Optical semiconductor device

DIE-BONDING MATERIAL FOR OPTICAL SEMICONDUCTOR DEVICES AND OPTICAL SEMICONDUCTOR DEVICE USING SAME

SUBMOUNT, OPTICAL MODULE PROVIDED THEREWITH, AND SUBMOUNT MANUFACTURING METHOD

SEMICONDUCTOR LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME

LED package with recess and protrusions

Light-emitting device, light-emitting device package, method of manufacturing light-emitting device, and method of packaging light-emitting device

Semiconductor package and method of manufacturing the same

Light emitting diode package

LIGHT EMITTING DIODE SOURCE WITH PROTECTIVE BARRIER

Light emitting diode (LED) devices, systems, and methods

LIGHT EMITTING DEVICE

Light emitting device and illumination apparatus using same

LOW-COST SOLID-STATE BASED LIGHT EMITTING DEVICES WITH PHOTOLUMINESCENT WAVELENGTH CONVERSION AND THEIR METHOD OF MANUFACTURE

High power LEDs with non-polymer material lenses and methods of making the same

Solid state lighting devices with accessible electrodes and methods of manufacturing

Light emitting device having a well structure different of a multi-quantum well structures

ELEMENT CARRIER AND LIGHT RECEIVING MODULE

Antenna, method of manufacturing the antenna, and wireless IC device

Metal paste with oxidizing agents

FEEDTHROUGH FOR A WALL OF A PACKAGE

PRINTED WIRING BOARD

Bonding structure and bonding method of heat diffusion member, and cooling unit using the same

Force sensor

Method for manufacturing printed wiring board

Semiconductor device

3D integrated circuit device fabrication with precisely controllable substrate removal

Electronic assemblies including mechanically secured protruding bonding conductor joints

Pre-bonded substrate for integrated circuit package and method of making the same

Method of manufacturing semiconductor device, manufacturing program, and manufacturing apparatus

Vented die and package

FOUR MOSFET FULL BRIDGE MODULE

MOLD RELEASE FILM AND PROCESS FOR PRODUCING LIGHT EMITTING DIODE

Microphone package and method for manufacturing same

Optical module

Switching device provided with a flowing restriction element

Light source module and backlight module

Printed circuit board

Device housing package and mounting structure

Radiofrequency amplifier

Semiconductor device and method of manufacturing the same

LIGHT-EMITTING DEVICE

Semiconductor device for battery power voltage control

Integrated circuit packaging system with interposer

Integrated circuit packaging system with bump conductors and method of manufacture thereof

Semiconductor device with wireless communication

Packaged microelectronic devices recessed in support member cavities, and associated methods

Method for packaging semiconductor dies having through-silicon vias

Semiconductor device and method of forming openings through insulating layer over encapsulant for enhanced adhesion of interconnect structure

Integrated circuit packaging system with vertical interconnection and method of manufacture thereof

Electronic device and method of manufacturing electronic device

Integrated circuit packaging system with interconnects and method of manufacture thereof

Integrated circuit packaging system with vertical interconnection and method of manufacture thereof

Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor device

Integrated circuit chip and fabrication method

Wafer-level interconnect for high mechanical reliability applications

Semiconductor package device with cavity structure and the packaging method thereof

Conductive pad structure, chip package structure and device substrate

BONDING PAD STRUCTURE AND INTEGRATED CIRCUIT COMPRISING A PLURALITY OF BONDING PAD STRUCTURES

SEMICONDUCTOR DEVICE WITH VIAS AND FLIP-CHIP

High performance low profile QFN/LGA

Solder bump connections

Semiconductor device including a DC-DC converter with schottky barrier diode

Compliant interconnects in wafers

SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREOF

Stacked structure and stacked method for three-dimensional chip

PIN ATTACHMENT

Multi-chip module (MCM) power quad flat no-lead (PQFN) semiconductor package utilizing a leadframe for electrical interconnections

SEMICONDUCTOR DEVICES AND ELECTRICAL PARTS MANUFACTURING USING METAL COATED WIRES

Integrated circuit packaging system with multiple row leads and method of manufacture thereof

Top exposed package and assembly method

Die arrangement and method of forming a die arrangement

Pre-bonded substrate for integrated circuit package and method of making the same

Substrate for integrated circuit package with selective exposure of bonding compound and method of making thereof

INTEGRATED CIRCUITS AND FABRICATION PROCESS THEREOF

Overmolded semiconductor package with wirebonds for electromagnetic shielding

Semiconductor device and method of forming recesses in substrate for same size or different sized die with vertical integration

Image sensor unit and image sensor apparatus

Manufacturing of a camera module

MAGNETIC FIELD CURRENT SENSORS

Magnetic field current sensors

Chip package and method for forming the same

Semiconductor device and semiconductor package

Chip package and method for forming the same

Light-emitting diode package structure

Vertical LED with current-guiding structure

Light emitting package

Light emitting device and method of fabricating the same

Conversion LED with high color rendition index

High Efficiency Conversion LED

Conversion medium body, optoelectronic semiconductor chip and method of producing an optoelectronic semiconductor chip

OPTICAL DEVICE

High efficiency LEDs and LED lamps

SiC semiconductor device

Light emitting device

Blister package with integrated electronic tag and method of manufacture

Brace for long wire bond

Interconnect structure

Wiring board and electronic component device

System for separating a diced semiconductor die from a die attach tape

Increased sensor die adhesion

Methods of manufacturing a semiconductor device

Method of fabricating oxide material layer with openings attached to device layers

Aluminum enhanced palladium CMP process

WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

Wafer level structures and methods for fabricating and packaging MEMS

Light emitting diode package having an LED chip mounted on a phosphor substrate

Metal-resin composite, method for producing the same, busbar, module case, and resinous connector part

OPTICAL COMMUNICATION MODULE

Integrated circuits secure from invasion and methods of manufacturing the same

Light emitting device module and backlight unit including the same

Flexible light source module

PRINTED CIRCUIT BOARD (PCB) ASSEMBLY WITH ADVANCED QUAD FLAT NO-LEAD (A-QFN) PACKAGE

Electronic paper display device and method for manufacturing the same

Integrated front-end passive equalizer and method thereof

Semiconductor device including a DC-DC converter

Wire bonding method and semiconductor device

Bonding structure of semiconductor package, method for fabricating the same, and stack-type semiconductor package

Multi-chip package and method of manufacturing thereof

Offset solder vias, methods of manufacturing and design structures

Semiconductor device utilizing a package on package structure and manufacturing method thereof

Integrated circuit packaging system with pad connection and method of manufacture thereof

Undercut-repair of barrier layer metallurgy for solder bumps and methods thereof

Electronic component

PRINTED CIRCUIT BOARD FOR SEMICONDUCTOR PACKAGE CONFIGURED TO IMPROVE SOLDER JOINT RELIABILITY AND SEMICONDUCTOR PACKAGE HAVING THE SAME

Semiconductor package

SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE USING THE CHIP

Semiconductor device and a method of manufacturing the same

Semiconductor structure with conductive plug in an oxide layer

Semiconductor device with stacked power converter

System and method for integrated waveguide packaging

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Stacked package structure including insulating layer between two stacked packages

Stacked microelectronic assemby with TSVS formed in stages and carrier above chip

METHOD FOR FABRICATING AT LEAST ONE DETECTOR PIXEL CELL, SENSOR COMPRISING AT LEAST ONE SUCH CELL

Multi-chip package

PRESSURE SENSOR AND METHOD OF PACKAGING SAME

Optoelectronic component

LED PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

White color reflecting material and process for production thereof

Semiconductor light emitting devices and submounts

LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE, AND LIGHT UNIT

Method for preparing phosphor and light emitting device

Metal substrate and light source device

LIGHT EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

Light emitting diode package

LIGHT-EMITTING DIODE DEVICE

Light-emitting diode package

Light emitting device package and manufacturing method thereof

LED PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Light emitting device

Semiconductor device for smoothing the voltage of the end face of a drain of a high frequency semiconductor chip

Infrared sensor package and electronic device equipped therewith

Method of receiving a module in a smart card body

Method of fabricating a microcircuit device

METHOD FOR FABRICATING OPTICAL SEMICONDUCTOR DEVICE

WIRE BONDING METHOD

Methods for fabricating an overmolded semiconductor package with wirebonds for electromagnetic shielding

Stacked microelectronic dies and methods for stacking microelectronic dies

Semiconductor device and manufacturing method of a semiconductor device

Methods for transferring heat from stacked microfeature devices

Method of manufacturing semiconductor device including filling gap between substrates with mold resin

Methods of packaging imager devices and optics modules, and resulting assemblies

Thermosetting die-bonding film

Semiconductor structures and method for fabricating the same

ADHESIVE SHEET AND METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

Light emitting device package and display device therewith

Methods of forming direct and decorative illumination

Light emitting device package

METHOD OF MANUFACTURING ELECTRONIC COMPONENT EMBEDDED CIRCUIT BOARD

Electronic device

Illumination unit having at least two solid state light sources in the same wavelength band

IMAGE CAPTURE DEVICE

Radiation sensor

Radiofrequency amplifier

STACKABLE SEMICONDUCTOR CHIP WITH EDGE FEATURES AND METHODS OF FABRICATING AND PROCESSING SAME

Mechanisms for resistivity measurement of bump structures

Airtight multi-layer array type LED

PHOTOSENSITIVE ADHESIVE, AND FILM ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, AND SEMICONDUCTOR DEVICE, WHICH ARE MADE USING SAME

Semiconductor device having semiconductor substrate electrode pads, and external electrodes

Edge connect wafer level stacking

SEMICONDUCTOR DEVICE, ELECTRONIC APPARATUS AND SEMICONDUCTOR DEVICE FABRICATING METHOD

Semiconductor chip and semiconductor device

Detector array with a through-via interposer

Surface mount semiconductor device

SEMICONDUCTOR STRUCTURE AND PROCESS THEREOF

Semiconductor device and method of manufacturing the same

Solder joint flip chip interconnection

MOUNTING STRUCTURE OF CHIP AND MODULE USING THE SAME

Semiconductor devices having electrodes

Integrated circuit package system with stacked die

Clip interconnect with encapsulation material locking feature

Integrated circuit packaging system with multi-row leads and method of manufacture thereof

TSV SUBSTRATE STRUCTURE AND THE STACKED ASSEMBLY THEREOF

Package configurations for low EMI circuits

Compensation network for RF transistor

Through silicon via for use in integrated circuit chips

LED PACKAGE

Light-emitting diode and method for producing a light-emitting diode

Light emitting diode package

Light emitting device employing non-stoichiometric tetragonal alkaline earth silicate phosphors

LED PACKAGE

Waterproof surface mount device package and method

LED MODULE AND ILLUMINATION APPARATUS

LED module

Cerium and europium doped phosphor compositions and light emitting devices including the same

Encapsulated photomultiplier device of semiconductor material, for use, for example, in machines for performing positron-emission tomography

Radiation sensor

WIRE FEEDING APPARATUS FOR WIRE BONDERS

Micro-fluidic injection molded solder (IMS)

Printed wiring board and method for manufacturing the same

LIGHT-EMITTING APPARATUS AND ENDOSCOPE HAVING LIGHT-EMITTING APPARATUS

ADHESIVE COMPOSITION, ADHESIVE SHEET, CIRCUIT BOARD AND SEMICONDUCTOR DEVICE BOTH PRODUCED USING THESE, AND PROCESSES FOR PRODUCING THESE

STRUCTURES AND METHODS FOR IMPROVING SOLDER BUMP CONNECTIONS IN SEMICONDUCTOR DEVICES

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor packages and methods of manufacturing the same

Method of constructing a semiconductor device and structure

Method of making stackable semiconductor assembly with bump/base/flange heat spreader and build-up circuitry

Resin dispensing apparatus for light emitting device package and method of manufacturing light emitting device package using the same

4D Device, process and structure

Multi-channel optical module

IMAGING OPERATIONS FOR A WIRE BONDING SYSTEM

Semiconductor device and electronic device

LED module

Light emitting devices and methods

Light emitting module

LIGHT-PERMEATING COVER BOARD, METHOD OF FABRICATING THE SAME, AND PACKAGE HAVING THE SAME

Integrated circuit package strip with stiffener

Stacked packaged integrated circuit devices

SOLDERING CONNECTING PIN, SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD OF MOUNTING SEMICONDUCTOR CHIP USING THE SAME

Multi-chip module

MODULE HOUSING AND METHOD FOR MANUFACTURING A MODULE HOUSING

Directly injected forced convection cooling for electronics

CYLINDRICAL PACKAGES, ELECTRONIC APPARATUS INCLUDING THE SAME, AND METHODS OF FABRICATING THE SAME

Input power port protection component

Pressure application apparatus and pressure application method

Semiconductor device

Semiconductor Device with Cross-shaped Bumps and Test Pads Alignment

Nitride phosphor and manufacturing method thereof, and light emitting device using the same

Vibrator element, sensor unit, electronic apparatus, manufacturing method of vibrator element, and manufacturing method of sensor unit

SEMICONDUCTOR PACKAGE

Semiconductor device and method of forming base substrate with recesses for capturing bumped semiconductor die

Integrated circuit packaging system with stack interconnect and method of manufacture thereof

Memory device, laminated semiconductor substrate and method of manufacturing the same

Semiconductor chip including a chip via plug penetrating a substrate, a semiconductor stack, a semiconductor device package and an electronic apparatus including the semiconductor chip

Semiconductor device having conductive vias and semiconductor package having semiconductor device

Substrate Arrangement and a Method of Manufacturing a Substrate Arrangement

Integrated circuit device having die bonded to the polymer side of a polymer substrate

Semiconductor device and semiconductor package having the same

Method of forming partially-etched conductive layer recessed within substrate for bonding to semiconductor die

Semiconductor device and manufacturing method thereof

Contact Array for Substrate Contacting

Integrated circuit manufacturing method and integrated circuit

Using bump bonding to distribute current flow on a semiconductor power device

Solder interconnect pads with current spreading layers

SEMICONDUCTOR DEVICE

Integrated circuit package and physical layer interface arrangement

SEMICONDUCTOR SUBSTRATE AND METHOD THEREOF

DIE DOWN DEVICE WITH THERMAL CONNECTOR

Integrated circuit device having through via and method for preparing the same

Methods for making micro needles and applications thereof

ENHANCED HEAT SPREADER FOR USE IN AN ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

Electronic devices

Method for semiconductor leadframes in low volume and rapid turnaround

PACKAGE STRUCTURE

Method for semiconductor leadframes in low volume and rapid turnaround

Magnetic shielding for multi-chip module packaging

ADHESIVE FILM FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

DIE BOND FILM, DICING DIE BOND FILM, METHOD OF MANUFACTURING DIE BOND FILM, AND SEMICONDUCTOR DEVICE HAVING DIE BOND FILM

SEMICONDUCTOR DEVICE PACKAGE WITH ELECTROMAGNETIC SHIELDING

Semiconductor device and method of forming passive devices

Semiconductor package

METHOD FOR MANUFACTURING SEMICONDUCTOR CHIPS, MOUNTING METHOD AND SEMICONDUCTOR CHIP FOR VERTICAL MOUNTING ONTO CIRCUIT SUBSTRATES

Systems and methods for a three-layer chip-scale MEMS device

Systems and methods for a four-layer chip-scale MEMS device

Packages and methods for packaging using a lid having multiple conductive layers

Sensor device having a structure element

ULTRA THIN DIE TO IMPROVE SERIES RESISTANCE OF A FET

Light emitting device and light unit using the same

Optoelectronic semiconductor component

LIGHT-EMITTING DIODE WITH COMPENSATING CONVERSION ELEMENT AND CORRESPONDING CONVERSION ELEMENT

Light emitting diode package and manufacturing method thereof

Illumination apparatus

LED PACKAGE

Light emitting diode package and method for manufacturing the same

Light emitting devices

LED PACKAGE

Light emitting devices for light emitting diodes (LEDs)

Package and high frequency terminal structure for the same

Light emitting device and lighting apparatus

Wafer level packaged GaN power device and the manufacturing method thereof

Light emitting device and light emitting device package

LIGHT EMITTING DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME

Ultrasonic transducers for wire bonding and methods of forming wire bonds using ultrasonic transducers

Insulating Resin Film, Bonded Structure Using Insulating Resin Film, and Production Method of Bonded Structure

Wiring structure for improving crown-like defect and fabrication method thereof

Copper conductor film and manufacturing method thereof, conductive substrate and manufacturing method thereof, copper conductor wiring and manufacturing method thereof, and treatment solution

Connecting and bonding adjacent layers with nanostructures

Semiconductor apparatus

METAL LAYER FORMATION METHOD FOR DIODE CHIPS/WAFERS

Method Of Manufacturing Semiconductor Package Board