Back-to-front via process

Methods of forming back side layers for thinned wafers

Method of manufacturing wiring substrate

Semiconductor device package and method for manufacturing same

Method for fabricating a flip chip system in package

Packaged semiconductor device with dual exposed surfaces and method of manufacturing

SEMICONDUCTOR DEVICE AND MANUFACTURING PROCESS THEREOF

Adhesion method using gray-scale photolithography

Ceramic circuit board, method for making the same, and power module

Printed circuit board and method of manufacturing semiconductor package using the same

Manufacturing method for white light emitting diode device including two step cure process

Camera module and method for forming the camera module

Optical demultiplexing device

Multi-chip build-up package of optoelectronic chip

Modular transistor outline can with internal components

Optical module and method for assembling an optical module

Millimeter-wave radar apparatus and millimeter radar system using the same

Arrangement and method impedance matching

Semiconductor device and electronic component module using the same

Light emitting element and lighting instrument

Light emitting device with blue light LED and phosphor components

Semiconductor component and apparatus for production of a semiconductor component

Power semiconductor module

Inter-stacking module system

GAP CONTROL BETWEEN INTERPOSER AND SUBSTRATE IN ELECTRONIC ASSEMBLIES

Semiconductor-element mounting substrate, semiconductor device, and electronic equipment

Through-hole contacts in a semiconductor device

Method for manufacturing mold type semiconductor device

Method and system for innovative substrate/package design for a high performance integrated circuit chipset

SEMICONDUCTOR PACKAGE HAVING IMPROVED SOLDER JOINT RELIABILITY AND METHOD OF FABRICATING THE SAME

Structure of Ball Grid Array package

Thermally balanced via

Semiconductor device

Pad layout

Electrical connections made with dissimilar metals

Integrated circuit package system including stacked die

Circuit module

Connecting module having passive components

Package optical chip with conductive pillars

SEMICONDUCTOR DEVICE

Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same

Dynamic quantity sensor

Managed memory component

Semiconductor device and a method of manufacturing the same

Integrated capacitors in package-level structures, processes of making same, and systems containing same

Semiconductor device

Multi-chip ball grid array package and method of manufacture

Electronic circuit package

Integrated circuit package-in-package system

Low profile managed memory component

Stacked integrated circuit package-in-package system

Multi-chip package system

Edge interconnects for die stacking

BGA-scale stacks comprised of layers containing integrated circuit die and a method for making the same

Semiconductor device, manufacturing method of semiconductor device, and RFID tag

Methods for packaging and encapsulating semiconductor device assemblies that include tape substrates

Interconnected IC packages with vertical SMT pads

Circuit board and electronic assembly

Semiconductor package

Package structure of thin lead-frame

Overhang integrated circuit package system

Heterogeneously integrated microsystem-on-a-chip

Device for implementing an inverter having a reduced size

Solid image-pickup device with flexible circuit substrate

Photodiode array, method for manufacturing same, and radiation detector

Semiconductor device having SOI structure

Semiconductor device

Semiconductor light-emitting device and method for manufacturing the device

Light emitting device and manufacturing method thereof

LED and attachment structure of LED

Semiconductor light-emitting device and method for manufacturing the device

Chip coated light emitting diode package and manufacturing method thereof

Optically active compositions and combinations of same with InGaN semiconductors

Phosphor and including the same, light emitting apparatus, illuminating apparatus and image display

Image Sensor Module and Method for Manufacturing the Same

SEMICONDUCTOR DEVICE

Semiconductor device

Method for joining electronic parts finished with nickel and electronic parts finished with electroless nickel

Heater, reflow apparatus, and solder bump forming method and apparatus

Electronic component mounting method

Rounded contact fingers on substrate/PCB for crack prevention

Manufacturing method for semiconductor device and semiconductor device

Article having metal impregnated within carbon nanotube array

Method for manufacturing high-frequency module device

Semiconductor multi-package module having package stacked over ball grid array package and having wire bond interconnect between stacked packages

Electronic device and method of manufacturing the same, circuit board, and electronic instrument

Method for Manufacturing Chip Package Structures

Wafer-level processing of chip-packaging compositions including bis-maleimides

Method of fabricating leadframe based flash memory cards including singulation by straight line cuts

Method of manufacturing light emitting diode package

Electronic component assemblies with electrically conductive bonds

Luminescent diode, fabrication method thereof, and backlight assembly having the same

LED housing

Plated module for an IC card

Light emitting diode array, method of manufacturing the same, backlight assembly having the same, and LCD having the same

Filter for printhead assembly

Display device

Method and system of trace pull test

White light-emitting device having a cap layer formed from a mixture of silicon and a phosphor blend

Wiring substrate having variously sized ball pads, semiconductor package having the wiring substrate, and stack package using the semiconductor package

ARRAY CIRCUIT SUBSTRATE AND WIRE BONDING PROCESS USING THE SAME

Stacked chip packaging structure

Tin-bismuth (Sn-Bi) family alloy solder and semiconductor device using the same

Package structure and manufacturing method thereof

Super high-density module with integrated wafer level packages

Chip package dielectric sheet for body-biasing

Forced heat transfer apparatus for heating stacked dice

Semiconductor device, package structure thereof, and method for manufacturing the semiconductor device

Hidden plating traces

Stacked-type chip package structure

Multi-die package and method for fabricating same

Low stress stacked die packages

Stacked die semiconductor package

Chip-packaging compositions including bis-maleimides, packages made therewith, and methods of assembling same

Electrical ground method for ball stack package

Light emitting diode

Multichip leadframe package

Array capacitors for broadband decoupling applications

LED with compound encapsulant lens

Light emitting apparatus method for producing it and assembly incorporating it

Test pads on flash memory cards

Package structure of image sensor device

IC CARD WITH IMPROVED PLATED MODULE

Package method for flash memory card and structure thereof

Chip-spacer integrated radio frequency ID tags, methods of making same, and systems containing same

Electronic part mounting method

Ceramic substrate

IC CARD AND AN ADAPTER FOR THE SAME

Electronic micromodule and method for manufacturing the same

Object and bonding method thereof

Nanostructure-based package interconnect

Method for fabricating a chip scale package using wafer level processing

Common drain dual semiconductor chip scale package and method of fabricating same

Microelectronic packages and methods therefor

Microelectronic devices and methods for manufacturing microelectronic devices

Electrical connection methods employing corresponding, insulator-coated members of interconnection elements

Methods for fabricating reinforced, self-aligning conductive structures for semiconductor device components

Microelectronic imagers with integrated optical devices and methods for manufacturing such microelectronic imagers

Low temperature bumping process

Electronic circuit device and manufacturing method thereof

Semiconductor laser device and manufacturing method thereof

Semiconductor laser device and manufacturing method thereof

Lighting system having lenses for light sources emitting rays at different wavelengths

VISIBLE LIGHT COMMUNICATION ORIENTED ILLUMINATION DEVICE

Liquid crystal display device and manufacturing method thereof

Package for solid image pickup element and solid image pickup device

Semiconductor light emitting device and semiconductor light emitting apparatus

Light-emitting diode emitting uniformly light all around

Semiconductor package having improved thermal performance

System to wirebond power signals to flip-chip core

Semiconductor device with semiconductor device components embedded in a plastic housing composition

Chip packaging structure without leadframe

CHIP STRUCTURE AND CHIP MANUFACTURING PROCESS

Semiconductor chip, mounting structure thereof, and methods for forming a semiconductor chip and printed circuit board for the mounting structure thereof

Semiconductor device and manufacturing method of the same

Conductive particles for anisotropic conductive interconnection

Semiconductor device and method of manufacturing the same

Vertical power semiconductor component, semiconductor device and methods for the production thereof

Semiconductor device having a metal plate conductor

Semiconductor device and method of manufacturing the same

Multi-chip package sharing temperature-compensated self-refresh signal and method thereof

Power Semiconductor Circuit And Method Of Manufacturing A Power Semiconductor Circuit

Semiconductor device and method for producing the same

Semiconductor device

Image sensor module with passive component

Semiconductor chip and semiconductor device

Sequential fabrication of vertical conductive interconnects in capped chips

Stacked packages with interconnecting pins

Packaged chip having features for improved signal transmission on the package

Super high-density module with integrated wafer level packages

Techniques for packaging multiple device components

Flip-chip mounting substrate and flip-chip mounting method

Semiconductor component including semiconductor chip and method for producing the same

Microelectronic elements with compliant terminal mountings and methods for making the same

Hermetically sealed integrated circuits and method

Stack-type semiconductor package and manufacturing method thereof

Package having exposed integrated circuit device

Plating bar design for high speed package design

STACK TYPE SURFACE ACOUSTIC WAVE PACKAGE, AND METHOD FOR MANUFACTURING THE SAME

Semiconductor device having semiconductor element, insulation substrate and metal electrode

Circuit board, semiconductor device, and manufacturing method of circuit board

Assembly of image-sensing chip and circuit board with inward wire bonding

Semiconductor device and electronic control unit using the same

Semiconductor device and manufacturing method of semiconductor device

Luminescent device and method for manufacturing the same

Semiconductor light emitting device, semiconductor element, and method for fabricating the semiconductor light emitting device

Semiconductor device and method for manufacturing the same

Light emitting diode package

Light emission diode and method of fabricating thereof

LED housing and fabrication method thereof

High luminance light emitting diode and liquid crystal display device using the same

Optimized contact design for thermosonic bonding of flip-chip devices

Packaging method for an assembly of image-sensing chip and circuit board

Carbon nanotubes solder composite for high performance interconnect

Packaging structure of gas detector and method for making the same

Method of making circuitized substrate with split conductive layer and information handling system utilizing same

METHOD FOR MANUFACTURING WIRING BOARD

Epoxy/silicone hybrid resin composition and optical semiconductor device

Method for fabricating a probing pad of an integrated circuit chip

Methods of fabricating interconnects for semiconductor components

Wafer structure and bumping process

Thin-film capacitor and method for fabricating the same, electronic device and circuit board

Method for fabricating semiconductor packages, and structure and method for positioning semiconductor components

Leadframe and method of manufacturing the same

Ribbon bonding in an electronic package

Wire bonding system and method of use

Stackable molded packages and methods of making the same

Method of manufacturing semiconductor device

Method of making light emitting device having a molded encapsulant

Method of producing a semiconductor device, and wafer-processing tape

LED apparatus with temperature control function

Light emitting apparatus, backlight apparatus, and electronic apparatus

Semiconductor package and method for manufacturing same

Chip on a board

Current sensor with reset circuit

LED emitter with radial prismatic light diverter

Liquid discharge head, and method of manufacturing liquid discharge head

RFID tag

Wafer-level flipchip package with IC circuit isolation

Integrated current sensor package

Integrated current sensor

Pr-doped inorganic compound, luminescent composition and luminescent body containing the same, and light emitting device

Light emitting device provided with semiconducting phosphor configured with four fluorescences having different emission peak wavelengths

Piezoelectric device

Surface acoustic wave element and surface acoustic wave device using the same

Method and power control structure for managing plurality of voltage islands

Peel strength simulating apparatus, peel strength simulating program storage medium, and peel strength simulating method

Package for high power density devices

Semiconductor device

Schottky Diode Device with Aluminum Pickup of Backside Cathode

Structure and method of making capped chip having discrete article assembled into vertical interconnect

Semiconductor device having metal interconnection structure and method for forming the same

Semiconductor device

Semiconductor device and manufacturing method of the same

Semiconductor device comprising a vertical semiconductor component and method for producing the same

Component stacking for integrated circuit electronic package

Apparatus and method for increasing the quantity of discrete electronic components in an integrated circuit package

Heat spreader and package structure utilizing the same

SEMICONDUCTOR PACKAGE WITH HEAT DISSIPATING STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device with thermoplastic resin to reduce warpage

Semiconductor device, and inspection method thereof

Stack package of ball grid array type

Semiconductor device and manufacturing method of the same

Packaging method of a plurality of chips stacked on each other and package structure thereof

Device package

Semiconductor package structure and method of manufacture

Semiconductor die structure featuring a triple pad organization

Semiconductor package

HEAT FIXTURE FOR WIRE BONDING

Field device incorporating circuit card assembly as environmental and EMI/RFI shield

Semiconductor device module structure

Image sensor module package

Electronics package with an integrated circuit device having post wafer fabrication integrated passive components

Coaxial through chip connection

Methods and apparatus for packaging integrated circuit devices

Light emitting diode with plural emission openings and backlight module with same

Light-receiving module

Light-emitting diode arrangement with heat dissipating plate

LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME

Multi-strand substrate for ball-grid array assemblies and method

Thermal conductive apparatus

Method for fabricating semiconductor component with adjustment circuit for adjusting physical or electrical characteristics of substrate conductors

Negative thermal expansion material filler for low CTE composites

Wireless communication system

Combination quad flat no-lead and thin small outline package

Method for mounting bumps on an under metallurgy layer

Integrated circuit having bond pad with improved thermal and mechanical properties

Space-efficient package for laterally conducting device

Semiconductor device having a through electrode with a low resistance and method of manufacturing the same

Canted-fiber duplex optical assembly

Light emitting diode unit and method for manufacturing light emitting diode unit

System and method of ESD protection of integrated circuit components

Light emitting device and lighting device using it, image display unit

High efficiency white light emitting diode and method for manufacturing the same

Semiconductor device and mold for resin-molding semiconductor device

FINE-SIZED CHIP PACKAGE STRUCTURE

Semiconductor device having a molded package

Electrical microfilament to circuit interface

Chip package structure

Semiconductor component having plate, stacked dice and conductive vias

Relay board provided in semiconductor device, semiconductor device, and manufacturing method of semiconductor device

Semiconductor device and method of manufacture thereof, circuit board and electronic instrument

Elastic conductive resin, and electronic device including elastic conductive bumps made of the elastic conductive resin

Projected contact structures for engaging bumped semiconductor devices

Integrated circuit chip with external pads and process for fabricating such a chip

System-in-package structure

Light-emitting diode assembly and method of fabrication

Thermal enhanced upper and dual heat sink exposed molded leadless package

Semiconductor device

Microelectronic devices having a curved surface and methods for manufacturing the same

Printed circuit board

Integrated circuit devices including compliant material under bond pads and methods of fabrication

Stacked semiconductor device

Multichip stacking structure

Semiconductor package having increased resistance to electrostatic discharge

Multiple stacked die window csp package and method of manufacture

Semiconductor chip mounted interposer, semiconductor device, semiconductor chip interposer fabrication method, bare chip mounted interposer, and interposer sheet

Power semiconductor component with semiconductor chip stack in a bridge circuit and method for producing the same

Flip chip MLP with conductive ink

High temperature package flip-chip bonding to ceramic