Semiconductor chip having bond pads

Semiconductor chip having bond pads

Package and package module of the package

Integrated circuit package system with arched pedestal

Stacking method and stacked structure for attaching memory components to associated device

Bumped chip carrier package using lead frame and method for manufacturing the same

Semiconductor chip package with a metal substrate and semiconductor module having the same

Low voltage drop and high thermal performance ball grid array package

Semiconductor device with integrated heat spreader

Method for fabricating semiconductor package

Semiconductor package system with thermal die bonding

Integrated circuit package system with mold clamp line critical area having widened conductive traces

Semiconductor package including a semiconductor die having redistributed pads

INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE STACKING SYSTEM

Integrated circuit package system including shield

Offset integrated circuit package-on-package stacking system

Semiconductor wafer, panel and electronic component with stacked semiconductor chips, and also method for producing same

Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor

Semiconductor device having transparent member

Structure for reducing stress for vias and fabricating method thereof

Semiconductor chip having bond pads

Moisture resistant chip package

Semiconductor device, fabrication method therefor, and film fabrication method

Micro lead frame packages and methods of manufacturing the same

Method of designing package for semiconductor device, layout design tool for performing the same, and method of manufacturing semiconductor device using the same

Flex circuit apparatus and method for adding capacitance while conserving circuit board surface area

Electronic device cooling device and electronic device cooling method

Pixel circuit, active matrix apparatus and display apparatus

Plastic semiconductor package having improved control of dimensions

Electronic Component Having at Least One Semiconductor Chip and Flip-Chip Contacts, and Method for Producing the Same

Ball grid array (BGA) package and method thereof

Semiconductor device and method of manufacturing the same

Coupling substrate for semiconductor components and method for producing the same

Method for making stacked integrated circuits (ICs) using prepackaged parts

Low profile semiconductor package

Semiconductor device and method of manufacturing the same

Ultrathin leadframe BGA circuit package

Method of making stacked die package

Adhesive film and process for preparing the same as well as adhesive sheet and semiconductor device

Interface materials and methods of production and use thereof

Method and apparatus for grounding a heat sink in thermal contact with an electronic component using a grounding spring having multiple-jointed spring fingers

Semiconductor device mounting socket

RF power amplifier and method for packaging the same

Board on chip package and method of manufacturing the same

Semiconductor package and substrate structure thereof

Chip stack structure having shielding capability and system-in-package module using the same

Stacked semiconductor module

Optimal stacked die organization

Electronic component, module, module assembling method, module identification method and module environment setting method

Printed wiring board

Semiconductor device and manufacturing method thereof

Structure and self-locating method of making capped chips

Structure and method of making capped chips having vertical interconnects

Semiconductor device having an electronic circuit disposed therein

Semiconductor component with a thin semiconductor chip and a stiff wiring substrate, and methods for producing and further processing of thin semiconductor chips

Back-face and edge interconnects for lidded package

Electronic-part built-in substrate and manufacturing method therefor

Stacked semiconductor device and lower module of stacked semiconductor device

Double-sided circuit board and multi-chip package including such a circuit board and method for manufacture

Semiconductor device and a method of manufacturing the same

Semiconductor module capable of enlarging stand-off height

Semiconductor die package including construction for preventing delamination and/or cracking of the semiconductor die

Integrated circuit package system including high-density small footprint system-in-package

Structure for protecting electronic packaging contacts from stress

Packaging for high speed integrated circuits

Substrate frame

High frequency chip packages with connecting elements

Multilayered printed circuit board and method for manufacturing the same

Heat treatment for a panel and apparatus for carrying out the heat treatment method

METHOD OF MAKING SEMICONDUCTOR PACKAGE WITH REDUCED MOISTURE SENSITIVITY

Semiconductor device packaging for avoiding metal contamination

Embedded inductor and application thereof

Embedded inductor element and chip package applying the same

Interposer and method for fabricating the same

Closed loop thermally enhanced flip chip BGA

Chip-packaging composition of resin and cycloaliphatic amine hardener

Integrated chip device in a package

System and method for decreasing stress on solder holding BGA module to computer motherboard

Multi-chip package structure

Multi-chip package structure

Interposer for compliant interfacial coupling

Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages

Housed DRAM chip for high-speed applications

Stack type semiconductor package module utilizing solder coated stacking protrusions and method for manufacturing the same

Method for manufacturing a printed circuit board for electronic devices and an electronic device using the same

System including a buffered memory module

Method for applying a structure of joining material to the back surfaces of semiconductor chips

CHIP PACKAGE METHOD

Semiconductor chip package

Method of improving power distribution in wirebond semiconductor packages

Semiconductor package for encapsulating multiple dies and method of manufacturing the same

Semiconductor device and manufacturing method of the same

Semiconductor device, mounting substrate and method of manufacturing mounting substrate, circuit board, and electronic instrument

Method for manufacturing semiconductor module using interconnection structure

Printed wiring board

Semiconductor device having a semiconductor chip, and method for the production thereof

Chip packaging process

Semiconductor device with electroless plating metal connecting layer and method for fabricating the same

Vertical packaged IC device modules with interconnected 3D laminates directly contacts wafer backside

Stacked-type chip package structure

SELECTIVE SOLDER DEPOSITION BY SELF-ASSEMBLY OF NANO-SIZED SOLDER PARTICLES, AND METHODS OF ASSEMBLING SOLDERED PACKAGES

Semiconductor assembly for improved device warpage and solder ball coplanarity

Liquid crystalline polymer and multilayer polymer-based passive signal processing components for RF/wireless multi-band applications

Integrated circuit support structures and their fabrication

Semiconductor device with semiconductor chip and adhesive film and method for producing the same

Memory module and memory system

Electronic component packaging structure and method for producing the same

Semiconductor package involving a rotary lock that connects a package substrate and a separate component

Universal chip package structure

Hybrid module and method of manufacturing the same

Manufacturing method for semiconductor device

Flip-chip type assembly

Intermetallic solder with low melting point

Interconnect substrate and electronic circuit device

Electronic apparatus

Electronic circuit chip, and electronic circuit device and method for manufacturing the same

Packages for electronic devices implemented with laminated board with a top and a bottom patterned metal layers

Semiconductor module having a coupling substrate, and methods for its production

Thermal expansion compensation graded IC package

Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same

Semiconductor packaging process and carrier for semiconductor package

Semiconductor package having an interfacial adhesive layer

Wiring board, semiconductor device, and method of manufacturing the same

Multilayered wiring board, semiconductor device in which multilayered wiring board is used, and method for manufacturing the same

Semiconductor device and a manufacturing method of the same

Wiring board and capacitor

Chip embedded packaging structure

Interposer and electronic device fabrication method

Relay board and semiconductor device having the relay board

Electronic device and manufacturing method of the same

Semiconductor device

Semiconductor chip and semiconductor device

Semiconductor device and semiconductor device production method

Semiconductor device and a manufacturing method of the same

Semiconductor package

Mid-plane arrangement for components in a computer system

System to control signal line capacitance

Optical device

Printed circuit board and manufacturing method thereof

Method of assembly for multi-flip chip on lead frame on overmolded IC package

Semiconductor device and method for manufacturing the same

PROCESS FOR FABRICATING CHIP PACKAGE STRUCTURE

Method for separating package of WLP

Method and system for hermetically sealing packages for optics

Memory module including a plurality of integrated circuit memory devices and a plurality of buffer devices in a matrix topology

Contacts to microdevices

Semiconductor device with improved design freedom of external terminal

Receiving device

Semiconductor package, method of manufacturing the same, stacked semiconductor package including the same and method of manufacturing the stacked semiconductor package

Modular bonding pad structure and method

Stacked die semiconductor package

Component with chip through-contacts

Semiconductor device having shield structure

Cavity chip package

Semiconductor device

Integrated circuit device incorporating metallurigical bond to enhance thermal conduction to a heat sink

Constraint stiffener design

Chip package and substrate thereof

Package with barrier wall and method for manufacturing the same

Semiconductor device with a plastic housing composition that includes filler particles and that at least partially embeds a semiconductor chip

Bumpless chip package and fabricating process thereof

Semiconductor chip and process for forming the same

INTEGRATED INDUCTOR STRUCTURE AND METHOD OF FABRICATION

Semiconductor device comprising a plurality of semiconductor constructs

Method for manufacturing substrate with cavity

Semiconductor manufacturing method

Semiconductor substrate with islands of diamond and resulting devices

Method for manufacturing an adhesive substrate with a die-cavity sidewall

Method for manufacturing substrate with cavity

Method of forming a semiconductor device

Method for manufacturing substrate with cavity

THERMAL ENHANCED PACKAGE FOR BLOCK MOLD ASSEMBLY

Pre-patterned thin film capacitor and method for embedding same in a package substrate

Substrate sheet material for a semiconductor device and a manufacturing method thereof, a molding method using a substrate sheet material, a manufacturing method of semiconductor devices

Cooling system for a semiconductor device and method of fabricating same

Ceramic capacitor

Method for forming component mounting hole in semiconductor substrate

Complete power management system implemented in a single surface mount package

Complete power management system implemented in a single surface mount package

Method of encapsulating packaged microelectronic devices with a barrier

SEMICONDUCTOR DEVICE

BGA package with stacked semiconductor chips and method of manufacturing the same

Integrated circuit package system with planar interconnects

INDUCTIVE STRUCTURE

Rigid-flexible printed circuit board for package on package and manufacturing method

Fan out type wafer level package structure and method of the same

Semiconductor chip having bond pads

Integrated circuit die configuration for packaging

Method for designing semiconductor apparatus, system for aiding to design semiconductor apparatus, computer program product therefor and semiconductor package

External contact material for external contacts of a semiconductor device and method of making the same

Semiconductor chip having bond pads and multi-chip package

Low temperature co-fired ceramic (LTCC) tape compositions, light emitting diode (LED) modules, lighting devices and method of forming thereof

Multilayered wiring substrate including wiring layers and insulating layers and method of manufacturing the same

Multi-level semiconductor module

Structure of IC packaging and method forming the same

Semiconductor device and automotive AC generator

Electronic component embedded board and its manufacturing method

METHOD FOR FABRICATING SEMICONDUCTOR PACKAGES

Cooling device using direct deposition of diode heat pump

Support with solder ball elements and a method for populating substrates with solder balls

Semiconductor chip package and method of manufacturing the same

Method and apparatus for decoupling conductive portions of a microelectronic device package

Semiconductor package and manufacturing method thereof

MULTI-CHIP PACKAGE STRUCTURE

THREE-DIMENSIONAL INTERCONNECT INTERPOSER ADAPTED FOR USE IN SYSTEM IN PACKAGE AND METHOD OF MAKING THE SAME

Partially patterned lead frames and methods of making and using the same in semiconductor packaging

Semiconductor package with a conductive post and wiring pattern

Determining the placement of semiconductor components on an integrated circuit

Multi-chip package type semiconductor device

Semiconductor module

Computing device including a stacked semiconductor device

LSI package provided with interface module

Semiconductor device including a plurality of semiconductor chips stacked three-dimensionally, and method of manufacturing the same

Stacked microelectronic devices and methods for manufacturing microelectronic devices

Semiconductor device, semiconductor package for use therein, and manufacturing method thereof

Ball grid array interface structure and method

Alpha particle shields in chip packaging

Chip package structure

Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices

Backside ground type flip chip semiconductor package

Microfeature workpiece substrates having through-substrate vias, and associated methods of formation

Methods of making a die-up ball grid array package with printed circuit board attachable heat spreader

Wiring board construction including embedded ceramic capacitors(s)

Wiring board and ceramic chip to be embedded

Printed circuit board assembly with strain-alleviating structures

Microfeature assemblies including interconnect structures and methods for forming such interconnect structures

Microelectronic devices and methods for manufacturing microelectronic devices

Printed circuit board for thermal dissipation and electronic device using the same

Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices

Semiconductor package featuring metal lid member

Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices

Semiconductor device and manufacturing method thereof

STACKING SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREOF

Methods of forming blind wafer interconnects

Method of manufacturing wiring board

Semiconductor device and method of manufacturing the same

Package for an implantable neural stimulation device

Flexible interconnect cable with grounded coplanar waveguide

Two layer substrate ball grid array design

Printed circuit board and method thereof and a solder ball land and method thereof

Semiconductor device and method of producing the same

Switching device for altering built-in function of IC chip

Integrated circuit package

Electronic device and carrier substrate

Thermally enhanced cavity down ball grid array package

Method and system for secure heat sink attachment on semiconductor devices with macroscopic uneven surface features

Underfilled semiconductor die assemblies and methods of forming the same

Semiconductor component comprising an interposer substrate

Bumpless chip package

Applicant screening

Semiconductor device and a manufacturing method of the same

Multichip packages with exposed dice

Semiconductor package with contact support layer and method to produce the package

Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device

Method And Device For Enhancing Solderability

Semiconductor device, laminated semiconductor device, and wiring substrate

Bonded structure and bonding method

Tier structure with tier frame having a feedthrough structure

Techniques for providing decoupling capacitance

Semiconductor device with improved contacts

Mount for a programmable electronic processing device

Integrated solder and heat spreader fabrication

Printed circuit board, semiconductor package and multi-stack semiconductor package using the same

Thin IC package for improving heat dissipation from chip backside

Stackable single package and stacked multi-chip assembly

Method for fabricating wafer level semiconductor package with build-up layer

Semiconductor device with conductor tracks between semiconductor chip and circuit carrier and method for producing the same

Capacitive element, method of manufacture of the same, and semiconductor device

Alpha-particle-tolerant semiconductor die systems, devices, components and methods for optimizing clock rates and minimizing die size

Method and apparatus for removing encapsulating material from a packaged microelectronic device

Solder composition for electronic devices

Capacitor for incorporation in wiring board, wiring board, method of manufacturing wiring board, and ceramic chip for embedment

Method for fabricating semiconductor package with heat sink

Board-on-chip package and stack package using the same

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Package module having a stacking platform

SEMICONDUCTOR DEVICE

Multilayered circuit substrate and semiconductor package structure using the same

Power plane design and jumper wire bond for voltage drop minimization

Stack package implementing conductive support

SEMICONDUCTOR DEVICE

Electronic parts packaging structure and method of manufacturing the same

Multilayer printed wiring board

Semiconductor device and electronic instrument

Semiconductor device and electronic instrument

Semiconductor device and method of manufacturing the same

Semiconducting device with folded interposer

Semiconductor module comprising components for microwave engineering in plastic casing and method for the production thereof

Embedded actives and discrete passives in a cavity within build-up layers

Semiconductor device and method of manufacturing the same

Flip chip interface including a mixed array of heat bumps and signal bumps

Semiconductor package

Structures and methods for an application of a flexible bridge

Dual BGA alloy structure for improved board-level reliability performance

Semiconductor device-composing substrate and semiconductor device

Semiconducting device with folded interposer

Semiconductor device having capacitors for reducing power source noise

Substrate based IC-package

Multi-chip semiconductor package featuring wiring chip incorporated therein, and method for manufacturing such multi-chip semiconductor package

METHOD FOR PRODUCING A CHIP ARRANGEMENT, A CHIP ARRANGEMENT AND A MULTICHIP DEVICE