Method and system for customized radio frequency shielding using solder bumps

Via/BSM pattern optimization to reduce DC gradients and pin current density on single and multi-chip modules

Semiconductor device that suppresses variations in high frequency characteristics of circuit elements

Method of forming a connecting conductor and wirings of a semiconductor chip

Manufacturing process for chip package without core

Method and apparatus for attaching microelectronic substrates and support members

Low profile, chip-scale package and method of fabrication

Method of manufacturing electronic circuit device

Method and apparatus for attaching microelectronic substrates and support members

Polygonal, rounded, and circular flip chip ball grid array board

Security apparatus

SEMICONDUCTOR PACKAGING DEVICE AND MANUFACTURE THEREOF

Wafer-level-chip-scale package and method of fabrication

Semiconductor chip production method, semiconductor device production method, semiconductor chip, and semiconductor device

Ball grid array package and substrate within

Wiring substrate and semiconductor package implementing the same

Semiconductor device and manufacturing method thereof

Electronic component and electronic configuration

Packaging for high speed integrated circuits

Stack package made of chip scale packages

Memory module with stacked semiconductor devices

Stacked semiconductor package having adhesive/spacer structure and insulation

Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby

Packaging for high speed integrated circuits

Packaging for high speed integrated circuits

Packaging for high speed integrated circuits

Semiconductor package without chip carrier and fabrication method thereof

Packaging for high speed integrated circuits

Packaging for high speed integrated circuits

Electronic device and carrier substrate for same

Fabrication method of semiconductor circuit device

Folded frame carrier for MOSFET BGA

Semiconductor device and manufacturing method thereof

Bumped die and wire bonded board-on-chip package

Semiconductor device and a manufacturing method of the same

ELECTRONIC MODULE WITH STACKED IC CHIP STRUCTURE

Integrated circuit package and method with an electrical component embedded in a substrate via

Semiconductor device and electronic apparatus of multi-chip packaging

Stacked Semiconductor Package having Adhesive/Spacer Structure and Insulation

Thermally conductive materials, solder preform constructions, assemblies and semiconductor packages

MEMS packaging method for enhanced EMI immunity using flexible substrates

Interlayer insulating layer for printed wiring board, printed wiring board and method for manufacturing same

Printed circuit board for thermal dissipation and electronic device using the same

Chip package without core and stacked chip package structure thereof

Packaging of a microchip device

Package substrate and semiconductor package using the same

MEMS package using flexible substrates, and method thereof

Camera module fabrication method including singulating a substrate

Electronic component package including joint material having higher heat conductivity

Micro-optics on optoelectronics

Package structure for a semiconductor device incorporating enhanced solder bump structure

Wire-bonding method and semiconductor package using the same

Semiconductor package having dual interconnection form and manufacturing method thereof

Stack type package

Stack package and semiconductor module implementing the same

Ball grid array package enhanced with a thermal and electrical connector

SEMICONDUCTOR MULTI-CHIP PACKAGE

Chip-embedded interposer structure and fabrication method thereof, wafer level stack structure and resultant package structure

Lead frame, resin-encapsulated semiconductor device, and method of producing the same

Light-emitting device

Cavity ball grid array apparatus having improved inductance characteristics

Method of making mutilayered circuitized substrate assembly having sintered paste connections

Methods for forming multilayer structures

Method of reducing warpage in an over-molded IC package

Semiconductor device and manufacturing method thereof

Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same

Chip and multi-chip semiconductor device using the chip, and method for manufacturing same

Arrangement in semiconductor packages for inhibiting adhesion of lid to substrate while providing compression support

Lighting device

Semiconductor device with improved signal transmission characteristics

Thermal interface material with carbon nanotubes and particles

Stacked semiconductor package

Adhesive layer forming a capacitor dielectric between semiconductor chips

BUMP FOR OVERHANG DEVICE

Low profile stacked semiconductor chip package

Semiconductor assemblies including redistribution layers and packages and assemblies formed therefrom

Anti-warp heat spreader for semiconductor devices

System and method for venting pressure from an integrated circuit package sealed with a lid

Semiconductor package having lead free conductive bumps and method of manufacturing the same

Semiconductor memory device and manufacturing method thereof

Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages

Circuit device and method of manufacturing the same

Auto connection assignment system and method

Memory device identification

Thermally conductive grease and methods and devices in which said grease is used

Spacer die structure and method for attaching

Electronic component and method for manufacturing the same

Method of manufacturing a semiconductor device

Method for fabricating board on chip (BOC) semiconductor package with circuit side polymer layer

Standoffs for centralizing internals in packaging process

Method of fabricating a stacked die in die BGA package

Method of fabricating a stacked die in die BGA package

Stacked die in die BGA package

Heat-dissipating semiconductor package and fabrication method thereof

Optically connectable circuit board with optical component(s) mounted thereon

Semiconductor device and method for manufacturing the same

Semiconductor package

Multi-chip device and method for producing a multi-chip device

Stacked semiconductor component

Intrinsic thermal enhancement for FBGA package

Microelectronic die cooling device including bonding posts and method of forming same

Packaging logic and memory integrated circuits

Pre-patterned thin film capacitor and method for embedding same in a package substrate

Reliable integrated circuit and package

Semiconductor device

Double-sided wiring board, double sided wiring board manufacturing method, and multilayer wiring board

Method of preparing terminal board

SACRIFICIAL COMPONENT

Multi-chip device and method for producing a multi-chip device

Semiconductor packages and methods of manufacturing thereof

Flip-chip mounting electronic component and method for producing the same, circuit board and method for producing the same, method for producing package

Signal isolation in a package substrate

Wireless local area network communications module and integrated chip package

Power amplifier of a transmitter

Multi-package module and electronic device using the same

Flip chip packaging using recessed interposer terminals

Wirebond electronic package with enhanced chip pad design, method of making same, and information handling system utilizing same

CSP semiconductor chip and BGA assembly with enhanced physical protection, protective members and assemblies used with same, and methods of enhancing physical protection of chips and assemblies

Module having stacked chip scale semiconductor packages

Chip stack package having same length bonding leads

System for hermetically sealing packages for optics

Wiring board, method for manufacturing same, and semiconductor package

Wiring board and method for manufacturing the same

Multilayer electronic component and structure for mounting multilayer electronic component

Integrated thin-film capacitor with etch-stop layer, process of making same, and packages containing same

Packaging method and package using the same

Decoupling capacitor for an integrated circuit and method of manufacturing thereof

Semiconductor device and method for manufacturing semiconductor device

Substrate for pre-soldering material and fabrication method thereof

Integrated electronic chip and interconnect device and process for making the same

Soldered assemblies and methods of making the same

Stack circuit member and method

Method for manufacturing semiconductor component with a media channel

Ball grid array package with thermally-enhanced heat spreader

Panel and semiconductor component having a composite board with semiconductor chips and plastic package molding compound and method for the production thereof

Semiconductor device, stacked semiconductor device, and manufacturing method for semiconductor device

Laminated semiconductor package

Semiconductor device having a stacked chip structure

Electronic circuit protection device

Electronic apparatus with thermal module

Electronic circuit protection device

FLIP CHIP PACKAGE AND METHOD OF CONDUCTING HEAT THEREFROM

Substrate structure of semiconductor package

Semiconductor package and fabrication method thereof

Optoelectronic semiconductor assembly with an optically transparent cover, and a method for producing optoelectronic semiconductor assembly with an optically transparent cover

Semiconductor sensor component including a sensor chip and methods for the manufacturing thereof

Image sensor chip package and method of manufacturing the same

Wiring board and method for manufacturing the same

Wiring board and manufacturing method of wiring board

Memory module, cache system and address conversion method

Method of fabricating wiring board and method of fabricating semiconductor device

Semiconductor chip with flip chip contacts and a passivation layer with varying thickness portions surrounding contact surfaces of the semiconductor chip

Surface mount type semiconductor device and method of manufacturing the same

Method of forming overhang support for a stacked semiconductor device

Integrated circuit package substrate having a thin film capacitor structure

Manufacturing method for an electronic component assembly and corresponding electronic component assembly

Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contacts

Method of making semiconductor BGA package having a segmented voltage plane

Method and circuit structure employing a photo-imaged solder mask

Interface module-mounted LSI package

Methods for packaging an image sensor and a packaged image sensor

Zero ATE insertion force interposer daughter card

Epoxy bump for overhang die

Apparatuses and associated methods for improved solder joint reliability

Through electrode and method for forming the same

Semiconductor chip manufacturing method, semiconductor chip, semiconductor device manufacturing method, and semiconductor device

Taped semiconductor device and method of manufacture

Semiconductor device, laminated semiconductor device, and method for producing semiconductor device

Circuit device and method of manufacturing the same

Memory module with improved mechanical strength of chips

Semiconductor device

Semiconductor BGA package having a segmented voltage plane

System for assembling electronic components of an electronic system

Stacked semiconductor package assembly having hollowed substrate

Image sensitive electronic device packages

Solder joints for copper metallization having reduced interfacial voids

Panel and semiconductor device having a composite plate with semiconductor chips

Die-wafer package and method of fabricating same

Semiconductor device

Interposer, method of fabricating the same, and semiconductor device using the same

Surface roughening method for embedded semiconductor chip structure

Electronic substrate manufacturing method, semiconductor device manufacturing method, and electronic equipment manufacturing method

Method and apparatus for attaching an IC package to a PCB assembly

Systems and arrangements to assess thermal performance

CHIP PACKAGE STRUCTURE

Semiconductor device and method of manufacturing the same

Semiconductor device and manufacturing method thereof

Multi-chip module and methods

Semiconductor device and method for manufacturing the same

Multilayer module and method of manufacturing the same

SIP type package containing analog semiconductor chip and digital semiconductor chip stacked in order, and method for manufacturing the same

Sealing membrane for thermal interface material

Chip package having chip extension and method

Package cap with bypass capacitance

Flexible core for enhancement of package interconnect reliability

Semiconductor package substrate with embedded resistors and method for fabricating same

Stacked chip package with redistribution lines

System-in-a-package based flash memory card

Screen mask

Manufacturing method for wiring circuit substrate

INTEGRATED CAPACITOR FOR WAFER LEVEL PACKAGING APPLICATIONS

Method of producing a universal semiconductor housing with precrosslinked plastic embedding compounds

Method of manufacturing a semiconductor device comprising stacked chips and a corresponding semiconductor device

Offset integrated circuit package-on-package stacking system

Integrated circuit package including miniature antenna

Probe card and testing method of semiconductor chip, capacitor and manufacturing method thereof

Probe card and testing method of semiconductor chip, capacitor and manufacturing method thereof

Semiconductor device

Flip chip package having protective cap and method of fabricating the same

Handling and positioning of metallic plated balls for socket application in ball grid array packages

Multi-chip electronic package with reduced line skew and circuitized substrate for use therein

Lid used in package structure and the package structure having the same

System and method for vertically stacking computer memory components

Apparatus and methods for constructing balanced chip packages to reduce thermally induced mechanical strain

Method for making a flat-top pad

Electronic module and method for the production thereof

Microelectronic packages and methods therefor

Flip-chip semiconductor device

Multiple chip package module including die stacked over encapsulated package

Semiconductor device with substrate having penetrating hole having a protrusion

Stacked type semiconductor device

Stacked package semiconductor module having packages stacked in a cavity in the module substrate

Multi-chip module having a support structure and method of manufacture

Package substrate, integrated circuit apparatus, substrate unit, surface acoustic wave apparatus, and circuit device

SEMICONDUCTOR PACKAGE HAVING ULTRA-THIN THICKNESS AND METHOD OF MANUFACTURING THE SAME

Retinal prosthesis and method of manufacturing a retinal prosthesis

Multi-chip module and method of manufacture

Passive element chip and manufacturing method thereof, and highly integrated module and manufacturing method thereof

Semiconductor device with semiconductor chip and rewiring layer and method for producing the same

Semiconductor device having a plurality of semiconductor chips and method for manufacturing the same

Stacked die package for peripheral and center device pad layout device

Three dimensional packaging optimized for high frequency circuitry

Compliant contact pin test assembly and methods thereof

Method of fabricating a stacked integrated circuit package system

Memory packages having stair step interconnection layers

Electronic component and electronic configuration

Semiconductor device including a base member and a semiconductor constructing body directly fixed to thermosetting resin of the base member

Multilayer printed wiring board

Semiconductor device and method of manufacturing the same

Memory module

Electronic circuit device

Semiconductor device, manufacturing method thereof, and connection method of circuit board

Semiconductor device with a rewiring level and method for producing the same

Semiconductor package including second substrate and having exposed substrate surfaces on upper and lower sides

Multilayer printed wiring board

Method of making a circuitized substrate

Semiconductor device and method of manufacturing the same

Semiconductor device with terminals, and method of manufacturing the same

Method and apparatus for flip-chip packaging providing testing capability

Method of making a multi-chip electronic package having laminate carrier

Integrated circuit package and method for producing it

Apparatus for attaching a cooling structure to an integrated circuit

Circuit device

Carrying structure of electronic components

Semiconductor die edge reconditioning

BGA-type multilayer circuit wiring board

Electronic circuit device

System having semiconductor component with multiple stacked dice

Standoffs for centralizing internals in packaging process

System and method for enhancing wafer chip scale packages

Thermal enhanced low profile package structure

Semiconductor chip with fuse unit

Multilayer printed wiring board

Method and system for an improved package substrate for use with a semiconductor package

Memory module that is capable of controlling input/output in accordance with type of memory chip

Electronic device

Semiconductor device with self-aligning contactless interface

Non-cavity semiconductor packages

Bonding pad for a packaged integrated circuit

Fan out type wafer level package structure and method of the same

BGA semiconductor chip package and mounting structure thereof

Semiconductor package accomplishing fan-out structure through wire bonding

Systems and methods for reducing simultaneous switching noise in an integrated circuit

Thermally enhanced semiconductor package and fabrication method thereof

Pillar grid array package

Multilevel semiconductor module and method for fabricating the same

Structure having an integrated circuit on another integrated circuit with an intervening bent adhesive element

Semiconductor device having resin-sealed area on circuit board thereof

BGA type semiconductor package featuring additional flat electrode teminals, and method for manufacturing the same

Semiconductor device and chip-stack semiconductor device

Semiconductor chip mounting body and manufacturing method thereof

Printed wiring board and information processing apparatus

Manufacturing process of a chip package structure

Image sensor module package

Capacitor with co-planar electrodes

Method for fabricating a flip chip package

Multichip package or system-in package

Micro electric power converter

Integrated heat spreader and method for using

Method of forming metal interconnect layers for flip chip device

Semiconductor package substrate having contact pad protective layer formed thereon

Ball grid array package stack

Chip package

Semiconductor multipackage module including tape substrate land grid array package stacked over ball grid array package

Structure and assembly method of integrated circuit package

Semiconductor device, method for manufacturing the semiconductor device and semiconductor substrate

Multipackage module having stacked packages with asymmetrically arranged die and molding

Semiconductor device and method of manufacturing semiconductor device

Area mount type semiconductor device, and die bonding resin composition and encapsulating resin composition used for the same

Method of manufacturing stack-type semiconductor device and method of manufacturing stack-type electronic component