Structure and method for thin single or multichip semiconductor QFN packages

Chip package structure

Chip package and coreless package substrate thereof

Microstrip spacer for stacked chip scale packages, methods of making same, methods of operating same, and systems containing same

Microelectromechanical component

Semiconductor dynamic sensor and method of manufacturing the same

AllnGaP LED having reduced temperature dependence

Radiation-emitting and/or radiation-receiving semiconductor component and method for the production thereof

Light emitting device

Light-emitting element and making method thereof

Color-mixing LED

Apparatus, unit and method for testing image sensor packages

Radio frequency device

Method for the planar joining of components of semiconductor devices and a diffusion joining structure

Surface processing agent for tin or tin alloy material

Transferring die(s) from an intermediate surface to a substrate

Method of fabricating electrical connection terminal of embedded chip

Carbon nanotube reinforced metallic layer

Adhesion by plasma conditioning of semiconductor chip surfaces

Method and system for increasing yield of vertically integrated devices

System and method for implementing transformer on package substrate

Method and system for hermetically sealing packages for optics

Metal-base circuit board and its manufacturing method

Microelectronic component assemblies having lead frames adapted to reduce package bow

Method of making exposed pad ball grid array package

Method for packaging microelectronic devices

LED display

Electronic circuit device and method of manufacturing the same

Devices and system for electrostatic discharge suppression

Bonding apparatus having adjacent hot-heads for liquid crystal display manufacture

Image sensor chip packaging method

Solid state imaging device

Light emitting device

ELECTRONIC DEVICE

Sensor system having a substrate and a housing, and method for manufacturing a sensor system

Sensor module and method for manufacturing same

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor device with a wiring substrate and method for producing the same

Semiconductor module and manufacturing method thereof

Package substrate

Metal core, package board, and fabricating method thereof

CIRCUIT FILM WITH BUMP, FILM PACKAGE USING THE SAME, AND RELATED FABRICATION METHODS

Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit board, and electronic device

Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another

Semiconductor device and IC card including supply voltage wiring lines formed in different areas and having different shapes

MEMORY CARD

Surface-mountable light-emitting diode structural element

Chip package structure

Leadframe comprising tin plating or an intermetallic layer formed therefrom

Microelectronic package having a stiffening element and method of making same

Leadless semiconductor package and method of manufacture

Semiconductor components having through wire interconnects (TWI)

Method of manufacturing a semiconductor package using lead frame having through holes or hollows therein

Chip on lead frame for small package speed sensor

SEMICONDUCTOR DEVICE

Digital camera module

Semiconductor device and method for manufacturing same, and semiconductor wafer

High-power LED chip packaging structure and fabrication method thereof

Light emitting device

LIGHT EMITTING DEVICE AND MANUFACTURE METHOD THEREOF

White light emitting diode

Photonic device with integrated hybrid microlens array

Phosphors protected against moisture and LED lighting devices

Metal silicate halide phosphors and LED lighting devices using the same

CAPILLARY FOR A BONDING TOOL

High-temperature solder, high-temperature solder paste and power semiconductor using same

CIRCUIT SUBSTRATES, SEMICONDUCTOR DEVICES, SEMICONDUCTOR MANUFACTURING APPARATUSES, METHODS FOR MANUFACTURING CIRCUIT SUBSTRATES, AND METHODS FOR MANUFACTURING SEMICONDUCTOR DEVICES

Flexible array

Interconnect assemblies and methods

Semiconductor devices with conductive clips

Interconnection element for BGA housings and method for producing the same

Semiconductor device having high frequency components and manufacturing method thereof

FORMING A BARRIER LAYER IN JOINT STRUCTURES

Eliminate IMC cracking in post wirebonded dies: macro level stress reduction by modifying dielectric/metal film stack in be layers during Cu/Low-K processing

Semiconductor device manufacturing method

Circuit under pad structure and bonding pad process

Method for forming solder balls with a stable oxide layer by controlling the reflow ambient

Individualized low parasitic power distribution lines deposited over active integrated circuits

Method of making semiconductor package having exposed heat spreader

Bonding structure with buffer layer and method of forming the same

Bond pad for low K dielectric materials and method for manufacture for semiconductor devices

Camera module package

Protection for an integrated circuit chip containing confidential data

Built-in capacitor type wiring board and method for manufacturing the same

Radio-frequency system in package including antenna

CIRCUIT BOARD WITH MICROELECTRONIC ELEMENTS ASSEMBLED THEREON AND METHOD FOR PRODUCING SUCH CIRCUIT BOARD

Phosphor plate and light emitting device having same

Method for producing molding compound resin tablet for wavelength conversion, and method for manufacturing white light emitting diode by using the production method

Flip chip hermetic seal using pre-formed material

Flip chip package and manufacturing method of the same

Intermediate connection for flip chip in packages

A SEMICONDUCTOR HAVING A COPPER-BASED METALLIZATION STACK WITH A LAST ALUMINUM METAL LINE LAYER

Semiconductor device

Semiconductor wafer, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment

Semiconductor packages having leadframe-based connection arrays

Interposer and stacked chip package

Semiconductor device

Semiconductor device having electrostatic breakdown protection element

Assembly jig and manufacturing method of multilayer semiconductor device

Pin-type chip tooling

Circuit substrate and method of manufacture

Semiconductor/printed circuit board assembly, and computer system

Semiconductor integrated circuit

SEMICONDUCTOR DEVICE

Side view light emitting diode package

Leadframes for improved moisture reliability and enhanced solderability of semiconductor devices

Low cost bonding pad and method of fabricating same

Wire under dam package and method for packaging image-sensor

Method and apparatus that provides differential connections with improved ESD protection and routing

Rugged MESFET for Power Applications

SEMICONDUCTOR LIGHT EMITTING DEVICE

Coated LED with improved efficiency

Stem for optical element and optical semiconductor device using the same

Component mounting tool, and method and apparatus for mounting component using this tool

Two-step high bottleneck type capillary for wire bonding device

Power module

Wiring board, electronic component mounting structure, and electronic component mounting method

THERMAL INTERFACE APPARATUS, SYSTEMS, AND METHODS

Inductive Heating of Microelectronic Components

Prevention of Sn whisker growth for high reliability electronic devices

Camera module using printed circuit board with step portion

Method for the interconnection of active and passive components and resulting thin heterogeneous component

3D integrated circuits using thick metal for backside connections and offset bumps

Semiconductor device having align mark layer and method of fabricating the same

Methods for fabricating protective layers on semiconductor device components

Small form factor molded memory card and a method thereof

Apparatus incorporating small-feature-size and large-feature-size components and method for making same

Method of making a semiconductor device with improved heat dissipation

Integrated heat spreader with intermetallic layer and method for making

Method of fabricating a semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) package

Method of fabricating a multi-die semiconductor package assembly

Semiconductor Device with Improved Stud Bump

Flip-chip semiconductor device manufacturing method

Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material

Microelectronic imaging units and methods of manufacturing microelectronic imaging units

Method for the production of light-emitting semiconductor diodes

Method of manufacturing a wafer level package with a cap structure for hermetically sealing a micro device

Method of manufacturing optical module

METAL LAYER FORMATION METHOD FOR DIODE CHIPS/WAFERS

Package for optical transceiver module

Vertically displaced stack of multi-mode single emitter laser diodes

Modular diode laser assembly

Modular diode laser assembly

Optical display systems and methods

Light emitting apparatus, method for driving the light emitting apparatus, and display apparatus including the light emitting apparatus

Interconnecting a port of a microwave circuit package and a microwave component mounted in the microwave circuit package

Output amplifier structure with bias compensation

Radio-frequency amplifier and radio-frequency wireless communication apparatus

Light emitting device with blue light LED and phosphor components

Semiconductor package with heat sink, stack package using the same and manufacturing method thereof

Semiconductor package structure and method of manufacture

Semiconductor device and method of manufacturing the same

SEMICONDUCTOR DEVICE

Alternate pad structures/passivation inegration schemes to reduce or eliminate IMC cracking in post wire bonded dies during Cu/Low-K BEOL processing

Packaged device and method of forming same

Interconnecting element between semiconductor chip and circuit support and method

Semiconductor package form within an encapsulation

Fluid cooled encapsulated microelectronic package

Stackable semiconductor package and method for its fabrication

Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrate

Integrated circuit stacking system with integrated passive components

Method of fabricating a semiconductor assembly including chip scale package and second substrate with exposed substrate surfaces on upper and lower sides

Die package having an adhesive flow restriction area

Integrated circuit package system with lead structures including a dummy tie bar

Semiconductor device having a heat spreader exposed from a seal resin

Ultra-thin quad flat no-lead (QFN) package

Semiconductor devices including voltage switchable materials for over-voltage protection

Integrated circuit package system with bump pad

Integrated passive device system

Method for manufacturing a microelectromechanical component, and a microelectromechanical component

SEMICONDUCTOR DEVICE

LED module

Flip-chip light emitting diode device without sub-mount

Light emitting element, production method thereof, backlight unit having the light emitting element, and production method thereof

Optical module and method of manufacturing the same

White LED illumination device

Optical element sealing structure, optical coupler, and optical element sealing method

Light emitting device

Semiconductor die package using leadframe and clip and method of manufacturing

Micromechanical pressure sensor system

Curable organopolysiloxane composition and semiconductor device

Buffered Thin Module System and Method

Method and device for connecting chips

Circuit Board Manufacturing Technique and Resulting Circuit Board

Semiconductor assembly having substrate with electroplated contact pads

Damascene patterning of barrier layer metal for C4 solder bumps

PROCESSING METHOD FOR SEMICONDUCTOR STRUCTURE

Wafer redistribution structure with metallic pillar and method for fabricating the same

Method of fabricating an exposed die package

Integrated circuit package system with heat sink

Lead frame structure having blocking surfaces and semiconductor package integrated with the lead frame structure

Method of forming a leaded molded array package

Micro chip-scale-package system

Method of fabricating a semiconductor multi-package module having a second package substrate with an exposed metal layer wire bonded to a first package substrate

Silicon based package

Method of manufacturing a semiconductor device

Carbon-carbon and/or metal-carbon fiber composite heat spreader

Method for fabricating conductive bumps with non-conductive juxtaposed sidewalls

INTEGRATED CIRCUIT PACKAGE SYSTEM

Enhancing shock resistance in semiconductor packages

Reversible leadless package and methods of making and using same

LED and LED light source

Surface emitting device, manufacturing method thereof and projection display device using the same

Method and apparatus for forming a DMD window frame with molded glass

Semiconductor device

Semiconductor product and method for forming a semiconductor product

Linear light source, method for manufacturing the same and surface emitting device

Flashlights utilizing unique LED light sources

Integrated circuit package system with channel

STACKED INTEGRATED CIRCUITS PACKAGE SYSTEM

INTEGRATED CIRCUIT PACKAGE SYSTEM

Wafer scale heat slug system

Semiconductor device

Power converter

Semiconductor image sensing element and fabrication method therefor, and semiconductor image sensing device and fabrication method therefor

Led array head and image recording device

Fluorescent substance

Semiconductor device and method for producing it, and use of an electrospinning method

Semiconductor device

INTEGRATED CIRCUIT PACKAGE SYSTEM

Semiconductor chip having bond pads

Semiconductor chip having bond pads

Semiconductor device and method for manufacturing the same

Package and package module of the package

Chip and package structure

Integrated circuit package system with arched pedestal

Microelectronic connection component

Chip structure and manufacturing method of the same

EMBEDDED SEMICONDUCTOR DEVICE SUBSTRATE AND PRODUCTION METHOD THEREOF

Bumped chip carrier package using lead frame and method for manufacturing the same

Semiconductor device

Bump chip carrier semiconductor package system

Stacked integrated circuit leadframe package system

Integrated circuit package system including ribbon bond interconnect

Semiconductor device

Semiconductor chip package with a metal substrate and semiconductor module having the same

Low voltage drop and high thermal performance ball grid array package

Integrated circuit package system with heat dissipation enclosure

Integrated circuit package system using heat slug

Method for fabricating semiconductor package

Semiconductor package system with thermal die bonding

Integrated circuit package system with mold clamp line critical area having widened conductive traces

Integrated circuit package system with a heat sink

Integrated circuit package system including shield

Offset integrated circuit package-on-package stacking system

Semiconductor wafer, panel and electronic component with stacked semiconductor chips, and also method for producing same

Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor

Semiconductor device having transparent member

Semiconductor package that includes stacked semiconductor die

Chip stack package and manufacturing method thereof

Method for fabricating semiconductor package with stacked chips

Semiconductor device and method of manufacturing the same

Integrated circuit package to package stacking system

Integrated circuit package system with multi-planar paddle

Thermally enhanced power semiconductor package system

Semiconductor device

Semiconductor chip having bond pads

Image sensor chip package

Stackable power semiconductor package system

SEMICONDUCTOR STRUCTURE

Infrared-blocking encapsulant with organometallic colloids

Image sensor with a compound structure

Semiconductor device

Optical sensor including photoconductive material and carbon nanotube

LED PACKAGE WITH IMPROVED HEAT DISSIPATION AND LED ASSEMBLY INCORPORATING THE SAME

Light-emitting diode with UV-blocking nano-particles

Semiconductor device and manufacturing method of semiconductor device

LED package

Three wavelength LED structure

Semiconductor light-emitting device and surface light source using the same

Padless substrate for surface mounted components

Wire bonding method

Method and apparatus for rapid thermal processing and bonding of materials using RF and microwaves

Surface acoustic wave device and method of producing the same

Method of Forming Bump, Method of Forming Image Sensor Using the Method, Semiconductor Chip and the Sensor so Formed

Electrical interconnection structure formation

Small chips with fan-out leads

Bonding a non-metal body to a metal surface using inductive heating

Semiconductor device, fabrication method therefor, and film fabrication method

Micro lead frame packages and methods of manufacturing the same

Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package

BRACE FOR WIRE LOOP

Solder joint flip chip interconnection

Microelectronic devices and microelectronic support devices, and associated assemblies and methods

Method of designing package for semiconductor device, layout design tool for performing the same, and method of manufacturing semiconductor device using the same

Packaging methods

Front side illuminated photodiode with backside bump

Nitride semiconductor light emitting device and method for manufacturing the same

Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices

Photosensitive composition

White light LED production method

Assembled device of a light module and a liquid crystal panel

Illumination system using a plurality of light sources

White light emitting device

Light illumination device

Resettable circuit protection apparatus

Laser light source device, display device, scanning type display device, and projector

Mm-wave antenna using conventional IC packaging

Constant voltage diode