Yellow phosphor and white light emitting device incorporating the same

Integrated circuit device

Plastic semiconductor package having improved control of dimensions

Device and method of manufacturing the same

CHIP STRUCTURE WITH SOLDER BUMP AND METHOD FOR PRODUCING THE SAME

Solvent Assisted Burnishing of Pre-Underfilled Solder-Bumped Wafers for Flipchip Bonding

Ball grid array (BGA) package and method thereof

Bumping process with self-aligned A1-cap and the elimination of 2nd passivation layer

Semiconductor device and method of manufacturing the same

Semiconductor device, method of manufacturing a semiconductor device and substrate to be used to manufacture a semiconductor device

Reduction of macro level stresses in copper/low-K wafers

Composite carbon nanotube thermal interface device

Coupling substrate for semiconductor components and method for producing the same

Method for making stacked integrated circuits (ICs) using prepackaged parts

Single chip and stack-type chip semiconductor package and method of manufacturing the same

Multi-stack chip package with wired bonded chips

Pad redistribution chip for compactness, method of manufacturing the same, and stacked package using the same

IC card with bonding wire connections of different lengths

IC card

Electrode package for semiconductor device

Power semiconductor module

Lead arrangement and chip package using the same

Electronic packaging for optical emitters and sensors

Low profile semiconductor package

Semiconductor device and a method of manufacturing the same

Multi-chip assembly with optically coupled die

Light emitting diode unit

Lens in light emitting device

LED packaging

Optical semiconductor device and a method for manufacturing the same

Lighting Device And Method

Light-receiving diode

IC card

CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

Miniature package for translation of sensor sense axis

Power module having at least two substrates

Method for forming multi-layer bumps on a substrate

Manufacturing method for magnetic sensor and lead frame therefor

Methods and apparatus for Flip-Chip-On-Lead semiconductor package

Ultrathin leadframe BGA circuit package

Method of making stacked die package

Method of manufacturing flash memory cards

Fabrication method for a chip packaging structure

LED manufacturing process

Adhesive film and process for preparing the same as well as adhesive sheet and semiconductor device

Lighting apparatus

Semiconductor light emitting device

Semiconductor device mounting socket

Inductively powered transponder device

RF power amplifier and method for packaging the same

Semiconductor device including a particular dummy terminal

Semiconductor device package

METHOD FOR REDUCING OR ELIMINATING SEMICONDUCTOR DEVICE WIRE SWEEP IN A MULTI-TIER BONDING DEVICE AND A DEVICE PRODUCED BY THE METHOD

Board on chip package and method of manufacturing the same

Electronic assembly having graded wire bonding

Junction structure for a terminal pad and solder, and semiconductor device having the same

Chip stack structure having shielding capability and system-in-package module using the same

Optimal stacked die organization

Semiconductor device and manufacturing method of the same

Printed wiring board

Semiconductor device

Semiconductor device featuring electrode terminals forming superior heat-radiation system

Contact pad structure for flip chip semiconductor die

Semiconductor device and manufacturing method thereof

Semiconductor chip with post-passivation scheme formed over passivation layer

Structure and self-locating method of making capped chips

Structure and method of making capped chips having vertical interconnects

Semiconductor device

Semiconductor device having an electronic circuit disposed therein

Semiconductor component with a thin semiconductor chip and a stiff wiring substrate, and methods for producing and further processing of thin semiconductor chips

Manufacture of mountable capped chips

Back-face and edge interconnects for lidded package

Package device with electromagnetic interference shield

Electronic-part built-in substrate and manufacturing method therefor

Stacked semiconductor device and lower module of stacked semiconductor device

Active device bases and leadframes utilizing the same

Double-sided circuit board and multi-chip package including such a circuit board and method for manufacture

Semiconductor die package including construction for preventing delamination and/or cracking of the semiconductor die

Methods for a multiple die integrated circuit package

Integrated circuit package system including high-density small footprint system-in-package

Implantable microelectronic device and method of manufacture

Image sensor module structure and a method for manufacturing the same

Semiconductor unit, and power conversion system and on-vehicle electrical system using the same

Packaging for high speed integrated circuits

Supporting frame for surface-mount diode package

Light emitting diode package

Substrate frame

LEADFRAME FOR SEMICONDUCTOR PACKAGES

Integrated circuit packaging

Multiple die integrated circuit package

Three-dimensionally integrated electronic assembly

Semiconductor chip having a photodiode

High frequency chip packages with connecting elements

Sealing structure for a white light LED

Semiconductor device and method of manufacturing semiconductor device

Cladding layer structure of a LED package structure

Coaxial LED lighting board

Light emitting diode package and method of manufacturing the same

Semiconductor light emitting device and method of manufacturing same and semiconductor light emitting apparatus

Light emitting apparatus

Led device

Semiconductor light emitting device and apparatus having a translucent conductive film

High-heat-resistant semiconductor device

Multilayered printed circuit board and method for manufacturing the same

Method and apparatus for attaching a workpiece to a workpiece support

Method for mounting electronic component

Bond Surface Conditioning System for Improved Bondability

Complex RF device and method for manufacturing the same

Relay module and electrical component unit

Stacked wafer or die packaging with enhanced thermal and device performance

Encapsulating electrical connections

Method for evaluating and modifying solder attach design for integrated circuit packaging assembly

Semiconductor heat-transfer method

Semiconductor component and method for production of a semiconductor component

Method for manufacturing a semiconductor device

Method of making light emitting device with silicon-containing encapsulant

Method of making light emitting device with silicon-containing encapsulant

METHOD OF MAKING LIGHT EMITTING DEVICE HAVING A MOLDED ENCAPSULANT

MEMS module package

Semiconductor laser apparatus and fabrication method of the same

Package for a laser diode component, laser diode component and method for producing laser diode component

High power led electro-optic assembly

Embedded inductor and application thereof

Embedded inductor element and chip package applying the same

Semiconductor device and method for manufacturing the same

Current sensor

Semiconductor device and power supply device using the same

LIGHT-EMITTING DIODE ASSEMBLY AND METHOD OF FABRICATION

Interposer and method for fabricating the same

Semiconductor device with improved encapsulation

Integrated circuit package encapsulating a hermetically sealed device

Plastic packaged device with die interface layer

Semiconductor device with reduced package cross-talk and loss

Semiconductor chip package and fabrication method thereof

Semiconductor device and method for producing the same

Semiconductor package with controlled solder bump wetting

Sensor having semiconductor chip and circuit chip

Semiconductor component of semiconductor chip size with flip-chip-like external contacts

Semiconductor module including a plurality of IC chips therein

Closed loop thermally enhanced flip chip BGA

Chip-packaging composition of resin and cycloaliphatic amine hardener

Technique for moderating stresses cause by a difference in thermal expansion coeffiecients between a substrate and an electronic component

Integrated chip device in a package

Semiconductor device that attains a high integration

Structure and method of molded QFN device suitable for miniaturization, multiple rows and stacking

Semiconductor component and methods to produce a semiconductor component

Integrated circuit mounting for thermal stress relief useable in a multi-chip module

Circuit device and method of manufacturing the same

Stacked die package with thermally conductive block embedded in substrate

Semiconductor structure and method of assembly

Semiconductor structure and method of manufacture

Package structure for solid-state lighting devices and method of fabricating the same

Multi-chip package structure

Multi-chip package structure

Apparatus and method for manufacturing imaging device package

Semiconductor package having an optical device and the method of making the same

Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages

Lead frame having outer leads coated with a four layer plating

Housed DRAM chip for high-speed applications

Production process for manufacturing such semiconductor package

Leadframes for improved moisture reliability of semiconductor devices

Electronic module and method of assembling the same

Thin package system with external terminals

Photodiode array, method for manufacturing same, and radiation detector

Microelectromechanical component and method for the production thereof

Semiconductor devices with multiple heat sinks

Radio frequency power semiconductor device package comprising dielectric platform and shielding plate

Bond pad structure

COB-typed LED package with phosphor

Light emitting device

Light emitting diode package

Semiconductor light emitting device

Image sensor structure with a connector

Electro-optical device, transferred chip, and transfer origin substrate

SEMICONDUCTOR DEVICE

Adhesive composition and sheet having an adhesive layer of the composition

Image sensor package structure

Electronic Part Manufacturing Method

Method for forming solder contacts on mounted substrates

Circuit board providing coplanarity of solders and high soldering reliability for semiconductor component

Semiconductor device and method for manufacturing thereof

Electronic part mounting substrate and method for producing same

System including a buffered memory module

Method of producing image display unit

Lamp and a process for producing a lamp

Semiconductor component and method for contracting said semiconductor component

Method for forming bumps

Wafer structure with electroless plating metal connecting layer and method for fabricating the same

Etchant and method for forming bumps

Method for forming improved bump structure

Method for applying a structure of joining material to the back surfaces of semiconductor chips

Substrate embedded with passive device

CHIP PACKAGE METHOD

Semiconductor chip package

Method of improving power distribution in wirebond semiconductor packages

Semiconductor package for encapsulating multiple dies and method of manufacturing the same

Semiconductor device and manufacturing method of the same

Method and apparatus for integrated-circuit battery devices

Semiconductor device, mounting substrate and method of manufacturing mounting substrate, circuit board, and electronic instrument

Light transmission/reception module and light transmission/reception device

Circuit board structure of integrated optoelectronic component

Semiconductor light emitting device

Illuminator assembly

Method for manufacturing semiconductor module using interconnection structure

Housing for an electromagnetic radiation emitting optoelectronic component, component and method of making a housing or a component

Printed wiring board

Printer controller apparatus implemented as a system in a package

Liquid crystal display apparatus

Encapsulation of a chip module

Semiconductor device having strong adhesion between wiring and protective film, and manufacturing method therefor

Semiconductor device with multiple designation marks

Re-enforced ball-grid array packages for semiconductor products

FLIP CHIP PACKAGE

Semiconductor device having a semiconductor chip, and method for the production thereof

Semiconductor device with electroless plating metal connecting layer and method for fabricating the same

Power semiconductor device in lead frame employing connecting element with conductive film

Integrated circuit package system using etched leadframe

Semiconductor insulation structure

LIGHT EMITTING DIODE PACKAGE

Decoupling capacitor closely coupled with integrated circuit

Semiconductor chip and method of manufacturing semiconductor chip

Stack structure of carrier board embedded with semiconductor components and method for fabricating the same

Vertical packaged IC device modules with interconnected 3D laminates directly contacts wafer backside

Stacked-type chip package structure

STACKED DIE PACKAGING SYSTEM

Semiconductor device and fabrication method thereof

Power semiconductor module with overcurrent protective device

Method for fabricating an image sensor mounted by mass reflow

Conductor substrate, semiconductor device and production method thereof

Semiconductor package with position member

Chip package having with asymmetric molding and turbulent plate downset design

SELECTIVE SOLDER DEPOSITION BY SELF-ASSEMBLY OF NANO-SIZED SOLDER PARTICLES, AND METHODS OF ASSEMBLING SOLDERED PACKAGES

Apparatus and method for providing bypass capacitance and power routing in QFP package

Method and apparatus for providing double-sided cooling of leadframe-based wire-bonded electronic packages

Light emitting device

Robust Group III light emitting diode for high reliability in standard packaging applications

Light emitting device using light emitting diode chip

Light emitting diode package

Light emitting diode package

Dissipative pick and place tools for light wire and LED displays

Light-emitting devices and related systems

Method and apparatus for manufacturing IC chip packaged device

Solid state relay

Methods for aligning a device and for stacking two devices in an aligned manner and device for improved stacking

Conductive ball, formation method for electrode of electronic component, electronic component and electronic equipment

Bonding apparatus comprising improved oscillation amplification device

Low stress conductive polymer bump

Stack structure of carrier boards embedded with semiconductor components and method for fabricating the same

Heat exchanger, method of manufacturing heat exchanger, liquid cooling system, light source device, projector, electronic device unit, and electronic equipment

Integrated circuit support structures and their fabrication

Method for forming bonding pad and semiconductor device having the bonding pad formed thereby

Semiconductor device with semiconductor chip and adhesive film and method for producing the same

Method for manufacturing liquid crystal display device

Semiconductor device protective structure and method for fabricating the same

LED backlight unit

Electronic component packaging structure and method for producing the same

Surface mounting semiconductor device

Package for high frequency waves containing high frequency electronic circuit

Composite filter chip

Connecting structure, printed substrate, circuit, circuit package and method of forming connecting structure

Semiconductor device

Universal chip package structure

Support structures for semiconductor devices

Bond pads and methods for fabricating the same

Manufacturing method for semiconductor device

Arrangement of conductive pads on grid array package and on circuit board

Flip-chip type assembly

Semiconductor chip having a bump with conductive particles and method of manufacturing the same

Bump structure and its forming method

Intermetallic solder with low melting point

Electronic apparatus

Electronic circuit chip, and electronic circuit device and method for manufacturing the same

Semiconductor module having a coupling substrate, and methods for its production

Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same

Integrated circuit package system

Semiconductor packaging process and carrier for semiconductor package

Semiconductor package having an interfacial adhesive layer

Lead frame package structure with high density of lead pins arrangement

Semiconductor device and a method of manufacturing the same

Semiconductor device with front side metallization and method for the production thereof

Optoelectronic semiconductor device in which current spreading layer of sol gel material mixed with nanoparticles is mixed with wavelength conversion dyes

Microelectronic interconnect substrate and packaging techniques

Optical device package structure

Power package and fabrication method thereof

Radiation emitting component

Highly efficient luminous substance

Ultrasonic horn

Wiring board, semiconductor device, and method of manufacturing the same

Microelectronic package having multiple conductive paths through an opening in a support substrate

Method of manufacturing a semiconductor device including a bump forming process

Semiconductor device and a manufacturing method of the same

Microelectronic packages and methods therefor

Method of reducing surface tackiness of silicone rubber cured product, liquid silicone rubber composition for sealing semiconductor, silicone rubber-sealed semiconductor device, and method of producing semiconductor device

Optical interconnection module and method of manufacturing the same

Semiconductor laser apparatus

Wiring board and capacitor

Electronic device with conductive connection structure

Module type multiphase inverter

Interposer and electronic device fabrication method

Magnetic sensor and current sensor