Package having shield case

METHODS AND APPARATUS FOR MULTICHIP MODULE PACKAGING

Package level noise isolation

Semiconductor devices and methods of forming the same

Individual sub-assembly containing a ceramic interposer, silicon voltage regulator, and array capacitor

INTEGRATED ELECTRONIC CIRCUIT CHIP COMPRISING AN INDUCTOR

SEMICONDUCTOR DEVICE HAVING ANTIFUSE AND METHOD OF MANUFACTURING THE SAME

Stacked Printed Devices on a Carrier Substrate

Optical sensor package

PACKAGE FOR SEMICONDUCTOR DEVICE AND PACKAGING METHOD THEREOF

Differential pressure sensing device and fabricating method therefor

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND PROCESS FOR MANUFACTURING THE SAME

Integrated circuits and interconnect structure for integrated circuits

Lens compression molded over LED die

Surface mount lateral light emitting apparatus and fabrication method thereof

Semiconductor lamp

Semiconductor device and method of manufacturing the same

Method for direct bonding of metallic conductors to a ceramic substrate

PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND ELECTRONIC DEVICE

Alignment and cutting of microelectronic substrates

Control unit with flexible circuit board

Fluorination pre-treatment of heat spreader attachment indium thermal interface material

Bonding method and bonding material using metal particle

Methods of connecting an antenna to a transponder chip

Wiring substrate, manufacturing method thereof, and semiconductor device

Semiconductor chip and method of manufacturing semiconductor chip

Semiconductor device and method of forming passive devices

Thinned die integrated circuit package

Semiconductor Package Block Mold and Method

Chip mounting with flowable layer

SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DICE HAVING BACK SIDE REDISTRIBUTION LAYER ACCESSED USING THROUGH-SILICON VIAS, METHODS

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Flip chip mounting method by no-flow underfill

Flip chip mounting method by no-flow underfill having level control function

Stacked semiconductor components

Light emitting diode package with direct leadframe heat dissipation

Semiconductor light emitting device, optical pickup unit and information recording/reproduction apparatus

Semiconductor integrated circuit

Fabrication structure for light emitting diode component

Light emission diode

Ultra thin power led light with heat sink

Printed-wiring board, method of manufacturing printed-wiring board, and electronic equipment

Method of making circuitized substrate with a resistor

Accessible electronic storage apparatus

System in package integrating a plurality of semiconductor chips

Light emitting diode based backlighting for color liquid crystal displays

Imaging device and manufacturing method thereof

Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication

Circuit for suppressing voltage jitter and method thereof

Voltage regulator integrated with semiconductor chip

Electrical fuse circuit

Light-emitting device and manufacturing method thereof

Semiconductor device and power supply for the same

Capillary-flow underfill compositions, packages containing same, and systems containing same

Semiconductor package and method of manufacturing the same

Mounting structure for semiconductor element

SEMICONDUCTOR DEVICE

Semiconductor device and method of protecting passivation layer in a solder bump process

Semiconductor Package with Perforated Substrate

Integrated circuit package system with offset stacked die and method of manufacture thereof

Semiconductor device and manufacturing method of the same

Stacked die package with stud spacers

Stacked-die packages with silicon vias and surface activated bonding

METHOD FOR FABRICATING A CIRCUIT

Mounting method for semiconductor parts on circuit substrate

Semiconductor device

Semiconductor chip assembly and fabrication method therefor

Thermal management of dies on a secondary side of a package

Semiconductor device comprising a plastic housing, a semiconductor chip and an interposer including a convex or concave lens-shape top side fitting shape

Semiconductor Package With Rigid And Flexible Circuits

Microelectronic assemblies having compliancy and methods therefor

Stacked semiconductor chips having double adhesive insulating layer interposed therebetween

Integrated circuit package system employing mold flash prevention technology

Semiconductor package on package having plug-socket type wire connection between packages

Thermal spacer for stacked die package thermal management

Memory device

Semiconductor package structure and method for manufacturing the same

ELECTRONIC COMPONENT

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME

Inverted lead frame in substrate

Power semiconductor component stack using lead technology with surface-mountable external contacts and a method for producing the same

LEADFRAME WITH DIFFERENT TOPOLOGIES FOR MEMS PACKAGE

Multi-die IC package and manufacturing method

Semiconductor device with lead frame including conductor plates arranged three-dimensionally

IC package encapsulating a chip under asymmetric single-side leads

Multi-chip package

MULTI-CHIP MODULE, MANUFACTURING METHOD THEREOF, MOUNTING STRUCTURE OF MULTI-CHIP MODULE, AND MANUFACTURING METHOD OF MOUNTING STRUCTURE

SEMICONDUCTOR DEVICE PACKAGE

Flip chip shielded RF I/O land grid array package

Method of fabricating a shielded stacked integrated circuit package system

Semiconductor device having through vias

Semiconductor package

Plastic electronic component package

Process for making contact with and housing integrated circuits

Image sensor and method for manufacturing the same

Information sensing device with electroconductive structure and molded body surrounding each other

Systems and methods for reducing contact to gate shorts

Trenched shield gate power semiconductor devices and methods of manufacture

Light emitting device package and method for manufacturing the same

Light-emitting apparatus and method of producing the same

Transparent light emitting diodes

Light-radiating semiconductor component with a luminescence conversion element

Nitride phosphor, method for producing this nitride phosphor, and light emitting device that uses this nitride phosphor

Light emitting device

LEAD FRAME FOR TRANSPARENT AND MIRRORLESS LIGHT EMITTING DIODES

Nitride semiconductor device

Multilayer wiring board and power supply structure to be embedded in multilayer wiring board

Printed circuit board, light emitting apparatus having the same and manufacturing method thereof

Printed wiring board

Integrated circuit device mounting with folded substrate and interposer

Semiconductor device and electronic device

Electric component having microtips and ductile conducting bumps

Top layers of metal for high performance IC's

Method for fabricating a circuit component

Semiconductor component comprising a semiconductor chip and semiconductor component carrier with external connection strips

Increasing the resistance of a high frequency input/output power delivery decoupling path

Semiconductor package, manufacturing method thereof and IC chip

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Manufacturing method for micro-SD flash memory card

Semiconductor package for fine pitch miniaturization and manufacturing method thereof

Semiconductor apparatus and manufacturing method of semiconductor apparatus

Electronic package

Memory Module Including A Plurality Of Integrated Circuit Memory Devices And A Plurality Of Buffer Devices In A Matrix Topology

LIGHT EMITTING DIODE PACKAGE, AND LIGHT SOURCE UNIT AND BACKLIGHT UNIT INCLUDING THE SAME

LED Light Source Having Flexible Reflectors

Circuit board and manufacturing method thereof

Printed circuit board

Flip chip semiconductor packaging device and testing method using first and second reflectors for determining gap between chip and circuit board or first and second chips

Light source module, light source apparatus and liquid crystal display

Image pickup device and image pickup lens

Display drive circuit

Electroluminescent module with thermal-conducting carrier substrate

Controlling flow of underfill using polymer coating and resulting devices

Contact Pad And Bump Pad Arrangement for High-Lead Or Lead-Free Bumps

Flip-chip mounting substrate

Thin passivation layer on 3D devices

Three-dimensional integrated circuits with protection layers

Semiconductor integrated circuit

Semiconductor processing methods, methods of forming contact pads, and methods of forming electrical connections between metal-containing layers

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Interposer and electronic device using the same

Dummy patterns and method of manufacture for mechanical strength of low K dielectric materials in copper interconnect structures for semiconductor devices

MICROBALL MOUNTING METHOD AND MOUNTING DEVICE

STRUCTURE FOR CONTROLLED COLLAPSE CHIP CONNECTION WITH A CAPTURED PAD GEOMETRY

Semiconductor device

Metal particles-dispersed composition and flip chip mounting process and bump-forming process using the same

Chip package

Tubular-shaped bumps for integrated circuit devices and methods of fabrication

Semiconductor package having non-ceramic based window frame

Three-dimensional package and method of making the same

Stress management in BGA packaging

Heat-dissipating structure and heat-dissipating semiconductor package having the same

Multi-chip package having two or more heat spreaders

SEMICONDUCTOR DEVICE

Semiconductor package

Semiconductor integrated circuit package having electrically disconnected solder balls for mounting

Chip package and method of manufacturing the same

SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION LAYER OF SEMICONDUCTOR CHIP DIRECTLY CONTACTED WITH SUBSTRATE AND METHOD OF FABRICATING THE SAME

Stacked package and method for manufacturing the package

Integrated circuit package system with thermo-mechanical interlocking substrates

3D ELECTRONIC PACKAGING STRUCTURE WITH ENHANCED GROUNDING PERFORMANCE AND EMBEDDED ANTENNA

Stacked-flip-assembled semiconductor chips embedded in thin hybrid substrate

Integrated circuit package system employing a support structure with a recess

Leadframe on heat sink (LOHS) semiconductor packages and fabrication methods thereof

Semiconductor device package diepad having features formed by electroplating

Lead-frame circuit package

Integrated circuit package with elevated edge leadframe

Semiconductor device encapsulated by an electrically conductive plastic housing composition with conductive particles

Semiconductor device having active element formation region provided under a bump pad

Semiconductor device

Semiconductor device and method for manufacturing the same

Semiconductor apparatus having a large-size bus connection

Interconnects for semiconductor light emitting devices

Package structure for ESD protection of light-emitting device

Semiconductor light emitting element

Reflective mounting substrates for light emitting diodes

Flip chip type LED lighting device manufacturing method

Chip-scale methods for packaging light emitting devices and chip-scale packaged light emitting devices

GaOsemiconductor device

Light-emitting diode chip including a mirror layer and a light-generating active zone

Method of making an optoelectronic module and optoelectronic module obtained by such method

Multipurpose decapsulation holder and method for a ball grid array package

Integrated Circuit Packaging Using Electrochemically Fabricated Structures

Wiring board manufacturing method

Printed circuit board

Manufacturing process of a carrier

Interconnecting board and three-dimensional wiring structure using it

Semiconductor device

Post passivation interconnection schemes on top of the IC chips

Semiconductor chip and production process therefor

Microelectronic devices and methods for forming interconnects in microelectronic devices

Manufacturing method of semiconductor device

Methods of making power semiconductor devices with thick bottom oxide layer

Semiconductor device and fabrication method thereof

METHOD OF MANUFACTURING MULTI-STACK PACKAGE

Method of making semiconductor device

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Light emitting device with blue light LED and phosphor components

Hybrid structure of multi-layer substrates and manufacture method thereof

Semiconductor Laser Device and Method for Manufacturing Same

Optical module

Integrally formed single piece light emitting diode light wire

Illumination device and display device incorporating the same

Electronic component device and method of mounting electronic component

Microelectronic substrate including embedded components and spacer layer and method of forming same

Integrated circuit package system employing thin profile techniques

Method for manufacturing an antenna

Liquid metal thermal interface material system

Memory chip and insert card having the same thereon

Electronic element package and method of manufacturing the same

Image Module

Method and structure for RF antenna module

Signal isolator using micro-transformers

Current sensor

Glass-sealed light emitting element, circuit board with the glass-sealed light emitting element, and methods for manufacturing those

Lighting device and lighting method

Power module

Semiconductor device

Stacked die in die BGA package

Semiconductor package and method of manufacturing the same

Structure and method of making interconnect element having metal traces embedded in surface of dielectric

INTEGRATED CIRCUITS WITH CONDUCTIVE FEATURES IN THROUGH HOLES PASSING THROUGH OTHER CONDUCTIVE FEATURES AND THROUGH A SEMICONDUCTOR SUBSTRATE

Packaging board and manufacturing method therefor, semiconductor module and mobile apparatus

Method of bonding wire of semiconductor package

Semiconductor device

SEMICONDUCTOR DEVICE

Method for manufacturing semiconductor device and semiconductor device

Direct via wire bonding and method of assembling the same

Method of manufacturing hybrid structure of multi-layer substrates

Semiconductor device and method of manufacturing the same

Function element and function element mounting structure

Semiconductor device, method for manufacturing the same, and semiconductor device mounting structure

Packaged integrated circuit with enhanced thermal dissipation

High power semiconductor package and method of making the same

Semiconductor package and method for manufacturing the same

Semiconductor device

Stack package and stack packaging method

Stacked integrated circuit package-in-package system

Stacked integrated circuit package-in-package system

Stackable integrated circuit package system

MULTI-CHIP PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

Multi-layer semiconductor package

Carrierless chip package for integrated circuit devices, and methods of making same

PACKAGE DEVICE

Wire bond interconnection

Electronic component with layered frame

LDO regulator with ground connection through package bottom

Lead frame of through-hole light emitting diode

Semiconductor device having plurality of leads

SEMICONDUCTOR DEVICE PACKAGE FEATURING ENCAPSULATED LEADFRAME WITH PROJECTING BUMPS OR BALLS

STRESS-IMPROVED FLIP-CHIP SEMICONDUCTOR DEVICE HAVING HALF-ETCHED LEADFRAME

Integrated circuit package system employing structural support

Semiconductor device and method of manufacturing the same

Amplifier chip mounted on a lead frame

Fabrication method of semiconductor package and structure thereof

Power semiconductor devices having termination structures and methods of manufacture

Light emitting chip package and light source module

OPTICAL SEMICONDUCTOR DEVICE AND OPTICAL TRANSMISSION DEVICE

Light-emitting semiconductor device, light-emitting system and method for fabricating light-emitting semiconductor device

Semiconductor wafer

Test structure

Image sensor module

Method for manufacturing an electrode and electrode component mounted body

Printed wiring board having plural solder resist layers and method for production thereof

Modular sensor assembly and methods of fabricating the same

Airtight apparatus having a lid with an optical window for passage of optical signals

Method for fabricating an interposer

Apparatus and process for precise encapsulation of flip chip interconnects

Method for Preparing an Intergrated Circuits Device Having a Reinforcement Structure

Semiconductor device and manufacturing method of the same

Optimum padset for wire bonding RF technologies with high-Q inductors

Electroplating method for a semiconductor device

Semiconductor package and production method thereof, and semiconductor device

METHOD OF DIE STACKING USING INSULATED WIRE BONDS

Method of fabricating a film-on-wire bond semiconductor device

Reverse build-up process for fine bump pitch approach

IMAGE SENSOR HAVING INTEGRATED INFRARED-FILTERING OPTICAL DEVICE AND RELATED METHOD

Method of producing acceleration sensor chip package

Single Layer Carbon Nanotube-Based Structures and Methods for Removing Heat from Solid-State Devices

Epoxy resin composition and semiconductor package including the same

Electronic packages and components thereof formed by co-deposited carbon nanotubes

Bundle of long thin carbon structures, manufacturing method thereof, and electronic device

Microphone package

Solid-state light source

Substrate for mounting light-emitting element and light-emitting element module

Light-emitting element mounting board, light-emitting element module, lighting device, display device, and traffic signal equipment

Light emitting diode replacement lamp

Lighting device and lighting method

Lighting device and lighting method

Microchip assembly including an inductor and fabrication method

Method of fabricating an electronic device

COMPLEX MEMORY CHIP, MEMORY CARD HAVING THE SAME, AND METHOD OF MANUFACTURING THE MEMORY CARD

Electronic package encapsulating electronic components therein

Method and apparatus for supporting a computer chip on a printed circuit board assembly

Assembly comprising a support element and a chip, support element, method for shielding, and method for protecting

Semiconductor device

Method and apparatus for performing shifting in an integrated circuit

Configurable IC with interconnect circuits that have select lines driven by user signals