and method of assembly by dielectrophoresis

Integrated circuit packaging system having a cavity

MINIATURE MICROWAVE PACKAGE AND PROCESS FOR FABRICATING THE PACKAGE

Integrated circuit package with open substrate

Integrated circuit package system for package stacking and manufacturing method thereof

Semiconductor package and method for manufacturing the same

Semiconductor structure with communication element

Integrated circuit package system

Metal leadframe package with secure feature

Leadless package with internally extended package leads

Semiconductor module with two cooling surfaces and method

Aluminum bump bonding for fine aluminum wire

Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages

Method of manufacturing stacked semiconductor device

Method for fabricating package structure of stacked chips

Semiconductor device

Exposed interconnect for a package on package system

Thin inductor, method of producing the thin inductor, and ultra small size power conversion apparatus using the thin inductor

Method for forming a package-on-package structure

Semiconductor device with an improved solder joint

Semiconductor assembly with component pads attached on die back side

Flange package for a semiconductor device

IC Package Method Capable of Decreasing IR Drop and Associated IC Apparatus

CHIP PACKAGE STRUCTURE

Stacked Memory Module

Compact co-packaged semiconductor dies with elevation-adaptive interconnection plates

Lead frame package

Semiconductor device with plastic package molding compound, semiconductor chip and leadframe and method for producing the same

Electronic device and method of manufacturing same

Semiconductor device packages with electromagnetic interference shielding

Assembling of Electronic Members on IC Chip

Destructor integrated circuit chip, interposer electronic device and methods

Semiconductor device and radio communication device

Semiconductor device and method for making the same

NONVOLATILE MEMORY SYSTEM

DICING DIE-BONDING FILM

Dicing die-bonding film

DICING DIE-BONDING FILM

Integrated circuit package system with concave terminal

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

DICING DIE-BONDING FILM

Stackable optoelectronics chip-to-chip interconnects and method of manufacturing

Stackable optoelectronics chip-to-chip interconnects and method of manufacturing

Stackable optoelectronics chip-to-chip interconnects and method of manufacturing

Microelectronic packages with small footprints and associated methods of manufacturing

Antennas integrated in semiconductor chips

SHIELDED WIREBOND

Copper on organic solderability preservative (OSP) interconnect and enhanced wire bonding process

Optical semiconductor apparatus

Leadframe, semiconductor device, and method of manufacturing the same

Integrated circuit package stacking system

Fan-in interposer on lead frame for an integrated circuit package on package system

RDL patterning with package on package system

Method for forming an etched recess package on package system

Semiconductor device, semiconductor module, method for manufacturing semiconductor device, and lead frame

Method and System for Secure Heat Sink Attachment on Semiconductor Devices with Macroscopic Uneven Surface Features

Method and device for controlling the generation of ultrasonic wire bonds

Printed circuit boards

Copper bonding method

Method of forming support structures for semiconductor devices

METHOD OF FORMING ON-CHIP PASSIVE ELEMENT

Method for manufacturing package on package with cavity

Method of manufacturing a stacked semiconductor apparatus

RF shielding arrangement for semiconductor packages

Method of manufacturing a wafer including providing electrical conductors isolated from circuitry

Method and apparatus for improvements in chip manufacture and design

STACKED DIE PACKAGE HAVING REDUCED HEIGHT AND METHOD OF MAKING SAME

Semiconductor device including a transformer on chip

Semiconductor device and method for manufacturing the same

Semiconductor module and a method for producing an electronic circuit

High frequency ceramic package and fabrication method for the same

BALL GRID ARRAY PACKAGE

UNIVERSAL SUBSTRATE FOR SEMICONDUCTOR PACKAGES AND THE PACKAGES

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME

Integrated circuit package system with leadframe substrate

Semiconductor chip package, stacked package comprising semiconductor chips and methods of fabricating chip and stacked packages

Method of forming a molded array package device having an exposed tab and structure

DICING/DIE BONDING FILM

Semiconductor system-in-package and method for making the same

Multi lead frame power package

Integrated circuit package with etched leadframe for package-on-package interconnects

Semiconductor device and method of forming shielding along a profile disposed in peripheral region around the device

IC HAVING FLIP CHIP PASSIVE ELEMENT AND DESIGN STRUCTURE

STACK TYPE SEMICONDUCTOR CHIP PACKAGE HAVING DIFFERENT TYPE OF CHIPS AND FABRICATION METHOD THEREOF

Semiconductor device and semiconductor package including the same

Holding jig for electronic parts

Manufacturing method of semiconductor device

CONTACT SURROUNDED BY PASSIVATION AND POLYMIDE AND METHOD THEREFOR

Thermally enhanced single inline package (SIP)

Semiconductor device and manufacturing method thereof

Pop semiconductor device manufacturing method

METHODS AND SYSTEMS FOR PACKAGING INTEGRATED CIRCUITS WITH THIN METAL CONTACTS

Semiconductor module and method

Printed circuit board for accomplishing narrow scribe lane and semiconductor package including the printed circuit board

FINE PITCH BOND PAD STRUCTURE

Stacked semiconductor chips with separate encapsulations

Semiconductor device and method of providing a thermal dissipation path through RDL and conductive via

Semiconductor device, production method for the same, and substrate

Power semiconductor device

Power semiconductor device

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

High density stacked die assemblies, structures incorporated therein and methods of fabricating the assemblies

POWER MODULE PACKAGE HAVING EXCELLENT HEAT SINK EMISSION CAPABILITY AND METHOD FOR MANUFACTURING THE SAME

Semiconductor device, lead frame and method of manufacturing semiconductor device

Stress Mitigation in Packaged Microchips

Semiconductor package

Stackable molded packages and methods of making the same

Semiconductor device packages with electromagnetic interference shielding

OPTICAL SEMICONDUCTOR DEVICE

Metal core circuit element mounting board

Radio frequency unit analog level detector and feedback control system

Aluminum leadframes for semiconductor QFN/SON devices

Method of manufacture for semiconductor package with flow controller

Semiconductor device

Lens support and wirebond protector

Semiconductor device and method of forming stepped-down RDL and recessed THV in peripheral region of the device

Integrated connection arrangements

Semiconductor device having a semiconductor chip and resin sealing portion

Semiconductor device and a method of manufacturing the same

Semiconductor device and method of forming composite bump-on-lead interconnection

INTEGRATED CIRCUIT DEVICE WITH IMPROVED UNDERFILL COVERAGE

Semiconductor device and heat sink with 3-dimensional thermal conductivity

Semiconductor package and method for packaging a semiconductor package

Semiconductor package, method for enhancing the bond of a bonding wire, and method for manufacturing a semiconductor package

Semiconductor package and method for processing and bonding a wire

Semiconductor device

Wafer and semiconductor package

Semiconductor device

Multi-layer semiconductor package with vertical connectors and method of manufacture thereof

Semiconductor package structure and method for manufacturing the same

Chip-Stacked Package Structure with Leadframe Having Multi-Piece Bus Bar

Carrier for bonding a semiconductor chip onto and a method of contracting a semiconductor chip to a carrier

Resin-encapsulated semiconductor device and its manufacturing method

Embedded semiconductor die package and method of making the same using metal frame carrier

Integrated circuit package system with chip on lead

Fine-pitch routing in a lead frame based system-in-package (SIP) device

Packaging integrated circuits for high stress environments

INTEGRATED CIRCUIT PACKAGE WITH EMI SHIELD

Non-pull back pad package with an additional solder standoff

Wiring substrate and method of manufacturing the same

Method of fabricating a circuit apparatus

Method of making a semiconductor chip assembly with a post/base heat spreader and vertical signal routing

Method of making a semiconductor chip assembly with a post/base heat spreader and horizontal signal routing

Optical signaling for a package-on-package stack

System-in-package module and mobile terminal having the same

Package substrate structure

Radio frequency (RF) integrated circuit (IC) packages having characteristics suitable for mass production

Semiconductor device

SOLDER CONTACT

Semiconductor device with fuse portion

Semiconductor chip assembly with post/base heat spreader and vertical signal routing

Semiconductor device

Integrated circuit package system with supported stacked die

SYSTEM IN PACKAGE MODULE

PACKAGE STRUCTURE FOR RADIO FREQUENCY MODULE AND MANUFACTURING METHOD THEREOF

Semiconductor device including power supply bar having jutted portion, parallel running portion and bent portion and manufacturing method therefor

Integrated circuit package system with bumped lead and nonbumped lead

Integrated circuit package system with lead-frame paddle scheme for single axis partial saw isolation

Manufacturing method for integrating a shunt resistor into a semiconductor package

Integrated circuit package, notably for image sensor, and method of positioning

Semiconductor chip assembly with post/base heat spreader and horizontal signal routing

Electronic device having contact elements with a specified cross section and manufacturing thereof

Circuit substrate and method of fabricating the same and chip package structure

Lead-embedded metallized ceramics substrate and package

Printed circuit board assembly

Method of manufacturing layered chip package

Method of fabricating stacked wire bonded semiconductor package with low profile bond line

Method of fabricating stacked semiconductor package with localized cavities for wire bonding

Laser optical path detection in integrated circuit packaging

Non-destructive laser optical integrated circuit package marking

Method of making an electronic device and electronic device substrate

Semiconductor package with reduced inductive coupling between adjacent bondwire arrays

Transistor and routing layout for a radio frequency integrated CMOS power amplifier device

Electronic device having a wiring substrate

Semiconductor memory device

Layered chip package and method of manufacturing same

WIRE ON WIRE STITCH BONDING IN A SEMICONDUCTOR DEVICE

Stacked wire bonded semiconductor package with low profile bond line