Carrier, method of manufacturing a carrier and an electronic device

Leadframe and method of manufacturing the same

Method for manufacturing semiconductor device with plural semiconductor chips

Method of assembling light-emitting apparatus

Condenser microphone and method for making the same

Semiconductor laser with grating structure for stabilizing the wavelength of optical radiation

Semiconductor integrated circuit device

Stacked IC device having functions for selecting and counting IC chips

Method and apparatus for protecting a print engine assembly from print media pulling

Surface acoustic wave device

Module for radio-frequency applications

RF power amplifier and method for packaging the same

Semiconductor chip package

Die package having an adhesive flow restriction area

UBM for fine pitch solder ball and flip-chip packaging method using the same

Wafer-level assembly method for chip-size devices having flipped chips

Semiconductor device and manufacturing method for the same

Efficient use of wafer area with device under the pad approach

Fabrication process for a semiconductor integrated circuit device

Semiconductor device

Bonding wire and an integrated circuit device using the same

Semiconductor device having capacitors for reducing power source noise

Semiconductor device and manufacturing method thereof

Electronic device and intermediate product of electronic device

Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier

Semiconductor chip heat transfer

Semiconductor device

Three-level leadframe for no-lead packages

Low profile package having multiple die

Semiconductor device and manufacturing method for the same

Surface mount type semiconductor device and lead frame structure thereof

Electronic device having wiring substrate and lead frame

Semiconductor chip and manufacturing method for the same, and semiconductor device

Integrated circuit device packaging structure and packaging method

Integrated circuit device packaging structure and packaging method

Light emission device

LED substrate

Image sensor and manufacturing method thereof

Bumping electronic components using transfer substrates

System and method for increasing the strength of a bond made by a small diameter wire in ball bonding

Arrangement for wire bonding and method for producing a bonding connection

Electrode module

Method for producing an electronic device connected to a printed circuit board

Moisture resistant, flexible epoxy/cyanate ester formulation

Electronic circuit device having circuit board electrically connected to semiconductor element via metallic plate

Memory card with chamfer

Photoresist process to enable sloped passivation bondpad openings for ease of metal step coverings

Semiconductor device and manufacturing method thereof

Conductive pattern producing method and its applications

Encapsulated semiconductor components and methods of fabrication

Manufacturing method of thin film integrated circuit device and manufacturing method of non-contact type thin film integrated circuit device

Method for fabricating a flash-preventing window ball grid array semiconductor package

Alignment and orientation features for a semiconductor package

Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package

Method of manufacturing an electronic device, and electronic device

Method for producing a luminescence diode chip

Use of direct gold surface finish on a copper wire-bond substrate, methods of making same, and methods of testing same

Circuit

System and method for optically interconnecting memory devices

Elongated flexible lighting equipment and fabricating method of same

High frequency module

Insulating substrate for IC packages having integral ESD protection

Optical modulator exciting circuit

Solid image-pickup device and method for manufacturing the solid image pickup device

Digital camera that incorporates an authentication arrangement for application to consumable print rolls

High-frequency module, and method of producing same

Method of manufacturing semiconductor device

Micro lead frame package having transparent encapsulant

Semiconductor chip with external connecting terminal

Semiconductor chip with external connecting terminal

Electronic package structure and the packaging process thereof

Wafer stacking with anisotropic conductive adhesive

Semiconductor device and semiconductor module

Method for fabricating a semiconductor interconnect having conductive spring contacts

Method of forming a bonding pad structure

Semiconductor device and method for manufacturing the same

Semiconductor chip with external connecting terminal

Solder ball pad structure

Semiconductor element having protruded bump electrodes

Solderless connection in LED module

Electronics unit

Package circuit board with a reduced number of pins and package including a package circuit board with a reduced number of pins and methods of manufacturing the same

Power supply connection structure to a semiconductor device

Method of fabricating a pad over active circuit I.C. with frame support structure

Stackable ceramic FBGA for high thermal applications

Multi-chip module and methods

Semiconductor device

Semiconductor device and manufacturing method thereof

Multi-part lead frame with dissimilar materials

Method of packaging an optical sensor

Semiconductor device

Surface mount package

Integrated circuit package for semiconductor devices having a reduced leadframe pad and an increased bonding area

Optical semiconductor device and method of manufacturing optical semiconductor device

I/O architecture for integrated circuit package

Strobe light control circuit and IGBT device

LED package die having a small footprint

Light emitting device and illuminator using the same

Electronic circuit

Apparatus and methods for an underfilled integrated circuit package

Method for fabricating a warpage-preventive circuit board

Method of forming bump pad of flip chip and structure thereof

Method of disposing conductive bumps onto a semiconductor device and semiconductor devices so formed

Method of manufacturing a semiconductor device by using a matrix frame

Method of backside grinding a bumped wafer

Stacking memory chips using flat lead-frame with breakaway insertion pins and pin-to-pin bridges

Semiconductor device with intermediate connector

Mounting structure of semiconductor chip, semiconductor device and method of making the semiconductor device

Method for forming at least one protective cap

Moulding assembly for forming at least one protective cap

Package for housing optical semiconductor element and optical semiconductor apparatus

Connection apparatus for parallel optical interconnect module and parallel optical interconnect module using the same

Optical coupler and electronic equipment using same

Package for light emitting element and process for fabricating same

Thin film capacitors on ceramic

Electrical connection of components

Optical device for optical semiconductor package and fabrication method

Electromagnetic wave absorber, method of manufacturing the same and appliance using the same

Fabrication methods for electronic system modules

Semiconductor device, manufacturing method thereof and electronic equipment

Method of manufacturing a semiconductor device

Multi-chip package structure

Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof

Electronic circuit unit and method of fabricating the same

Method of manufacturing a semiconductor device including a semiconductor chip having an inclined surface

Semiconductor device and method of fabricating the same

Integrated circuit arrangement

Electrode-type heat sink

Chip assembly package

Semiconductor package

Semiconductor chip package and multichip package

Method of manufacturing a semiconductor device

High-frequency device

Multi-chip package structure

Semiconductor device having layered chips

Chip package structure

System and method for improving solder joint reliability in an integrated circuit package

Leadless semiconductor package

Semiconductor package with increased number of input and output pins

Chemical leadframe roughening process and resulting leadframe and integrated circuit package

Signal routing in a hermetically sealed MEMS device

Chip-mounted film package

Photosensitive semiconductor package and method for fabricating the same

Wide band cross point switch using MEMS technology

Methods for depositing, releasing and packaging microelectromechanical devices on wafer substrates

Package structure for semiconductor

Semiconductor light-emitting apparatus having wavelength conversion portion and method of fabricating the same

Image sensor package and method for manufacturing the same

High power light emitting diode package and fabrication method thereof

Structure of chip carrier for semiconductor optical device, optical module, and optical transmitter and receiver

Pixelated cadmium zinc telluride based photon counting mode detector

Wire bonder for ball bonding insulated wire and method of using same

Electrolytic stripping method

Mounting device and method thereof

Optoelectronic component with a peltier cooler

Wireless communication apparatus and semiconductor device

Novel process for improved hot carrier injection

Method to remove fluorine residue from bond pads

Semiconductor device and fabrication method thereof

Methods of providing solder structures for out plane connections

Die exhibiting an effective coefficient of thermal expansion equivalent to a substrate mounted thereon, and processes of making same

Attachment of integrated circuit structures and other substrates to substrates with vias

Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities

Process for producing optical semiconductor device

Manufacturing method of semiconductor device, semiconductor device, circuit substrate and electronic equipment

Warpage control of array packaging

Stacked semiconductor device assembly and method for forming

EMI-EMC shield for silicon-based optical transceiver

Chip-to-chip communication system using an ac-coupled bus and devices employed in same

LED package assembly with datum reference feature

Method and apparatus for producing untainted white light using off-white light emitting diodes

Flash module with quantum dot light conversion

Package structure of optical sensitive device and method for packaging optical sensitive device

Semiconductor module with vertically mounted semiconductor chip packages

Electric circuit module

Integrated circuit package substrate having a thin film capacitor structure

Integrating passive components on spacer in stacked dies

Ceramic embedded wireless antenna

Microconverter and laminated magnetic-core inductor

Deformation element for a motor vehicle

Semiconductor light emitting device

Chip packaging compositions, packages and systems made therewith, and methods of making same

Adhesive film for manufacturing semiconductor device

Embedded redistribution interposer for footprint compatible chip package conversion

Semiconductor module with a semiconductor stack, and methods for its production

Packaging substrates for integrated circuits and soldering methods

Flexible package with rigid substrate segments for high density integrated circuit systems

Wire loop grid array package

Tapered dielectric and conductor structures and applications thereof

Multiple chip package module having inverted package stacked over die

System and method for increasing the number of IO-s on a ball grid pattern

Stress distribution package

Wire bonding package

Thermally enhanced semiconductor package

Method of assembling a ball grid array package with patterned stiffener layer

Integrated circuit package substrate having a thin film capacitor structure

Dual semiconductor die package with reverse lead form

Microelectronic assemblies with composite conductive elements

Stack package with improved heat radiation and module having the stack package mounted thereon

Semiconductor package with a flip chip on a solder-resist leadframe

Manufacturing method of a semiconductor device

Lead frame structure with aperture or groove for flip chip in a leaded molded package

Semiconductor device and method for the fabrication thereof grinding frame portion such that plural electrode constituent portions

Substrate structure capable of reducing package singular stress

Semiconductor packaging substrate

Photosensitive semiconductor package, method for fabricating the same, and lead frame thereof

Semiconductor component arrangement with an insulating layer having nanoparticles

Method for manufacturing semiconductor device, adhesive sheet for use therein and semiconductor device

Nitride semiconductor light emitting device and method for manufacturing the same

Opto-electronic assembly having an encapsulant with at least two different functional zones

Package for housing light-emitting element, light-emitting apparatus and illumination apparatus

Nitride semiconductor light emitting device

P and N contact pad layout designs of GaN based LEDs for flip chip packaging

Nitride semiconductor light emitting diode and fabrication method thereof

Semiconductor testing device and semiconductor testing method

Optical apparatus and image production apparatus

Methods of forming solder areas on electronic components and electronic components having solder areas

Flip-chip solder bump formation using a wirebonder apparatus

Wire bonding simulation

Wire bonding apparatus and method for clamping a wire

Method and apparatus for trace shielding and routing on a substrate

Chip orientation and attachment method

Slotted planar power conductor

Photocurable adhesive compositions, reaction products of which have low halide ion content

Intra-cavity catheters and methods of use

Method for making a package substrate without etching metal layer on side walls of die-cavity

Method for manufacturing semiconductor device

Capacitor and manufacturing method thereof, semiconductor device and substrate for a semiconductor device

Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat

Castellation wafer level packaging of integrated circuit chips

Method of making a microelectronic assembly

Shielding arrangement to protect a circuit from stray magnetic fields

Integrated battery pack with lead frame connection

Epoxy/silicone mixed resin composition and light-emitting semiconductor device

Semiconductor device including multi-chip

Power module with heat exchange

Circuits and methods that attenuate coupled noise

Cerdip type of solid-state image sensing device, structure and method for gripping cerdip type of solid-state image sensing device

Durable radio frequency identification label and methods of manufacturing the same

Impedance transformation ratio control in film acoustically-coupled transformers

Light emitting device having a backside electrode portion and same thickness protrusion and method of manufacturing the same

Driving circuit for an ignition element of a passenger protection system

Method for producing light-guiding LED bodies in two spatially and temporally separate steps

Conductor composition, a mounting substrate and a mounting structure utilizing the composition

Method of manufacturing a semiconductor device and a semiconductor device

Semiconductor component and method for fabricating

Inverted J-lead for power devices

Method for ball grid array chip packages having improved testing and stacking characteristics

Structure and method for reinforcing a bond pad on a chip

Underfill integration for optical packages

Semiconductor device

Semiconductor device

Semiconductor device and the method of producing the same

Solder bump structure for flip chip package and method for manufacturing the same

Method of making semiconductor device

Semiconductor device having insulating material dispersed with conductive particles which establish electrical connection by penetrating to both copper conductive layer and land of wiring board

Ball grid array package substrates with a modified central opening and method for making the same

Copper-based chip attach for chip-scale semiconductor packages

Arrangement with a semiconductor chip and support therefore and method for a bonded wire connection

Bonding pads with dummy patterns in semiconductor devices and methods of forming the same

Semiconductor package

Semiconductor packages for enhanced number of terminals, speed and power performance

Multi-die processor

Microelectronic device signal transmission by way of a lid

Semiconductor package with improved solder joint reliability

Light-emitting diode package structure

Thin, thermally enhanced molded package with leadframe having protruding region

Method for manufacturing thin GaAs die with copper-back metal structures

Microelectronic devices and methods for filling vias in microelectronic devices

Semiconductor device and fabrication method thereof

LED package

Light-emitting diode

Light-radiating semiconductor component with a luminescence conversion element

Laser diode and manufacturing method thereof

Carrier layer for a semiconductor layer sequence and method for producing semiconductor chips

Optical semiconductor device

Optoelectronic component

Optical display systems and methods

LED light with blaze-like radiance effect

[METHOD OF FORMING BOND MICROSTRUCTURE]

Mounting method of bump-equipped electronic component and mounting structure of the same

Roller wire brake for wire bonding machine

Bonding apparatus and bonding external appearance inspection device

Nano-metal composite made by deposition from colloidal suspensions

Heat sink in the form of a heat pipe and process for manufacturing such a heat sink

Acceleration sensor and method of manufacturing acceleration sensor

Manufacturing method of a modularized leadframe

Method of incorporating interconnect systems into an integrated circuit process flow

Semiconductor packaging

Adapter for connecting an optoelectronic transducer module to a printed circuit board, transmitting and/or receiving arrangement with such an adapter, optoelectronic transducer module and method for its production

Circuit board and method for manufacturing the same, semiconductor package, component built-in module and board for electronic equipment

Fine particle film forming apparatus and method and semiconductor device and manufacturing method for the same

Method of forming land grid array packaged device

Electrical connecting apparatus

Method of producing an electronic component

Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devices

Impedance matching circuit with simultaneous shielding of parasitic effects for transceiver modules

Fingerprint reading device and personal verification system

Semiconductor device and method of manufacturing thereof

Light source apparatus and optical communication apparatus using the same